CN115334774B - Inverter manufacturing method and inverter - Google Patents
Inverter manufacturing method and inverter Download PDFInfo
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- CN115334774B CN115334774B CN202211255601.8A CN202211255601A CN115334774B CN 115334774 B CN115334774 B CN 115334774B CN 202211255601 A CN202211255601 A CN 202211255601A CN 115334774 B CN115334774 B CN 115334774B
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- integrated module
- crimping
- printed circuit
- circuit board
- coating
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3447—Lead-in-hole components
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- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M7/00—Conversion of ac power input into dc power output; Conversion of dc power input into ac power output
- H02M7/003—Constructional details, e.g. physical layout, assembly, wiring or busbar connections
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2089—Modifications to facilitate cooling, ventilating, or heating for power electronics, e.g. for inverters for controlling motor
- H05K7/209—Heat transfer by conduction from internal heat source to heat radiating structure
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Power Engineering (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Inverter Devices (AREA)
Abstract
The embodiment of the invention provides an integrated module, a crimping jig, a printed circuit board and a radiator, wherein a contact pin is preset at one side of the integrated module, the crimping jig comprises a crimping upper die and a crimping lower die, and a preformed hole is preset in the printed circuit board. Positioning and mounting the printed circuit board on the lower crimping die, placing the integrated module on the printed circuit board, aligning the contact pin with the reserved hole, placing the upper crimping die on the integrated module and wrapping the integrated module; applying pressure to the crimping upper die, so that the contact pin is inserted into the reserved hole along the preset direction, and the integrated module is connected with the printed circuit board to form a circuit unit; the circuit unit is taken out of the crimping jig, the circuit unit is connected with the radiator to obtain the inverter, the integrated module and the printed circuit board are crimped firstly by changing the traditional inverter production process, the manual operation can be removed, the crimping accuracy and the welding efficiency are far higher than those of manual welding, and the assembly line batch production can be carried out.
Description
Technical Field
The invention belongs to the field of photovoltaic energy storage equipment, and particularly relates to a manufacturing method of an inverter and the inverter.
Background
In recent years, the aim of energy development is to construct a clean, low-carbon, safe and efficient energy system, and the development speed of the photovoltaic industry serving as a ring of the energy system is greatly increased.
The inverter is an important part in photovoltaic power generation, and is a converter capable of converting direct current electric energy into constant-frequency constant-voltage or frequency-modulation voltage-regulation alternating current. With the rapid development of the photovoltaic industry, the market demand for high-power inverters is also increasing, which also has higher and higher requirements on the reliability of printed circuit boards, especially on the reliability of integrated modules in direct contact with a heat sink in the inverter.
In the prior art, the electrical connection between the printed circuit board and the integrated module in the high-power inverter is as follows: the printed circuit board and the integrated module are firstly locked on the radiator by screws, and then the integrated module is manually welded on the printed circuit board. The disadvantages of this connection are: because there are a plurality of contact pins on the collection moulding piece, manual welding precision and welding inefficiency appear welding unusual inconvenience among the welding process and carry out the dismouting maintenance.
Disclosure of Invention
The embodiment of the application aims to provide a manufacturing method of an inverter and the inverter, which can improve the connection efficiency of a printed circuit board and an integrated module in a high-power inverter and can conveniently carry out disassembly, assembly and maintenance on welding abnormity in the welding process.
In order to achieve the purpose, the technical scheme adopted by the application is as follows:
in a first aspect, the present invention provides a method for manufacturing an inverter, including the steps of:
providing an integrated module, a crimping jig, a printed circuit board and a radiator, wherein a contact pin is preset on one side of the integrated module, the crimping jig comprises a crimping upper die and a crimping lower die, and a preformed hole is preset in the printed circuit board;
positioning and mounting the printed circuit board on the lower crimping die;
placing the integrated module on the printed circuit board, and aligning the contact pin with the preformed hole;
placing the crimping upper die on the integrated module and wrapping the integrated module;
applying pressure to the crimping upper die, so that the contact pin is inserted into the preformed hole along a preset direction, and the integrated module is connected with the printed circuit board to form a circuit unit;
and taking the circuit unit out of the crimping jig, and connecting the circuit unit with the radiator to obtain the inverter.
In an embodiment, the lower crimping die comprises a base, a positioning structure arranged on the base, and a connecting structure arranged on the base and spaced from the positioning structure, wherein a avoidance hole is preset on the connecting structure, a first area is arranged on the printed circuit board, and the reserved hole is arranged in the first area;
the step of positioning and mounting the printed circuit board on the crimping lower die comprises the following steps:
and placing the printed circuit board on the positioning structure, aligning the first area with the connecting structure, and aligning the preformed hole with the avoiding hole.
In one embodiment, the printed circuit board is provided with a first through hole, and the connecting structure is provided with a positioning pin;
the step after placing the printed circuit board on the positioning structure further comprises:
inserting the positioning pin into the first through hole.
In one embodiment, the crimping upper die comprises an upper die body and a plurality of pressure limiting plates arranged on the upper die body, the plurality of pressure limiting plates are connected with each other to define a first accommodating space of the crimping upper die, or the plurality of pressure limiting plates are arranged at intervals to define a second accommodating space of the crimping upper die;
the step of placing the crimping upper die on the integrated module and wrapping the integrated module comprises:
completely wrapping the integrated module in the first accommodating space;
or, the integrated module part is wrapped in the second accommodating space.
In one embodiment, the upper die body is provided with a second through hole, and the integrated module is provided with a third through hole;
the integrated module is completely wrapped in the first accommodating space; or, after the step of wrapping the integrated module part in the second accommodating space, the method further includes:
and sequentially inserting the positioning pin into the third through hole and the second through hole.
In an embodiment, the step of taking out the circuit unit from the crimping jig and connecting the circuit unit and the heat sink to obtain the inverter includes:
taking the circuit unit out of the crimping jig;
coating a heat conduction layer on the heat dissipation surface of the circuit unit;
and connecting the circuit unit with the radiator, and enabling the heat dissipation surface provided with the heat conduction layer to face the radiator.
In one embodiment, the step of coating the heat conducting layer on the heat dissipation surface of the circuit unit includes:
providing a coating jig, wherein the coating jig comprises a positioning base and a coating plate, and the coating plate is provided with a coating opening;
positioning and mounting the circuit unit on the positioning base, directly placing the coating board on the circuit unit, wrapping the coating opening with the integrated module along the circumferential direction, and keeping a preset distance between the coating board and the heat dissipation surface in the height direction;
coating heat-conducting paint on the heat dissipation surface until the thickness of the heat-conducting paint is equal to the preset distance;
cooling the thermally conductive coating to form a thermally conductive layer.
In one embodiment, the thermally conductive layer is a silicone layer.
In one embodiment, the thickness of the coating plate is 0.08-0.13mm.
In an embodiment, the positioning structure comprises a first plane abutting the printed circuit board, the connecting structure comprises a second plane abutting the printed circuit board, and the flatness tolerance between the first plane and the second plane is a positive tolerance.
In a second aspect, the invention further provides an inverter, which is prepared by adopting the manufacturing method of the inverter.
The beneficial effect of this application lies in: according to the manufacturing method of the inverter, provided by the embodiment of the invention, the traditional inverter production process is changed, the integrated module and the printed circuit board are firstly subjected to pressure welding, the manual operation can be removed, the pressure welding accuracy and the welding efficiency are far higher than those of manual welding, the assembly line batch production can be carried out, and the production efficiency of the inverter is greatly increased.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the embodiments or exemplary technical descriptions will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on the drawings without creative efforts.
Fig. 1 is a step diagram of a method of manufacturing an inverter of an embodiment of the invention;
fig. 2 is an exploded view of a crimping jig according to an embodiment of the invention;
FIG. 3 is a schematic diagram illustrating a relative position relationship between a printed circuit board and a press-bonding fixture according to an embodiment of the invention;
FIG. 4 is a perspective view of a connection structure of an embodiment of the present invention;
FIG. 5 is a perspective view of a crimping upper die in accordance with an embodiment of the present invention;
FIG. 6 is a perspective view of a crimping upper die of another embodiment of the present invention;
FIG. 7 is a schematic structural diagram of an integrated module according to an embodiment of the present invention;
FIG. 8 is a schematic diagram illustrating a relative position relationship between a circuit unit and a coating fixture according to an embodiment of the present invention;
fig. 9 is a perspective view of an inverter according to an embodiment of the present invention.
Wherein, in the figures, the respective reference numerals:
1. an integration module; 10. inserting a pin; 11. a heat dissipating surface; 12. a third through hole;
2. pressing and connecting the jig; 20. crimping an upper die; 201. an upper die body; 202. a pressure limiting plate; 203. pressing the face; 204. a second through hole; 21. crimping the lower die; 211. a base; 212. a positioning structure; 213. a corner piece limiter; 2131. a corner limiting notch; 214. a straight limit piece; 2141. a straight edge limit notch; 215. a first plane; 216. a connecting structure; 2161. positioning pins; 2162. a second plane; 2163. avoiding holes;
3. a printed circuit board; 31. a first region; 311. reserving a hole; 312. a first through hole;
4. a heat sink;
5. coating a jig; 51. a positioning base; 511. taking a plate opening; 52. coating a board; 521. coating the opening;
6. an inverter.
Detailed Description
In order to make the objects, technical solutions and advantages of the present application more apparent, the present application is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the present application.
It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly or indirectly connected to the other element. The terms "upper", "lower", "left", "right", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description, but do not indicate or imply that the referred devices or elements must have a specific orientation, be constructed in a specific orientation, and operate, and thus are not to be construed as limiting the present application, and the specific meanings of the above terms may be understood by those skilled in the art according to specific situations. The terms "first", "second" and "first" are used merely for descriptive purposes and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features. The meaning of "plurality" is two or more unless specifically limited otherwise.
It should be noted that the direction indicators in the embodiments are only used for explaining the present invention, and are not used for limiting the present invention.
Referring to fig. 1, an embodiment of the invention provides a method for manufacturing an inverter, including the following steps:
100. providing an integrated module 1, a crimping jig 2, a printed circuit board 3 and a heat sink 4, wherein a contact pin 10 is preset on one side of the integrated module 1, the crimping jig 2 comprises a crimping upper die 20 and a crimping lower die 21, and a preformed hole 311 is preset on the printed circuit board 3.
The present invention mainly improves the manufacturing method of the inverter 6, please refer to fig. 7, the integrated module 1 and the printed circuit board 3 both adopt the center of the prior art, which has no significant difference from the prior art, and refer to the prior inverter 6, it can be understood that the integrated module 1 and the printed circuit board 3 are generally connected to the metalized holes by using solder legs, which is equivalent to the pin 10 of the present invention connected to the preformed hole 311, the pin 10 and the preformed hole 311 are provided with a plurality of pins 10 corresponding to each other, and the pin 10 can be a rigid pin 10 or a pin 10 with certain elasticity. Illustratively, the pin 10 may be a fisheye pin 10.
Crimping lower mould 21 is mainly used for fixing a position the installation to printed circuit board 3, prevents to take place to rock in the crimping process to, crimping lower mould 21 can also make printed circuit board 3 keep certain height in the space, prevents that components and parts on printed circuit board 3 from contacting the workstation and taking place the damage.
200. The printed circuit board 3 is positioned and mounted on the lower crimping die 21.
When the printed circuit board 3 is mounted on the lower press-fitting die 21, only one degree of freedom is required in the space, so that the printed circuit board 3 is prevented from sliding to cause the pins 10 to slip when the pressing operation is performed. As shown in fig. 2, the printed circuit board 3 can only move in the positive Z-axis direction, and a robot may be used to place the printed circuit board 3 in the lower crimping die 21.
300. The integrated module 1 is placed on the printed circuit board 3 and the pins 10 are aligned with the prepared holes 311.
Generally, the size of the pin 10 may be slightly larger than the size of the preformed hole 311, so that the pin 10 is aligned with the preformed hole 311 and is not inserted into the preformed hole 311, and the pin 10 is pressed into the preformed hole 311 under the pressure in the preset direction, for example, the pin 10 is in interference connection or over-connected with the preformed hole 311.
400. The crimping upper die 20 is placed on the integrated module 1 and wraps the integrated module 1.
In order to avoid that the connection between the integrated module 1 and the crimping upper die 20 is unstable in the crimping process, so that the integrated module 1 cannot be stressed uniformly, the invention adopts a wrapping type connection mode, facilitates the positioning connection between the integrated module 1 and the crimping upper die 20, and increases the connection stability. After the predetermined distance is pressed, the pressing surface 203 of the upper press mold 20 abuts against the printed circuit board 3 to prevent the pin 10 from being pressed further, thereby reducing the occurrence of an over-pressure phenomenon.
500. The upper crimping die 20 is pressed to insert the pins 10 into the prepared holes 311 in a predetermined direction, so that the integrated module 1 is connected to the printed circuit board 3 to form a circuit unit.
600. The circuit unit is taken out of the crimping jig 2, and the inverter 6 is obtained by connecting the circuit unit to the heat sink 4.
According to the manufacturing method of the inverter 6 provided by the embodiment of the invention, the traditional inverter 6 production process is changed, the integrated module 1 and the printed circuit board 3 are firstly crimped, the manual operation can be removed, the crimping accuracy and the welding efficiency are far higher than those of manual welding, the assembly line batch production can be carried out, and the production efficiency of the inverter 6 is greatly increased.
It should be noted that the circuit unit is formed by combining the integrated module 1 and the printed circuit board 3, and it is understood that the printed circuit board 3 has a certain functional module, and the circuit unit is formed by mounting different integrated modules 1 to the upper side, so that the circuit unit has a desired function. In the present embodiment, for the inverter, the inversion and the boost are the most important functions of the photovoltaic inverter, so what needs to be pre-installed on the printed circuit board 3 is the inversion integrated module 1 and the boost integrated module 1. Meanwhile, after the circuit unit is obtained, components such as a housing and a heat sink need to be connected to form a complete inverter. The present invention does not improve the process of assembly of the module with the housing and heat sink and should not be a reason why the present disclosure is inadequate.
Note that, the crimping in the integrated module 1 includes the following cases:
when the integrated module 1 is provided as a single, crimping according to a single time only needs to be performed.
When there are a plurality of integrated modules 1, the integrated modules 1 may be respectively and sequentially crimped, or a plurality of integrated modules 1 may be crimped at the same time.
Referring to fig. 2-3, in an embodiment, the lower compression mold 21 includes a base 211, a positioning structure 212 disposed on the base 211, and a connecting structure 216 disposed on the base 211 and spaced apart from the positioning structure 212, the connecting structure 216 is pre-provided with an avoiding hole 2163, the printed circuit board 3 is provided with a first area 31, and the reserved hole 311 is disposed in the first area 31.
For example, the base 211 may be a rectangular plate-shaped structure, the base 211 is placed on a workbench, and the base 211 may be fixed on the workbench by forming a positioning hole.
For example, when the printed circuit board 3 is rectangular, the positioning structure 212 may include four corner limiting members 213 and a straight limiting member 214, the straight limiting member 214 is provided with a straight-side limiting notch 2141, the corner limiting member 213 is provided with a corner limiting notch 2131, the four corner limiting members 213 are disposed at four corners of the base 211, and the corner limiting notches 2131 of the four corner limiting members 213 face the center of the base 211. The corner piece stop 213 may be composed of two straight stops 214 connected in a staggered manner. The corner position-limiting members 213 can fix four corners of the printed circuit board 3, and the straight position-limiting members 214 can fix right-angled sides of the printed circuit board 3, so that the printed circuit board 3 can only move along the positive direction of the z-axis when being fixed on the positioning structure 212.
Referring to fig. 4, the connection structures 216 may be provided in one or more, corresponding to the number of the integrated modules 1. A plurality of connecting structures 216 are detachably arranged on the base plate with a predetermined rule.
In the crimping process of the integrated module 1, the crimping of the integrated module 1 on the middle position of the printed circuit board 3 can lead the printed circuit board 3 to deform, the middle part of the printed circuit board 3 is sunken towards the Z-axis negative direction, the edge of the printed circuit board 3 warps towards the Z-axis square, the axis of the preformed hole 311 and the axis of the contact pin 10 deviate, if the force along the Z-axis direction is continuously applied on the integrated module 1, the contact pin 10 can be led to be inserted into the printed circuit board 3 along the direction deviating from the axis of the preformed hole 311, the printed circuit board 3 is damaged, the aperture of the preformed hole 311 can be enlarged, and the contact pin 10 can be easily separated from the preformed hole 311 to cause poor contact.
Therefore, the connecting structure 216 is used for providing an upward supporting force, so as to reduce the sinking degree of the middle part of the printed circuit board 3 towards the negative direction of the Z axis, so that the printed circuit board 3 tends to be flat, and the preformed hole 311 tends to be attached to the axis of the contact pin 10, thereby reducing the probability of occurrence of the above situation.
Illustratively, the connecting structure 216 is a column structure having at least two parallel surfaces, the connecting structure 216 may be a prism or a frustum or a circular table, one of the surfaces is connected to the bottom plate, the other surface is connected to the printed circuit board 3, and when the printed circuit board 3 is placed on the positioning structure 212, the connecting structure 216 abuts against the printed circuit board 3. The face of the connecting structure 216 connected to the printed circuit board 3 is provided with a relief hole 2163 to prevent the pin 10 from being inserted into the connecting structure 216 during the crimping process.
Step 200 comprises: the printed circuit board 3 is placed on the positioning structure 212 such that the first area 31 is aligned with the connection structure 216 and the preformed hole 311 is aligned with the avoiding hole 2163. The step can reduce the damage of the printed circuit board 3 in the crimping process and improve the yield of products. It will be appreciated that, since the distribution of the integrated modules 1 is different for different printed circuit boards 3, the positions of the plurality of connecting structures 216 need only be changed, and thus the wide applicability is achieved. Particularly, according to the embodiment, a designer of the printed circuit board 3 can divide one or more first regions 31 in advance to meet the function and heat dissipation requirements of the printed circuit board 3, and the jig can be conveniently adapted by synchronously moving the position of the connecting structure 216 on the bottom plate.
In one embodiment, the printed circuit board 3 is provided with a first through hole 312, and the connecting structure 216 is provided with a positioning pin 2161.
Illustratively, the first through hole 312 is a circular hole, the positioning pin 2161 is a cylindrical positioning pin 2161, the first through hole 312 is connected with the positioning pin 2161 in a matching manner, and the printed circuit board 3 can slide on the positioning pin 2161 along the Z-axis direction through the first through hole.
Steps subsequent to step 300 further include: the positioning pin 2161 is inserted into the first through hole 312. This step functions to perform secondary positioning of the printed circuit board 3, so that the printed circuit board 3 can be quickly mounted on the lower crimping die 21.
Referring to fig. 5 to 6, in an embodiment, the crimping upper die 20 includes an upper die body 201 and a plurality of pressure-limiting plates 202 disposed on the upper die body 201, where the plurality of pressure-limiting plates 202 are connected to each other to define a first receiving space of the crimping upper die 20, or the plurality of pressure-limiting plates 202 are disposed at intervals to define a second receiving space of the crimping upper die 20.
Referring to fig. 7, for example, the plurality of pressure limiting plates 202 are symmetrically distributed on the circumferential direction of the Z axis with the Z axis as a central axis, the plurality of pressure limiting plates 202 are connected to each other to form a rectangular parallelepiped housing, a first accommodating space is defined between the rectangular parallelepiped housing and the upper die body, and the shape of the first accommodating space depends on the connection manner of the pressure limiting plates 202.
Illustratively, two pressure limiting plates 202 are arranged, spaced and oppositely arranged on two sides of the upper die body 201, and the two pressure limiting plates 202 and the upper die body define a second accommodating space.
Step 400 comprises:
the integrated module 1 is completely wrapped in the first accommodating space. It will be appreciated that by completely enclosing the integrated module 1 in the first space, tilting of the integrated module 1 due to uneven forces applied during the pressing down process can be prevented.
Or, the integrated module 1 is partially wrapped in the second accommodating space, so that the pressing condition of the pins 10 can be clearly observed, and the pressing pressure can be adjusted.
In an embodiment, the upper die body 201 is provided with a second through hole 204, and the integrated module 1 is provided with a third through hole 12;
completely wrapping the integrated module 1 in the first accommodating space; or, after the step of partially wrapping the integrated module 1 in the second receiving space, the method further includes:
the positioning pins 2161 are inserted into the third through hole 12 and the second through hole 204 in sequence.
Illustratively, the positioning pin 2161 is arranged along the Z-axis direction, and when the crimping action is performed, the upper crimping die 20 and the integrated die move downwards along the axial direction of the positioning pin 2161, so as to further ensure the connection stability of the pin 10 and the prepared hole 311.
In one embodiment, the side of the integrated module 1 facing away from the pins 10 is provided with a heat dissipation surface 11. Exemplarily, the heat dissipation surfaces 11 and the pins 10 are disposed on two opposite sides of the integrated module 1 in the Z-axis direction, the heat dissipation surfaces 11 may be flat surfaces, and the heat dissipation surfaces 11 are disposed to increase the bonding area between the integrated module 1 and the heat sink 4 and increase the heat dissipation capability of the integrated module 1.
Step 600 comprises:
taking out the circuit unit from the crimping jig 2;
coating a heat conduction layer on the heat dissipation surface 11 of the circuit unit;
the circuit unit is connected to the heat sink 4, and the heat radiation surface 11 having the heat conductive layer faces the heat sink 4.
For example, the step of taking out the circuit unit from the crimping jig 2 may be: along the positive half axis direction of the Z axis, the upper crimping die 20 is taken off from the positioning pin 2161, and then the circuit unit is taken out directly.
Because part of the integrated module 1 is made of plastic, when the circuit unit is installed on the radiator 4, the integrated module 1 is abutted against the radiator 4, the integrated module 1 exchanges heat with the radiator 4 through heat conduction between the heat dissipation surface 11 and the radiator 4, and in order to increase the heat transfer efficiency between the heat dissipation surface 11 and the radiator 4, the heat dissipation surface 11 of the circuit unit (the heat dissipation surface 11 on the circuit unit integrated module 1) is coated with a heat conduction layer, and the heat conduction layer faces the radiator 4, so that the heat transfer efficiency is increased. The heat conductivity of the heat conducting layer is exemplarily greater than the heat conductivity of the heat dissipation surface 11 of the integrated module 1. The heat conducting layer is used for filling gaps generated when the integrated module 1 is in hard contact with the radiator 4, and the heat radiating efficiency is improved.
Referring to fig. 8, in an embodiment, the step of coating the heat-conducting layer on the heat-dissipating surface 11 of the circuit unit includes:
providing a coating jig 5, wherein the coating jig 5 comprises a positioning base 51 and a coating plate 52, and the coating plate 52 is provided with a coating opening 521;
positioning the circuit unit on the positioning base 51, directly placing the coating plate 52 on the circuit unit, wrapping the coating opening 521 around the integrated module 1, and keeping the coating plate 52 at a preset distance from the heat dissipation surface 11 in the height direction;
coating heat-conducting paint on the heat dissipation surface 11 until the thickness of the heat-conducting paint is equal to the preset distance;
cooling the thermally conductive coating to form a thermally conductive layer.
Illustratively, the positioning base 51 is similar to the lower crimping die 21 in structure and is spaced from the working surface of the table by a certain distance when the circuit unit is placed on the positioning base 51, for example, the positioning base 51 can keep a height difference of 60-80mm between the circuit unit and the working surface, so as to avoid the circuit unit from being damaged by contacting with the working surface when the circuit unit is installed, and the circuit unit is positioned on the positioning base 51 and can only be withdrawn from the positioning base 51 along the positive half-axis direction of the Z-axis. The positioning base 51 is provided with a board taking opening 511, and when the circuit unit is placed on the positioning base 51, the board taking opening 511 is arranged between the circuit unit and the positioning base 51 and used for conveniently taking out the circuit unit.
After the circuit unit is positioned and installed on the positioning base 51, the heat dissipation surface 11 can be directly coated with the coating manually, but the manual coating can cause uneven thickness of the heat conduction layer, which further affects the heat dissipation capability of the circuit unit, and the coating can be sputtered onto the printed circuit board 3, which results in scrapping of the printed circuit board 3.
As a preferable example, when the coating board 52 is placed on the circuit unit, the coating board 52 is positioned and mounted on the positioning base 51, as a supplementary description for mounting the coating board 52, when the integrated module 1 is a cylinder, the heat dissipation surface 11 is one of two end surfaces, the coating board 52 has a circular coating opening 521, the coating opening 521 is made to wrap the integrated module 1 along the circumferential direction, that is, the outer side wall of the cylinder is made to be matched and connected with the inner side wall of the coating opening 521, the coating board 52 keeps a preset distance from the heat dissipation surface 11 in the height direction, that is, the position of the integrated module 1 relative to the coating board 52 is adjusted, and the heat dissipation surface 11 is located in the coating opening 521, it can be understood that the preset distance is equal to the distance between the heat dissipation surface 11 and the upper surface of the coating board 52 in the Z-axis direction.
Preferably, the shape of the coating opening 521 may vary, for example, the coating opening 521 may include a first portion and a second portion communicating with each other. The first part and the second part are both columnar cavities and are communicated with each other. For example, the first portion may be a cylinder, and the second portion may be a cylindrical inscribed polygon, where the cylinder may be positioned and installed on the integrated module 1 in the Z-axis direction, and the inscribed polygon determines the shape and thickness of the heat conducting layer.
Illustratively, the coating plate 52 may be a steel plate, and the thickness of the steel plate may be equal to that of the heat conductive layer, which facilitates rapid thermal dissipation and solidification of the coating.
This embodiment is through the setting of coating opening 521, can control the shape and the thickness of heat-conducting layer, and heat-conducting layer thickness is even and can not make coating sputter to printed circuit board 3 when the coating on, leads to printed circuit board 3 to scrap, makes radiating surface 11 have good heat-sinking capability, and this embodiment also can be applicable to the viscosity and is lower the coating and be connected between radiating surface 11 simultaneously.
It should be noted that the above description of the shape of the integrated module 1 is only for more clearly illustrating the connection principle of the connection circuit unit and the coating plate 52, and is not intended to specifically limit the shape of the integrated module 1 or the coating opening 521, and the shape of the coating opening 521 may be substantially similar to the cross-sectional shape of the integrated module 1.
In one embodiment, the thermally conductive layer is a silicone layer. The silicone grease layer is composed of a substantially liquid matrix of polymer and a large amount of electrically non-conductive but thermally conductive filler (filler). Typical matrix materials are silicone (primary), polyurethane, acrylate polymers, etc.; the fillers include diamond powder (primary), aluminum nitride (secondary), aluminum oxide, boron nitride, and zinc oxide. The mass fraction of filler is generally 70-80%.
In one embodiment, the coating plate 52 and the thermally conductive layer are each 0.08-0.13mm thick. Too thick a heat conducting layer affects the heat conduction, too thin a heat conducting layer cannot fill the gap between the heat sink 4 and the integrated module 1, and the coating plate 52 and the heat conducting layer may have a thickness of 0.08mm, 0.085mm, 0.09mm, 0.095mm, 0.10mm, 0.105 mm, 0.11 mm, 0.115 mm, 0.12 mm, 0.125 mm, 0.13mm, for example.
In an embodiment, the positioning structure 212 includes a first plane 215 abutting against the printed circuit board 3, and the connecting structure 216 includes a second plane 2162 abutting against the printed circuit board 3, it should be noted that the second plane 2162 is a plane formed by combining a plurality of straight position-limiting elements 214 and a plane where the corner position-limiting elements 213 abut against the printed circuit board 3, a negative tolerance is formed between the first plane 215 and the second plane 2162, which is likely to cause the integrated module 1 to be pressed excessively against the printed circuit board 3, and a flatness tolerance between the first plane 215 and the second plane 2162 is a positive tolerance, which is in a range of 0 to +0.05mm.
Referring to fig. 9, the present invention further provides an inverter 6, wherein the inverter 6 is manufactured by using the method for manufacturing an inverter according to any one or more of the above embodiments. Since the inverter adopts all technical solutions of all the embodiments, all the beneficial effects brought by the technical solutions of the embodiments are also achieved, and are not repeated herein.
The above are merely examples of the present application and are not intended to limit the present application. Various modifications and changes may occur to those skilled in the art. Any modification, equivalent replacement, improvement or the like made within the spirit and principle of the present application shall be included in the scope of the claims of the present application.
Claims (9)
1. A method of manufacturing an inverter, comprising the steps of:
providing an integrated module, a crimping jig, a printed circuit board and a radiator, wherein a contact pin is preset on one side of the integrated module, the crimping jig comprises a crimping upper die and a crimping lower die, and a preformed hole is preset in the printed circuit board;
positioning and mounting the printed circuit board on the lower crimping die;
placing the integrated module on the printed circuit board, and aligning the contact pin with the preformed hole;
placing the crimping upper die on the integrated module and wrapping the integrated module;
applying pressure to the crimping upper die, so that the contact pin is inserted into the preformed hole along a preset direction, and the integrated module is connected with the printed circuit board to form a circuit unit;
taking the circuit unit out of the crimping jig, and connecting the circuit unit with the radiator to obtain the inverter;
a heat dissipation surface is preset on one side of the integrated module, which is far away from the contact pin;
the step of taking out the circuit unit from the crimping jig and connecting the circuit unit with the radiator to obtain the inverter includes:
taking the circuit unit out of the crimping jig;
coating a heat conduction layer on the heat dissipation surface of the circuit unit;
connecting a circuit unit with the radiator, enabling the heat dissipation surface with the heat conduction layer to face the radiator, and enabling the integrated module to be abutted against the radiator when the circuit unit is installed on the radiator;
the step of coating the heat conduction layer on the heat dissipation surface of the circuit unit comprises the following steps:
providing a coating jig, wherein the coating jig comprises a positioning base and a coating plate, and the coating plate is provided with a coating opening; the coating jig is used for coating the heat conduction layer on the heat dissipation surface, and the coating plate controls the shape and the thickness of the heat conduction layer through the coating opening;
positioning and mounting the circuit unit on the positioning base, directly placing the coating board on the circuit unit, wrapping the coating opening with the integrated module along the circumferential direction, and keeping a preset distance between the coating board and the heat dissipation surface in the height direction;
coating heat-conducting paint on the heat dissipation surface until the thickness of the heat-conducting paint is equal to the preset distance;
cooling the thermally conductive coating to form a thermally conductive layer.
2. The method of manufacturing an inverter according to claim 1, wherein: the lower crimping die comprises a base, a positioning structure arranged on the base and a connecting structure arranged on the base and spaced from the positioning structure, avoidance holes are preset in the connecting structure, a first area is arranged on the printed circuit board, and the reserved holes are arranged in the first area;
the step of positioning and mounting the printed circuit board on the lower crimping die comprises the following steps:
and placing the printed circuit board on the positioning structure, aligning the first area with the connecting structure, and aligning the preformed hole with the avoiding hole.
3. The method of manufacturing an inverter according to claim 2, wherein: the printed circuit board is provided with a first through hole, and the connecting structure is provided with a positioning pin;
the step after placing the printed circuit board on the positioning structure further comprises:
inserting the positioning pin into the first through hole.
4. The method of manufacturing an inverter according to claim 3, wherein: the crimping upper die comprises an upper die body and a plurality of pressure limiting plates arranged on the upper die body, the plurality of pressure limiting plates are connected with one another to limit a first accommodating space of the crimping upper die, or the plurality of pressure limiting plates are arranged at intervals to limit a second accommodating space of the crimping upper die;
the step of placing the crimping upper die on the integrated module and wrapping the integrated module comprises:
completely wrapping the integrated module in the first accommodating space;
or, the integrated module part is wrapped in the second accommodating space.
5. The method of manufacturing an inverter according to claim 4, wherein: the upper die body is provided with a second through hole, and the integrated module is provided with a third through hole;
the integrated module is completely wrapped in the first accommodating space; or, after the step of wrapping the integrated module part in the second accommodating space, the method further includes:
and sequentially inserting the positioning pin into the third through hole and the second through hole.
6. The method of manufacturing an inverter according to claim 1, wherein: the heat conduction layer is a silicone layer.
7. The method of manufacturing an inverter according to claim 1, wherein: the thickness of the coating plate is 0.08-0.13mm.
8. The method of manufacturing an inverter according to claim 2, wherein: the positioning structure comprises a first plane abutting against the printed circuit board, the connecting structure comprises a second plane abutting against the printed circuit board, and the flatness tolerance between the first plane and the second plane is positive tolerance.
9. An inverter, characterized by: the inverter is manufactured by the manufacturing method of the inverter according to any one of claims 1 to 8.
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Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101882585A (en) * | 2010-06-23 | 2010-11-10 | 四川虹欧显示器件有限公司 | Method for arranging radiator of integrated circuit and integrated circuit component |
| CN102665374A (en) * | 2012-04-20 | 2012-09-12 | 京信通信系统（中国）有限公司 | Method for assembling printed circuit board |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN2636414Y (en) * | 2003-06-14 | 2004-08-25 | 鸿富锦精密工业（深圳）有限公司 | Radiator heat conducting gum protective device |
| CN102056411B (en) * | 2009-11-10 | 2016-06-01 | 沈阳新邮通信设备有限公司 | Printing fixture for circuit board |
| CN206401697U (en) * | 2016-12-26 | 2017-08-11 | 武汉倍普科技有限公司 | A kind of connector compression bonding apparatus of printed circuit board assembly |
| CN110719705B (en) * | 2018-07-11 | 2022-06-03 | 迈普通信技术股份有限公司 | Crimping die block |
| CN109219233B (en) * | 2018-09-04 | 2021-01-22 | 合肥巨一动力系统有限公司 | Crimping structure and crimping method for PCB and IGBT module |
| CN111970917B (en) * | 2020-07-30 | 2021-06-15 | 西南电子技术研究所（中国电子科技集团公司第十研究所） | Flat pressing type crimping tool for PCB and connector |
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Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101882585A (en) * | 2010-06-23 | 2010-11-10 | 四川虹欧显示器件有限公司 | Method for arranging radiator of integrated circuit and integrated circuit component |
| CN102665374A (en) * | 2012-04-20 | 2012-09-12 | 京信通信系统（中国）有限公司 | Method for assembling printed circuit board |
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