CN113015315B - Circuit board capable of improving wiring overcurrent capacity and manufacturing method thereof - Google Patents

Circuit board capable of improving wiring overcurrent capacity and manufacturing method thereof Download PDF

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Publication number
CN113015315B
CN113015315B CN202110196555.8A CN202110196555A CN113015315B CN 113015315 B CN113015315 B CN 113015315B CN 202110196555 A CN202110196555 A CN 202110196555A CN 113015315 B CN113015315 B CN 113015315B
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China
Prior art keywords
circuit board
jumper
windows
routing
wire
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CN113015315A (en
Inventor
李思宁
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Shenzhen Topband Co Ltd
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Shenzhen Topband Co Ltd
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
    • H05K1/0203—Cooling of mounted components
    • H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H05K1/0242—Structural details of individual signal conductors, e.g. related to the skin effect
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/09—Use of materials for the conductive, e.g. metallic pattern
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/328—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by welding
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/3457—Solder materials or compositions; Methods of application thereof
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/03—Conductive materials
    • H05K2201/0332—Structure of the conductor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/06—Thermal details
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/10—Details of components or other objects attached to or integrated in a printed circuit board
    • H05K2201/10227—Other objects, e.g. metallic pieces
    • H05K2201/10363—Jumpers, i.e. non-printed cross-over connections
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/03—Metal processing
    • H05K2203/0338—Transferring metal or conductive material other than a circuit pattern, e.g. bump, solder, printed component

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  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Manufacturing & Machinery (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Structure Of Printed Boards (AREA)

Abstract

The invention is suitable for the field of circuit boards, and provides a circuit board capable of improving the overcurrent capacity of routing, which comprises a plurality of windows positioned on the routing and a welding surface covering the routing, wherein a plurality of windows are arranged on the welding surface at intervals along the routing direction, a jumper wire is arranged on the welding surface and positioned above the window, and the window is filled with solder to ensure that the jumper wire is tightly attached to the routing. According to the circuit board, the jumper wire is additionally arranged on the routing window, so that the jumper wire is tightly attached to the routing, the adhesive force to the solder is increased, more solder is left between the routing and the jumper wire, and the overcurrent capacity of the circuit board is increased; in addition, the solder is adhered between the routing wire and the jumper wire to form an arc shape, so that the cross section area of the conductor is enlarged, heat dissipation is facilitated, and the influence of resistance enlargement caused by the skin effect of the conductor is reduced; and the overcurrent capacity of the circuit board is increased by increasing the width and the thickness of the circuit board, and the circuit board has the advantages of simple process and low cost. The invention also provides a manufacturing method of the circuit board.

Description

Circuit board capable of improving wiring overcurrent capacity and manufacturing method thereof
Technical Field
The invention belongs to the field of circuit boards, and particularly relates to a circuit board capable of improving wiring overcurrent capacity and a manufacturing method thereof.
Background
The wiring is a Printed Circuit on a Printed Circuit Board (PCB), and the current carrying capability of the wiring directly affects the power that the PCB can carry. In the prior art, the current carrying capacity of the PCB trace is improved by increasing the width and thickness of the trace, but for the PCB with higher device density and trace density, there is no enough space to increase the width and thickness of the trace. And increase and walk the thickness of line just need increase PCB's conducting layer thickness earlier, no matter choose the PCB material of thick conducting layer for use, still carry out secondary treatment to the conducting layer on the PCB, all can greatly promote PCB cost. And when the conducting layer is in the condition of certain thickness to make the thin wire with smaller width on the PCB, the process difficulty is very high, and the making quality is difficult to ensure.
For the over wave soldering surface of the PCB bottom layer, the wave soldering aims at achieving the purpose of soldering by enabling the soldering surface of the plug-in board to be directly contacted with high-temperature liquid tin, and the high-temperature liquid tin keeps an inclined surface. In the prior art, a windowing part is added on a copper foil wiring of a welding surface of wave soldering, and then the windowing part is filled with soldering tin to increase the overcurrent capacity of the PCB wiring of the welding surface of the wave soldering.
Therefore, it is desirable to develop a low cost device for increasing the current carrying capacity of PCB traces.
Disclosure of Invention
The embodiment of the invention provides a circuit board capable of improving the overcurrent capacity of wiring, and aims to solve the problem that the overcurrent capacity of the wiring is low when the conventional circuit board passes through wave soldering.
The embodiment of the invention is realized in such a way that the circuit board capable of improving the overcurrent capacity comprises the routing and the welding surface covering the routing, wherein a plurality of windows are arranged on the welding surface at intervals along the routing direction, the jumper wire is arranged on the welding surface and positioned above the windows, and the windows are filled with solder to enable the jumper wire and the routing to be attached to each other.
Furthermore, at least two rows of windows are arranged on the welding surface in parallel along the routing direction, and the at least two rows of windows are arranged in a staggered manner in parallel.
Furthermore, the length X of the jumper is h/sinQ, where h is the height of the soldering surface and Q is the angle between the circuit board and the horizontal plane.
Further, the height h of the welding surface ranges from (d/2, 2d/3), wherein d is the thickness of the circuit board.
Furthermore, the length of the jumper wire is not less than that of the window; the width of the window is not less than the width of the jumper.
Furthermore, any one of the windows is symmetrically arranged relative to two windows adjacent to the window on the adjacent row.
Further, the fenestration has a rectangular cross-section.
The invention also provides a circuit board manufacturing method, which comprises the following steps:
arranging a plurality of windows on a welding surface covering the routing along the routing direction on the circuit board;
arranging a jumper wire above the windowing part on the welding surface;
and filling solder in the window to enable the jumper wire to be attached to the routing wire.
Furthermore, at least two rows of windows are arranged on the welding surface in parallel along the routing direction, and the windows in the rows are arranged in a staggered manner.
Furthermore, the length X of the jumper is h/sinQ, wherein h is the height of the welding surface, and Q is the angle between the circuit board and the horizontal plane; the height h of the welding surface ranges from (d/2, 2d/3), wherein d is the thickness of the circuit board.
The circuit board capable of improving the wiring overcurrent capacity comprises the wiring and a welding surface covering the wiring, wherein a plurality of windows are arranged on the welding surface at intervals along the wiring direction, a jumper wire is arranged on the welding surface above the windows, and the windows are filled with solder to enable the jumper wire and the wiring to be attached to each other. In the circuit board of the embodiment, the jumper wire is additionally arranged above the routing window, so that the jumper wire is tightly attached to the routing, the adhesive force to the solder is increased, more solder is left between the routing and the jumper wire, and the overcurrent capacity of the circuit board is increased; in addition, the solder is adhered between the routing wire and the jumper wire to form an arc, so that the cross section area of the conductor is enlarged, heat dissipation is facilitated, and the influence of resistance enlargement caused by the skin effect of the conductor is reduced; and the overcurrent capacity of the circuit board is increased relative to the increase of the width and the thickness of the circuit board, and the circuit board has the advantages of simple process and low cost.
Drawings
Fig. 1 is a schematic structural diagram of a circuit board for improving a trace over-current capability according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a circuit board for improving trace over-current capability according to a second embodiment of the present invention;
fig. 3 is a schematic structural diagram of a circuit board for improving trace over-current capability according to a third embodiment of the present invention.
The reference numbers illustrate:
10. a circuit board; 11. welding a surface; 20. routing; 21. windowing; 22. and (4) jumping.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and are not intended to limit the invention.
The invention provides a circuit board for improving the over-current capability of routing, wherein the circuit board 10 comprises a routing 20 and a welding surface for covering the routing, a plurality of windows 21 are arranged on the welding surface 11 at intervals along the direction of the routing 20, a jumper wire 22 is arranged on the welding surface 11 and positioned above the window 21, and the window 21 is filled with solder to ensure that the jumper wire 22 is tightly attached to the routing 20. According to the circuit board, the jumper wire 22 is additionally arranged on the window 21 of the routing wire 20, so that the jumper wire 22 is tightly attached to the routing wire 20, the adhesive force to the solder is increased, more solder is left between the routing wire 20 and the jumper wire 22, and the overcurrent capacity of the circuit board 10 is increased; in addition, the solder is adhered between the routing 20 and the jumper 22 to form an arc shape, so that the cross section area of the conductor is enlarged, heat dissipation is facilitated, and the influence of resistance enlargement caused by the skin effect of the conductor is reduced; and the overcurrent capacity of the circuit board 10 is increased relative to the increase of the width and the thickness of the circuit board 10, and the circuit board has simple process and low cost.
Example one
Referring to fig. 1 to 3, the present embodiment provides a circuit board for improving trace overcurrent capacity, where the circuit board 10 includes a trace 20 and a soldering surface covering the trace 20, a plurality of windows 21 are disposed on the soldering surface 11 at intervals along a direction of the trace 20, a jumper 22 is disposed on the soldering surface 11 above the window 21, and the window 21 is filled with solder to make the jumper 22 and the trace 20 tightly contact.
In the present embodiment, the trace 20 is a copper foil trace located on the bottom layer of the circuit board 10, and the soldering surface 11 is a soldered surface that covers the copper foil trace and is subjected to wave soldering. A plurality of windows 21 are arranged at intervals along the copper foil routing direction to expose the copper foil. The solder is solder, and the window 21 is filled with solder, so that the copper foil wire is tightly attached to the jumper 22, and the overcurrent capacity of the circuit board 10 is improved.
In other embodiments, the trace 20 may also be a trace located on the top layer of the circuit board 10, a window 21 is formed on the trace 20, a jumper 22 is disposed above the window 21, solder is filled in the window 21, and the trace 20 and the jumper 22 are attached to each other by the solder, so as to increase the overcurrent capability of the circuit board.
In the embodiment, the jumper 22 is added on the copper foil routing window 21 passing through the wave-soldering welding surface, the routing 20 is tightly attached to the jumper 22 by using the soldering tin, so that the adsorption force on the soldering tin is increased, more soldering tin is left between the routing 20 and the jumper 22, and the overcurrent capacity of the circuit board 10 is increased; in addition, the soldering tin is adhered between the routing 20 and the jumper 22 to form an arc shape, so that the cross section area of the conductor is enlarged, heat dissipation is facilitated, and the influence of resistance enlargement caused by the skin effect of the conductor is reduced; and the overcurrent capacity of the circuit board 10 is increased by increasing the width and the thickness of the circuit board 10, the circuit board of the embodiment has simple process and low cost.
Example two
On the basis of the first embodiment, in the present embodiment, at least two rows of windows 21 are arranged in parallel on the soldering surface 11 along the trace direction, and the at least two rows of windows 21 are arranged in a parallel staggered manner.
In the embodiment, the soldering surface 11 is a soldering surface for wave soldering, two rows of windows 21 are arranged on the soldering surface 11 in parallel along the routing direction, and the two rows of windows 21 are arranged in parallel and staggered, so that soldering tin is added to the greatest extent, because the soldering tin has high fluidity at high temperature, and the soldering tin flows away when the windows 21 are too close to or connected together. In addition, the distance between the windows 21 is affected by the process precision of the green oil, and is not suitable to be too small.
It is understood that in other embodiments, the number of columns of the windows 21 is set according to the width of the traces 20, and there may be three or more columns of windows.
EXAMPLE III
On the basis of the first or second embodiment, the present embodiment provides a circuit board for improving trace overcurrent capability, in the present embodiment, the length X of the jumper 22 is h/sinQ, where h is the height of the soldering surface 11, and Q is the angle between the circuit board 10 and the horizontal plane, that is, the angle between the soldering surface 11 and the horizontal plane.
In the present embodiment, the bonding surface 11 is a bonding surface that is subjected to wave soldering, and the bonding surface subjected to wave soldering has an angle with a horizontal plane. Specifically, the angle of the circuit board 10 to the horizontal plane is typically 4 to 7 degrees; h is the height of the welding surface passing through wave soldering. On the basis, the shorter the length of the jumper wire 22 is, the better the tinning effect is, but the cost is too high; when the jumper wire 22 is too long, the solder attached between the jumper wire 22 and the copper foil is dragged by the wave crest of the wave soldering, and the solder flows away, so that the length X of the jumper wire 22 can be calculated by the formula X h/sinQ.
The circuit board 10 of the embodiment obtains the length of the jumper wire 22 according to the height of wave soldering and the angle between the circuit board 10 and the horizontal plane, so that the tinning effect is optimal under the condition of controlling the cost, and the overcurrent capacity of the circuit board 10 is highest.
Example four
On the basis of the third embodiment, the present embodiment provides a circuit board for improving the trace overcurrent capability, wherein the height h of the soldering surface is in the range of (d/2, 2d/3), where d is the thickness of the circuit board.
In the present embodiment, the soldering surface 11 is an over-wave soldered soldering surface having a height of 2d/3, where d is 1.6mm, and the height of the over-wave soldered soldering surface is 1 mm. The angle of the circuit board 10 to the horizontal plane is 5 degrees, and the length of the jumper wire 22 is 1cm according to X being 1/sin (5 °) being 11.49 mm.
The length of the jumper 22 is calculated according to the height of the wave soldering welding surface and the angle between the circuit board 10 and the horizontal plane, so that on one hand, the jumper 22 is prevented from being too short, cost is increased, on the other hand, the jumper 22 is prevented from being too long, and the wave crest of the wave soldering can drag tin to the soldering tin attached between the jumper 22 and the copper foil, so that the soldering tin flows away.
EXAMPLE five
On the basis of the first embodiment, the present embodiment provides a circuit board for improving the routing overcurrent capability, wherein the length of the jumper 22 is not less than the length of the window 21; the width of the fenestration 21 is not less than the width of the patch cord 22.
In the present embodiment, the cross-sectional area of the opening 21 is rectangular, wherein the length of the jumper 22 is not less than the length of the opening 21, and the width of the opening 21 is not less than the width of the jumper 22, so as to increase the solder adhered to the opening 21 to the maximum.
Further, any one of the windows 21 is symmetrically disposed with respect to two adjacent windows 21 on the adjacent column.
In the present embodiment, any one of the windows 21 is symmetrically disposed with respect to two adjacent windows 21 on the adjacent row, so as to avoid solder flowing away due to the parallel disposition of the windows 21 and the too close distance between the windows, further increase the solder attached to the windows 21, and improve the overcurrent capability of the circuit board 10.
According to the circuit board, the jumper 22 is additionally arranged on the copper foil routing window 21 passing through the wave-soldering welding surface, the routing 20 is tightly attached to the jumper 22 through soldering tin, so that the adsorption force on the soldering tin is increased, more soldering tin is left between the routing 20 and the jumper 22, and the overcurrent capacity of the circuit board 10 is further increased; in addition, the soldering tin is adhered between the routing 20 and the jumper 22 to form an arc, so that the cross section area of the conductor is enlarged, heat dissipation is facilitated, and the influence of resistance enlargement caused by the skin effect of the conductor is reduced; and compared with the method for increasing the width and the thickness of the circuit board 10 to increase the overcurrent capacity of the circuit board 10, the circuit board of the embodiment has the advantages of simple process and low cost. At least two rows of windows 21 are arranged on the welding surface of the wave soldering in parallel along the routing direction, the at least two rows of windows 21 are arranged in parallel and staggered, soldering tin is increased to the maximum extent, and the soldering tin can flow away when the windows 21 are connected together because the soldering tin has high fluidity at high temperature. In addition, the distance between the windows 21 is affected by the process accuracy of the green oil, and is not suitable to be too small. The length of the jumper wire 22 is obtained according to the height of the wave soldering surface and the angle between the circuit board 10 and the horizontal plane, so that the tinning effect is the best under the condition of controlling the cost; and on the one hand, the problem that the cost is increased due to the fact that the length of the jumper wire 22 is too short is avoided, on the other hand, the problem that the jumper wire 22 is too long is avoided, and the wave crest of wave soldering drags tin to the soldering tin attached between the jumper wire and the copper foil, so that the soldering tin flows away.
Example six
The invention also provides a manufacturing method of the circuit board, which comprises the following steps:
arranging a plurality of windows 21 on the welding surface 11 covering the routing 20 along the direction of the routing 20 on the circuit board 10;
a jumper wire 22 is arranged above the window 21 on the welding surface 11;
the window 21 is filled with solder, and the jumper 22 is attached to the trace 20.
In the present embodiment, the trace 20 is a copper foil trace located on the bottom layer of the circuit board 10, and the soldering surface 11 is a soldered surface that covers the copper foil trace and is subjected to wave soldering. A plurality of windows 21 are arranged at intervals along the copper foil routing direction to expose the copper foil. The solder is solder, and the window 21 is filled with solder, so that the copper foil wire is tightly attached to the jumper 22, and the overcurrent capacity of the circuit board 10 is improved.
In other embodiments, the trace 20 may also be located on the top layer of the circuit board 10, a window 21 is formed on the trace 20, a jumper 22 is disposed above the window 21, solder is filled in the window 21, and the trace 20 and the jumper 22 are attached to each other by the solder, so as to increase the overcurrent capability of the circuit board 10.
In the manufacturing method of the circuit board of the embodiment, the jumper 22 is arranged on the copper foil routing windowing 21 passing through the wave-soldering welding surface, and then the solder is filled on the windowing 21 to enable the routing 20 to be attached to the jumper 22, so that the adsorption force of the solder is increased, more solder is left between the routing 20 and the jumper 22, and the overcurrent capacity of the circuit board 10 is further increased; in addition, the soldering tin is adhered between the routing 20 and the jumper wire 22 to form an arc shape, so that the cross section area of the conductor is enlarged, heat dissipation is facilitated, and the influence of resistance enlargement caused by the skin effect of the conductor is reduced; and the overcurrent capacity of the circuit board 10 is increased by increasing the width and the thickness of the circuit board 10, the circuit board of the embodiment has simple process and low cost.
EXAMPLE seven
On the basis of the sixth embodiment, the present embodiment further provides a method for manufacturing a circuit board, wherein at least two rows of windows 21 are arranged in parallel on the soldering surface 11 along the direction of the trace 20, and the at least two rows of windows 21 are arranged in a staggered manner.
In the embodiment, the soldering surface 11 is a soldering surface for wave soldering, two rows of windows 21 are arranged on the soldering surface 11 in parallel along the direction of the trace 20, the two rows of windows 21 are arranged in parallel and staggered, and the soldering tin is increased to the maximum extent because the soldering tin has high fluidity at high temperature, and the soldering tin flows away when the windows 21 are connected together. In addition, the distance between the windows 21 is affected by the process accuracy of the green oil, and is not suitable to be too small.
It is understood that in other embodiments, there may be three or more than three columns of windows 21, depending on the width of the traces 20.
Example eight
On the basis of the sixth or seventh embodiment, the present embodiment provides a method for manufacturing a circuit board, in the present embodiment, the length X of the jumper 22 is h/sinQ, where h is the height of the soldering surface, and Q is the angle between the circuit board 10 and the horizontal plane, that is, the angle between the soldering surface 11 and the horizontal plane.
In the present embodiment, the soldering surface 11 is a surface to be soldered by wave soldering, and the circuit board 10 is at an angle to the horizontal plane. Typically, the angle of the circuit board 10 to the horizontal is typically 4 to 7 degrees; h is the height of the welding surface of wave soldering. On the basis, the shorter the length of the jumper wire 22 is, the better the tinning effect is, but the cost is high; when the jumper wire 22 is too long, the solder attached between the jumper wire 22 and the copper foil is dragged by the wave crest of the wave soldering, and the solder flows away, so that the length X of the jumper wire 22 can be calculated by the formula X h/sinQ.
The circuit board of the embodiment obtains the length of the jumper wire according to the height of wave soldering and the angle between the circuit board 10 and the horizontal plane, so as to achieve the best tin soldering effect under the condition of controlling the cost and achieve the highest overcurrent capacity of the circuit board 10.
Example nine
On the basis of the eighth embodiment, the present embodiment provides a method for manufacturing a circuit board, wherein the height h of the soldering surface 11 ranges from (d/2, 2d/3), where d is the thickness of the circuit board.
In the present embodiment, the soldering surface 11 is an over-wave soldering surface, and the height of the wave-soldering surface is 2d/3, where d is 1.6mm, and thus the height of the wave-soldering surface is 1 mm. The angle between the circuit board 10 and the horizontal plane is 5 degrees, and the length of the jumper wire 22 is 1cm according to X1/sin (5 °) 11.49 mm.
The length of wire jumper 22 is calculated according to the height of wave-soldering face of weld and the angle of circuit board 10 and horizontal plane to the circuit board of this embodiment, avoids wire jumper 22 length short on the one hand, leads to cost increase, and on the other hand avoids wire jumper 22 overlength, and the wave crest of wave-soldering can drag tin to the soldering tin of adhering to between wire jumper 22 and the copper foil, leads to soldering tin to flow away.
EXAMPLE ten
On the basis of the sixth embodiment, the present embodiment provides a method for manufacturing a circuit board, wherein the length of the jumper 22 is not less than the length of the window 21; the width of the fenestration 21 is not less than the width of the patch cord 22.
In the present embodiment, the cross-sectional area of the opening 21 is rectangular, wherein the length of the jumper wire 22 is not less than the length of the opening 21, and the width of the opening 21 is not less than the width of the jumper wire 22, so as to increase the solder adhered to the opening 21 to the maximum.
Further, any one of the windows 21 is symmetrically disposed with respect to two adjacent windows 21 on the adjacent column.
In the present embodiment, any one of the windows 21 is symmetrically disposed about two adjacent windows 21 on the adjacent row, so as to avoid the windows 21 being disposed in parallel and not too close to each other, increase the solder adhered to the windows 21, and improve the overcurrent capability of the circuit board.
According to the manufacturing method of the circuit board, the jumper 22 is added on the copper foil routing windowing 21 which passes through the wave-soldering welding surface, and then the soldering tin is filled on the windowing 21 to enable the routing 20 and the jumper 22 to be attached tightly, so that the adsorption force of the soldering tin is increased, more soldering tin is left between the routing 20 and the jumper 22, and the overcurrent capacity of the circuit board 10 is further increased; in addition, the soldering tin is adhered between the routing 20 and the jumper wire 22 to form an arc shape, so that the cross section area of the conductor is enlarged, heat dissipation is facilitated, and the influence of resistance enlargement caused by the skin effect of the conductor is reduced; and the overcurrent capacity of the circuit board 10 is increased by increasing the width and the thickness of the circuit board 10, the circuit board of the embodiment has simple process and low cost. According to the manufacturing method of the circuit board, at least two rows of windows 21 are arranged on the welding surface of wave soldering in parallel along the routing direction, the at least two rows of windows 21 are arranged in parallel and staggered, soldering tin is increased to the greatest extent, and the soldering tin flows away when the windows 21 are connected together because the soldering tin has high fluidity at high temperature. In addition, the distance between the windows 21 is affected by the process precision of the green oil, and is not suitable to be too small. The length of the jumper wire 22 is obtained according to the height of wave soldering and the angle between the circuit board 10 and the horizontal plane, so that the tinning effect is the best under the condition of controlling the cost; and on one hand, the problem that the cost is increased due to the fact that the length of the jumper wire 22 is too short is avoided, on the other hand, the jumper wire 22 is prevented from being too long, and the wave crest of wave soldering drags tin to the soldering tin attached between the jumper wire and the copper foil, so that the soldering tin flows away, and the overcurrent capacity of the circuit board is reduced.
The above description is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the invention, and any modifications, equivalents and improvements made within the spirit and principle of the present invention are intended to be included within the scope of the present invention.

Claims (10)

1. The utility model provides an improve circuit board of walking line throughput, its characterized in that includes:
the welding wire comprises a wire and a welding surface covering the wire, wherein a plurality of windows are arranged on the welding surface at intervals along the wire routing direction, a wire jumper is arranged on the welding surface above the windows, the extending direction of the wire jumper is the same as the wire routing direction, and solder is filled in the windows to enable the wire jumper and the wire to be attached to each other.
2. The circuit board of claim 1,
at least two rows of windows are arranged on the welding surface in parallel along the routing direction, and the at least two rows of windows are arranged in a staggered manner in parallel.
3. The circuit board of claim 1 or 2,
the length X of the jumper is h/sinQ, wherein h is the height of the welding surface, and Q is the angle between the circuit board and the horizontal plane.
4. The circuit board of claim 3,
the height h of the welding surface ranges from (d/2, 2d/3), wherein d is the thickness of the circuit board.
5. The circuit board of claim 1,
the length of the jumper is not less than that of the window; the width of the window is not less than the width of the jumper.
6. The circuit board of claim 2,
any one of the windows is symmetrically arranged with respect to two adjacent windows on the adjacent row.
7. The circuit board of claim 1,
the cross section of the windowing is rectangular.
8. A method of manufacturing a circuit board, comprising the steps of:
arranging a plurality of windows on the welding surface covering the wires along the wire direction on the circuit board;
arranging a jumper wire above the window on the welding surface, wherein the extension direction of the jumper wire is the same as the routing direction;
and filling solder in the window to enable the jumper wire to be attached to the routing wire.
9. The manufacturing method according to claim 8,
at least two rows of windows are arranged on the welding surface in parallel along the routing direction, and the windows in the rows are arranged in a staggered manner.
10. The manufacturing method according to claim 8 or 9,
the length X of the jumper is h/sinQ, wherein h is the height of the welding surface, and Q is the angle between the circuit board and the horizontal plane; the height h of the welding surface ranges from (d/2, 2d/3), wherein d is the thickness of the circuit board.
CN202110196555.8A 2021-02-22 2021-02-22 Circuit board capable of improving wiring overcurrent capacity and manufacturing method thereof Active CN113015315B (en)

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Application Number Priority Date Filing Date Title
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CN113015315B true CN113015315B (en) 2022-07-19

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Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1256998A2 (en) * 2001-05-08 2002-11-13 Murata Manufacturing Co., Ltd. Antenna structure and communication apparatus including the same
KR20110060046A (en) * 2009-11-30 2011-06-08 뉴콘전자(주) Method for manufacturing jumper for surface mount devices and the jumper manufactured by the method
CN102316663A (en) * 2010-07-01 2012-01-11 启碁科技股份有限公司 Circuit board with wire jumper structure
CN103917057A (en) * 2012-12-31 2014-07-09 深南电路有限公司 Manufacturing method of printed circuit board small windowing pad

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP1256998A2 (en) * 2001-05-08 2002-11-13 Murata Manufacturing Co., Ltd. Antenna structure and communication apparatus including the same
KR20110060046A (en) * 2009-11-30 2011-06-08 뉴콘전자(주) Method for manufacturing jumper for surface mount devices and the jumper manufactured by the method
CN102316663A (en) * 2010-07-01 2012-01-11 启碁科技股份有限公司 Circuit board with wire jumper structure
CN103917057A (en) * 2012-12-31 2014-07-09 深南电路有限公司 Manufacturing method of printed circuit board small windowing pad

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