CN117038598A - Crimping type power module and packaging method thereof - Google Patents
Crimping type power module and packaging method thereof Download PDFInfo
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- CN117038598A CN117038598A CN202311137204.5A CN202311137204A CN117038598A CN 117038598 A CN117038598 A CN 117038598A CN 202311137204 A CN202311137204 A CN 202311137204A CN 117038598 A CN117038598 A CN 117038598A
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- 238000002788 crimping Methods 0.000 title claims abstract description 46
- 238000000034 method Methods 0.000 title claims abstract description 15
- 238000004806 packaging method and process Methods 0.000 title claims abstract description 14
- 229910052751 metal Inorganic materials 0.000 claims abstract description 180
- 239000002184 metal Substances 0.000 claims abstract description 180
- 238000003825 pressing Methods 0.000 claims abstract description 90
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 64
- 229910052709 silver Inorganic materials 0.000 claims description 58
- 239000004332 silver Substances 0.000 claims description 58
- 238000002360 preparation method Methods 0.000 claims description 15
- 238000001816 cooling Methods 0.000 claims description 13
- 238000004519 manufacturing process Methods 0.000 claims description 5
- 239000002826 coolant Substances 0.000 claims description 3
- 230000000149 penetrating effect Effects 0.000 claims 1
- 230000009286 beneficial effect Effects 0.000 abstract description 7
- 238000005493 welding type Methods 0.000 description 6
- 239000004484 Briquette Substances 0.000 description 2
- 238000001125 extrusion Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 239000011261 inert gas Substances 0.000 description 2
- 238000009434 installation Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000012858 packaging process Methods 0.000 description 2
- 230000003071 parasitic effect Effects 0.000 description 2
- 239000002356 single layer Substances 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 1
- 230000003749 cleanliness Effects 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000011900 installation process Methods 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000010410 layer Substances 0.000 description 1
- 238000010248 power generation Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/31—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the arrangement or shape
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/56—Encapsulations, e.g. encapsulation layers, coatings
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
- H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
- H01L21/50—Assembly of semiconductor devices using processes or apparatus not provided for in a single one of the subgroups H01L21/06 - H01L21/326, e.g. sealing of a cap to a base of a container
- H01L21/60—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation
- H01L21/603—Attaching or detaching leads or other conductive members, to be used for carrying current to or from the device in operation involving the application of pressure, e.g. thermo-compression bonding
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/28—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection
- H01L23/29—Encapsulations, e.g. encapsulating layers, coatings, e.g. for protection characterised by the material, e.g. carbon
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/52—Arrangements for conducting electric current within the device in operation from one component to another, i.e. interconnections, e.g. wires, lead frames
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Battery Mounting, Suspending (AREA)
Abstract
The invention discloses a crimping power module and a packaging method thereof, wherein the crimping power module comprises a shell, a bottom plate sub-module, a middle sub-module, a metal cover plate and a pressing block structure, wherein the middle sub-module is provided with one or more first chip units which are connected with the metal middle plate of the adjacent middle sub-module through the pressing block structure, each second chip unit in the middle sub-module adjacent to the metal cover plate is connected with the metal cover plate through the pressing block structure, each second chip unit in the rest middle sub-module is connected with the metal middle plate of the other middle sub-module adjacent to the pressing block structure through the pressing block structure, the bottom plate sub-module is sequentially connected with the middle sub-modules in series, the metal middle plate of the middle sub-module is used as the cover plate of one side sub-module and the bottom plate of the other side sub-module, the structure is more compact and simple, and the crimping power module is beneficial to simplifying the external circuit connected with the adjacent sub-modules in series, thereby reducing stray inductance.
Description
Technical Field
The invention relates to the technical field of power electronic devices, in particular to a crimping type power module and a packaging method thereof.
Background
The power module is applied to the fields of rail transit, industrial control, power grid transmission, photovoltaic power generation and the like, the existing power module mainly comprises a welding type power module and a crimping type power module, the welding type power module is used for realizing electric connection of all parts in a welding and wire bonding mode, however, when the working voltage and current capacity of a power system are increased, more chips are required to be connected in parallel inside the welding type power module, the number of wires is increased, parasitic parameters are increased, voltage overshoot is increased, turn-off loss is increased, the problem of unbalanced module current is caused, and the application reliability of the welding type power module is lower. The crimping power module realizes the electric connection of each chip in a surface contact mode, leads are not needed, so that more chips are connected in parallel, parasitic parameters are not greatly increased, and the crimping power module has the advantages of large current capacity, low stray inductance, high switching speed and the like.
However, in practical use, a plurality of press-connection power modules are generally required to be connected in series, and the series connection of the plurality of press-connection power modules causes the external structure to be complex, so that more stray inductance is introduced, and the working performance of the press-connection power modules is affected.
Disclosure of Invention
The present invention aims to solve at least one of the technical problems existing in the prior art. Therefore, the pressure welding type power module provided by the invention has a more compact and simple structure, and is beneficial to simplifying the external circuit of the mutually connected adjacent sub-modules, thereby reducing stray inductance and improving the working performance of the pressure welding type power module.
The invention also provides a crimping power module packaging method for manufacturing the crimping power module.
An embodiment of a first aspect of the present invention provides a crimping power module, including:
the shell is provided with a first opening and a second opening at two ends respectively;
the bottom plate sub-module comprises a metal bottom plate, a first grid PCB (printed circuit board), a plurality of first terminals and a plurality of first chip units, wherein the metal bottom plate is covered on the first opening, the first terminals are connected to one side of the metal bottom plate, which faces the inside of the shell, the plurality of first chip units are correspondingly arranged on the plurality of first terminals one by one, the first grid PCB is arranged on the metal bottom plate, and the plurality of first chip units are connected in parallel through the first terminals;
the middle sub-module comprises a metal middle plate, a second grid PCB (printed circuit board), a plurality of second terminals and a plurality of second chip units, wherein the metal middle plate is accommodated in the shell, the second terminals are connected to one side, away from the metal bottom plate, of the metal middle plate, the second chip units are correspondingly arranged on the second terminals one by one, the second grid PCB is arranged on the metal middle plate, and the second chip units are connected in parallel through the second terminals;
The metal cover plate is covered on the second opening;
a briquetting structure;
the middle sub-module is provided with one, each first chip unit is connected with the metal middle plate of the adjacent middle sub-module through one pressing block structure, each second chip unit is connected with the metal cover plate through one pressing block structure, and the bottom plate sub-module is connected with the middle sub-module in series;
or alternatively, the first and second heat exchangers may be,
the middle sub-module is provided with a plurality of, each first chip unit is connected to the metal middle plate of the adjacent middle sub-module through one press block structure, each second chip unit in the middle sub-module adjacent to the metal cover plate is connected to the metal cover plate through one press block structure, each second chip unit in the rest middle sub-module is connected to the metal middle plate of another middle sub-module adjacent to the press block structure through one press block structure, and the bottom plate sub-module and the middle sub-modules are sequentially connected in series.
The crimping power module provided by the embodiment of the first aspect of the invention has at least the following beneficial effects: the internal part of the crimping power module provided by the embodiment of the first aspect of the invention is formed by stacking and sequentially connecting the bottom plate sub-module and one or more middle sub-modules in series, the metal middle plate of the middle sub-module is used as a cover plate of one side sub-module and is also used as a bottom plate of the other side sub-module.
In some embodiments of the present invention, the crimping power module further includes a cooling pipe, wherein the interior of the metal middle plate is provided with a flow channel, the cooling pipe penetrates through the shell and is connected to the metal middle plate, the cooling pipe is communicated with the flow channel, and the cooling pipe and the flow channel are used for cooling medium to flow.
In some embodiments of the present invention, the bottom plate sub-module further includes a plurality of first spring pins, each of the first spring pins is correspondingly mounted on one of the first terminals, and at least part of the first chip units are electrically connected to the first grid PCB board through the first spring pins; the middle sub-module further comprises a plurality of second spring pins, each second spring pin is correspondingly arranged on one second terminal, and at least part of the second chip units are electrically connected with the second grid PCB through the second spring pins.
In some embodiments of the present invention, the bottom plate sub-module further includes a plurality of first fixing blocks, the plurality of first spring pins are mounted on the plurality of first fixing blocks in a one-to-one correspondence manner, at least part of the first terminals have first fixing grooves, and each of the first fixing blocks is correspondingly embedded in one of the first fixing grooves; the middle sub-module further comprises a plurality of second fixing blocks, a plurality of second spring pins are arranged on the second fixing blocks in a one-to-one correspondence mode, at least part of the second terminals are provided with second fixing grooves, and each second fixing block is correspondingly embedded in one second fixing groove.
In some embodiments of the present invention, the pressing block structure includes a pressing block and a spring plate, the pressing block is connected to the spring plate, the spring plate is connected to the metal middle plate or the metal cover plate, and the pressing block abuts against the first chip unit or the second chip unit.
In some embodiments of the present invention, the pressing block structure further includes an elastic member, the pressing block includes a connecting portion and an abutting portion that are connected to each other, the abutting portion extends to an outer side of the connecting portion, the elastic member is sleeved on the connecting portion, and two ends of the elastic member are respectively abutted to the abutting portion and the metal intermediate plate or the metal cover plate.
In some embodiments of the present invention, a limiting boss is connected to a side of the metal intermediate plate away from the second terminal, and/or a limiting boss is connected to a side of the metal cover plate facing the interior of the housing; the limiting boss is provided with a limiting blind hole and a limiting clamping groove, the limiting blind hole extends along the direction perpendicular to the metal middle plate, the limiting clamping groove is communicated with the limiting blind hole in the circumferential direction of the limiting blind hole, the elastic piece is embedded in the limiting clamping groove, the pressing block is inserted in the limiting blind hole, and two ends of the elastic piece are respectively abutted to the abutting portion and the limiting boss.
In some embodiments of the present invention, the plurality of press block structures are arranged in an array on the same metal intermediate plate or on the metal cover plate, and the arrangement directions of any two adjacent elastic sheets are perpendicular to each other.
In some embodiments of the present invention, the first chip unit includes a first insulating frame, a first lower silver sheet, a first power chip, a first upper silver sheet, and a first insulating pressing plate, where the first insulating frame is sleeved on the first terminal, the first lower silver sheet, the first power chip, and the first upper silver sheet are sequentially stacked and clamped between the first terminal and the first insulating pressing plate, the first lower silver sheet is in contact with the first terminal, and the first upper silver sheet is in contact with the pressing block structure; the second chip unit comprises a second insulating frame, a second lower silver sheet, a second power chip, a second upper silver sheet and a second insulating pressing plate, wherein the second insulating frame is sleeved on the second terminal, the second lower silver sheet, the second power chip and the second upper silver sheet are sequentially stacked and clamped between the second terminal and the second insulating pressing plate, the second lower silver sheet is contacted with the second terminal, and the second upper silver sheet is contacted with the pressing block structure.
An embodiment of a second aspect of the present invention provides a packaging method of a press-fit power module, for manufacturing the press-fit power module provided by any one of the embodiments of the first aspect of the present invention, the packaging method of the press-fit power module includes the steps of:
and performing a bottom plate sub-module preparation step, wherein the bottom plate sub-module preparation step comprises the following steps:
taking or preparing a metal bottom plate, wherein the surface of the metal bottom plate is connected with a plurality of first terminals;
mounting a first grid PCB on the surface of the metal bottom plate with the first terminal;
mounting a plurality of first chip units to a plurality of first terminals in a one-to-one correspondence manner, and electrically connecting the first chip units to the first grid PCB, so that the plurality of first chip units are connected in parallel through the first terminals to form a bottom plate sub-module;
and performing an intermediate sub-module preparation step, wherein the intermediate sub-module preparation step comprises the following steps:
taking or preparing a metal intermediate plate, wherein the surface of the metal intermediate plate is connected with a plurality of second terminals;
mounting a second grid PCB on the surface of the metal middle plate with the second terminal;
mounting a plurality of second chip units to a plurality of second terminals in a one-to-one correspondence manner, and electrically connecting the second chip units to the second grid PCB, so that the plurality of second chip units are connected in parallel through the second terminals to form an intermediate sub-module;
Judging whether the intermediate sub-module needs to be continuously prepared, if so, repeating the preparation steps of the intermediate sub-module;
if the number of the intermediate sub-modules is one, then:
installing a plurality of pressing block structures on one side of the metal middle plate far away from the second terminal, and correspondingly connecting the pressing block structures on the metal middle plate to the first chip units one by one;
a metal cover plate is taken or prepared, a plurality of pressing block structures are arranged on one side of the metal cover plate, and the pressing block structures on the metal cover plate are correspondingly connected to the second chip units one by one;
connecting the bottom plate sub-module in series with the middle sub-module;
if the number of the intermediate sub-modules is a plurality of, then:
stacking the bottom plate sub-module and a plurality of middle sub-modules in sequence;
installing a plurality of press block structures on one side of the metal intermediate plate closest to the bottom plate sub-module, which is far away from the second terminal connected with the metal intermediate plate, and connecting the plurality of press block structures on the metal intermediate plate to the plurality of first chip units in a one-to-one correspondence manner;
installing a plurality of pressing block structures on one side of the rest of the metal intermediate plates far away from the second terminals connected with the metal intermediate plates, and correspondingly connecting the pressing block structures on the metal intermediate plates to the second chip units of the adjacent intermediate sub-modules one by one;
Taking or preparing a shell with a first opening and a second opening which are opposite, mounting the combination of the bottom plate subunit, the middle subunit and the metal cover plate into the shell, and enabling the metal bottom plate to cover the first opening and the metal cover plate to cover the second opening;
and sequentially connecting the bottom plate sub-module with a plurality of middle sub-modules in series.
The packaging method of the crimping type power module provided by the embodiment of the second aspect of the invention has at least the following beneficial effects: according to the packaging method of the crimping power module provided by the embodiment of the second aspect of the invention, the crimping power module provided by the embodiment of the first aspect of the invention can be manufactured, the inside of the crimping power module is formed by stacking and sequentially connecting the bottom plate sub-module and one or more middle sub-modules in series, the specific number of the middle sub-modules can be designed according to actual requirements, the metal middle plate of the middle sub-module is used as the cover plate of one side sub-module and the bottom plate of the other side sub-module, compared with the serial connection of a plurality of single-layer chips, the crimping power module provided by the embodiment of the first aspect of the invention is more compact and simpler in structure, the packaging process flow is simpler, and the external circuit of the serial connection of the adjacent sub-modules is facilitated to be simplified, so that stray inductance is reduced, and the working performance of the crimping power module is improved.
Additional aspects and advantages of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention.
Drawings
The invention is further described with reference to the accompanying drawings and examples, in which:
fig. 1 is a schematic perspective view of a crimping power module according to some embodiments of a first aspect of the present invention;
FIG. 2 is an exploded view of a bottom plate sub-module and an intermediate sub-module of the crimping power module shown in FIG. 1;
FIG. 3 is a front view of the crimped power module shown in FIG. 1;
FIG. 4 is a cross-sectional view taken along section A-A of FIG. 3;
FIG. 5 is an enlarged view at C in FIG. 4;
FIG. 6 is an enlarged view of FIG. 4 at D;
FIG. 7 is an enlarged view at E in FIG. 4;
FIG. 8 is a cross-sectional view of section B-B of FIG. 3;
FIG. 9 is an exploded view of a briquette structure in the crimped power module shown in FIG. 1;
FIG. 10 is an exploded view of a first chip unit (a second chip unit) in the crimping power module shown in FIG. 1;
fig. 11 is a perspective view of a metal intermediate plate in the crimping power module shown in fig. 1.
Reference numerals:
the electronic device comprises a housing 100, a bottom plate sub-module 200, a metal bottom plate 210, a first gate PCB 220, a first terminal 230, a first chip unit 240, a first insulating frame 241, a first lower silver piece 242, a first power chip 243, a first upper silver piece 244, a first insulating pressing plate 245, a first spring pin 250, a first fixing block 260, an intermediate sub-module 300, a metal middle plate 310, a runner 311, a second gate PCB 320, a second terminal 330, a second chip unit 340, a second insulating frame 341, a second lower silver piece 342, a second power chip 343, a second upper silver piece 344, a second insulating pressing plate 345, a second spring pin 350, a limiting boss 360, a limiting blind hole 361, a limiting clamping groove 362, a second fixing block 370, a metal cover plate 400, a pressing block structure 500, a pressing block 510, a connecting part 511, an abutting part 512, a pressing part 513, a spring piece 520, an elastic piece 530, a cooling tube 600, 700.
Detailed Description
Embodiments of the present invention are described in detail below, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to like or similar elements or elements having like or similar functions throughout. The embodiments described below by referring to the drawings are illustrative only and are not to be construed as limiting the invention.
In the description of the present invention, it should be understood that references to orientation descriptions, such as directions of up, down, left, right, etc., are based on the orientation or positional relationship shown in the drawings, are merely for convenience of description and simplification of the description, and do not indicate or imply that the apparatus or element in question must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as limiting the invention.
In the description of the present invention, unless explicitly defined otherwise, terms such as arrangement, installation, connection, etc. should be construed broadly and the specific meaning of the terms in the present invention can be reasonably determined by a person skilled in the art in combination with the specific contents of the technical scheme.
In the description of the present invention, reference to the term "one embodiment," "some embodiments," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the present invention. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiments or examples. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
Referring to fig. 1 to 4, a crimping power module according to an embodiment of the first aspect of the present invention includes a housing 100, a bottom sub-module 200, a middle sub-module 300, a metal cover 400, and a pressing block structure 500, wherein both ends of the housing 100 have a first opening and a second opening, respectively; the bottom plate sub-module 200 includes a metal bottom plate 210, a first gate PCB 220, a plurality of first terminals 230, and a plurality of first chip units 240, wherein the metal bottom plate 210 covers the first opening, the first terminals 230 are connected to one side of the metal bottom plate 210 facing the interior of the housing 100, the plurality of first chip units 240 are mounted on the plurality of first terminals 230 in a one-to-one correspondence manner, the first gate PCB 220 is mounted on the metal bottom plate 210, and the plurality of first chip units 240 are connected in parallel through the first terminals 230; the middle sub-module 300 comprises a metal middle plate 310, a second grid PCB 320, a plurality of second terminals 330 and a plurality of second chip units 340, wherein the metal middle plate 310 is accommodated in the shell, the second terminals 330 are connected to one side of the metal middle plate 310, which is away from the metal bottom plate 210, the plurality of second chip units 340 are correspondingly arranged on the plurality of second terminals 330 one by one, the second grid PCB 320 is arranged on the metal middle plate 310, and the plurality of second chip units 340 are connected in parallel through the second terminals 330; the metal cover 400 covers the second opening.
In some embodiments of the present invention, referring to fig. 4, the middle sub-module 300 is provided with two, each first chip unit 240 is connected to the metal middle plate 310 of the adjacent middle sub-module 300 through one press block structure 500, each second chip unit 340 in the middle sub-module 300 adjacent to the metal cover plate 400 is connected to the metal cover plate 400 through one press block structure 500, each second chip unit 340 in the rest of the middle sub-modules 300 is connected to the metal middle plate 310 of the other middle sub-module 300 adjacent thereto through one press block structure 500, and the bottom sub-module 200 is sequentially connected in series with the two middle sub-modules 300.
In other embodiments of the present invention, the middle sub-module 300 is provided with one, each first chip unit 240 is connected to the metal middle plate 310 of the adjacent middle sub-module 300 through one press block structure 500, each second chip unit 340 is connected to the metal cover plate 400 through one press block structure 500, and the bottom sub-module 200 is connected in series with the middle sub-module 300;
in still other embodiments of the present invention, the middle sub-module 300 is provided with more than two first chip units 240 each connected to the metal middle plate 310 of the adjacent middle sub-module 300 through one press block structure 500, each second chip unit 340 in the middle sub-module 300 adjacent to the metal cover plate 400 is connected to the metal cover plate 400 through one press block structure 500, each second chip unit 340 in the rest of the middle sub-modules 300 is connected to the metal middle plate 310 of the other middle sub-module 300 adjacent thereto through one press block structure 500, and the bottom sub-module 200 is sequentially connected in series with the plurality of middle sub-modules 300.
The interior of the crimping power module provided by the embodiment of the first aspect of the invention is formed by stacking and sequentially connecting the bottom plate sub-module 200 and one or more middle sub-modules 300 in series, and the metal middle plate 310 of the middle sub-module 300 is used as a cover plate of one side sub-module and a bottom plate of the other side sub-module. In addition, the pressure-proof power module provided by the embodiment of the first aspect of the invention is internally provided with the plurality of sub-modules which are connected in series, thereby being beneficial to improving the pressure-proof value of the whole pressure-proof power module and meeting the higher pressure-proof requirement.
Further, referring to fig. 1 and 8, the press-fit power module further includes a cooling tube 600, the metal intermediate plate 310 has a flow channel 311 therein, the cooling tube 600 is disposed through the housing 100 and connected to the metal intermediate plate 310, the cooling tube 600 is connected to the flow channel 311, and the cooling tube 600 and the flow channel 311 are used for flowing a cooling medium. The metal intermediate plate 310 serves as both a component for electrical interconnection between chips in adjacent sub-modules and a heat dissipation component, and can make the structure of the crimping power module more compact while improving the heat dissipation efficiency of the crimping power module.
Further, referring to fig. 2 and 6, the bottom sub-module 200 further includes a plurality of first spring pins 250, each first spring pin 250 is correspondingly mounted on one first terminal 230, at least a portion of the first chip unit 240 is electrically connected to the first gate PCB 220 through the first spring pin 250, and the first spring pin 250 can improve the stability of the electrical connection between the first chip unit 240 and the first gate PCB 220, and is beneficial to simplifying the design of the gate control circuit; referring to fig. 2 and 5, the middle sub-module 300 further includes a plurality of second spring pins 350, each second spring pin 350 is correspondingly mounted on one second terminal 330, at least a portion of the second chip unit 340 is electrically connected to the second gate PCB 320 through the second spring pin 350, and the second spring pins 350 can improve the stability of the electrical connection between the second chip unit 340 and the second gate PCB 320, and facilitate the design of the gate control circuit.
Further, referring to fig. 2 and 6, the bottom sub-module 200 further includes a plurality of first fixing blocks 260, the plurality of first spring pins 250 are correspondingly mounted on the plurality of first fixing blocks 260, at least a portion of the first terminals 230 have first fixing grooves, each first fixing block 260 is correspondingly embedded in one first fixing groove, and the inner wall of the first fixing groove can provide stable limit for the first fixing block 260, so that the first fixing block 260 can stably support the first spring pins 250, thereby positioning of the first spring pins 250 is accurate and difficult to loosen; referring to fig. 2 and 5, the middle sub-module 300 further includes a plurality of second fixing blocks 370, the plurality of second pogo pins 350 are mounted on the plurality of second fixing blocks 370 in a one-to-one correspondence manner, at least a portion of the second terminals 330 have second fixing grooves, each second fixing block 370 is correspondingly embedded in one second fixing groove, and the inner wall of the second fixing groove can provide a stable limit for the second fixing block 370, so that the second fixing block 370 can stably support the second pogo pins 350, thereby positioning of the second pogo pins 350 is accurate and difficult to loosen.
Further, referring to fig. 2 and 9, the press block structure 500 includes a press block 510 and a spring 520, the press block 510 is connected to the spring 520, referring to fig. 6, in the press block structure 500 located between the bottom sub-module 200 and the middle sub-module 300, the spring 520 is connected to the metal middle plate 310, and the press block 510 is abutted against the first chip unit 240; referring to fig. 7, in a press block structure 500 between a metal cover 400 and an intermediate sub-module 300, a spring piece 520 is connected to the metal cover 400, and the press block 510 abuts against a second chip unit 340; referring to fig. 5, in the pressing block structure 500 between two middle sub-modules 300, the elastic sheet 520 is connected to the metal middle plate 310, and the pressing block 510 abuts against the second chip unit 340. The elastic sheet 520 can enable the pressing block 510 to be elastically connected with the metal cover plate 400 or the metal middle plate 310, the bottom plate sub-module 200 and the middle sub-module 300 are sequentially stacked in the shell 100, and after the metal cover plate 400 is covered on the second opening of the shell 100, each layer of pressing block structure 500 is extruded, and the elastic sheet 520 deforms under the extrusion force, so that the pressing block 510 is tightly contacted with the first chip unit 240 or the second chip unit 340 which is contacted with the pressing block 520, even if the heights of the chip units have errors, the errors can be compensated through the deformation of the elastic sheet 520, and the pressure born by the chip units can be balanced.
Further, referring to fig. 2 and 9, the press block structure 500 further includes an elastic member 530, the press block 510 includes a connecting portion 511 and an abutting portion 512 connected to each other, the abutting portion 512 extends to the outside of the connecting portion 511, the elastic member 530 is sleeved on the connecting portion 511, referring to fig. 5 and 6, in the press block structure 500 located between the two middle sub-modules 300, and in the press block structure 500 located between the bottom sub-module 200 and the middle sub-module 300, both ends of the elastic member 530 are respectively abutted against the abutting portion 512 and the metal middle plate 310; referring to fig. 7, in the press block structure 500 between the metal cover 400 and the middle sub-module 300, both ends of the elastic member 530 are respectively abutted against the abutment portion 512 and the metal cover 400. The elastic member 530 can further form elastic connection between the pressing block 510 and the metal cover plate 400 or between the pressing block 510 and the metal middle plate 310, sequentially stack the bottom plate sub-module 200 and the middle sub-module 300 in the housing 100, and cover the metal cover plate 400 at the second opening of the housing 100, each pressing block structure 500 is extruded, and the elastic sheet 520 and the elastic member 530 are deformed under the extrusion force, so that the pressing block 510 is tightly contacted with the first chip unit 240 or the second chip unit 340 contacted with the pressing block 520, and even if errors exist in the heights of the chip units, the errors can be compensated by the deformation of the elastic sheet 520 and the elastic member 530, thereby being beneficial to better balancing the pressure suffered by the chip units.
Further, referring to fig. 4 to 7, a limit boss 360 is connected to a side of the metal intermediate plate 310 remote from the second terminal 330, and a limit boss 360 is connected to a side of the metal cap plate 400 facing the inside of the case 100; referring to fig. 11, the limiting boss 360 has a limiting blind hole 361 and a limiting slot 362, the limiting blind hole 361 extends along a direction perpendicular to the metal middle plate 310, the limiting slot 362 is communicated with the limiting blind hole 361 in a circumferential direction of the limiting blind hole 361, the elastic piece 520 is embedded in the limiting slot 362, the pressing block 510 is inserted in the limiting blind hole 361, and two ends of the elastic piece 530 are respectively abutted to the abutting portion 512 and the limiting boss 360. In the installation process of the press block structure 500, the limiting boss 360 positions the elastic sheet 520 through the limiting clamping groove 362, and positions the press block 510 through the limiting blind hole 361, so that the installation difficulty of the press block structure 500 is reduced; in the process of stacking and crimping a plurality of sub-modules, the limiting boss 360 limits deformation of the elastic sheet 520 through the limiting clamping groove 362, and limits movement of the pressing block 510 through the limiting blind hole 361, so that the direction of a pressing force provided by the pressing block structure 500 is limited, and the structural stability of the inside of the crimping type power module is improved.
Further, the elastic piece 520 is connected to the metal middle plate 310 or the metal cover plate 400 through a bolt, so as to realize tight connection between the elastic piece 520 and the metal middle plate 310 or between the elastic piece 520 and the metal cover plate 400 through threads, thereby ensuring the reliability of electrical connection.
Further, referring to fig. 2, on the same metal middle plate 310, a plurality of press block structures 500 are arranged in an array, and the arrangement directions of any two adjacent elastic sheets 520 are mutually perpendicular, so that the arrangement of the plurality of press block structures 500 is more compact, so as to reduce the volume of the crimping power module. Similarly, on the metal cover 400, a plurality of press block structures 500 are arranged in an array, and the arrangement directions of any two adjacent elastic sheets 520 are mutually perpendicular.
It can be understood that, referring to fig. 11, on the same metal intermediate plate 310, the plurality of limiting bosses 360 are arranged in an array, and the extending directions of the limiting slots 362 of any two adjacent limiting bosses 360 are perpendicular to each other, so that the arranging directions of any two adjacent spring plates 520 in the plurality of press block structures 500 connected to the metal intermediate plate 310 are perpendicular to each other. Similarly, on the metal cover 400, a plurality of limiting bosses 360 are arranged in an array, and the extending directions of the limiting clamping grooves 362 of any two adjacent limiting bosses 360 are mutually perpendicular.
Further, referring to fig. 10, the first chip unit 240 includes a first insulating frame 241, a first lower silver sheet 242, a first power chip 243, a first upper silver sheet 244 and a first insulating pressing plate 245, the first insulating frame 241 is sleeved on the first terminal 230, the first lower silver sheet 242, the first power chip 243 and the first upper silver sheet 244 are sequentially stacked and clamped between the first terminal 230 and the first insulating pressing plate 245, the first lower silver sheet 242 contacts the first terminal 230, and the first upper silver sheet 244 contacts the briquetting structure 500. The first power chip 243 and the first terminal 230 are electrically connected through the first lower silver piece 242, the first lower silver piece 242 can buffer the pressure between the first terminal 230 and the first power chip 243, the first power chip 243 and the briquetting structure 500 are electrically connected through the first upper silver piece 244, the first upper silver piece 244 can buffer the pressure between the briquetting structure 500 and the first power chip 243, and the possibility that the first power chip 243 is crushed or damaged can be reduced while reliable electrical connection between the first power chip 243 and other components is ensured; the first insulating frame 241 is used for limiting the positions of the first lower silver piece 242, the first power chip 243 and the first upper silver piece 244 in the circumferential direction, and the first insulating pressing plate 245 is used for pressing the first lower silver piece 242, the first power chip 243 and the first upper silver piece 244 on the first terminal 230 in the thickness direction, so that the first lower silver piece 242, the first power chip 243 and the first upper silver piece 244 are insulated from other components in the circumferential direction, and only in the thickness direction, the electrical connection is realized, and the stability of the electrical connection and the stability of the structure are ensured.
Similarly, referring to fig. 10, the second chip unit 340 includes a second insulating frame 341, a second lower silver flake 342, a second power chip 343, a second upper silver flake 344, and a second insulating pressing plate 345, where the second insulating frame 341 is sleeved on the second terminal 330, the second lower silver flake 342, the second power chip 343, and the second upper silver flake 344 are sequentially stacked and clamped between the second terminal 330 and the second insulating pressing plate 345, the second lower silver flake 342 is in contact with the second terminal 330, and the second upper silver flake 344 is in contact with the briquette structure 500. The second power chip 343 and the second terminal 330 are electrically connected through the second lower silver piece 342, the second lower silver piece 342 can buffer the pressure between the second terminal 330 and the second power chip 343, the second power chip 343 and the briquetting structure 500 are electrically connected through the second upper silver piece 344, the second upper silver piece 344 can buffer the pressure between the briquetting structure 500 and the second power chip 343, and the possibility of the second power chip 343 being crushed or damaged can be reduced while reliable electrical connection between the second power chip 343 and other components is ensured; the second insulating frame 341 is used for limiting the positions of the second lower silver piece 342, the second power chip 343 and the second upper silver piece 344 in the circumferential direction, and the second insulating pressing plate 345 is used for pressing the second lower silver piece 342, the second power chip 343 and the second upper silver piece 344 on the second terminal 330 in the thickness direction, so that the second lower silver piece 342, the second power chip 343 and the second upper silver piece 344 are insulated from other components in the circumferential direction, and only realize electrical connection in the thickness direction, thereby ensuring the stability of electrical connection and the stability of the structure.
Further, referring to fig. 10, the first insulating pressing plate 245 has a through hole for exposing the first upper silver sheet 244, the second insulating pressing plate 345 has a through hole for exposing the second upper silver sheet 344, referring to fig. 9, the pressing block 510 in the pressing block structure 500 further includes a pressing part 513, the pressing part 513 is located at one end of the pressing block 510 away from the spring sheet 520, referring to fig. 6, in the pressing block structure 500 located between the bottom sub-module 200 and the middle sub-module 300, the pressing part 513 is received in the through hole of the first insulating pressing plate 245 and abuts against the first upper silver sheet 244, referring to fig. 5 and 7, in the pressing block structure 500 located between the two middle sub-modules 300, or in the pressing block structure 500 located between the metal cover plate 400 and the middle sub-module 300, the pressing part 513 is received in the through hole of the second insulating pressing plate 345 and abuts against the second upper silver sheet 344.
Further, in order to further improve structural stability, insulating glue may be encapsulated between the first insulating frame 241 and the first insulating pressing plate 245, and between the second insulating frame 341 and the second insulating pressing plate 345, so that the first chip unit 240 and the second chip unit 340 have better insulating properties.
Further, in order to enhance the appearance cleanliness of the first chip unit 240 and the second chip unit 340, an upper surface of the first insulating pressing plate 245 may be disposed flush with an upper surface of the first insulating frame 241, and an upper surface of the second insulating pressing plate 345 may be disposed flush with an upper surface of the second insulating frame 341.
Further, in order to ensure insulation performance of the inside of the crimp-type power module, an inert gas may be filled into an inner space of the crimp-type power module defined by the housing 100, the metal bottom plate 210 and the metal cover plate 400, and further, referring to fig. 1, the crimp-type power module further includes a vent pipe 700, and the vent pipe 700 is connected to the housing 100 and is communicated with the inner space of the crimp-type power module defined by the housing 100, the metal bottom plate 210 and the metal cover plate 400, for filling the inert gas into the inner space.
An embodiment of a second aspect of the present invention provides a method for packaging a crimped power module, for manufacturing the crimped power module provided in any one of the embodiments of the first aspect of the present invention, the method for packaging the crimped power module including the steps of:
the bottom plate sub-module 200 preparation step is performed, and the bottom plate sub-module 200 preparation step includes:
taking or preparing a metal base plate 210, wherein a plurality of first terminals 230 are connected to the surface of the metal base plate 210;
mounting the first gate PCB 220 on the surface of the metal chassis 210 having the first terminal 230;
the plurality of first chip units 240 are mounted to the plurality of first terminals 230 in a one-to-one correspondence, and the first chip units 240 are electrically connected to the first gate PCB 220, so that the plurality of first chip units 240 are connected in parallel through the first terminals 230 to form the bottom plate sub-module 200;
The intermediate sub-module 300 preparation step is performed, the intermediate sub-module 300 preparation step comprising:
taking or preparing a metal intermediate plate 310, wherein a plurality of second terminals 330 are connected to the surface of the metal intermediate plate 310;
mounting the second gate PCB 320 on the surface of the metal intermediate plate 310 having the second terminal 330;
mounting a plurality of second chip units 340 to a plurality of second terminals 330 in a one-to-one correspondence, and electrically connecting the second chip units 340 to the second gate PCB 320, so that the plurality of second chip units 340 are connected in parallel through the second terminals 330 to form an intermediate sub-module 300;
judging whether the intermediate sub-module 300 needs to be continuously prepared, if so, repeating the preparation steps of the intermediate sub-module 300;
if the number of intermediate sub-modules 300 is one, then:
a plurality of press block structures 500 are installed at a side of the metal intermediate plate 310 remote from the second terminal 330, and the plurality of press block structures 500 on the metal intermediate plate 310 are connected to the plurality of first chip units 240 in a one-to-one correspondence;
taking or preparing a metal cover plate 400, installing a plurality of press block structures 500 on one side of the metal cover plate 400, and connecting the plurality of press block structures 500 on the metal cover plate 400 to a plurality of second chip units 340 in a one-to-one correspondence manner;
the bottom plate sub-module 200 is connected in series with the middle sub-module 300;
If the number of intermediate sub-modules 300 is plural, then:
stacking the bottom plate sub-module 200 and the plurality of middle sub-modules 300 in sequence;
a plurality of press block structures 500 are installed at a side of the metal intermediate plate 310 closest to the bottom plate sub-module 200, which is away from the second terminals 330 to which it is connected, and the plurality of press block structures 500 on the metal intermediate plate 310 are connected to the plurality of first chip units 240 in a one-to-one correspondence;
mounting a plurality of press block structures 500 on a side of the remaining metal intermediate plate 310 remote from the second terminal 330 to which it is connected, and connecting the plurality of press block structures 500 on the metal intermediate plate 310 to the plurality of second chip units 340 of the adjacent intermediate sub-module 300 in a one-to-one correspondence;
taking or preparing a shell 100 with a first opening and a second opening which are opposite, mounting the combination of the bottom plate subunit, the middle subunit and the metal cover plate 400 into the shell 100, and enabling the metal bottom plate 210 to cover the first opening and the metal cover plate 400 to cover the second opening;
the bottom plate sub-module 200 is serially connected in sequence with a plurality of intermediate sub-modules 300.
The method for packaging the crimping power module provided by the embodiment of the second aspect of the present invention can manufacture the crimping power module provided by the embodiment of the first aspect of the present invention, wherein the inside of the crimping power module is formed by stacking and sequentially connecting the bottom plate sub-module 200 and one or more middle sub-modules 300 in series, the specific number of the middle sub-modules 300 can be designed according to actual requirements, the metal middle plate 310 of the middle sub-module 300 is used as a cover plate of one side sub-module and a bottom plate of the other side sub-module, compared with the serial connection of a plurality of single-layer chips, the crimping power module provided by the embodiment of the first aspect of the present invention is stacked and crimped into one device through the plurality of sub-modules, the structure is more compact and simple, the packaging process flow is simpler, and the simplification of the external circuit connected with the adjacent sub-modules in series is facilitated, thereby reducing stray inductance and improving the working performance of the crimping power module.
The embodiments of the present invention have been described in detail with reference to the accompanying drawings, but the present invention is not limited to the above embodiments, and various changes can be made within the knowledge of one of ordinary skill in the art without departing from the spirit of the present invention. Furthermore, embodiments of the invention and features of the embodiments may be combined with each other without conflict.
Claims (10)
1. A crimped power module, comprising:
the shell is provided with a first opening and a second opening at two ends respectively;
the bottom plate sub-module comprises a metal bottom plate, a first grid PCB (printed circuit board), a plurality of first terminals and a plurality of first chip units, wherein the metal bottom plate is covered on the first opening, the first terminals are connected to one side of the metal bottom plate, which faces the inside of the shell, the plurality of first chip units are correspondingly arranged on the plurality of first terminals one by one, the first grid PCB is arranged on the metal bottom plate, and the plurality of first chip units are connected in parallel through the first terminals;
the middle sub-module comprises a metal middle plate, a second grid PCB (printed circuit board), a plurality of second terminals and a plurality of second chip units, wherein the metal middle plate is accommodated in the shell, the second terminals are connected to one side, away from the metal bottom plate, of the metal middle plate, the second chip units are correspondingly arranged on the second terminals one by one, the second grid PCB is arranged on the metal middle plate, and the second chip units are connected in parallel through the second terminals;
The metal cover plate is covered on the second opening;
a briquetting structure;
the middle sub-module is provided with one, each first chip unit is connected with the metal middle plate of the adjacent middle sub-module through one pressing block structure, each second chip unit is connected with the metal cover plate through one pressing block structure, and the bottom plate sub-module is connected with the middle sub-module in series;
or alternatively, the first and second heat exchangers may be,
the middle sub-module is provided with a plurality of, each first chip unit is connected to the metal middle plate of the adjacent middle sub-module through one press block structure, each second chip unit in the middle sub-module adjacent to the metal cover plate is connected to the metal cover plate through one press block structure, each second chip unit in the rest middle sub-module is connected to the metal middle plate of another middle sub-module adjacent to the press block structure through one press block structure, and the bottom plate sub-module and the middle sub-modules are sequentially connected in series.
2. The crimped power module according to claim 1, further comprising a cooling tube having a flow passage inside the metal intermediate plate, the cooling tube penetrating the housing and connected to the metal intermediate plate, the cooling tube being in communication with the flow passage, the cooling tube and the flow passage being for a flow of a cooling medium.
3. The crimped power module according to claim 1, wherein the base plate sub-module further comprises a plurality of first spring pins, each of the first spring pins being correspondingly mounted to one of the first terminals, at least a portion of the first die units being electrically connected to the first gate PCB board through the first spring pins; the middle sub-module further comprises a plurality of second spring pins, each second spring pin is correspondingly arranged on one second terminal, and at least part of the second chip units are electrically connected with the second grid PCB through the second spring pins.
4. The crimping power module of claim 3, wherein the base plate sub-module further comprises a plurality of first fixing blocks, the plurality of first spring pins are mounted on the plurality of first fixing blocks in a one-to-one correspondence manner, at least part of the first terminals are provided with first fixing grooves, and each first fixing block is correspondingly embedded in one first fixing groove; the middle sub-module further comprises a plurality of second fixing blocks, a plurality of second spring pins are arranged on the second fixing blocks in a one-to-one correspondence mode, at least part of the second terminals are provided with second fixing grooves, and each second fixing block is correspondingly embedded in one second fixing groove.
5. The crimping power module of claim 1, wherein the press-fit structure comprises a press-fit and a spring, the press-fit is connected to the spring, the spring is connected to the metal middle plate or the metal cover plate, and the press-fit is abutted to the first chip unit or the second chip unit.
6. The crimping power module according to claim 5, wherein the pressing block structure further comprises an elastic member, the pressing block comprises a connecting portion and an abutting portion which are connected with each other, the abutting portion extends to the outer side of the connecting portion, the elastic member is sleeved on the connecting portion, and two ends of the elastic member are respectively abutted to the abutting portion and the metal middle plate or the metal cover plate.
7. The crimping power module according to claim 6, wherein a side of the metal intermediate plate away from the second terminal is connected with a limit boss, and/or a side of the metal cover plate facing the inside of the housing is connected with a limit boss;
the limiting boss is provided with a limiting blind hole and a limiting clamping groove, the limiting blind hole extends along the direction perpendicular to the metal middle plate, the limiting clamping groove is communicated with the limiting blind hole in the circumferential direction of the limiting blind hole, the elastic piece is embedded in the limiting clamping groove, the pressing block is inserted in the limiting blind hole, and two ends of the elastic piece are respectively abutted to the abutting portion and the limiting boss.
8. The crimping power module according to claim 5, wherein a plurality of the press-block structures are arranged in an array on the same metal intermediate plate or on the metal cover plate, and the arrangement directions of any two adjacent spring plates are mutually perpendicular.
9. The crimping power module of claim 1, wherein the first chip unit comprises a first insulating frame, a first lower silver sheet, a first power chip, a first upper silver sheet and a first insulating pressing plate, the first insulating frame is sleeved on the first terminal, the first lower silver sheet, the first power chip and the first upper silver sheet are sequentially stacked and clamped between the first terminal and the first insulating pressing plate, the first lower silver sheet is contacted with the first terminal, and the first upper silver sheet is contacted with the pressing block structure; the second chip unit comprises a second insulating frame, a second lower silver sheet, a second power chip, a second upper silver sheet and a second insulating pressing plate, wherein the second insulating frame is sleeved on the second terminal, the second lower silver sheet, the second power chip and the second upper silver sheet are sequentially stacked and clamped between the second terminal and the second insulating pressing plate, the second lower silver sheet is contacted with the second terminal, and the second upper silver sheet is contacted with the pressing block structure.
10. A packaging method of a crimping power module for manufacturing the crimping power module according to any one of claims 1 to 9, characterized in that the packaging method of the crimping power module comprises the steps of:
and performing a bottom plate sub-module preparation step, wherein the bottom plate sub-module preparation step comprises the following steps:
taking or preparing a metal bottom plate, wherein the surface of the metal bottom plate is connected with a plurality of first terminals;
mounting a first grid PCB on the surface of the metal bottom plate with the first terminal;
mounting a plurality of first chip units to a plurality of first terminals in a one-to-one correspondence manner, and electrically connecting the first chip units to the first grid PCB, so that the plurality of first chip units are connected in parallel through the first terminals to form a bottom plate sub-module;
and performing an intermediate sub-module preparation step, wherein the intermediate sub-module preparation step comprises the following steps:
taking or preparing a metal intermediate plate, wherein the surface of the metal intermediate plate is connected with a plurality of second terminals;
mounting a second grid PCB on the surface of the metal middle plate with the second terminal;
mounting a plurality of second chip units to a plurality of second terminals in a one-to-one correspondence manner, and electrically connecting the second chip units to the second grid PCB, so that the plurality of second chip units are connected in parallel through the second terminals to form an intermediate sub-module;
Judging whether the intermediate sub-module needs to be continuously prepared, if so, repeating the preparation steps of the intermediate sub-module;
if the number of the intermediate sub-modules is one, then:
installing a plurality of pressing block structures on one side of the metal middle plate far away from the second terminal, and correspondingly connecting the pressing block structures on the metal middle plate to the first chip units one by one;
a metal cover plate is taken or prepared, a plurality of pressing block structures are arranged on one side of the metal cover plate, and the pressing block structures on the metal cover plate are correspondingly connected to the second chip units one by one;
connecting the bottom plate sub-module in series with the middle sub-module;
if the number of the intermediate sub-modules is a plurality of, then:
stacking the bottom plate sub-module and a plurality of middle sub-modules in sequence;
installing a plurality of press block structures on one side of the metal intermediate plate closest to the bottom plate sub-module, which is far away from the second terminal connected with the metal intermediate plate, and connecting the plurality of press block structures on the metal intermediate plate to the plurality of first chip units in a one-to-one correspondence manner;
installing a plurality of pressing block structures on one side of the rest of the metal intermediate plates far away from the second terminals connected with the metal intermediate plates, and correspondingly connecting the pressing block structures on the metal intermediate plates to the second chip units of the adjacent intermediate sub-modules one by one;
Taking or preparing a shell with a first opening and a second opening which are opposite, mounting the combination of the bottom plate subunit, the middle subunit and the metal cover plate into the shell, and enabling the metal bottom plate to cover the first opening and the metal cover plate to cover the second opening;
and sequentially connecting the bottom plate sub-module with a plurality of middle sub-modules in series.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN202311137204.5A CN117038598A (en) | 2023-08-31 | 2023-08-31 | Crimping type power module and packaging method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202311137204.5A CN117038598A (en) | 2023-08-31 | 2023-08-31 | Crimping type power module and packaging method thereof |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117238901A (en) * | 2023-11-16 | 2023-12-15 | 西安西电电力系统有限公司 | Crimping IGBT structure and power assembly |
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- 2023-08-31 CN CN202311137204.5A patent/CN117038598A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117238901A (en) * | 2023-11-16 | 2023-12-15 | 西安西电电力系统有限公司 | Crimping IGBT structure and power assembly |
| CN117238901B (en) * | 2023-11-16 | 2024-03-08 | 西安西电电力系统有限公司 | Crimping IGBT structure and power assembly |
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