CN210075743U - Bending and welding device for pins of electronic elements - Google Patents
Bending and welding device for pins of electronic elements Download PDFInfo
- Publication number
- CN210075743U CN210075743U CN201920438458.3U CN201920438458U CN210075743U CN 210075743 U CN210075743 U CN 210075743U CN 201920438458 U CN201920438458 U CN 201920438458U CN 210075743 U CN210075743 U CN 210075743U
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- bending
- circuit board
- pin
- board assembly
- supporting part
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Abstract
The utility model relates to the technical field of circuit board welding, in particular to a bending and welding device for pins of electronic components, which comprises a bending device and a reflow soldering device, wherein the bending device comprises a bracket, a supporting block arranged on the bracket, a pressing block movably matched with the bracket and a first driving piece for driving the pressing block, and the supporting block is provided with a containing groove, a pin passing groove and a supporting part; the supporting part and the pressing block are L-shaped and mutually buckled, and the straight-line pin is bent into the surface-mounted pin by the mutually buckled supporting part and the pressing block; after the bending device bends the linear pins of the electronic elements into the surface mounting pins, the external chip mounter pastes the electronic elements processed by the bending device to corresponding positions on the circuit board assembly, then the reflow soldering device welds the electronic elements processed by the chip mounter to the circuit board assembly, and an operator does not need to insert the linear pins of the electronic elements into jacks of the circuit board assembly, so that the welding efficiency and the welding yield of the electronic elements are improved.
Description
Technical Field
The utility model relates to a circuit board welding technology field especially discloses an electronic component pin welding set of buckling.
Background
The pins of the existing electronic elements such as LEDs are linear pins, and the linear pins of the electronic elements are required to be manually inserted into corresponding hole positions of the PCBA by operators, so that the inserting efficiency is extremely low, and the welding efficiency of the electronic elements and the PCBA is also extremely low; in addition, manual insertion by an operator easily causes insertion errors, and also causes errors in subsequent electronic component soldering, which seriously affects the improvement of the soldering yield of the electronic component.
Disclosure of Invention
In order to overcome the shortcoming and the not enough that exist among the prior art, the utility model aims to provide an electronic component pin welding set of buckling, the electronic component after the device of will buckling is handled to external chip mounter pastes the corresponding position of establishing on circuit board assembly, then the electronic component welding after reflow soldering chip mounter handles is on circuit board assembly, need not in the operation personnel inserts circuit board assembly's jack with electronic component's sharp pin, promotes electronic component's welding efficiency and welding yield.
In order to achieve the above object, the present invention provides an electronic component pin bending and welding device, which includes a bending device and a reflow soldering device, wherein the bending device is used for bending a linear pin of an electronic component into a surface-mount pin, and the reflow soldering device is used for soldering the surface-mount pin of the electronic component processed by the bending device onto a circuit board assembly; the bending device comprises a support, a supporting block arranged on the support, a pressing block movably matched with the support, and a first driving piece fixed on the support and used for driving the pressing block to be close to or far away from the supporting block, wherein the supporting block is provided with a containing groove, a foot passing groove and a supporting part, the containing groove is used for containing a main body of an electronic element, and the foot passing groove is used for containing one end of a linear pin close to the main body; the L type of supporting part and briquetting for lock each other, the briquetting is contradicted and is extruded sharp pin and keep away from the one end of main part for sharp pin keeps away from the one end of main part and buckles and the centre gripping between supporting part and briquetting, and the supporting part of lock and briquetting of cooperation each other make sharp pin buckle into surface mounting pin.
The corner of the supporting part and the corner of the pressing block form arc transition surfaces which are matched with each other respectively, and the arc transition surfaces of the supporting part and the pressing block enable the corner of the pin to form an arc transition part.
The side, close to each other, of the supporting part and the pressing block is provided with a blind groove, the blind groove is L-shaped, and the blind groove is used for accommodating and arranging pins of the positioning electronic element.
The heating wire is arranged in the supporting part, and heat generated by the heating wire is transferred to the linear pin through the supporting block so as to increase the plasticity of the linear pin.
The supporting block comprises a heat insulation part, the supporting part is connected with the heat insulation part, the containing groove is located on the heat insulation part, and the foot passing groove is formed in the supporting part.
The reflow soldering device comprises a preheating mechanism, a heat preservation mechanism, a soldering mechanism and a cooling mechanism; the preheating mechanism is used for preheating the circuit board assembly carrying the electronic element processed by the bending device so as to volatilize solvent and gas in solder paste of the circuit board assembly; the heat preservation mechanism is used for carrying out heat preservation treatment on the circuit board assembly treated by the preheating mechanism; the welding mechanism is used for heating the solder paste of the circuit board assembly processed by the heat preservation mechanism so that the solder paste is melted and adhered to the surface mounting pins of the electronic element; and the cooling mechanism enables the solder paste of the circuit board assembly processed by the welding mechanism to be solidified.
The electronic component pin bending and welding device comprises a machine table, a second driving piece and a cam divider which are arranged on the machine table, a rotary table arranged on an output shaft of the cam divider, and a plurality of carriers arranged on the rotary table, wherein the second driving piece drives the cam divider to rotate, a support is arranged on the machine table, a bending device, a preheating mechanism, a heat preservation mechanism, a welding mechanism and a cooling mechanism are arranged around the rotary table, the carriers are used for bearing a circuit board assembly, and an electronic component processed by the bending device is attached to the circuit board assembly borne by the carriers through an external chip mounter.
The electronic element pin bending and welding device further comprises an AOI detection device, and the AOI detection device is used for detecting the circuit board assembly processed by the cooling mechanism.
Has the advantages that: after the bending device bends the linear pins of the electronic elements into the surface mounting pins, the external chip mounter pastes the electronic elements processed by the bending device to corresponding positions on the circuit board assembly, then the reflow soldering device welds the electronic elements processed by the chip mounter to the circuit board assembly, and an operator does not need to insert the linear pins of the electronic elements into jacks of the circuit board assembly, so that the welding efficiency and the welding yield of the electronic elements are improved.
Drawings
Fig. 1 is a schematic structural view of the present invention;
fig. 2 is a schematic structural view of the bending device of the present invention;
FIG. 3 is a schematic view of the fitting structure of the supporting block and the pressing block of the present invention;
fig. 4 is a schematic structural view of an electronic component with a linear pin according to the present invention;
fig. 5 is a schematic structural view of an electronic component with surface mount pins according to the present invention.
The reference numerals include:
1-bending device 2-reflow soldering device 3-support
4-supporting block 5-briquetting 6-containing groove
7-foot passing groove 8-supporting part 9-arc transition surface
11-blind groove 12-heating wire 13-heat insulation part
14-preheating mechanism 15-heat preservation mechanism 16-welding mechanism
17-cooling mechanism 18-machine platform 19-turntable
21-carrier 22-AOI detection device 101-main body
102-linear pins 103-surface mount pins.
Detailed Description
The present invention will be further described with reference to the following examples and accompanying drawings.
Referring to fig. 1 to 5, the utility model discloses an electronic component pin welding set that buckles, including buckling device 1 and reflow soldering device 2, buckle device 1 and be used for buckling into surface mounting pin 103 with electronic component's sharp pin 102, reflow soldering device 2 is used for welding the surface mounting pin 103 of the electronic component after device 1 handles of buckling to circuit board subassembly.
The bending device 1 comprises a support 3, a supporting block 4 installed on the support 3, a pressing block 5 movably matched with the support 3, and a first driving piece fixed on the support 3 and used for driving the pressing block 5 to be close to or far away from the supporting block 4, wherein a containing groove 6, a foot passing groove 7 and a supporting part 8 are arranged on the supporting block 4, the containing groove 6 is used for containing a main body 101 of an electronic element, the foot passing groove 7 is used for containing one end, close to the main body 101, of a linear pin 102, and the supporting part 8 and the pressing block 5 are L-shaped and mutually buckled. The pressing block 5 pushes against one end of the linear pin 102 far away from the main body 101, so that one end of the linear pin 102 far away from the main body 101 is bent and clamped between the supporting part 8 and the pressing block 5, and the supporting part 8 and the pressing block 5 which are mutually buckled are matched to bend the linear pin 102 into the surface-mounted pin 103.
After the bending device 1 bends the linear pins 102 of the electronic element into the surface mounting pins 103, the external chip mounter pastes the electronic element processed by the bending device 1 to the corresponding position on the circuit board assembly, and then the reflow soldering device 2 solders the electronic element processed by the chip mounter on the circuit board assembly, so that the operation personnel are not required to insert the linear pins 102 of the electronic element into the jacks of the circuit board assembly, and the welding efficiency and the welding yield of the electronic element are improved.
The corner of the supporting part 8 and the corner of the pressing block 5 respectively form arc transition surfaces 9 matched with each other, and the arc transition surfaces 9 of the supporting part 8 and the pressing block 5 enable the corners of the pins to form arc transition parts. In the process of bending the linear pins 102 into the surface mount pins 103, the corners of the support portion 8 and the corners of the pressing block 5 guide the linear pins 102 to be bent gradually, so that the linear pins 102 are prevented from being excessively bent and broken, and the bending yield of the pins is improved.
The side, close to each other, of the supporting portion 8 and the pressing block 5 is provided with a blind groove 11, according to actual needs, the blind groove 11 can be arranged on the supporting portion 8 or/and the pressing block 5, the blind groove 11 is in an L shape, and the blind groove 11 is used for accommodating and arranging pins of the electronic component. In the process of bending the linear pin 102 into the surface mount pin 103, the wall of the blind groove 11 abuts against and limits the pin, so that poor bending of the pin in the bending process is prevented, and the bending yield of the pin is improved.
The heating wire 12 is installed in the supporting portion 8, when the surface-mounted pin 103 needs to be bent from the linear pin 102, the heating wire 12 emits heat, the heat generated by the heating wire 12 is transmitted to the linear pin 102 through the supporting block 4, so that the temperature of the linear pin 102 is increased, the plasticity of the linear pin 102 is increased, then the first driving piece drives the pressing block 5 to be bent by abutting against one end, far away from the main body 101, of the linear pin 102, the probability of breakage of the pin in the bending process is reduced, and the bending yield of the pin is improved.
The supporting block 4 comprises a heat insulation part 13, the heat insulation part 13 is made of heat insulation materials, the supporting part 8 is connected with the heat insulation part 13, the accommodating groove 6 is arranged on the heat insulation part 13, and the foot passing groove 7 is arranged on the supporting part 8. By virtue of the special arrangement of the heat insulating portion 13, when the heat of the heating wire 12 is transmitted to the supporting portion 8, the heat on the supporting portion 8 is prevented from melting the main body 101 of the electronic component in the containing groove 6.
The reflow soldering device 2 comprises a preheating mechanism 14, a heat preservation mechanism 15, a welding mechanism 16 and a cooling mechanism 17; the inert gas (such as nitrogen gas and the like) heated by the preheating mechanism 14 is blown onto the circuit board assembly, so that the circuit board assembly carrying the electronic element processed by the bending device 1 is preheated, and the solvent and the gas in the solder paste of the circuit board assembly are volatilized; then the heat preservation mechanism 15 carries out heat preservation treatment on the circuit board assembly treated by the preheating mechanism 14, and the circuit board assembly and the electronic element are prevented from suddenly entering a high-temperature area of the welding mechanism 16 to cause damage to the circuit board assembly or/and damage to the electronic element; the soldering mechanism 16 is used for heating the solder paste of the circuit board assembly processed by the heat preservation mechanism 15 to make the solder paste melt and adhere to the surface mounting pins 103 of the electronic component; finally, the cooling mechanism 17 solidifies the solder paste of the circuit board assembly processed by the soldering mechanism 16, thereby firmly soldering the circuit board assembly and the electronic component together.
The electronic component pin bending and welding device comprises a machine table 18, a second driving piece and a cam divider which are arranged on the machine table 18, a rotating disc 19 arranged on an output shaft of the cam divider, and a plurality of carriers 21 arranged on the rotating disc 19, wherein the second driving piece is used for driving the cam divider to rotate, the carriers 21 are arranged in an annular array around a rotating axis of the rotating disc 19, a support 3 is fixedly arranged on the machine table 18, a bending device 1, a preheating mechanism 14, a heat preservation mechanism 15, a welding mechanism 16 and a cooling mechanism 17 are arranged around the rotating disc 19, the carriers 21 are used for bearing a circuit board assembly, an electronic component processed by the bending device 1 is attached to the circuit board assembly borne by the carriers 21 through an external chip mounter, the chip mounter is the prior art, and the description is omitted here.
Electronic component pin welding set that buckles still includes AOI detection device 22, and AOI detection device 22 is used for detecting the circuit board subassembly after cooling body 17 handles, realizes circuit board subassembly's automated inspection, need not that the operation personnel range estimation carries out manual detection to the circuit board subassembly after the welding handles, promotes circuit board subassembly's detection efficiency.
The above description is only for the preferred embodiment of the present invention, and the present specification should not be construed as limiting the present invention.
Claims (8)
1. A bending and welding device for pins of electronic components comprises a bending device and a reflow soldering device, wherein the bending device is used for bending linear pins of the electronic components into surface-mounted pins; the method is characterized in that: the bending device comprises a support, a supporting block arranged on the support, a pressing block movably matched with the support, and a first driving piece fixed on the support and used for driving the pressing block to be close to or far away from the supporting block, wherein the supporting block is provided with a containing groove, a foot passing groove and a supporting part, the containing groove is used for containing a main body of an electronic element, and the foot passing groove is used for containing one end of a linear pin close to the main body; the L type of supporting part and briquetting for lock each other, the briquetting is contradicted and is extruded sharp pin and keep away from the one end of main part for sharp pin keeps away from the one end of main part and buckles and the centre gripping between supporting part and briquetting, and the supporting part of lock and briquetting of cooperation each other make sharp pin buckle into surface mounting pin.
2. The electronic component pin bending and welding device according to claim 1, wherein: the corner of supporting part, the corner of briquetting form the arc transition face of mutually supporting respectively, and the arc transition face of supporting part, the arc transition face of briquetting make the corner of pin form circular arc transition portion.
3. The electronic component pin bending and welding device according to claim 1, wherein: and one side of the supporting part and one side of the pressing block, which are close to each other, are provided with blind grooves, the blind grooves are L-shaped, and the blind grooves are used for accommodating pins for positioning the electronic elements.
4. The electronic component pin bending and welding device according to claim 1, wherein: the heating wire is arranged in the supporting part, and heat generated by the heating wire is transferred to the linear pin through the supporting block so as to increase the plasticity of the linear pin.
5. The electronic component pin bending and welding device according to claim 4, wherein: the supporting shoe includes thermal-insulated portion, and the supporting part is connected with thermal-insulated portion, holds the groove and is located thermal-insulated portion, crosses the foot groove and sets up on the supporting part.
6. The electronic component pin bending and welding device according to claim 1, wherein: the reflow soldering device comprises a preheating mechanism, a heat preservation mechanism, a soldering mechanism and a cooling mechanism; the preheating mechanism is used for preheating the circuit board assembly carrying the electronic element processed by the bending device so as to volatilize solvent and gas in solder paste of the circuit board assembly; the heat preservation mechanism is used for carrying out heat preservation treatment on the circuit board assembly treated by the preheating mechanism; the welding mechanism is used for heating the solder paste of the circuit board assembly processed by the heat preservation mechanism so that the solder paste is melted and adhered to the surface mounting pins of the electronic element; and the cooling mechanism enables the solder paste of the circuit board assembly processed by the welding mechanism to be solidified.
7. The electronic component pin bending and welding device according to claim 6, wherein: the electronic component pin bending and welding device comprises a machine table, a second driving piece and a cam divider which are arranged on the machine table, a rotating disc arranged on an output shaft of the cam divider, and a plurality of carriers arranged on the rotating disc, wherein the second driving piece drives the cam divider to rotate, a support is arranged on the machine table, a bending device, a preheating mechanism, a heat insulation mechanism, a welding mechanism and a cooling mechanism are arranged around the rotating disc, the carriers are used for bearing a circuit board assembly, and an electronic component processed by the bending device is attached to the circuit board assembly borne by the carriers through an external chip mounter.
8. The electronic component pin bending and welding device according to claim 7, wherein: the electronic component pin bending and welding device further comprises an AOI detection device, and the AOI detection device is used for detecting the circuit board assembly processed by the cooling mechanism.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920438458.3U CN210075743U (en) | 2019-04-02 | 2019-04-02 | Bending and welding device for pins of electronic elements |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920438458.3U CN210075743U (en) | 2019-04-02 | 2019-04-02 | Bending and welding device for pins of electronic elements |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210075743U true CN210075743U (en) | 2020-02-14 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920438458.3U Expired - Fee Related CN210075743U (en) | 2019-04-02 | 2019-04-02 | Bending and welding device for pins of electronic elements |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210075743U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113511508A (en) * | 2021-07-13 | 2021-10-19 | 珠海智新自动化科技有限公司 | Vertical-to-horizontal capacitor feeder |
| CN113873763A (en) * | 2021-09-26 | 2021-12-31 | 昆山振顺电子科技有限公司 | Rotary fixing device and rotary fixing method for line bending machine |
| CN115383247A (en) * | 2022-10-27 | 2022-11-25 | 靖江天元爱尔瑞电子科技有限公司 | Electronic component welding jig and welding method |
| CN117156717A (en) * | 2023-10-31 | 2023-12-01 | 深圳市首航新能源股份有限公司 | Method for manufacturing circuit board, method for manufacturing power module and power module |
-
2019
- 2019-04-02 CN CN201920438458.3U patent/CN210075743U/en not_active Expired - Fee Related
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113511508A (en) * | 2021-07-13 | 2021-10-19 | 珠海智新自动化科技有限公司 | Vertical-to-horizontal capacitor feeder |
| CN113511508B (en) * | 2021-07-13 | 2023-01-13 | 珠海智新自动化科技有限公司 | Vertical-to-horizontal capacitor feeder |
| CN113873763A (en) * | 2021-09-26 | 2021-12-31 | 昆山振顺电子科技有限公司 | Rotary fixing device and rotary fixing method for line bending machine |
| CN113873763B (en) * | 2021-09-26 | 2022-12-30 | 昆山振顺电子科技有限公司 | Rotary fixing device and rotary fixing method for line bending machine |
| CN115383247A (en) * | 2022-10-27 | 2022-11-25 | 靖江天元爱尔瑞电子科技有限公司 | Electronic component welding jig and welding method |
| CN117156717A (en) * | 2023-10-31 | 2023-12-01 | 深圳市首航新能源股份有限公司 | Method for manufacturing circuit board, method for manufacturing power module and power module |
| CN117156717B (en) * | 2023-10-31 | 2024-02-06 | 深圳市首航新能源股份有限公司 | Method for manufacturing circuit board, method for manufacturing power module and power module |
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| Date | Code | Title | Description |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20200214 |
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| CF01 | Termination of patent right due to non-payment of annual fee |