CN115194276B - Welding process of endoscope illumination module - Google Patents
Welding process of endoscope illumination module Download PDFInfo
- Publication number
- CN115194276B CN115194276B CN202210830378.9A CN202210830378A CN115194276B CN 115194276 B CN115194276 B CN 115194276B CN 202210830378 A CN202210830378 A CN 202210830378A CN 115194276 B CN115194276 B CN 115194276B
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- Prior art keywords
- wire
- bonding pad
- solder paste
- piece
- red copper
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/0008—Soldering, e.g. brazing, or unsoldering specially adapted for particular articles or work
- B23K1/0016—Brazing of electronic components
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/06—Solder feeding devices; Solder melting pans
- B23K3/0607—Solder feeding devices
- B23K3/0638—Solder feeding devices for viscous material feeding, e.g. solder paste feeding
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/08—Auxiliary devices therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2101/00—Articles made by soldering, welding or cutting
- B23K2101/36—Electric or electronic devices
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/18—Dissimilar materials
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K2103/00—Materials to be soldered, welded or cut
- B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26
- B23K2103/52—Ceramics
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- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Endoscopes (AREA)
Abstract
The invention provides a welding process of an endoscope lighting module, and belongs to the technical field of endoscopes. A welding process of an endoscope illumination module, comprising: s1, printing low-melting-point solder paste on a bonding pad on the front surface of a ceramic piece, and arranging an LED lamp at the bonding pad; s2, printing high-melting-point solder paste on a bonding pad on the front surface of the red copper piece; s3, arranging a back bonding pad of the ceramic piece on a front bonding pad of the red copper piece, enabling the polarity holes of the ceramic piece to correspond to the wire holes of the red copper piece one by one, and welding at high temperature; s4, penetrating one end of a wire from a wire hole of the red copper piece to a polarity hole of the ceramic piece, enabling a wire core of the wire to be attached to a front bonding pad of the ceramic piece, and enabling an insulating layer of the wire to enter the polarity hole of the ceramic piece; s5, coating the low-melting-point solder paste on a bonding pad on the front surface of the ceramic part, wrapping a wire core of the wire, and performing low-temperature welding.
Description
Technical Field
The invention belongs to the technical field of endoscopes, and particularly relates to a welding process of an endoscope lighting module.
Background
In the welding process of the existing endoscope lighting module, the defects of LED secondary heating damage or blue light exposure, high-temperature-resistant wire breakage and bending, irregular forming of welding spots with positive and negative polarities for power supply or irregular forming of welding spots with positive and negative polarities, short circuit of red copper parts or contact position of wire holes with ceramic parts for carrying polarities during power supply exist, and the high-temperature-resistant wire ends with positive and negative polarities are directly conducted with the copper parts, so that the yield of the lighting module is extremely low, and the risk of oral electric shock in the use process or part of the lighting module cannot be used is caused.
Disclosure of Invention
The invention aims to solve the problems in the prior art, provides a welding process of an endoscope lighting module, and solves the problem of low yield in the welding process of the endoscope lighting module.
The aim of the invention can be achieved by the following technical scheme:
a welding process of an endoscope illumination module, comprising
S1, printing low-melting-point solder paste on a bonding pad on the front surface of a ceramic piece, and arranging an LED lamp at the bonding pad;
s2, printing high-melting-point solder paste on a bonding pad on the front surface of the red copper piece;
s3, arranging a back bonding pad of the ceramic piece on a front bonding pad of the red copper piece, enabling the polarity holes of the ceramic piece to correspond to the wire holes of the red copper piece one by one, and welding at high temperature;
s4, penetrating one end of a wire from a wire hole of the red copper piece to a polarity hole of the ceramic piece, enabling a wire core of the wire to be attached to a front bonding pad of the ceramic piece, and enabling an insulating layer of the wire to enter the polarity hole of the ceramic piece;
s5, coating the low-melting-point solder paste on a bonding pad on the front surface of the ceramic part, wrapping a wire core of the wire, and performing low-temperature welding.
In the welding process of the endoscope illumination module, in step S1 and step S2, a steel screen printing method is adopted.
In the welding process of the endoscope illumination module, the difference between the melting point of the high-melting-point solder paste and the melting point of the low-melting-point solder paste is more than 100 ℃, and the lowest melting point of the low-melting-point solder paste is required to be more than 150 ℃.
In the welding process of the endoscope illumination module, the highest melting point of the high melting point solder paste is 260 ℃, and the highest melting point of the low melting point solder paste is 160 ℃.
In the welding process of the endoscope illumination module, the temperature and humidity requirements of a workshop are as follows: the temperature is 20-28 ℃, and the humidity is 60-80%.
In the above welding process of the endoscope illumination module, in step S5, the outer end of the polar hole is covered with a low melting point solder paste.
In the welding process of the endoscope illumination module, after step S5, the superfluous wire cores on the surface after welding are cut off along the surface welding spots, and the cut surface is coated with solder paste and welded at low temperature.
In the welding process of the endoscope lighting module, the wire holes of the ceramic piece correspond to the wire holes of the red copper piece one by one, the polar holes are vertically arranged on the front surface of the bonding pad of the red copper piece, and the edge of the ceramic piece is aligned with the edge of the red copper piece.
Compared with the prior art, the invention has the following advantages:
1. by means of printing, the occurrence of overflow of solder on the LED bonding pad, the ceramic piece and the red copper piece bonding pad is reduced.
2. After penetrating to the polarity hole through the wire, the at least partial polar hole that wears out of sinle silk of wire, and the insulating layer of wire also gets into in the polarity hole to effectual copper piece appears short circuit or carries polarity when having reduced the power supply, at copper piece's line hole and ceramic piece contact position, the sinle silk of positive and negative polarity wire and the direct problem of switching on of copper piece.
3. Through the setting that adopts the melting point solder paste and low-melting point solder paste, can make and connect in batches between the different parts on the same subassembly, reduced the possibility that LED lamp, wire damaged.
Drawings
Fig. 1 is a schematic view of an endoscope illumination module according to the present invention.
In the drawing the view of the figure,
2. a ceramic member; 21. a polar hole;
3. a red copper piece; 31. a wire hole;
4. an LED lamp;
5. a wire; 51. a wire core; 52. an insulating layer;
6. high-melting-point solder paste;
7. low melting point tin paste.
Description of the embodiments
The following description of the embodiments of the present invention will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
As shown in figure 1 of the drawings,
a welding process of an endoscope illumination module comprises
S1, printing low-melting-point solder paste 7 on a bonding pad on the front surface of a ceramic piece 2, and arranging an LED lamp 4 at the bonding pad;
in the step, the LED lamp 4 is arranged at a preset position, and the front bonding pad of the ceramic piece 2 comprises at least one positive bonding pad and at least one negative bonding pad, which can be adjusted according to actual conditions; the ceramic piece 2 is in the prior art, and the ceramic piece 2 is provided with a front bonding pad and a back bonding pad;
the solder paste is arranged on the bonding pad on the front surface of the ceramic piece 2 in a printing mode, so that the method is stable and high in precision, and the solder paste on the bonding pad overflows less.
S2, printing high-melting-point solder paste 6 on the front bonding pad of the red copper piece 3;
the solder paste is arranged on the bonding pad on the front surface of the red copper piece 3 in a printing mode, so that the method is stable and high in precision, and the solder paste on the bonding pad overflows less;
s3, arranging a back bonding pad of the ceramic piece 2 on a front bonding pad of the red copper piece 3, enabling the polarity holes 21 of the ceramic piece 2 to correspond to the wire holes 31 of the red copper piece 3 one by one, and welding at a high temperature;
in the step, the ceramic piece 2 is placed on the red copper piece 3, and then the assembly is sent into a reflow soldering agent for high-temperature soldering, so that the ceramic piece 2 and the red copper piece 3 are connected together; the polarity holes 21 of the ceramic piece 2 correspond to the wire holes 31 of the red copper piece 3, so that the subsequent wire 5 can be conveniently penetrated;
s4, one end of the lead 5 is penetrated from the wire hole 31 of the red copper piece 3 to the polar hole 21 of the ceramic piece 2, the wire core 51 of the lead 5 is attached to the front bonding pad of the ceramic piece 2, and the insulating layer 52 of the lead 5 enters the polar hole 21 of the ceramic piece 2;
in this step, after the wire 5 penetrates into the polar hole 21, at least part of the wire core 51 of the wire 5 penetrates out of the polar hole 21, and the insulating layer 52 of the wire 5 also enters into the polar hole 21, so that the problem that the red copper member 3 is short-circuited or carries polarity during power supply is effectively reduced, and the wire core 51 of the wire 5 with positive and negative polarities is directly conducted with the red copper member 3 at the contact position of the wire hole 31 of the red copper member 3 and the ceramic member 2.
S5, coating the low-melting-point solder paste 7 on a bonding pad on the front surface of the ceramic part 2, wrapping the wire core 51 of the lead 5, and performing low-temperature welding. By adopting the low Wen Xigao different from the former steps, under the condition that the solder paste is melted in the former steps, the high-temperature solder paste in the former steps is not melted, so that the connection and fixation of the wire core 51 of the lead 5 in the steps are reduced, and the position relationship among the ceramic piece 2, the LED lamp 4 and the red copper piece 3 is not influenced. And, adopt low temperature solder paste, in the heating process, reduced the possibility that wire 5 outside insulating layer 52 damaged, reduced the emergence of short circuit condition.
Specifically, in step S1 and step S2, a steel screen printing method is adopted. The method has the advantages of high precision, stability and low cost.
Specifically, the difference between the melting points of the high-melting-point solder paste 6 and the low-melting-point solder paste 7 is more than 100 ℃, and the lowest melting point of the low-melting-point solder paste 7 is required to be more than 150 ℃. By providing a difference in melting points, it is possible to batch-connect the different components on the same assembly. The assembly is more convenient. For example, in the invention, the LED lamp 4, the red copper member 3 and the ceramic member 2 are welded and fixed in advance by using the solder paste with a high melting point, and then the lead 5 is connected with the front bonding pad of the ceramic member 2 by using the solder paste with a low melting point, so that the possibility of damaging the insulating layer 52 of the lead 5 by temperature can be reduced.
Specifically, the highest melting point of the high melting point solder paste 6 was 260 ℃, and the highest melting point of the low melting point solder paste 7 was 160 ℃. The two melting points are selected, so that the connection strength can be ensured, and meanwhile, in the reflow soldering process, the subsequent soldering temperature is reduced, and the influence on the prior soldering step is caused.
Specifically, the temperature and humidity requirements of a workshop are as follows: the temperature is 20-28 ℃, and the humidity is 60-80%. The best welding effect is achieved at this temperature and humidity.
Specifically, in step S5, the outer ends of the polarity holes 21 are covered with the low-melting-point solder paste 7. Has better connection effect after welding.
Specifically, after step S5, the soldered surface surplus wire cores 51 are cut off along the surface solder joints, and solder paste is coated on the cut-off surface, and soldering is performed at low temperature. The welding spots with positive and negative polarities are powered to be irregularly formed or have the height larger than the surface height of the LED lamp 4, the part higher than the surface of the LED lamp 4 can be cut off, then the welding spots are coated with low Wen Xigao again, and the surface of the welding spots is smooth and attractive after being heated.
Specifically, the polarity holes 21 of the ceramic piece 2 are in one-to-one correspondence with the line holes 31 of the red copper piece 3, the polarity holes 21 are vertically arranged on the front bonding pad of the red copper piece 3, and the edge of the ceramic piece 2 is aligned with the edge of the red copper piece 3. The design can make the endoscope lighting module more beautiful. And when placing ceramic part 2 on red copper spare 3, also align more easily, easy to assemble. And the polar hole 21 is in the same line with the red copper member 3.
It should be noted that all directional indicators (such as up, down, left, right, front, and rear … …) in the embodiments of the present invention are merely used to explain the relative positional relationship, movement, etc. between the components in a particular posture (as shown in the drawings), and if the particular posture is changed, the directional indicator is changed accordingly.
Furthermore, the description of "first," "second," etc. in this disclosure is for descriptive purposes only and is not to be construed as indicating or implying a relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. Meanwhile, the meaning of "and/or" appearing throughout the text is to include three schemes, taking "a and/or B" as an example, including a scheme, or B scheme, or a scheme that a and B satisfy simultaneously. In addition, the technical solutions of the embodiments may be combined with each other, but it is necessary to base that the technical solutions can be realized by those skilled in the art, and when the technical solutions are contradictory or cannot be realized, the combination of the technical solutions should be considered to be absent and not within the scope of protection claimed in the present invention.
All the components are general standard components or components known to the person skilled in the art, and the structures and principles of the components are known to the person skilled in the art through technical manuals or through routine experimental methods.
The specific embodiments described herein are offered by way of example only to illustrate the spirit of the invention. Those skilled in the art may make various modifications or additions to the described embodiments or substitutions thereof without departing from the spirit of the invention or exceeding the scope of the invention as defined in the accompanying claims.
Claims (8)
1. A welding process of an endoscope illumination module, comprising
S1, printing low-melting-point solder paste (7) on a bonding pad on the front surface of a ceramic piece (2), and arranging an LED lamp (4) at the bonding pad;
s2, printing high-melting-point solder paste (6) on a front bonding pad of the red copper piece (3);
s3, arranging a back bonding pad of the ceramic piece (2) on a front bonding pad of the red copper piece (3), enabling the polarity holes (21) of the ceramic piece (2) to correspond to the wire holes (31) of the red copper piece (3) one by one, and welding at a high temperature;
s4, penetrating one end of a wire (5) from a wire hole (31) of the red copper piece (3) to a polar hole (21) of the ceramic piece (2), enabling a wire core (51) of the wire (5) to be attached to a front bonding pad of the ceramic piece (2), and enabling an insulating layer (52) of the wire (5) to enter the polar hole (21) of the ceramic piece (2);
s5, coating the low-melting-point solder paste (7) on a bonding pad on the front surface of the ceramic part (2) and wrapping a wire core (51) of the lead (5), and performing low-temperature welding.
2. The welding process of an endoscope illumination module according to claim 1, wherein in step S1 and step S2, a steel screen printing method is adopted.
3. The welding process of an endoscope illumination module according to claim 1, characterized in that the melting point of the high melting point solder paste (6) differs from the melting point of the low melting point solder paste (7) by more than 100 ℃, the minimum melting point of the low melting point solder paste (7) being required to be more than 150 ℃.
4. A soldering process for an endoscope illumination module according to claim 3, characterized in that the highest melting point of the high melting point solder paste (6) is 260 ℃ and the highest melting point of the low melting point solder paste (7) is 160 ℃.
5. The welding process of an endoscope illumination module according to claim 1, wherein the shop temperature and humidity requirements: the temperature is 20-28 ℃, and the humidity is 60-80%.
6. Welding process of an endoscope illumination module according to claim 1, characterized in that in step S5 the outer ends of the polar holes (21) are covered with a low melting point solder paste (7).
7. The welding process of an endoscope illumination module according to claim 1, wherein after step S5, the welded surface surplus wire cores (51) are cut off along the surface pads, and solder paste is applied to the cut-off surfaces, and the welding is performed at a low temperature.
8. The welding process of an endoscope illumination module according to claim 1, wherein the polar holes (21) of the ceramic piece (2) are in one-to-one correspondence with the wire holes (31) of the red copper piece (3), the polar holes (21) are vertically arranged on the front bonding pad of the red copper piece (3), and the edge of the ceramic piece (2) is aligned with the edge of the red copper piece (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210830378.9A CN115194276B (en) | 2022-07-13 | 2022-07-13 | Welding process of endoscope illumination module |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202210830378.9A CN115194276B (en) | 2022-07-13 | 2022-07-13 | Welding process of endoscope illumination module |
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| Publication Number | Publication Date |
|---|---|
| CN115194276A CN115194276A (en) | 2022-10-18 |
| CN115194276B true CN115194276B (en) | 2023-09-15 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202210830378.9A Active CN115194276B (en) | 2022-07-13 | 2022-07-13 | Welding process of endoscope illumination module |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104042179A (en) * | 2014-07-04 | 2014-09-17 | 王刚 | Integrated medical endoscope system |
| CN213704921U (en) * | 2020-10-21 | 2021-07-16 | 上海龙旗科技股份有限公司 | Verification structure for printing high-low temperature solder paste on PCB |
| CN114192915A (en) * | 2021-12-27 | 2022-03-18 | 烟台台芯电子科技有限公司 | IGBT welding process method |
| CN114682870A (en) * | 2022-03-29 | 2022-07-01 | 联宝(合肥)电子科技有限公司 | POP hybrid welding process and system |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20110308847A1 (en) * | 2010-06-21 | 2011-12-22 | Randy Allen Normann | Method for high-temperature circuit board assembly |
-
2022
- 2022-07-13 CN CN202210830378.9A patent/CN115194276B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104042179A (en) * | 2014-07-04 | 2014-09-17 | 王刚 | Integrated medical endoscope system |
| CN213704921U (en) * | 2020-10-21 | 2021-07-16 | 上海龙旗科技股份有限公司 | Verification structure for printing high-low temperature solder paste on PCB |
| CN114192915A (en) * | 2021-12-27 | 2022-03-18 | 烟台台芯电子科技有限公司 | IGBT welding process method |
| CN114682870A (en) * | 2022-03-29 | 2022-07-01 | 联宝(合肥)电子科技有限公司 | POP hybrid welding process and system |
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| CN115194276A (en) | 2022-10-18 |
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