CN117156717A

CN117156717A - Method for manufacturing circuit board, method for manufacturing power module and power module

Info

Publication number: CN117156717A
Application number: CN202311421834.5A
Authority: CN
Inventors: 谢伟枫; 尹恒
Original assignee: Shenzhen Sofarsolar Co Ltd
Current assignee: Shenzhen Sofarsolar Co Ltd
Priority date: 2023-10-31
Filing date: 2023-10-31
Publication date: 2023-12-01
Anticipated expiration: 2043-10-31
Also published as: CN117156717B

Abstract

The embodiment of the invention relates to the technical field of power module production, and discloses a method for manufacturing a circuit board, a method for manufacturing a power module and the power module, wherein the method comprises the following steps: the method comprises the steps of providing a substrate, a plurality of electronic elements, a heat dissipation piece and a bending device, wherein the substrate is provided with a plurality of welding positions, the welding positions are provided with a plurality of jacks, the jacks penetrate through the substrate, the electronic elements are provided with a plurality of pins, at least one of the pins is bent through the bending device so that the at least one pin is not coplanar with other pins, the plurality of electronic elements are fixed on the first surface of the heat dissipation piece, the heat dissipation piece is arranged on one side of the substrate, one electronic element is located at one welding position, one pin is inserted into one jack, and the pins are welded on the substrate to obtain the circuit board. Through the mode, when the plurality of pins are welded on the substrate, the situation that tin connection occurs to the adjacent pins is reduced, and the situation that short circuit occurs to the electronic element is reduced.

Description

Method for manufacturing circuit board, method for manufacturing power module and power module

Technical Field

The embodiment of the invention relates to the technical field of power module production, in particular to a method for manufacturing a circuit board, a method for manufacturing a power module and the power module.

Background

An inverter is an electrical device used in a power generation system and is responsible for converting direct current generated by a power generation assembly into alternating current. The power module is an important part of the inverter, the power module is integrated with a plurality of power devices, and pins of the power devices are welded on a substrate of the power module, so that the power devices and the substrate are connected and fixed.

However, in implementing embodiments of the present invention, the inventors found that: at present, the power device is provided with a plurality of pins, the pins are arranged at coplanar intervals, but the intervals among some pins are very small, when the pins are welded on the substrate, the situation of tin connection easily occurs among some adjacent pins, and the power device is short-circuited.

Disclosure of Invention

The embodiment of the invention mainly provides a method for manufacturing a circuit board, a method for manufacturing a power module and the power module, wherein at least one pin of an electronic element is bent through a bending device, so that the at least one pin and other pins are not coplanar and staggered, and then, when a plurality of pins are welded on a substrate, the situation that adjacent pins are connected with tin is reduced, and the situation that the electronic element is short-circuited is reduced.

In order to solve the technical problems, one technical scheme adopted by the embodiment of the invention is as follows: a method of manufacturing a circuit board, comprising:

providing a substrate, a plurality of electronic elements, a heat dissipation piece and a bending device, wherein the substrate is provided with a plurality of welding positions, the welding positions are provided with a plurality of jacks, the jacks penetrate through the substrate, and the electronic elements are provided with a plurality of pins;

bending at least one of the plurality of pins by a bending device so that the at least one pin is not coplanar with other pins;

fixing the electronic components on the first surface of the heat dissipation element;

arranging the heat dissipation piece on one side of the substrate, wherein one electronic element is positioned at one welding position, and one pin is inserted into one jack;

and welding the pins on the substrate to obtain the circuit board.

Optionally, the bending device comprises a bracket, a bottom die, an upper die and a driving assembly, wherein the bottom die comprises a limiting block and a forming block, the limiting block is fixed on the bracket, the forming block is fixed on the limiting block, the upper die comprises a punching block, the punching block and the forming block are oppositely arranged, the driving assembly is respectively connected with the punching block and the bracket, and the driving assembly is used for driving the punching block to lift;

the step of bending at least one of the plurality of pins by a bending device comprises the following steps:

placing the electronic components on the limiting block;

controlling the driving assembly to drive the stamping block to press and bend at least one of the pins so that the at least one pin is not coplanar with other pins;

and controlling the driving assembly to drive the punching block to ascend, and taking out the plurality of electronic elements.

Optionally, the limiting block is provided with a plurality of accommodating grooves;

the step of placing the plurality of electronic components in the limiting block further includes:

and placing the electronic element in the accommodating groove, wherein the pins extend out of the accommodating groove.

Optionally, the molding block is provided with a molding inclined part and a molding straight part, and the molding inclined part is connected with the molding straight part;

the stamping block comprises a plurality of stamping sheets, wherein the stamping sheets are provided with stamping inclined portions and stamping straight portions, the stamping inclined portions are connected with the stamping straight portions, the stamping inclined portions are oppositely arranged with the forming inclined portions, and the stamping straight portions are oppositely arranged with the forming straight portions.

Optionally, the step of fixing the plurality of electronic components to the first surface of the heat sink further includes:

providing a plurality of heat conducting pieces, a positioning jig and a plurality of first bolts, wherein the positioning jig comprises a positioning bottom plate, a limiting plate and a positioning plate, the positioning bottom plate is provided with a positioning groove, the limiting plate is provided with a plurality of first limiting openings, and the positioning plate is provided with a plurality of second limiting openings;

placing the heat dissipation piece in a positioning groove, wherein the first surface is flush with the surface of the positioning bottom plate, which is away from the groove bottom of the positioning groove;

placing the limiting plate on one side of the positioning bottom plate;

placing the heat conducting piece on the first limit opening, and attaching the heat conducting piece to the first surface;

stacking the positioning plate on the limiting plate;

placing the electronic element at the second limit opening, wherein the electronic element is overlapped with the heat conducting piece;

fixing the electronic element and the heat conducting piece to the heat radiating piece through the first bolt;

and removing the positioning jig to obtain the heat dissipation piece with the plurality of electronic elements and the plurality of heat conduction pieces.

Optionally, between the step of placing the limiting plate on one side of the positioning base plate and the step of placing the heat conducting member on the first limiting opening, the heat conducting member is attached to the first surface, the method further includes:

and brushing layers on the surfaces of two opposite sides of the heat conducting piece.

In order to solve the technical problems, another technical scheme adopted by the embodiment of the invention is as follows: the method for manufacturing the power module comprises the steps of providing a circuit board, wherein the circuit board is prepared by adopting the method;

providing a radiator and a second bolt, wherein the radiator is provided with a containing groove, and a base plate of the circuit board is provided with a filling opening;

the circuit board is arranged on the radiator, wherein the accommodating groove accommodates part of the radiating piece and a plurality of electronic elements;

fixing the circuit board and the radiator through the second bolt;

filling the accommodating groove with a filler through the filling opening, wherein the accommodating groove is filled with the filler;

and curing the filler to obtain the power module.

Optionally, the step of curing the filler to obtain the power module further includes:

and standing and solidifying the filler to obtain the power module.

and baking and solidifying the filler to obtain the power module.

In order to solve the technical problems, another technical scheme adopted by the embodiment of the invention is as follows: the power module is provided and is prepared by the method.

The embodiment of the invention has the beneficial effects that: compared with the prior art, the embodiment of the invention bends at least one pin of the electronic element through the bending device, so that the at least one pin is not coplanar and staggered with other pins, and when a plurality of pins are welded on the substrate, the situation that adjacent pins are connected with tin is reduced, and the situation that the electronic element is short-circuited is reduced.

Filling the filling material into the accommodating groove through the filling opening, so that the filling material is fully contacted with the heat radiating piece, the heat conducting piece, the plurality of electronic components and the radiator respectively, and the heat radiating efficiency of the radiator is improved. In addition, the method is suitable for various semi-package type radiators, so that the occupied space for process assembly is small, and the device is fully contacted by the filling process, so that the radiating efficiency is better.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below. Like elements or portions are generally identified by like reference numerals throughout the several figures. In the drawings, elements or portions thereof are not necessarily drawn to scale.

FIG. 1 is a schematic diagram of a power module according to an embodiment of the present invention;

FIG. 2 is a schematic exploded view of a power module according to an embodiment of the present invention;

fig. 3 is an enlarged view of a portion a of fig. 2;

FIG. 4 is a schematic view of a bending apparatus according to an embodiment of the present invention;

FIG. 5 is a schematic view of the bottom die of the bending apparatus according to the embodiment of the present invention;

FIG. 6 is a schematic exploded view of the upper die of the bending apparatus according to the embodiment of the present invention;

fig. 7 is an enlarged view of a portion B of fig. 6;

FIG. 8 is a schematic diagram of a positioning fixture and a portion of a circuit board according to an embodiment of the present invention;

FIG. 9 is an exploded view of a positioning fixture and a portion of a circuit board according to an embodiment of the present invention;

FIG. 10 is a flow chart of a method of manufacturing a circuit board of the present invention;

fig. 11 is a detailed flowchart of step 02 of fig. 10;

FIG. 12 is a detailed flow chart of an embodiment of step 03 of FIG. 10;

FIG. 13 is a detailed flow chart of another embodiment of step 03 of FIG. 10;

fig. 14 is a flow chart of a method of manufacturing a power module of the present invention.

Reference numerals illustrate:

10. a power module; 11. a heat sink; 111. a heat dissipation body; 1111. a receiving groove; 112. a support column; 1121. a first screw hole; 12. a circuit board; 121. a substrate; 1211. a first through hole; 1212. welding positions; 1213. a first positioning through hole; 1214. a filling port; 1215. a jack; 122. a heat sink; 1221. supporting feet; 1222. a second screw hole; 1223. a heat radiation fin; 1224. a boss; 123. a heat conductive member; 1231. a second through hole; 124. an electronic component; 1241. pins; 1242. a third through hole; 125. a first bolt; 13. a second bolt;

20. a bending device; 21. a bracket; 22. a bottom die; 221. a limiting block; 2211. a receiving groove; 2212. a support part; 222. molding blocks; 2221. forming an inclined part; 2222. shaping the straight part; 2223. a first avoidance groove; 23. an upper die; 230. a briquetting assembly; 231. briquetting; 2311. a second avoidance groove; 2312. a first slot; 2313. a pressing part; 232. a connecting block; 2321. a first chute; 2322. a second chute; 233. connecting a guide rod; 234. a sliding sleeve; 235. an elastic member; 236. stamping blocks; 237. a fixing plate; 238. punching the sheet; 2381. stamping the inclined part; 2382. stamping the straight part; 24. a drive assembly; 241. a fixing frame; 242. a grip portion; 243. a fixed sleeve; 244. a connecting rod; 25. a guide rod;

30. positioning jig; 31. positioning a bottom plate; 311. a positioning groove; 312. positioning columns; 32. a limiting plate; 321. a first limit port; 322. a second positioning through hole; 33. a positioning plate; 331. a second limit port; 332. and a third positioning through hole.

Detailed Description

In order that the invention may be readily understood, a more particular description thereof will be rendered by reference to specific embodiments that are illustrated in the appended drawings. It will be understood that when an element is referred to as being "fixed" to another element, it can be directly on the other element or one or more intervening elements may be present therebetween. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or one or more intervening elements may be present therebetween. The terms "upper," "lower," "inner," "outer," "vertical," "horizontal," and the like as used in this specification, refer to an orientation or positional relationship based on that shown in the drawings, merely for convenience of description and to simplify the description, and do not denote or imply that the devices or elements referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus should not be construed as limiting the invention. Furthermore, the terms "first," "second," and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and/or" as used in this specification includes any and all combinations of one or more of the associated listed items.

In addition, the technical features mentioned in the different embodiments of the invention described below can be combined with one another as long as they do not conflict with one another.

For the convenience of the reader, please refer to fig. 1-9, the structure of the power module 10, and the structures of the bending device 20 and the positioning fixture 30 provided for manufacturing the circuit board 12 of the power module 10 will be described in detail.

For the above power module 10, referring to fig. 1 and 2, the power module 10 includes a heat sink 11, a circuit board 12, a second bolt 13, and a filler (not shown). The heat sink 11 is used to dissipate heat generated by the circuit board 12. The circuit board 12 is disposed on the heat sink 11, and a portion of the circuit board 12 is disposed in the heat sink 11. The second bolts 13 are connected to the circuit board 12 and the heat sink 11 to connect and fix the circuit board 12 and the heat sink 11. The filler is disposed in the heat sink 11, and fills the gap between a part of the circuit board 12 and the heat sink 11, and the filler is used for heat conduction and insulation, so that heat generated by the circuit board 12 is transferred to the heat sink 11.

For the above-mentioned heat sink 11, please refer to fig. 2, the heat sink 11 includes a heat dissipation body 111 and support columns 112. The heat dissipation body 111 is provided with a receiving groove 1111, and the receiving groove 1111 is used for receiving a part of the circuit board 12. The support column 112 is fixed on the surface of the heat dissipation body 111 facing away from the bottom of the accommodating groove 1111, and the support column 112 is provided with a first screw hole 1121.

For the above-mentioned circuit board 12, referring to fig. 2 and 3, the circuit board 12 includes a substrate 121, a heat dissipation member 122, a plurality of heat conduction members 123, a plurality of electronic components 124, and a plurality of first bolts 125. The substrate 121 is carried by the support column 112, and the substrate 121 is provided with a first through hole 1211, a plurality of soldering sites 1212, a first positioning through hole 1213 and a filling port 1214. The bonding sites 1212 are provided with a plurality of receptacles 1215, the plurality of receptacles 1215 extending through the substrate 121, wherein at least one receptacle 1215 is not coplanar with the other receptacles 1215. A filling port 1214 is provided in the center of the substrate 121, and the filling port 1214 is used to facilitate filling the receiving groove 1111 with a filler when producing a circuit board. The heat sink 122 is provided with a support leg 1221, a plurality of second screw holes 1222, and a plurality of heat sink fins 1223. The supporting leg 1221 is disposed on a side of the heat dissipation element 122 facing the substrate 121, the supporting leg 1221 is provided with a boss 1224, the supporting leg 1221 is inserted into the first positioning hole 1213, and the boss 1224 is carried on the substrate 121 to carry the heat dissipation element 122 on the substrate 121. The heat sink 122 protrudes into the receiving groove 1111 from a side of the substrate 121. The second screw holes 1222 are disposed at intervals on the first surface of the heat dissipation element 122. The plurality of heat dissipation fins 1223 are disposed at intervals on a second surface of the heat sink 11, and the plurality of heat dissipation fins 1223 are disposed in the receiving groove 1111, the second surface being opposite to the first surface. The heat conducting members 123 are attached to the first surface of the heat sink 11 at intervals, and the heat conducting members 123 are located in the accommodating groove 1111. The heat conductive member 123 is provided with a second through hole 1231, and the heat conductive member 123 is used for heat conduction and insulation. An electronic component 124 is attached to a surface of the heat conducting member 123 facing away from the heat dissipating member 122, and the electronic component 124 is located at a soldering position 1212, and a side of the electronic component 124 facing away from the circuit board 12 extends into the accommodating groove 1111. The electronic component 124 is provided with a plurality of pins 1241 and third through holes 1242. At least one of the plurality of pins 1241 is not coplanar with other pins 1241, such that at least one of the pins 1241 is offset from an adjacent pin 1241, and one of the pins 1241 is inserted into and fixed to an insertion hole 1215, so as to connect and fix the electronic component 124 to the substrate 121. The third through hole 1242 is in stacked communication with the second through hole 1231. A first bolt 125 is threaded into a second screw hole 1222 through the third through hole 1242 and the second through hole 1231 to fix an electronic component 124 and a heat conducting member 123 to the heat dissipating member 122.

In some embodiments, the aperture ratio of the receptacles 1215 is greater than the width of the pins 1241 by 0.3-0.5 millimeters, facilitating easy tinning of the pins 1241 during soldering.

In some embodiments, the number of the heat dissipation elements 122 is four, and the four heat dissipation elements 122 are symmetrically arranged in two rows, but the number of the heat dissipation elements 122 is not limited thereto, and the number of the heat dissipation elements 122 is set according to actual requirements, for example, the number of the heat dissipation elements 122 may be six, eight, etc.

In some embodiments, the heat conductive member 123 is made of a ceramic material, and the electronic component 124 is a power device, and may be an IGBT element in particular, but not limited thereto, and the electronic component 124 may be other devices.

For the first bolt 125, referring to fig. 2, the first bolt 125 passes through the first through hole 1211 and is then screwed into the first screw hole 1121 to connect and fix the circuit board 12 and the support column 112, and further connect and fix the circuit board 12 and the heat sink 11.

In some embodiments, the number of first bolts 125, support columns 112, and first through holes 1211 are all multiple. A plurality of support posts 112 surround the receiving groove 1111. The plurality of first through holes 1211 surrounds the substrate 121. A first bolt 125 is screwed to a first screw hole 1121 of a support column 112 through a first through hole 1211.

For the above-mentioned filler, the filler is located in the accommodating groove 1111, and the filler fills the accommodating groove 1111, specifically, the filler fills the gaps between the heat dissipating member 122, the heat conducting member 123, the plurality of electronic components 124, the wall surface of the accommodating groove 1111 and the bottom of the accommodating groove 1111, and the filler is used for heat conduction and insulation, which is beneficial to improving the heat dissipating efficiency. Specifically, the heat generated by the electronic component 124 is transferred to the heat dissipation element 122 through the heat conduction element 123, then transferred to the heat sink 11 through the filler, and then dissipated by the heat sink 11. Of course, some of the heat generated by the electronic component 124 is also directly transferred to the heat sink 11 via the filler. Furthermore, the filler can also play a role in fixedly supporting the heat dissipation member 122, the heat conduction member 123 and the plurality of electronic components 124.

In some embodiments, the filler is a thermally conductive glue.

For the above-mentioned bending device 20, referring to fig. 4, the bending device 20 includes a bracket 21, a bottom die 22, an upper die 23, a driving assembly 24, and a guide rod 25. The bottom die 22 is fixed to the bracket 21. The upper die 23 is connected to a driving assembly 24, and the upper die 23 and the bottom die 22 are used together to bend at least one pin 1241. The driving assembly 24 is connected to the bracket 21, and the driving assembly 24 is used for driving the upper die 23 to lift. The guide rod 25 is fixed on the bracket 21, the guide rod 25 is inserted into the upper die 23, and the guide rod 25 is used for guiding the upper die 23.

For the bottom mold 22, referring to fig. 5, the bottom mold 22 includes a stopper 221 and a molding block 222. The limiting block 221 is fixed on the bracket 21, and the limiting block 221 is provided with a plurality of accommodating grooves 2211 and a supporting portion 2212. The plurality of accommodating grooves 2211 and the supporting portion 2212 are disposed on the surface of the limiting block 221 facing the upper die 23, the accommodating grooves 2211 are used for accommodating the electronic components 124, and the supporting portion 2212 is used for clamping the plurality of pins 1241 together with the portion of the bottom die 22. The molding block 222 is fixed to the stopper 221, and the molding block 222 is provided with a molding inclined portion 2221, a molding straight portion 2222, and a first escape groove 2223. The profiled inclined part 2221 is connected to the profiled straight part 2222. The first avoiding groove 2223 is disposed at the connection between the forming inclined portion 2221 and the forming straight portion 2222, and the first avoiding groove 2223 is used for preventing the pin 1241 from breaking at the forming portion of the pin 1241 when the pin 1241 is bent and pressed.

For the upper die 23, referring to fig. 6 and 7, the upper die 23 includes a press block assembly 230 and a press block 236. The press block assembly 230 includes a press block 231, a connection block 232, a connection guide 233, a sliding sleeve 234, and an elastic member 235. The pressing block 231 is provided with a second avoidance groove 2311, a first insertion groove 2312 and a pressing portion 2313. The second avoidance groove 2311 is disposed opposite to the plurality of receiving grooves 2211, and the second avoidance groove 2311 is used for avoiding the electronic component 124 located in the receiving groove 2211. The pressing portion 2313 is disposed opposite to the supporting portion 2212, and the pressing portion 2313 and the supporting portion 2212 are commonly used to clamp the plurality of pins 1241. The connection block 232 is connected to the driving assembly 24, and the connection block 232 is provided with a first sliding groove 2321, a second sliding groove 2322 and a second slot (not shown). The first sliding groove 2321 and the second sliding groove 2322 both penetrate through the connecting block 232. The second slot is disposed opposite to the first slot 2312. One end of the connection rod 233 passes through the first sliding groove 2321 and then is connected to the pressing block 231, so that the connection block 232 is connected with the pressing block 231, and the connection rod 233 is used for limiting the connection block 232 and enabling the connection block 232 to slide along the connection rod 233. The sliding sleeve 234 is fixed on the second sliding groove 2322, the sliding sleeve 234 is used for the guide rod 25 to pass through, and the sliding sleeve 234 is used for reducing friction force, so that the pressing block assembly 230 slides along the guide rod 25 more smoothly. One end of the elastic member 235 is inserted into the first slot 2312, and the other end of the elastic member 235 is inserted into the second slot. The punching block 236 is disposed at one side of the pressing block 231, and the punching block 236 includes a fixing plate 237 and a plurality of punching plates 238. The fixing plate 237 is fixed to a surface of the connection block 232 facing the stopper 221. The stamping pieces 238 are arranged on the fixing plate 237 at intervals, and the stamping pieces 238 are provided with stamping inclined portions 2381 and stamping straight portions 2382. The press inclined portion 2381 is connected to the press straight portion 2382, the press inclined portion 2381 is provided opposite to the molding inclined portion 2221, and the press inclined portion 2381 and the molding inclined portion 2221 are used together to bend at least one of the plurality of pins 1241 at a time. The stamped straight portion 2382 is disposed opposite the shaped straight portion 2222, and the stamped straight portion 2382 and the shaped straight portion 2222 are commonly used to secondarily bend at least one of the plurality of pins 1241.

When at least one of the pins 1241 is bent, the control connection block 232 drives the pressing block 231 and the punching block 236 to descend, and when the bottom of the second avoiding groove 2311 abuts against the electronic components 124, the pressing block 231 and the limiting block 221 clamp the electronic components 124, and at the same time, the pressing portion 2313 and the supporting portion 2212 clamp the pins 1241. Continuously controlling the connection block 232 to overcome the action force of the elastic piece 235, the connection block 232 descends along the connection guide rod 233 relative to the pressing block 231 to drive the pressing block 236 to descend, and bending and forming are carried out on at least one of the pins 1241 twice in one pressing process under the action of the pressing block 238 and the forming block 222.

In some embodiments, the plurality of receiving grooves 2211 are symmetrically arranged in two rows, and the number of punching blocks 236 and forming blocks 222 is two. The two stamping blocks 236 are symmetrically fixed on two sides of the connecting block 232, and the pressing block 231 is positioned between the two stamping blocks 236. The two forming blocks 222 are symmetrically connected to two sides of the limiting block 221. Furthermore, the plurality of accommodating grooves 2211 encircle the limiting block 221, the punching block 236 is fixedly encircling the connecting block 232, and the forming block 222 is fixedly encircling the limiting block 221.

In some embodiments, the stopper 221 is integrally formed with the molding block 222. The punch block 236 is integrally formed.

For the above-mentioned driving assembly 24, please refer to fig. 4, the driving assembly 24 includes a fixing frame 241, a grip portion 242, a fixing sleeve 243 and a connecting rod 244. The fixing frame 241 is fixed to the bracket 21. One end of the grip portion 242 is rotatably connected to the fixing frame 241. The fixing sleeve 243 is fixed to the fixing member. One end of the connecting rod 244 is rotatably connected to the other end of the grip 242, and the other end of the connecting rod 244 is connected to the connecting block 232 through the fixing sleeve 243. It can be seen that the fixing frame 241, the grip 242, the fixing sleeve 243 and the connecting rod 244 form a connecting rod structure, so that the grip 242 is lifted or pressed down to drive the pressing block assembly 230 to lift the pressing block 236.

In some embodiments, the drive assembly 24 may be a pneumatic cylinder, an electric cylinder, a servo motor, or the like.

For the positioning jig 30, referring to fig. 8 and 9, the positioning jig 30 includes a positioning base 31, a limiting plate 32 and a positioning plate 33. The positioning base plate 31 is provided with a positioning groove 311 and a positioning column 312. The positioning groove 311 is used for accommodating the heat sink 122, and when the heat sink 122 is placed in the accommodating groove 1111, the first surface of the heat sink 122 is flush with the surface of the positioning bottom plate 31 away from the groove bottom of the accommodating groove 1111. The positioning posts 312 are disposed on the surface of the positioning bottom plate 31 away from the bottom of the receiving groove 1111. The limiting plate 32 is provided with a plurality of first limiting openings 321 and second positioning through holes 322. When the limiting plate 32 is placed on one side of the positioning base plate 31, the plurality of first limiting openings 321 are in stacked communication with the accommodating groove 1111, the first limiting opening 321 is used for placing a heat conducting member 123 and limiting the heat conducting member 123, and the second positioning through hole 322 is used for passing through the positioning column 312 to position the limiting plate 32. The positioning plate 33 is provided with a plurality of second limiting ports 331 and third positioning through holes 332. When the positioning plate 33 is stacked on the limiting plate 32, a second limiting opening 331 is in stacked communication with a first limiting opening 321, the second limiting opening 331 is used for placing an electronic component 124 and limiting the electronic component 124, so as to avoid displacement when the electronic component 124 is locked on the heat sink 122, and further avoid dislocation of the pins 1241 and the jacks 1215, ensure that the electronic component 124 is mounted on the substrate 121, and the third positioning through hole 332 is used for passing through the positioning column 312 to position the positioning plate 33.

Referring to fig. 10, fig. 10 is a flowchart of a method of manufacturing a circuit board 12 according to the present invention, the method comprising:

step 01: a substrate 121, a number of electronic components 124, a heat sink 122 and a bending device 20 are provided.

Step 02: at least one of the plurality of pins 1241 is bent by bending device 20 such that at least one pin 1241 is not coplanar with other pins 1241.

In some embodiments, referring to fig. 11, step 02 includes:

step 021: a number of electronic components 124 are placed on the stopper 221.

In some embodiments, step 021 is specifically: an electronic component 124 is disposed in a receiving space 2211, and a plurality of pins 1241 extend out of the receiving space 2211.

Step 022: the control drive assembly 24 drives the punch block 236 to fold down at least one of the plurality of pins 1241 such that at least one pin 1241 is not coplanar with the other pins 1241.

It should be noted that, the driving assembly 24 is controlled to drive the punch block 236 to press down, specifically, the driving assembly 24 is controlled to drive the connecting block 232 to descend, so as to drive the punch block 236 and the punch block 231 to descend, in the descending process, the bottom of the second avoiding groove 2311 and the pressing portion 2313 are respectively abutted against the electronic element 124 and the plurality of pins 1241, so that the pressing block 231 and the limiting block 221 clamp and fix the electronic element 124, and the pressing portion 2313 and the supporting portion 2212 clamp the plurality of pins 1241, then, the driving assembly 24 is controlled to continuously drive the connecting block 232 to continuously descend along the connecting guide rod 233 relative to the pressing block 231 against the acting force of the elastic element 235, so as to drive the punch block 236 to descend, and under the action of the punch block 238 and the forming block 222, at least one of the plurality of pins 1241 is formed by bending twice in one pressing process, so that the at least one pin 1241 is not coplanar with other pins 1241, and the problem of too small distance between the at least one pin 1241 and the adjacent pins 1241 is avoided. When the bending device 20 is used, the bottom and the wall surface of the second avoiding groove 2311 are coated with a silicone rubber, and the silicone rubber is used for supporting the electronic component 124, so as to prevent the electronic component 124 from being displaced when the at least one pin 1241 is bent and molded.

Step 023: the control driving assembly 24 drives the punching block 236 to ascend, and the plurality of electronic components 124 are taken out.

Step 03: a plurality of electronic components 124 are secured to the first surface of the heat sink 122.

In some embodiments, referring to fig. 12, fig. 12 is a flowchart of a first embodiment of step 03, step 03 comprising:

step 031: a plurality of heat conductive members 123, a positioning jig 30, and a plurality of first bolts 125 are provided.

Step 032: the heat sink 122 is placed in the positioning groove 311, and the first surface is flush with the surface of the positioning bottom plate 31 facing away from the bottom of the positioning groove 311.

Step 033: the limiting plate 32 is placed at one side of the positioning base plate 31.

Step 034: a heat conducting piece 123 is arranged at a first limiting opening 321, and the heat conducting piece 123 is attached to the first surface.

Step 035: an electronic component 124 is disposed in a second limiting opening 331, and the electronic component 124 is stacked on a heat conducting member 123.

Step 036: an electronic component 124 and a heat conductive member 123 are fixed to the heat sink 122 by a first bolt 125.

Step 037: the positioning jig 30 is removed to obtain the heat sink 122 with the plurality of electronic components 124 and the plurality of heat conductive members 123.

In some embodiments, referring to fig. 13, fig. 12 is a flowchart of a second embodiment of step 03, which is different from the other embodiments in that:

between step 033 and step 034, step 03 comprises:

step 038: the surfaces of the heat conductive member 123 on opposite sides are coated with a brush.

The surface of one side is the surface of the heat conducting member 123 attached to the first surface, and the surface of the other side is the surface of the heat conducting member 123 attached to the electronic element 124. In some embodiments, the coating is silicone grease, and the thickness of the coating is 0.1 mm to 0.15 mm, in this embodiment, 0.1 mm.

Step 04: the heat sink 122 is disposed on one side of the substrate 121, an electronic component 124 is located at a soldering site 1212, and a pin 1241 is plugged into a socket 1215.

Step 05: a plurality of pins 1241 are soldered to the substrate 121 to obtain the circuit board 12.

In some embodiments, step 05 is specifically: the plurality of pins 1241 are wave soldered using a soldering apparatus such that the plurality of pins 1241 are soldered to the substrate 121, wherein a soldering temperature is 270 ℃ to 280 ℃ at the time of soldering.

In the embodiment of the present invention, at least one pin 1241 of the electronic component 124 is bent by the bending device 20, so that at least one pin 1241 is not coplanar with other pins 1241, and then, when a plurality of pins 1241 are welded to the substrate 121, the situation that tin is connected to the adjacent pins 1241 is reduced, the situation that the electronic component 124 is shorted is reduced, and the welding yield of the circuit board 12 is also improved.

Referring to fig. 14, fig. 14 is a flowchart of a method for manufacturing a power module 10 according to the present invention, the method includes:

step S1: a circuit board 12 is provided in which the power module 10 is prepared by the method described above.

Step S2: a heat sink 11 and a second bolt 13 are provided.

Step S3: the circuit board 12 is provided to the heat sink 11.

The substrate 121 of the circuit board 12 is carried by the support column 112, and a plurality of heat dissipation fins 1223, a plurality of heat conductive members 123, and a plurality of electronic components 124 are disposed in the accommodating groove 1111 at a side facing away from the circuit board 12.

Step S4: the circuit board 12 is fixed to the heat sink 11 by a second bolt 13.

Step S5: the storage tank 1111 is filled with a filler through the filler port 1214.

The filler fills the accommodating groove 1111, that is, the filler fills the gaps between the heat sink 122, the plurality of heat conductive members 123, and the plurality of electronic components 124 and the groove bottom and wall surface of the accommodating groove 1111. And S5, filling the filler through a filling opening by adopting automatic dispensing equipment.

Step S6: curing the filler results in the power module 10.

In some embodiments, step S6 is specifically: the filler was left to stand for curing to obtain the power module 10, wherein the filler was left to stand for 24 hours to cure the filler.

The step S6 may be specifically: the filler is baked and cured to obtain the power module 10, wherein the filler is baked in an environment of 70-80 ℃ for 6 hours to cure the filler.

In some embodiments, the process of producing the filled filler is referred to as a glue filling process.

In the embodiment of the present invention, the heat conducting member 123, the plurality of electronic components 124, the heat dissipating member 122 and the heat sink 11 are fully contacted with the filler by filling the filler, which is beneficial to improving the heat dissipating efficiency of the heat sink 11. Specifically, when the power module 10 is in operation, the heat generated by the electronic component 124 is transferred to the heat dissipation element 122, the heat of the heat dissipation element 122 is transferred to the heat sink 11 through the filler, and then the heat is dissipated to the outside through the heat sink 11, and the filler is fully contacted with the heat dissipation element 122 and the heat sink 11 respectively, so that compared with a heat radiation and dissipation mode, the heat dissipation efficiency is improved due to the fact that the filler is fully contacted with the heat conduction mode. Furthermore, the filler can also play a role in fixedly supporting the heat dissipation member 122, the heat conduction member 123 and the plurality of electronic components 124.

It should be noted that the method is also suitable for various semi-package type radiators, so that the process assembly occupies small space, and the filling process makes the devices fully contacted, so that the heat dissipation efficiency is better.

The invention further provides an embodiment of the power module 10, wherein the power module 10 is prepared by the method.

It should be noted that the description of the present invention and the accompanying drawings illustrate preferred embodiments of the present invention, but the present invention may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein, which are not to be construed as additional limitations of the invention, but are provided for a more thorough understanding of the present invention. The above-described features are further combined with each other to form various embodiments not listed above, and are considered to be the scope of the present invention described in the specification; further, modifications and variations of the present invention may be apparent to those skilled in the art in light of the foregoing teachings, and all such modifications and variations are intended to be included within the scope of this invention as defined in the appended claims.

Claims

1. A method of manufacturing a circuit board, comprising:

and welding the pins on the substrate to obtain the circuit board.

2. The method of claim 1, wherein the step of determining the position of the substrate comprises,

the bending device comprises a support, a bottom die, an upper die and a driving assembly, wherein the bottom die comprises a limiting block and a forming block, the limiting block is fixed on the support, the forming block is fixed on the limiting block, the upper die comprises a punching block, the punching block and the forming block are oppositely arranged, the driving assembly is respectively connected with the punching block and the support, and the driving assembly is used for driving the punching block to lift;

placing the electronic components on the limiting block;

3. The method of claim 2, wherein the step of determining the position of the substrate comprises,

the limiting block is provided with a plurality of accommodating grooves;

4. The method of claim 2, wherein the step of determining the position of the substrate comprises,

the molding block is provided with a molding inclined part and a molding straight part, and the molding inclined part is connected with the molding straight part;

5. The method of claim 1, wherein the step of determining the position of the substrate comprises,

the step of fixing the plurality of electronic components to the first surface of the heat dissipation element further includes:

placing the limiting plate on one side of the positioning bottom plate;

stacking the positioning plate on the limiting plate;

6. The method of claim 5, wherein the step of determining the position of the probe is performed,

between the step of placing the limiting plate on one side of the positioning bottom plate and the step of placing the heat conducting piece on the first limiting opening, the heat conducting piece is attached to the first surface, the method further includes:

7. A method of manufacturing a power module, comprising:

providing a circuit board, wherein the circuit board is prepared by the method according to any one of claims 1-6;

fixing the circuit board and the radiator through the second bolt;

and curing the filler to obtain the power module.

8. The method of claim 7, wherein the step of determining the position of the probe is performed,

the step of curing the filler to obtain the power module further comprises the steps of:

and standing and solidifying the filler to obtain the power module.

9. The method according to claim 7, characterized in that

and baking and solidifying the filler to obtain the power module.

10. A power module prepared by the method of any one of claims 7-9.