CN107660085A - A kind of circuit board assemblies and preparation method thereof, multiple-printed-panel for circuit board, mobile terminal - Google Patents

A kind of circuit board assemblies and preparation method thereof, multiple-printed-panel for circuit board, mobile terminal Download PDF

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Publication number
CN107660085A
CN107660085A CN201710844200.9A CN201710844200A CN107660085A CN 107660085 A CN107660085 A CN 107660085A CN 201710844200 A CN201710844200 A CN 201710844200A CN 107660085 A CN107660085 A CN 107660085A
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CN
China
Prior art keywords
circuit board
pad
smd components
printed
panel
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
CN201710844200.9A
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Chinese (zh)
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CN107660085B (en
Inventor
王聪
谷平
谷一平
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Guangdong Oppo Mobile Telecommunications Corp Ltd
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Guangdong Oppo Mobile Telecommunications Corp Ltd
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Priority to CN201710844200.9A priority Critical patent/CN107660085B/en
Publication of CN107660085A publication Critical patent/CN107660085A/en
Application granted granted Critical
Publication of CN107660085B publication Critical patent/CN107660085B/en
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Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/14—Structural association of two or more printed circuits
    • H05K1/142—Arrangements of planar printed circuit boards in the same plane, e.g. auxiliary printed circuit insert mounted in a main printed circuit
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/18—Printed circuits structurally associated with non-printed electric components
    • H05K1/181—Printed circuits structurally associated with non-printed electric components associated with surface mounted components
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/16—Inspection; Monitoring; Aligning
    • H05K2203/167—Using mechanical means for positioning, alignment or registration, e.g. using rod-in-hole alignment

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Combinations Of Printed Boards (AREA)

Abstract

This application provides a kind of preparation method of circuit board assemblies, multiple-printed-panel for circuit board, circuit board assemblies and mobile terminal.The preparation method includes providing multiple-printed-panel for circuit board, and multiple-printed-panel for circuit board includes circuit board and is connected to the limiting plate of circuit board, and circuit board is provided with pad；Solder is applied to pad；SMD components are attached on pad；Overheating Treatment is carried out to the multiple-printed-panel for circuit board for sticking SMD components, solder makes to be electrically connected between SMD components and multiple-printed-panel for circuit board, wherein, limiting plate is used for the movement for limiting SMD components plane where circuit board；Limiting plate is removed, to obtain circuit board assemblies.The application can accurately limit the position of SMD components, significantly improve the welding precision of SMD components.

Description

A kind of circuit board assemblies and preparation method thereof, multiple-printed-panel for circuit board, mobile terminal
Technical field
The application is related to circuit board assemblies technical field, more particularly to a kind of preparation method of circuit board assemblies, circuit Plate jigsaw, circuit board assemblies and mobile terminal.
Background technology
SMD components are in automatic welding at present, because not spacing to the position of SMD components, paster member Device can produce movement in automatic Arc Welding, so as to which deviation occurs for position, when this SMD components needs accurately to match somebody with somebody When closing on other SMD components, the change of this position can cause the loose contact of product, the serious product that have impact on Normal use.
The content of the invention
This application provides a kind of preparation method of circuit board assemblies, the preparation method includes providing multiple-printed-panel for circuit board, electricity Road plate jigsaw includes circuit board and is connected to the limiting plate of circuit board, and circuit board is provided with pad；Solder is applied to pad；Will patch Piece component is attached on pad；Overheating Treatment is carried out to the multiple-printed-panel for circuit board for sticking SMD components, solder makes SMD components It is electrically connected between multiple-printed-panel for circuit board, wherein, limiting plate is used for the movement for limiting SMD components plane where circuit board； Limiting plate is removed, to obtain circuit board assemblies.
Present invention also provides a kind of multiple-printed-panel for circuit board, the multiple-printed-panel for circuit board includes circuit board and is connected to the limit of circuit board Position plate；Circuit board is provided with pad, and pad is used to install SMD components, and limiting plate is used to limit the paster being connected with pad The movement of component plane where pad.
Present invention also provides a kind of circuit board assemblies, the circuit board assemblies include circuit board and SMD components, circuit Plate is provided with pad, is connected in SMD components insertion pad with circuit board, circuit board assemblies are made up of above-mentioned preparation method.
Present invention also provides a kind of mobile terminal, mobile terminal includes foregoing circuit board component.
The application multiple-printed-panel for circuit board sets limiting plate, and SMD components are mounted onto pad, SMD components and limiting plate Contact, so as to the movement of limiting plate limitation SMD components plane where pad, on the premise of additionally cost is not increased, essence The position of true limitation SMD components, significantly improve the welding precision of SMD components.
Brief description of the drawings
In order to illustrate more clearly of the technical scheme in the embodiment of the present application, make required in being described below to embodiment Accompanying drawing is briefly described, it should be apparent that, drawings in the following description are only some embodiments of the present application, for For those of ordinary skill in the art, on the premise of not paying creative work, it can also be obtained according to these accompanying drawings other Accompanying drawing.
Fig. 1 is the schematic flow sheet of the embodiment of preparation method one of the application circuit board assemblies；
Fig. 2 is the top view of the embodiment of multiple-printed-panel for circuit board one in Fig. 1 embodiments of the method；
Fig. 3 is the top view that multiple-printed-panel for circuit board and SMD components assemble an embodiment in Fig. 1 embodiments of the method；
Fig. 4 is the sectional view in A directions in Fig. 3；
Fig. 5 is the top view of the embodiment of circuit board assemblies one in Fig. 1 embodiments of the method；
Fig. 6 is the top view of another embodiment of multiple-printed-panel for circuit board in Fig. 1 embodiments of the method；
Fig. 7 is the top view that multiple-printed-panel for circuit board and SMD components assemble another embodiment in Fig. 1 embodiments of the method；
Fig. 8 is the top view of multiple-printed-panel for circuit board another embodiment in Fig. 1 embodiments of the method；
Fig. 9 is multiple-printed-panel for circuit board and the top view of SMD components assembling another embodiment in Fig. 1 embodiments of the method；
Figure 10 is the top view of the another embodiment of multiple-printed-panel for circuit board in Fig. 1 embodiments of the method；
Figure 11 is the top view that multiple-printed-panel for circuit board and SMD components assemble another embodiment in Fig. 1 embodiments of the method；
Figure 12 is the top view of multiple-printed-panel for circuit board a further embodiment in Fig. 1 embodiments of the method；
Figure 13 is multiple-printed-panel for circuit board and the top view of SMD components assembling a further embodiment in Fig. 1 embodiments of the method；
Figure 14 is the top view of multiple-printed-panel for circuit board another embodiment in Fig. 1 embodiments of the method；
Figure 15 is multiple-printed-panel for circuit board and the top view of SMD components assembling another embodiment in Fig. 1 embodiments of the method；
Figure 16 is the structure chart of the embodiment of the application mobile terminal one.
Embodiment
Below in conjunction with the accompanying drawing in the embodiment of the present application, the technical scheme in the embodiment of the present application is carried out clear, complete Site preparation describes.It is understood that specific embodiment described herein is only used for explaining the application, rather than the limit to the application It is fixed.It also should be noted that for the ease of description, the part related to the application illustrate only in accompanying drawing and not all knot Structure.Based on the embodiment in the application, what those of ordinary skill in the art were obtained under the premise of creative work is not made All other embodiment, belong to the scope of the application protection.
The mobile terminal that the embodiment of the present application is provided, including smart mobile phone, tablet personal computer, Intelligent worn device, numeral The electronic equipments such as audio/video player, electronic reader, handheld game machine and vehicle electronic device.
Term " first " in the application, " second " are only used for describing purpose, and it is not intended that instruction or hint are relative Importance or the implicit quantity for indicating indicated technical characteristic.Thus, define " first ", the feature of " second " can be with bright Show or implicitly include at least one this feature.In the description of the present application, " multiple " are meant that at least two, such as two It is individual, three etc., unless otherwise specifically defined.In the embodiment of the present application institute it is directional instruction (it is such as upper and lower, left, It is right, forward and backward ...) be only used for explaining relative position relation under a certain particular pose (as shown in drawings) between each part, Motion conditions etc., if the particular pose changes, directionality instruction also correspondingly changes therewith.In addition, term " comprising " and " having " and their any deformations, it is intended that cover non-exclusive include.Such as contain series of steps Or process, method, system, product or the equipment of part, the step of being not limited to list or part, but alternatively also wrap The step of not listing or part are included, or is alternatively also included for the intrinsic other steps of these processes, method, product or equipment Rapid or part.
Referenced herein " embodiment " is it is meant that the special characteristic, structure or the characteristic that describe can wrap in conjunction with the embodiments It is contained at least one embodiment of the application.Each position in the description occur the phrase might not each mean it is identical Embodiment, nor the independent or alternative embodiment with other embodiments mutual exclusion.Those skilled in the art explicitly and Implicitly understand, embodiment described herein can be combined with other embodiments.
Factory can all select robotic automatic welding when welded and installed a large amount of SMD components, such as：Reflow Soldering Or wave-soldering.But during welding material melts automatically, SMD components can produce drift phenomenon, so as to cause to paste The position of piece component is moved.This phenomenon can cause three kinds of problems：1, misplaced between SMD components and pad And cause, the i.e. phenomenon of missing solder bad with contact pads；2, the skew of the positions of SMD components and with neighbouring electronic component Produce unnecessarily in electrical contact, i.e., short-circuit or electromagnetic interference phenomenon；3, the skew of the positions of SMD components and can not be just Often assembled with other electronic devices, i.e. the phenomenon of loose contact.To solve problem above, the application provides following technical side Case.
Referring to Fig. 1, Fig. 1 is the schematic flow sheet of the embodiment of preparation method one of the application circuit board assemblies.
M101, there is provided multiple-printed-panel for circuit board, multiple-printed-panel for circuit board include circuit board and be connected to the limiting plate of circuit board, circuit board Provided with pad.
In order to rationally utilize the material space of plank, different circuit boards or identical circuit board can be led in design Cross connecting plate to link together, so as to constitute multiple-printed-panel for circuit board, multiple-printed-panel for circuit board removes after completing to install electronic component Connecting plate has just obtained the circuit board assemblies that mobile terminal assembling needs.The technical scheme of the application makes connecting plate spacing Plate, circuit board and limiting plate collective effect are in electronic component, to reach the purpose of limitation electronic component position.
Referring to Fig. 2, Fig. 2 is the top view of the embodiment of multiple-printed-panel for circuit board one in Fig. 1 embodiments of the method.In the present embodiment In, multiple-printed-panel for circuit board 10 includes circuit board 12 and is connected to the limiting plate 14 of circuit board 12, and circuit board 12 is provided with pad 122, welds Disk 122 is used to install SMD components (referring specifically to SMD components 20 in Fig. 3), and limiting plate 14 is used to limit and pad The SMD components of 122 connections are mobile in the plane (referring specifically to Fig. 4 midplanes 126) where pad 122.Alternatively, limit Position plate 14 includes connecting portion 142 and lug boss 144, and connecting portion 142 is connected with circuit board 12 and lug boss 144 respectively, lug boss 144 are located at the side of pad 122, and the SMD components for being connected with pad 122 contact.
M102, solder is applied to pad.
The solder of the present embodiment can be tin cream, specifically, fully tin cream can be stirred using solder paste stirrer, Multiple-printed-panel for circuit board is placed under steel net template, and pad is directed at the corresponding hole of steel net template, the tin that then will be stirred Cream is placed on steel net template and deviates from multiple-printed-panel for circuit board side, and scraper plate compresses downwards steel net template, carries out scraping tin cream using scraper, with Scraper, which was scraped, not to be remained tin cream after steel mesh and is defined, and scraper angle may be controlled to 45 degree, use the Stress control of scraper about 5kg, used scraper are rubber scraper.
Tin cream is the medium of electronic component and welding circuit board, and form starts to change after tin cream is heated to 183 degrees Celsius, At this moment tin cream is just changed into molten condition from paste, and the tin cream of molten condition is flow between electronic component and pad, works as melting The tin cream temperature of state will become solid fraction body after reducing, so as to be fixed electronic component and make electronic component and circuit board Produce electric connection.
M103, SMD components are attached on pad.
Fig. 3 and Fig. 4 are referred to, Fig. 3 is that multiple-printed-panel for circuit board and SMD components assemble an embodiment in Fig. 1 embodiments of the method Top view, Fig. 4 is the sectional view in A directions in Fig. 3.
SMD components 20 include main part 22 and pin 24, and main part 22 is connected with pin 24, and SMD components 20 are logical To cross pin 24 and produce electric connection with circuit board 12, main part 22 can be electrically connected with other electronic components or circuit board, To realize the function such as conducting or regulation, such as the regulation operation such as volume and switching on and shutting down.
Circuit board 12 can be single layer board or multilayer circuit board, the shape of pad 122 can be it is circular, square or Person is the arbitrary shapes such as polygon, and pad 122 is provided with dew copper 124, the pins 24 of SMD components 20 be attached on pad 122 with Dew copper 124 is connected so as to produce electrical connection.The opposite both sides 222 of the main part 22 of SMD components 20 are convex with adjacent position Portion 144 is played to contact, the main part of SMD components 20 22 is overall be fitted in the place plane 126 of pad 122 or with plane 126 Certain interval be present.
M104, Overheating Treatment is carried out to the multiple-printed-panel for circuit board for sticking SMD components, solder makes SMD components and circuit It is electrically connected between plate jigsaw, wherein, limiting plate is used for the movement for limiting SMD components plane where pad.
The multiple-printed-panel for circuit board 10 after step M103 processing is heated, tin cream is heated to be melted into drawing for SMD components 20 Gap between pin 24 and dew copper 124, the dew copper that will be set after tin cream cooling in the pin 24 of SMD components 20 and pad 122 124 connection conductings.
During thawing, because tin cream is molten condition, SMD components 20 can be because the effect of external force And produce drift, such as wind blow or the shake of machine itself.But due to the main part 22 of SMD components 20 Opposite both sides 222 contact with the lug boss 144 of limiting plate 14, so SMD components 20 can be in the restriction effect of lug boss 144 Under without producing the phenomenon of drift in the place plane 126 of pad 122, the main part 22 of SMD components 20 in addition Opposite both sides 222 contact with lug boss 144, and contact will produce friction, frictional force can further prevent SMD components 20 and Contact surface relatively moves.
Alternatively, heating means are Reflow Soldering or wave-soldering.Reflow Soldering be air or nitrogen are heated to it is sufficiently high Temperature after-blow allows the solder of electronic component both sides to be glued after melting with circuit board to the circuit board for having posted electronic component Knot.The advantage of this technique is that temperature is easily controllable, and oxidation is also avoided that in welding process, and manufacturing cost is also easier to control. Wave-soldering refers to the solder of fusing, the solder wave through electrodynamic pump or electromagnetic pump jet flow into design requirement, also can be by weldering Material pond injects nitrogen to be formed, and the circuit board for making to be pre-loaded with electronic component realizes that electronic component welds by solder wave The room machine and the solder of electrical connection of end or pin with board pads.
M105, limiting plate is removed, to obtain circuit board assemblies.
Referring to Fig. 5, Fig. 5 is the top view of the embodiment of circuit board assemblies one in Fig. 1 embodiments of the method.By multiple-printed-panel for circuit board Limiting plate 14 get rid of, it is possible to obtain circuit board assemblies 30, circuit board assemblies 30 include circuit board 12 and SMD components 20, SMD components 20 are attached on the pad of circuit board 12 and (do not shown on figure) to be connected with circuit board 12.Machinery can be taken to add The mode of work removes, such as CNC cuttings or mould punching.Mode manually can also be taken to remove, in order to mitigate people The labor intensity of work can set a groove (not shown on figure) in limiting plate 14 and the junction of circuit board 12, because groove can be with Power is effectively given to the tip for focusing on groove, so groove is it is possible to prevente effectively from circuit board damages because artificial strength is uneven Hinder the phenomenon of the structure of circuit board 12.
The multiple-printed-panel for circuit board 10 of the present embodiment sets limiting plate 14, and the pin 24 of SMD components 20 is attached on pad 122, The opposite both sides 222 of SMD components 20 contact with limiting plate 14, so as to which limiting plate 14 limits SMD components 20 in pad 122 The movement of place plane 126, on the premise of additionally cost is not increased, the accurate position for limiting SMD components 20, significantly Improve the assembly precision of SMD components 20 and other electronic components.
Further, in another embodiment of preparation method of circuit board assemblies, Fig. 6 and Fig. 7 are referred to, Fig. 6 is Fig. 1 side The top view of another embodiment of multiple-printed-panel for circuit board in method embodiment, Fig. 7 are multiple-printed-panel for circuit board and paster member in Fig. 1 embodiments of the method Device assembles the top view of another embodiment.Multiple-printed-panel for circuit board 10a includes circuit board 12 and is connected to the limiting plate of circuit board 12 14, circuit board 12 is provided with pad 122, and the present embodiment multiple-printed-panel for circuit board 10a and upper embodiment multiple-printed-panel for circuit board 10 difference exist It is N number of and be disposed adjacent in the quantity of pad 122, the corresponding SMD components 20 for sticking respective numbers, N is more than or equal to 2 and be integer.SMD components 20 can be same type or different types, and the SMD components 20 of same type can Because of the difference of installation site SMD components 20 can be caused different from the corresponding shape of the contact position of lug boss 144, no The SMD components 20 of same type may be because the difference of shape and cause SMD components 20 and the contact position of lug boss 144 Corresponding position is different.The quantity of lug boss 144 is N+1, wherein, have N-1 lug boss 144 opposite both sides 146 and The SMD components 20 of adjacent position contact.Specifically, the present embodiment with pad 122 be two, it is corresponding installation two pasters Component 20, the quantity of corresponding lug boss 144 is three illustrations.The lug boss 144 1 of limiting plate 14 is located at two Between SMD components 20, the opposite both sides 146 of lug boss 144 contact with the SMD components 20 of adjacent position, two other Positioned at the both sides of two SMD components 20, the opposite both sides 222 of the main part 22 of SMD components 20 are convex with adjacent position Play portion 144 to contact, lug boss 144 limits SMD components 20 in the movement of the place plane of pad 122, the shape of lug boss 144 Depending on the concrete shape of SMD components 20 Yu the contact position of lug boss 144, as long as playing the shape of contact position-limiting action all It can receive, such as circular, ellipse, rectangle or irregular shape etc..
The present embodiment beneficial effect is, makes full use of the opposite both sides of the which part lug boss 144 of limiting plate 14 146, SMD components 20 can both sides 146 opposite with which part lug boss 144 contact, needing the patch of spacing identical quantity During piece component 20, it is possible to reduce the quantity of lug boss 144 of limiting plate 14, increase multiple-printed-panel for circuit board 10a space availability ratio.
Further, in the preparation method another embodiment of circuit board assemblies, Fig. 8 and Fig. 9 are referred to, Fig. 8 is Fig. 1 side The top view of multiple-printed-panel for circuit board another embodiment in method embodiment, Fig. 9 are multiple-printed-panel for circuit board and paster member in Fig. 1 embodiments of the method Device assembles the top view of another embodiment.Multiple-printed-panel for circuit board 10b includes circuit board 12 and is connected to the limiting plate of circuit board 12 14, circuit board 12 is provided with pad 122, and pad 122 is multiple and is disposed adjacent, the SMD components of corresponding insertion respective numbers 20, the present embodiment multiple-printed-panel for circuit board 10b and upper embodiment multiple-printed-panel for circuit board 10 difference are connecting portion 142 and paster member device The main part 22 of part 20 contacts.Connecting portion 142, lug boss 144 limit SMD components 20 in the place plane of circuit board 12 jointly Movement.
The present embodiment beneficial effect is, makes full use of the connecting portion 142 of limiting plate 14, and SMD components 20 can be with connecting Socket part 142 contacts, when needing the SMD components 20 of spacing identical quantity, it is possible to reduce the lug boss 144 of limiting plate 14 counts Amount, increase multiple-printed-panel for circuit board 10b space availability ratio.
Alternatively, in the another embodiment of preparation method of circuit board assemblies, Figure 10 and Figure 11 are referred to, Figure 10 is Fig. 1 The top view of the another embodiment of multiple-printed-panel for circuit board in embodiment of the method, Figure 11 are multiple-printed-panel for circuit board and patch in Fig. 1 embodiments of the method The top view of the another embodiment of piece components and parts assembling.Multiple-printed-panel for circuit board 10b includes circuit board 12 and is connected to the limit of circuit board 12 Position plate 14, circuit board 12 are provided with pad 122, the present embodiment multiple-printed-panel for circuit board 10c and upper embodiment multiple-printed-panel for circuit board 10b difference Point is connecting portion between SMD components 20, the opposite both sides (not indicated on figure) of connecting portion 142 all with adjacent position The main parts 22 of SMD components 20 contact.The opposite both sides of connecting portion 142, lug boss 144 limit SMD components jointly 20 the place plane of circuit board 12 movement.
The present embodiment beneficial effect is, makes full use of the 142 opposite both sides of connecting portion of limiting plate 14, connecting portion is in patch Between piece component 20, SMD components 20 can need the patch of spacing identical quantity with opposite two side contacts of connecting portion 142 During piece component 20, it is possible to reduce the quantity of lug boss 144 of limiting plate 14, increase multiple-printed-panel for circuit board 10c space availability ratio.Separately Outside, because connecting portion 142 is between SMD components 20, position more levels off to centre, so circuit board layout 10c's is whole Body structure is more uniform, and overall stability has obtained significant raising.
In the above-described embodiments, limiting plate includes connecting portion and lug boss.In certain embodiments, limiting plate does not include connecting Socket part and lug boss, limiting plate directly contact with the main part of SMD components, limit SMD components jointly with pad in electricity The movement of plane where the plate of road.
Alternatively, in the preparation method a further embodiment of circuit board assemblies, Figure 12 and Figure 13 are referred to, Figure 12 is Fig. 1 The top view of multiple-printed-panel for circuit board a further embodiment in embodiment of the method, Figure 13 are multiple-printed-panel for circuit board and patch in Fig. 1 embodiments of the method The top view of piece components and parts assembling a further embodiment.Multiple-printed-panel for circuit board 10d includes circuit board 12 and is connected to the limit of circuit board 12 Position plate 14, circuit board 12 are provided with pad 122, and circuit board 12 is multiple, and circuit board 12 can be mutually isostructural or different knots Structure, the structure of actual circuit plate 12 and quantity, limiting plate 14 are determined according to needs of production and the utilization ratio of plank Between circuit board 12, each circuit board 12 is connected.SMD components 20 include main part 22 and pin (not indicated on figure), Main part 22 is connected with pin, and pin is installed on pad 122.The opposite both sides of the main part 22 of SMD components 20 with it is adjacent The limiting plate 14 of position contacts, to limit movement of the SMD components 20 in the place plane of pad 122.
The present embodiment beneficial effect is that limiting plate 14 both plays limitation SMD components 20 in the place plane of pad 122 Mobile purpose, each circuit board 12 can be connected again, make whole circuit board layout 10d structure more stable and firm.
Further, in the preparation method another embodiment of circuit board assemblies, Figure 14 and Figure 15, Tu14Shi are referred to The top view of multiple-printed-panel for circuit board another embodiment in Fig. 1 embodiments of the method, Figure 15 are multiple-printed-panel for circuit board in Fig. 1 embodiments of the method With the top view of SMD components assembling another embodiment.Multiple-printed-panel for circuit board 10e includes circuit board 12 and is connected to circuit board 12 limiting plate 14, circuit board 12 are provided with pad 122, the present embodiment multiple-printed-panel for circuit board 10e and upper embodiment multiple-printed-panel for circuit board 10d Difference be the quantity of pad 122 for N and be disposed adjacent that the SMD components 20 of corresponding installation respective numbers, N is more than Or equal to 2 and it is integer.The quantity of limiting plate 14 is N+1, wherein, have the opposite both sides of N-1 limiting plate 14 with it is adjacent The SMD components 20 of position contact.Specifically, the present embodiment with pad 122 be two, it is corresponding installation two paster member devices Part 20, the quantity of corresponding limiting plate 14 is three illustrations.One of limiting plate 14 positioned at two SMD components 20 it Between, the opposite both sides 148 of the limiting plate 14 contact with the SMD components 20 of adjacent position, and two other is located at two paster members The both sides of device 20, the opposite both sides of the main part 22 of SMD components 20 contact with the limiting plate 14 of adjacent position, limiting plate 14 limit movement of the SMD components 20 in the place plane of pad 122, and the shape of limiting plate 14 is according to SMD components 20 and limit Depending on the concrete shape of the position contact position of plate 14, it can receive as long as playing the shape of contact position-limiting action, for example, it is circular, oval Shape, rectangle or irregular shape etc..
The present embodiment beneficial effect is, makes full use of the opposite both sides of limiting plate 14, and SMD components 20 can be with it Middle opposite two side contacts of part limiting plate 14, when needing the SMD components 20 of spacing identical quantity, it is possible to reduce limiting plate 14 quantity, increase multiple-printed-panel for circuit board 10e space availability ratio.
In the above-described embodiments, it is proposed that polytype multiple-printed-panel for circuit board.
Referring to Fig. 2, multiple-printed-panel for circuit board 10 includes circuit board 12 and is connected to the limiting plate 14 of circuit board 12.Circuit board 12 Provided with pad 122, pad 122 is used to install SMD components (specifically referring to SMD components 20 in Fig. 3), and limiting plate 14 is used In limitation with pad 122 be connected SMD components the place plane of pad 122 movement.
Alternatively, the limiting plate 14 of multiple-printed-panel for circuit board 10 includes connecting portion 142 and lug boss 144, connecting portion 142 respectively with Circuit board 12 and lug boss 144 connect, and the lug boss 144 of adjacent position is used for the paster member being connected with pad 122 Opposite two side contacts of device, to limit movement of the SMD components in the place plane of pad 122.
Further, referring to Fig. 6, the quantity of multiple-printed-panel for circuit board 10a pad 122 is N number of and is disposed adjacent, lug boss 144 quantity is N+1, wherein, the opposite both sides for having N-1 lug boss 144 are used for the adjacent bit being connected with pad 122 The SMD components contact put, N are more than or equal to 2 and are integer.
Further, referring to Fig. 8, multiple-printed-panel for circuit board 10b connecting portion 142 is used for the patch being connected with pad 122 Piece component contacts.
Further, referring to Fig. 10, multiple-printed-panel for circuit board 10c connecting portion 142 is between pad 122, connecting portion 142 Opposite both sides be all used to contact with the SMD components of adjacent position that pad 122 is connected.
Alternatively, Figure 12 is referred to, multiple-printed-panel for circuit board 10d circuit board 12 is multiple, and the limiting plate 14 of adjacent position is used In opposite two side contacts for the SMD components that limitation is connected with pad 122, to limit the patch being connected with pad 122 Movement of the piece component in the place plane of pad 122.
Further, Figure 14 is referred to, the quantity of multiple-printed-panel for circuit board 10e pad 122 is N number of and is disposed adjacent, spacing The quantity of plate 14 is N+1, wherein, the opposite both sides for having N-1 limiting plate 14 are used for the adjacent bit being connected with pad 122 The SMD components contact put, N are more than or equal to 2 and are integer.
Referring to Fig. 5, the application provides a kind of embodiment of circuit board assemblies, the circuit board assemblies 30 pass through foregoing circuit The preparation method of board component, processing foregoing circuit plate jigsaw 10,10a, 10b, 10c, 10d or 10e obtain electricity as shown in Figure 5 Road board component 30.Circuit board assemblies 30 include circuit board 12 and SMD components 20, and circuit board 12 (does not show provided with pad on figure Show), SMD components 20 are inserted in pad and are connected with circuit board 12.
Figure 16 is referred to, the application provides a kind of embodiment of mobile terminal, and mobile terminal includes foregoing circuit board component 30th, mobile phone screen assembly 40 and rear shell 50, mobile phone screen assembly 40 and rear shell 50 are interconnected so as to form confined space, circuit board assemblies 30 are contained in confined space with the circuit main board (not shown on figure) in mobile terminal or other electronic components (on figure Do not show) it is electrically connected with, so that mobile terminal can realize different functions.
Presently filed embodiment is the foregoing is only, not thereby limits the scope of the claims of the application, it is every to utilize this The equivalent structure or equivalent flow conversion that application specification and accompanying drawing content are made, or be directly or indirectly used in other related Technical field, similarly it is included in the scope of patent protection of the application.

Claims (17)

  1. A kind of 1. preparation method of circuit board assemblies, it is characterised in that including：
    Multiple-printed-panel for circuit board is provided, the multiple-printed-panel for circuit board includes circuit board and is connected to the limiting plate of the circuit board, the electricity Road plate is provided with pad；
    Solder is applied to the pad；
    SMD components are attached on the pad；
    Overheating Treatment is carried out to the multiple-printed-panel for circuit board for sticking the SMD components, the solder makes the SMD components It is electrically connected between the multiple-printed-panel for circuit board, wherein, the limiting plate is used to limit the SMD components in the pad The movement of place plane；
    The limiting plate is removed, to obtain the circuit board assemblies.
  2. 2. preparation method according to claim 1, it is characterised in that
    SMD components are attached in the step on the pad described, the limiting plate includes connecting portion and lug boss, institute Connecting portion is stated to be connected with the circuit board and the lug boss respectively, the opposite both sides and adjacent position of the SMD components The lug boss contact, to limit the movement of SMD components plane where the pad.
  3. 3. preparation method according to claim 2, it is characterised in that
    The quantity of the pad is N number of and be disposed adjacent, the SMD components of corresponding installation respective numbers, the projection The quantity in portion is N+1, wherein, the SMD components for having the opposite both sides and adjacent position of the N-1 lug bosses connect Touch, N is more than or equal to 2 and is integer.
  4. 4. preparation method according to claim 2, it is characterised in that
    The connecting portion contacts with the SMD components.
  5. 5. preparation method according to claim 4, it is characterised in that
    The connecting portion is between the SMD components, the patch of the opposite both sides of the connecting portion all with adjacent position Piece component contacts.
  6. 6. preparation method according to claim 1, it is characterised in that
    The circuit board is multiple, SMD components is attached in the step on the pad described, the SMD components Opposite both sides contacted with the limiting plate of adjacent position, to limit the shifting of SMD components plane where pad It is dynamic.
  7. 7. preparation method according to claim 6, it is characterised in that
    The quantity of the pad is N number of and is disposed adjacent that the SMD components of corresponding installation respective numbers are described spacing The quantity of plate is N+1, wherein, the SMD components for having the opposite both sides and adjacent position of the N-1 limiting plates connect Touch, N is more than or equal to 2 and is integer.
  8. 8. preparation method according to claim 1, it is characterised in that including：
    The solder is tin cream, and the Overheating Treatment is Reflow Soldering.
  9. A kind of 9. multiple-printed-panel for circuit board, it is characterised in that including：
    Circuit board and the limiting plate for being connected to the circuit board；
    Wherein, the circuit board is provided with pad, and the pad is used to install SMD components, and the limiting plate is used to limit and institute State the movement of SMD components plane where the pad of pad mating connection.
  10. 10. multiple-printed-panel for circuit board according to claim 9, it is characterised in that
    The limiting plate includes connecting portion and lug boss, and the connecting portion is connected with the circuit board and the lug boss respectively, The lug boss of adjacent position is used for opposite two side contacts for the SMD components being connected with the pad, with limit Make the movement of SMD components plane where the pad.
  11. 11. multiple-printed-panel for circuit board according to claim 10, it is characterised in that
    The quantity of the pad is N number of and is disposed adjacent that the quantity of the lug boss is N+1, wherein, there is N-1 individual described convex The opposite both sides in the portion of rising are used to contact with the SMD components of adjacent position that the pad is connected, N be more than or Equal to 2 and it is integer.
  12. 12. multiple-printed-panel for circuit board according to claim 10, it is characterised in that
    The connecting portion is used to contact with the SMD components that the pad is connected.
  13. 13. multiple-printed-panel for circuit board according to claim 12, it is characterised in that
    For the connecting portion between the pad, the opposite both sides of the connecting portion are all used for what is be connected with the pad The SMD components contact of adjacent position.
  14. 14. multiple-printed-panel for circuit board according to claim 9, it is characterised in that
    The circuit board is multiple, and the limiting plate of adjacent position is used for the paster member device being connected with the pad Opposite two side contacts of part, to limit the SMD components being connected with pad plane where the pad It is mobile.
  15. 15. multiple-printed-panel for circuit board according to claim 14, it is characterised in that
    The quantity of the pad is N number of and is disposed adjacent that the quantity of the limiting plate is N+1, wherein, there are the N-1 limits The opposite both sides of position plate are used to contact with the SMD components of adjacent position that the pad is connected, N be more than or Equal to 2 and it is integer.
  16. A kind of 16. circuit board assemblies, it is characterised in that including：
    Circuit board, provided with pad；
    SMD components, it is attached on the pad and is connected with the circuit board；
    Wherein, the circuit board assemblies are made up of the preparation method described in any one of claim 1 to 8.
  17. A kind of 17. mobile terminal, it is characterised in that including：
    Circuit board assemblies described in claim 16.
CN201710844200.9A 2017-09-18 2017-09-18 Circuit board assembly and manufacturing method thereof, circuit board jointed board and mobile terminal Expired - Fee Related CN107660085B (en)

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Application Number Priority Date Filing Date Title
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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110099506A (en) * 2019-05-09 2019-08-06 深圳市锐尔觅移动通信有限公司 A kind of electronic equipment, printed circuit board and preparation method thereof

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07245474A (en) * 1994-03-04 1995-09-19 Ibiden Co Ltd Method of mounting surface-mounting electronic part
CN201781683U (en) * 2010-07-19 2011-03-30 廖明忠 Circuit board for binding bare chip of sensor
CN203467081U (en) * 2013-09-10 2014-03-05 珠海市嘉德电能科技有限公司 Auxiliary tool for circuit board surface mount technology

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH07245474A (en) * 1994-03-04 1995-09-19 Ibiden Co Ltd Method of mounting surface-mounting electronic part
CN201781683U (en) * 2010-07-19 2011-03-30 廖明忠 Circuit board for binding bare chip of sensor
CN203467081U (en) * 2013-09-10 2014-03-05 珠海市嘉德电能科技有限公司 Auxiliary tool for circuit board surface mount technology

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110099506A (en) * 2019-05-09 2019-08-06 深圳市锐尔觅移动通信有限公司 A kind of electronic equipment, printed circuit board and preparation method thereof

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