CN216852675U

CN216852675U - Packaging shell and radar

Info

Publication number: CN216852675U
Application number: CN202123317075.7U
Authority: CN
Inventors: 施陈辉; 冯友怀; 张燎
Original assignee: Nanjing Hawkeye Electronic Technology Co Ltd
Current assignee: Nanjing Hawkeye Electronic Technology Co Ltd
Priority date: 2021-12-27
Filing date: 2021-12-27
Publication date: 2022-06-28
Anticipated expiration: 2031-12-27

Abstract

The application provides a package casing and radar, package casing's electrically conductive piece and/or radiating piece and first lid form the integral type structure for the connection between each part is more stable. Moreover, sealing and waterproofing can be realized through the integrated structure, relative vibration cannot be generated among all the parts, and structures such as sealing and waterproofing are not additionally arranged between the conductive piece and the first cover body and between the radiating piece and the first cover body, so that the parts and assembly processes are reduced, the cost is reduced, the process is simplified, and the assembly efficiency is improved. Simultaneously, also avoided after longer live time, connecting piece such as bolt and sealed and waterproof isotructure produce the risk of pine scheduling problem, help improving the life of product and the reliability when using for a long time.

Description

Packaging shell and radar

Technical Field

The application relates to the technical field of radars, in particular to a packaging shell and a radar.

Background

The radar shell is generally mainly composed of three parts, namely a connector, a radiating block and a shell, wherein the three parts are three independent parts, and when the radar shell is prepared, the three parts are generally prepared respectively and then assembled and fixed through connecting pieces such as screws and connecting columns, so that a finished product of the radar shell is finally obtained.

In the actual production and preparation process, in order to meet the waterproof requirement and the vibration isolation requirement of the radar, the connection reliability between the three parts is higher, and therefore, related parts are required to be additionally added at the connection positions of the three parts to meet the waterproof and vibration isolation requirements. Therefore, parts required by the radar shell are added, so that the structure of the radar shell becomes complex, the assembly steps are more, the precision requirement is correspondingly high, the cost of process production and the like is increased, and the large-scale manufacturing and the popularization and application of products are not facilitated.

SUMMERY OF THE UTILITY MODEL

The application provides a packaging shell and a radar, so that the connection reliability of main parts in the packaging shell is guaranteed.

The application provides a packaging shell, which comprises a first cover body, a conductive piece and a radiating piece, wherein the first cover body is provided with a connecting part which extends outwards from the outer wall of the first cover body, and a connecting interface communicated into the first cover body is formed in the connecting part; the conductive piece is arranged at the connecting interface; the heat dissipation member is arranged in the first cover body; the conductive piece and/or a part of the heat dissipation piece are/is covered by the first cover body to form an integrated structure with the first cover body.

In some embodiments, the heat sink is circumferentially provided with a step portion, and the step portion is covered by the first cover.

In some embodiments, the heat dissipation member has a first side surface, the first side surface has a plurality of ribs formed thereon, and the first side surface is covered by the first cover.

In some embodiments, the heat sink further has a second side surface opposite to the first side surface, and the second side surface is provided with a heat dissipation boss.

In some embodiments, the heat dissipation member is provided with an avoidance hole, and the side wall of the heat dissipation member close to the avoidance hole is provided with a protruding part protruding in a direction away from the avoidance hole.

In some embodiments, the conductive member is formed as an integral structure with the first cover by insert molding.

In some embodiments, the heat sink is formed as a unitary structure with the first cover by insert molding.

In some embodiments, the heat dissipation element is further provided with a positioning hole, and the positioning hole comprises a coarse positioning hole and a fine positioning hole, and the diameter of the coarse positioning hole is larger than that of the fine positioning hole.

In some embodiments, the package housing further includes a second cover body, the first cover body and the second cover body are matched to form a receiving space, the connection interface is communicated to the receiving space, and the conductive component and the heat sink are located in the receiving space.

Correspondingly, this application still provides a radar, and it includes aforementioned encapsulation casing and printed circuit board, printed circuit board sets up just be provided with the chip on and in the first lid, encapsulation casing electrically conductive with the printed circuit board electricity is connected, just encapsulation casing's radiating piece with be provided with on the printed circuit board the position of chip contacts.

The application has the following beneficial effects: the application provides a package casing and radar, package casing's electrically conductive piece and/or radiating piece and first lid form the integral type structure for the connection between each part is more stable. Moreover, sealing and waterproofing can be realized through the integrated structure, relative vibration cannot be generated among all the parts, additional sealing and waterproofing structures and the like do not need to be additionally arranged between the conductive piece and the first cover body and between the radiating piece and the first cover body, so that the parts and assembly processes are reduced, the cost is reduced, the process is simplified, the assembly efficiency is improved, and the large-scale production of products is facilitated. Meanwhile, the risk that the connecting pieces such as bolts and the structures such as sealing and water proofing are loosened after a long service time is avoided, and the service life of the product is prolonged and the reliability of the product in long-term use is improved.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present application, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.

Fig. 1 schematically illustrates a structure of a package housing according to the present application.

Fig. 2 is a schematic view illustrating an integrated structure formed by the first cover body, the conductive member, and the heat sink in the present application.

Fig. 3 schematically shows the structure of the second side surface of the heat sink in the present application.

Fig. 4 exemplarily shows a structural view of a first side surface of a heat sink in the present application.

Fig. 5 is a schematic diagram illustrating a structure of a radar in the present application.

Fig. 6 illustrates a schematic view of the structure of the printed circuit board of fig. 5.

The main elements in this application are labeled as follows:

first cover 110 of package housing 100

Connecting part 111 and connecting interface 112

The heat sink 130 of the conductive member 120

Coarse positioning hole 131 fine positioning hole 132

Step 133 first side 134

Second side 135 first ribs 136

Second rib 137 heat dissipation boss 138

Relief hole 139 protrusion 1391

Printed circuit board 140 chip 141

Protruding member 142 second cover 150

Radar 300

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are only a part of the embodiments of the present application, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application. Furthermore, it should be understood that the detailed description and specific examples, while indicating exemplary embodiments of the invention, are given by way of illustration and explanation only, and are not intended to limit the scope of the invention. In the present application, unless otherwise specified, the use of directional terms such as "upper", "lower", "left" and "right" generally refer to upper, lower, left and right in the actual use or operation of the device, and specifically to the orientation of the drawing figures.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of the feature.

The present application provides a package case and a radar, which will be described in detail below. It should be noted that the following description of the embodiments is not intended to limit the preferred order of the embodiments of the present application. In the following embodiments, the descriptions of the respective embodiments have respective emphasis, and reference may be made to related descriptions of other embodiments for parts that are not described in detail in a certain embodiment.

Referring to fig. 1, an embodiment of the present application provides a package body 100, where the package body 100 can be applied to various components with connection functions to serve as a housing of the components and provide functions of accommodating and protecting components therein. Illustratively, the package 100 may be used as a housing for the radar 300, and components related to the radar 300 are disposed in the package 100. As another example, the package body 100 may be a housing of a photoelectric converter, and related components such as an optical fiber adapter and a photoelectric conversion module are disposed in the package body 100.

As shown in fig. 2, the package housing 100 mainly includes a first cover 110, a conductive member 120, and a heat sink 130.

The first cover 110 is a base for supporting other components, the first cover 110 has a connecting portion 111 extending outward from an outer wall thereof, and a connecting interface 112 communicating with the inside of the first cover 110 is formed in the connecting portion 111. In some embodiments, the first cover 110 is further provided with a connection hole for connecting a component disposed in the first cover 110, such as the printed circuit board 140, by a connection member, such as a bolt or a connection pin. Illustratively, the coupling holes are provided at four corners of the first cover 110.

The conductive member 120 is disposed at the connection interface 112, where the conductive member 120 is used for electrically connecting with a component disposed in the first cover 110 and providing a function for electrically connecting the component with the outside. For example, as shown in fig. 2, the conductive members 120 may be a plurality of pins, and the pins are disposed at an inner end of the connection interface 112, and when an external device is plugged into the connection interface 112 and electrically connected to the pins, the pins enable the external device to be electrically connected to components in the first cover 110, so as to transmit electrical signals.

The heat sink 130 is disposed in the first cover 110, where the heat sink 130 is used to provide a heat dissipation function for components disposed in the first cover 110. For example, referring to fig. 2 and 3, the heat sink 130 is a flat plate-shaped structure, and the heat sink 130 can contact other components disposed in the first cover 110 to provide heat dissipation. It may be made of metal, for example, aluminum, or for better heat dissipation performance, the heat dissipation member 130 may be made of copper with higher cost or its main heat dissipation portion is made of copper. It is understood that, in other embodiments, the heat dissipation member 130 may also be made of other materials with good thermal conductivity, and/or a thermal grease layer may be further disposed on the heat dissipation member 130 to enhance the heat dissipation effect, which is not limited in this embodiment.

Here, a portion of the conductive member 120 and/or the heat sink 130 is covered by the first cover body 110 to form an integrated structure with the first cover body 110.

For example, a portion of the conductive member 120 is covered by the first cover 110, and the conductive member 120 and the first cover 110 form an integrated structure. In another example, a portion of the heat sink 130 is covered by the first cover 110, and the heat sink 130 and the first cover 110 form an integrated structure. Further exemplarily, a portion of the conductive element 120 and a portion of the heat sink 130 are respectively covered by the first cover body 110, and the conductive element 120, the heat sink 130 and the first cover body 110 form an integrated structure.

It can be seen that, in the package housing 100 provided in the present application, the conductive element 120 and/or the heat sink 130 and the first cover 110 form an integrated structure, and compared to a scheme that the conductive element 120 and the heat sink 130 are assembled to the first cover 110 by a connector such as a bolt, the present application enables the components to form an integrated connection, which is more stable. Moreover, sealing and waterproofing can be realized through the integrated structure, relative vibration does not occur between the components, and additional structures such as sealing and waterproofing are not required to be additionally arranged between the conductive component 120 and the first cover body 110 and between the heat dissipation member 130 and the first cover body 110, so that the number of parts and assembly processes is reduced, the cost is reduced, the process is simplified, and the assembly efficiency is improved. Simultaneously, also avoided after longer live time, connecting piece such as bolt and sealed and waterproof isotructure produce the risk of pine scheduling problem, help improving the life of product and the reliability when using for a long time.

In some embodiments, the integrated structure formed between the conductive member 120 and/or the heat sink 130 and the first cover body 110 is obtained by insert molding. The insert molding refers to a molding process for preparing an integrated structure including the first cover body 110 by putting the conductive component 120 and/or the heat sink 130 as an insert into a mold. Specifically, the molding method is to load the conductive device 120 and/or the heat sink 130 into a mold, and then inject a resin or other molten material so that the molten material and the conductive device 120 and/or the heat sink 130 form an integrated structure.

For example, a connecting portion 111 is formed on the conductive member 120 through an injection molding process, and then the conductive member 120 with the connecting portion 111 is placed in an injection mold, wherein a positioning structure is provided in the injection mold to position the connecting portion 111 so as to position the conductive member 120. Then, a molten material is injected into the injection mold to perform insert molding, and an integrated structure including the conductive member 120 and the first cover body 110 is formed.

For example, referring to fig. 3 and 4, the heat dissipation element 130 is provided with a positioning portion, and the positioning portion includes a coarse positioning portion and a fine positioning portion, where the coarse positioning portion may be a coarse positioning hole 131, the fine positioning portion may be a fine positioning hole 132, and an aperture of the coarse positioning hole 131 is larger than an aperture of the fine positioning hole 132. The injection mold is provided with positioning pins corresponding to the coarse positioning portion and the fine positioning portion, respectively, and the positioning pins can be matched with the corresponding coarse positioning holes 131 or the fine positioning holes 132 to position the heat sink 130 into the injection mold. Because the diameter of the coarse positioning hole 131 is large, the positioning pin can be in transition fit with the coarse positioning hole 131 to realize coarse positioning, and the diameter of the fine positioning hole 132 is small, and the positioning pin can be in clearance fit or interference fit with the fine positioning hole 132 to realize fine positioning. Here, the different apertures of the fine positioning hole 132 and the coarse positioning hole 131 can prevent the fine positioning hole 132 and the coarse positioning hole 131 from being tightly matched with the heat sink 130 during positioning, and thus the positioning portion and the positioning pin are damaged due to interference when the assembly accuracy is insufficient. After the positioning is completed, a molten material is injected into the injection mold to perform insert injection, and an integrated structure including the heat sink 130 and the first cover 110 is formed.

For example, the conductive member 120 and the heat sink 130 are positioned in the injection mold, and then a molten material is injected into the injection mold to perform insert molding, thereby forming an integrated structure.

It is understood that in other embodiments, the integrated structure may be obtained by other methods, for example, a 3D printing process is performed on the conductive component 120 and/or the heat dissipation component 130 to form an integrated structure including the first cover 110.

In some embodiments, referring to fig. 3, in order to enable the heat sink 130 to be stably disposed in the first cover 110, a step portion 133 is disposed in a circumferential direction of the heat sink 130, and the step portion 133 is covered by the first cover 110. Compared with the heat sink 130 having a flat plate shape in the circumferential direction, when the first cover body 110 covers the circumferential direction of the heat sink 130, due to the arrangement of the step portion 133, a larger covering area can be provided between the heat sink 130 and the first cover body 110, so that the heat sink 130 and the first cover body 110 are connected more stably in an integrated manner. When the heat sink 130 is used for a long time, the integrated connection between the heat sink 130 and the first cover 110 is not easy to crack or separate due to external vibration.

Illustratively, the heat sink 130 is provided with a plurality of discontinuous stepped portions 133 at intervals in the circumferential direction. As another example, referring to fig. 3, a continuous step 133 is disposed at a circumferential position of the heat sink 130, and the step 133 is disposed completely around the circumferential position of the heat sink 130, so that the heat sink 130 and the first cover body 110 have a larger covering area therebetween.

In some embodiments, referring to fig. 3 and 4, the heat dissipation element 130 has a first side surface 134 and a second side surface 135 opposite to each other, and the first side surface 134 is covered by the first cover 110, so that a larger covering area is provided between the heat dissipation element 130 and the first cover 110, and the heat dissipation element 130 and the first cover 110 are connected more stably in an integrated manner.

In some examples, a plurality of ribs are formed on the first side 134, and the ribs are arranged to allow more wrapping area between the first side 134 of the heat sink 130 and the first cover 110. Meanwhile, the arrangement of the ribs also increases the heat exchange area between the first side surface 134 and the first cover 110, so that the heat sink 130 has a better heat dissipation effect.

Illustratively, a plurality of parallel ribs are uniformly disposed on the first side surface 134, so that the distribution of the connection force between the first side surface 134 and the first cover 110 is relatively uniform. As shown in fig. 4, a plurality of parallel first ribs 136 are uniformly disposed on the first side surface 134, and a plurality of parallel second ribs 137 are uniformly disposed on the first side surface 134, and the arrangement directions of the first ribs 136 and the second ribs 137 are not parallel, that is, an included angle is formed between the arrangement directions of the first ribs 136 and the second ribs 137. In this embodiment, the included angle is 90 °, that is, the first rib 136 is perpendicular to the second rib 137. Here, a plurality of ribs are disposed on the first side surface 134, so that the coating area is increased, the integral connection is more stable, and the heat dissipation effect of the heat dissipation member 130 is better. Meanwhile, the first ribs 136 and the second ribs 137 which are uniformly and alternately arranged also make the distribution of the connection force between the first side surface 134 and the first cover 110 more balanced and reliable.

In some embodiments, referring to fig. 3, a heat dissipation boss 138 is further disposed on the second side surface 135 of the heat dissipation member 130. The heat dissipation boss 138 is used to contact with a component that needs to dissipate heat and is disposed in the first cover 110, so as to provide a heat dissipation function.

For example, referring to fig. 5 and 6, a printed circuit board 140 is disposed in the first cover 110, the printed circuit board 140 has a chip 141 thereon, and the heat dissipation boss 138 is disposed corresponding to the chip 141, so that when the printed circuit board 140 is mounted in the first cover 110, an outer surface of the heat dissipation boss 138 can be attached to a position of the printed circuit board 140 where the chip 141 is disposed, so as to provide a heat dissipation function. It is understood that the specific number, the arrangement position, the projection height, etc. of the heat dissipation bosses 138 can be set according to the requirement of the actual product, and the present embodiment does not limit the same.

In some embodiments, please refer to fig. 3, in order to avoid the component disposed in the first cover body 110, the heat dissipation member 130 is provided with an avoidance hole 139, and meanwhile, in order to prevent the strength of the integrated structure formed by the first cover body 110 and the heat dissipation member 130 and/or the conductive member 120 from being weakened due to the provision of the avoidance hole 139, the heat dissipation member 130 is provided with a protruding portion 1931 protruding in a direction away from the avoidance hole 139 on a side wall close to the avoidance hole 139, so as to increase the thickness and the strength of the integrated structure corresponding to the position of the avoidance hole 139.

For example, referring to fig. 5, a printed circuit board 140 is disposed in the first cover body 110, referring to fig. 6, a protruding component 142 is disposed on the printed circuit board 140, referring to fig. 3, an avoiding hole 139 is disposed on the heat dissipation member 130 at a position relatively close to the edge, corresponding to the protruding component 142, and in this embodiment, the avoiding hole 139 is circular, it is understood that in other examples, the avoiding hole 139 may be disposed according to the shape of the component to be avoided. Heat dissipation member 130 is being close to on dodging hole 139's the lateral wall, be formed with to keeping away from dodge hole 139's the convex bulge 1931 of direction, just bulge 1931's outer end wall with dodge the wall looks profile modeling of hole 139 homonymy. Here, the protrusion 1931 makes the side wall of the heat sink 130 at the position corresponding to the avoiding hole 139 not thinned due to the arrangement of the avoiding hole 139, and thus the integrated structure including the heat sink 130 can have good strength at this position.

In some embodiments, referring to fig. 5, the package housing 100 further includes a second cover 150, the first cover 110 and the second cover 150 are matched with each other and form a receiving space therebetween, the connection interface 112 is connected to the receiving space, and the conductive component 120 and the heat sink 130 are located in the receiving space. The first cover body 110 and the second cover body 150 may be connected by a bolt, a welding, a clamping, or the like, and in this embodiment, for example, the first cover body 110 and the second cover body 150 are connected by a laser welding method.

Here, the second cover 150 and the first cover 110 are connected to each other to form a relatively independent accommodating space, wherein the second cover 150 may be connected to or be a part of other components, for example, it is a connecting seat connected to a vehicle, and the first cover 110 may be connected to the second cover 150 to achieve connection with the vehicle. Alternatively, the second cover 150 may not be connected to other components, and after the first cover 110 and the second cover 150 are connected, the package housing 100 may be connected to other components by welding, bolting, or other connection methods, which is not limited in this embodiment.

In order to better achieve the technical effect of the package housing 100, please refer to fig. 5, an embodiment of the present application specifically applies the package housing 100 to a radar 300 as a housing of the radar 300, and accordingly, an embodiment of the present application further provides a radar 300, where the radar 300 includes the package housing 100 and a printed circuit board 140, where the printed circuit board 140 is disposed in the first cover 110 and a chip 141 is disposed on the printed circuit board 140.

Here, the conductive member 120 of the package housing 100 is electrically connected to the printed circuit board 140, so that when an external device is plugged into the connection interface 112 and electrically connected to the conductive member 120, the conductive member 120 enables the external device to be electrically connected to the printed circuit board 140 accordingly. The external device may be a control system of a mobile device, such as a vehicle control system of an automobile, and the control system has a connector for mating connection with the connection interface 112 and the conductive member 120.

The heat sink 130 of the package housing 100 contacts the printed circuit board 140 at a position where the chip 141 is disposed, and illustratively, when the heat sink is disposed with the heat dissipating boss 138, the heat dissipating boss 138 is attached to the printed circuit board 140 at a position where the chip 141 is disposed.

It can be understood that the terms in the radar 300 of the present embodiment have the same meanings as those in the package housing 100, and specific implementation details may refer to descriptions in the embodiment of the package housing 100, and both the example descriptions and technical effects shown in the foregoing embodiment can be correspondingly implemented for the radar 300, and details of the present embodiment are not repeated.

Application example 1

In a first application example, a package housing 100 is provided, the package housing 100 includes the first cover 110, the conductive device 120 and the heat sink 130, wherein a section of the peripheral side portion of the conductive device 120, a first side 134 of the heat sink 130 close to the first cover 110, and a step portion 133 circumferentially disposed on the heat sink 130 are covered by the first cover 110 through an insert molding process, and the first cover 110, the conductive device 120 and the heat sink 130 form an integrated structure. The first cover body 110, the conductive member 120 and the heat sink 130 included in the integrated structure have good connection stability and sealing performance.

Application example two

In a second application example, a vehicle-mounted millimeter wave radar is provided, which has the package body 100 provided in the first application example as a housing, and the printed circuit board 140 is connected in the package body 100. A connecting base is provided on the vehicle, which is referred to as the second cover 150 in this example, and the first cover 110 of the package housing 100 can be connected to the connecting base by laser welding, so that the vehicle-mounted millimeter wave radar can be fixed on the vehicle. And the vehicle-mounted millimeter wave radar is connected to the vehicle-mounted control system of the automobile through the connection interface 112 and the conductive member 120.

The package housing 100 and the radar 300 provided in the present application are described in detail above, and the principles and embodiments of the present application are described herein using specific examples, which are only used to help understand the method and the core concept of the present application; meanwhile, for a person skilled in the art, according to the idea of the present application, the specific implementation manner and the application scope may be changed, and in summary, the content of the present specification should not be construed as a limitation to the present application.

Claims

1. A package casing is characterized by comprising,

the first cover body is provided with a connecting part extending outwards from the outer wall of the first cover body, and a connecting interface communicated into the first cover body is formed in the connecting part;

the conductive piece is arranged at the connecting interface; and

a heat sink disposed within the first cover;

wherein a portion of the conductive member and/or the heat sink is covered by the first cover to form an integrated structure with the first cover.

2. The package housing as claimed in claim 1, wherein the heat sink is circumferentially provided with a step portion, and the step portion is covered by the first cover.

3. The package housing as recited in claim 1, wherein the heat spreader has a first side surface, wherein a plurality of ribs are formed on the first side surface, and wherein the first side surface is covered by the first cover.

4. The package housing of claim 3, wherein the heat sink further has a second side opposite the first side, the second side having a heat sink boss disposed thereon.

5. The package housing according to claim 1, wherein the heat sink has an avoiding hole, and the heat sink has a protrusion protruding in a direction away from the avoiding hole on a side wall close to the avoiding hole.

6. The package housing of claim 1, wherein the conductive member is formed as a unitary structure with the first cover by insert molding.

7. The package housing as claimed in claim 1 or 6, wherein the heat sink is formed as a unitary structure with the first cover by insert molding.

8. The package housing as claimed in claim 7, wherein the heat sink further has positioning holes disposed thereon, the positioning holes including a coarse positioning hole and a fine positioning hole, the coarse positioning hole having a larger diameter than the fine positioning hole.

9. The package housing as recited in claim 1, further comprising a second cover, wherein the first cover and the second cover are mated and form a receiving space, the connection interface communicates with the receiving space, and the conductive component and the heat sink are located in the receiving space.

10. A radar, comprising,

a package housing according to any one of claims 1-9; and

the printed circuit board is arranged in the first cover body and is provided with a chip;

the conductive piece of the packaging shell is electrically connected with the printed circuit board, and the radiating piece of the packaging shell is contacted with the position, provided with the chip, of the printed circuit board.