CN112601374A - Laser oil burning reworking method for circuit board - Google Patents
Laser oil burning reworking method for circuit board Download PDFInfo
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- CN112601374A CN112601374A CN202011280452.1A CN202011280452A CN112601374A CN 112601374 A CN112601374 A CN 112601374A CN 202011280452 A CN202011280452 A CN 202011280452A CN 112601374 A CN112601374 A CN 112601374A
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- 238000004519 manufacturing process Methods 0.000 claims abstract description 7
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- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 claims description 12
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/225—Correcting or repairing of printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/26—Cleaning or polishing of the conductive pattern
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laser Beam Processing (AREA)
Abstract
The application provides a laser oil burning reworking method for a circuit board. The laser oil burning reworking method of the circuit board comprises the following steps: coating the dark photosensitive ink on a circuit board to cover the surface of the circuit board with the dark photosensitive ink; manufacturing an exposure negative film according to the position of a bonding pad of the circuit board; exposing the circuit board according to the exposure negative film to solidify the dark photosensitive ink on the bonding pad; developing the circuit board to remove the dark photosensitive ink covering the bonding pad; the laser ablation is carried out on the dark photosensitive ink on the welding disc to remove the dark photosensitive ink, the solder resist ink and the defective coating on the welding disc, the dark photosensitive ink, the solder resist ink and the defective coating are melted together under the action of the laser ablation, and due to the shielding of the dark photosensitive ink layer, the laser emitted by the laser machine cannot directly act on the solder resist ink and the defective coating of the welding disc, so that the damage to equipment or a human body caused by the fact that the gold coating reflects the laser can be avoided.
Description
Technical Field
The invention relates to the technical field of circuit board processing, in particular to a laser oil burning reworking method of a circuit board.
Background
In the processing process of the circuit board, after a circuit and a bonding pad of the circuit board are etched, the circuit board needs to be subjected to solder mask treatment, wherein the solder mask treatment is mainly to coat a layer of solder mask ink on the board surface through screen printing, expose the pad and the hole to be welded through exposure and development, cover a solder mask layer at other places and prevent short circuit during welding. In the solder mask treatment process, due to the reasons of poor quality of the solder mask ink, insufficient cleanliness of a circuit board body, overlong baking time of the solder mask ink and the like, the solder mask ink cannot be developed completely, so that the solder mask ink is attached to a pad, and therefore, when the surface of the pad is plated with gold or gold, the pad cannot be plated with a gold plating layer completely, the plating layer on the pad is incomplete, and the transmission effect of the circuit board is affected.
In the case where the solder resist ink is attached to the pad, the solder resist ink is usually reworked by first irradiating the pad with a laser machine to perform laser ablation, removing the solder resist ink and the gold plating layer on the pad, and then performing gold plating or gold immersion again on the surface of the pad. However, when the pad is ablated by laser, the gold plating layer has strong reflection capability to laser, so that the energy of the laser is reflected in a large quantity, and the solder resist ink and the gold plating layer of the pad cannot be removed.
Disclosure of Invention
The invention aims to overcome the defects in the prior art and provides a laser oil burning reworking method for a circuit board, which can improve the reworking quality of the circuit board, avoid the reflection of a gold coating and further improve the safety of the reworking process
The purpose of the invention is realized by the following technical scheme:
a laser oil burning reworking method of a circuit board comprises the following steps:
coating the dark photosensitive ink on a circuit board to cover the dark photosensitive ink on the surface of the circuit board;
manufacturing an exposure negative film according to the position of the bonding pad of the circuit board;
exposing the circuit board according to the exposure negative film to solidify the dark photosensitive ink on the bonding pad;
developing the circuit board to remove the dark photosensitive ink covering the bonding pad;
performing laser ablation on the dark photosensitive ink on the bonding pad to remove the dark photosensitive ink, the solder resist ink and the incomplete plating layer on the bonding pad to obtain a semi-finished circuit board product;
cleaning and visually inspecting the circuit board semi-finished product;
and carrying out surface treatment on the bonding pad to enable the bonding pad to be covered with the metal plating layer again.
In one embodiment, after the step of cleaning and visually inspecting the circuit board semi-finished product, the method further comprises the following steps:
and polishing the surface of the bonding pad.
In one embodiment, in the step of laser ablating the dark photosensitive ink on the pads, the laser processing apparatus uses a flat-top beam to laser ablate the dark photosensitive ink on the pads.
In one embodiment, the laser processing equipment is a carbon dioxide laser machine
In one embodiment, the dark photosensitive ink is a black photosensitive ink.
In one embodiment, after the step of coating the dark photosensitive ink on the circuit board and before the step of manufacturing an exposure negative according to the pad position of the circuit board, the laser oil burning reworking method further comprises the following steps:
and baking the dark photosensitive ink covered on the surface of the circuit board.
In one embodiment: in the step of baking the dark photosensitive ink covered on the surface of the circuit board, the baking temperature is 75-80 ℃, and the baking time is 25-30 min.
In one embodiment: before the step of coating the dark photosensitive ink on the circuit board, the laser oil burning reworking method further comprises the following steps:
and cleaning the circuit board.
In one embodiment: after the step of developing the circuit board to remove the dark photosensitive ink covering the pads, the method further comprises the following steps:
and polishing the cured dark photosensitive ink on the bonding pad.
In one embodiment: and in the step of polishing the cured dark photosensitive ink on the bonding pad, the thickness of the polished dark photosensitive ink is 2-3 mm.
Compared with the prior art, the invention has at least the following advantages:
1. send laser through the laser machine, the dark sensitization printing ink layer of adnexed solid-state on the ablation pad, heat up rapidly behind the energy of dark sensitization printing ink layer absorption laser, and the heat continuously radiates to the dark sensitization printing ink layer that covers hinders on printing ink and the incomplete cladding material, under laser ablation's effect, dark sensitization printing ink, hinder printing ink and incomplete cladding material and be melted together, owing to having sheltering from of dark sensitization printing ink layer, the laser of laser machine transmission can not the direct action pad hinder on printing ink and the incomplete cladding material, consequently, can avoid because equipment or human damage that gold cladding material reflection laser led to the fact, laser beam machining's security has been improved.
2. The dark photosensitive ink has stronger light absorption capacity, so that the energy of laser can be more effectively absorbed, the effect of preventing laser reflection or diffuse reflection is achieved, and the laser ablation efficiency can be correspondingly improved because the energy of the laser is fully absorbed by the dark photosensitive ink.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
FIG. 1 is a flow chart of a method for laser oil-burning rework of a circuit board in an embodiment;
fig. 2 is a schematic structural diagram of an antireflection laser processing device of the laser processing apparatus used in step S500 of the laser oil burning rework method shown in fig. 1.
Detailed Description
To facilitate an understanding of the invention, the invention will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present invention are shown in the drawings. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.
It will be understood that when an element is referred to as being "secured to" another element, it can be directly on the other element or intervening elements may also be present. When an element is referred to as being "connected" to another element, it can be directly connected to the other element or intervening elements may also be present. The terms "vertical," "horizontal," "left," "right," and the like as used herein are for illustrative purposes only and do not represent the only embodiments.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
As shown in fig. 1, a laser oil burning rework method of a circuit board of an embodiment includes the following steps: coating the dark photosensitive ink on a circuit board to cover the dark photosensitive ink on the surface of the circuit board; manufacturing an exposure negative film according to the position of the bonding pad of the circuit board; exposing the circuit board according to the exposure negative film to solidify the dark photosensitive ink on the bonding pad; developing the circuit board to remove the dark photosensitive ink covering the bonding pad; performing laser ablation on the dark photosensitive ink on the bonding pad to remove the dark photosensitive ink, the solder resist ink and the defective plating layer on the bonding pad to obtain a semi-finished circuit board; cleaning and visually inspecting the circuit board semi-finished product; and carrying out surface treatment on the bonding pad to enable the bonding pad to be covered with the metal plating layer again.
Send laser through the laser machine, the dark sensitization printing ink layer of adnexed solid-state on the ablation pad, heat up rapidly behind the energy of dark sensitization printing ink layer absorption laser, and the heat continuously radiates to the dark sensitization printing ink layer that covers hinders on printing ink and the incomplete cladding material, under laser ablation's effect, dark sensitization printing ink, hinder printing ink and incomplete cladding material and be melted together, owing to having sheltering from of dark sensitization printing ink layer, the laser of laser machine transmission can not the direct action pad hinder on printing ink and the incomplete cladding material, consequently, can avoid because equipment or human damage that gold cladding material reflection laser led to the fact, laser beam machining's security has been improved. The dark photosensitive ink has stronger light absorption capacity, so that the energy of laser can be more effectively absorbed, the effect of preventing laser reflection or diffuse reflection is achieved, and the laser ablation efficiency can be correspondingly improved because the energy of the laser is fully absorbed by the dark photosensitive ink.
In order to better understand the laser oil-burning rework method of the circuit board of the present invention, the laser oil-burning rework method of the circuit board of the present invention is further explained below, and the laser oil-burning rework method of the circuit board of an embodiment is used for reworking the circuit board. The laser oil burning reworking method of the circuit board comprises the following steps:
s100: and coating the dark photosensitive ink on a circuit board to cover the dark photosensitive ink on the surface of the circuit board. In this step, the dark photosensitive ink may be dark brown, dark blue, dark gray, black or the like, and the light absorption capacity of the photosensitive ink is increased by increasing the depth of color. The method for coating the dark photosensitive ink on the circuit board is characterized in that the dark photosensitive ink is coated on the circuit board through a screen printing method, the screen gauze is arranged above the circuit board, the scraper attached with the dark photosensitive ink horizontally moves from the screen gauze, the dark photosensitive ink penetrates through the screen gauze and is attached to the circuit board, and then the dark photosensitive ink is coated on the circuit board.
S200: and manufacturing an exposure negative film according to the position of the bonding pad of the circuit board. After the deep color photosensitive ink is coated on the circuit board, the deep color photosensitive ink on a bonding pad of the circuit board needs to be reserved, the deep color photosensitive ink outside the bonding pad needs to be removed, and the deep color photosensitive ink coating needs to be exposed and developed to achieve the effect.
S300: and exposing the circuit board according to the exposure negative film, so that the dark photosensitive ink on the bonding pad is cured. After the exposure negative film is manufactured, the exposure negative film and the circuit board are aligned, so that the irradiation area of the exposure negative film is opposite to the position of a bonding pad of the circuit board, the covering area of the exposure negative film is opposite to the position of a non-bonding pad of the circuit board, then the circuit board and the exposure negative film are placed in an exposure machine, the exposure negative film is positioned above the circuit board, the exposure negative film is irradiated through the exposure machine, ultraviolet rays emitted by the exposure machine penetrate through the irradiation area of the exposure negative film and then irradiate on the bonding pad, and the dark photosensitive ink on the bonding pad is cured by the irradiation of the ultraviolet rays to form an all-solid dark photosensitive.
S400: and developing the circuit board to remove the dark photosensitive ink covering the bonding pads. After the circuit board is exposed, the circuit board is washed by the developing solution, the developing solution is a sodium carbonate solution with alkalescence, unexposed dark photosensitive ink on the circuit board can fall off after being washed by the developing solution, and the solid dark photosensitive ink layer on the bonding pad can not be washed and is continuously attached to the bonding pad.
S500: performing laser ablation on the dark photosensitive ink on the bonding pad to remove the dark photosensitive ink, the solder resist ink and the defective plating layer on the bonding pad to obtain a semi-finished circuit board; after exposure and development processing is carried out on dark photosensitive ink of a circuit board, the circuit board is placed in a laser machine, laser is emitted through the laser machine, an attached solid dark photosensitive ink layer on a bonding pad is ablated, the dark photosensitive ink layer rapidly heats up after absorbing energy of the laser, and heat is continuously radiated to solder resist ink and a defective plating layer covered by the dark photosensitive ink layer. The dark photosensitive ink has stronger light absorption capacity, so that the energy of laser can be more effectively absorbed, the effect of preventing laser reflection or diffuse reflection is achieved, and the laser ablation efficiency can be correspondingly improved because the energy of the laser is fully absorbed by the dark photosensitive ink.
S600: and cleaning and visually inspecting the semi-finished circuit board. After the dark photosensitive ink on the bonding pad is ablated through laser, the dark photosensitive ink, the solder resist ink and the incomplete plating layer are melted together, and the melted substances are remained on the bonding pad of the circuit board, so that the circuit board needs to be cleaned to remove ablation products on the bonding pad.
S700: and carrying out surface treatment on the bonding pad. So that the pads are re-covered with the metal plating. After the circuit board is cleaned, the surface of the copper foil is exposed again, and because the exposed surface of the copper foil is easily affected with damp and oxidized, the copper foil of the bonding pad needs to be subjected to surface treatment, and a gold plating layer is added on the surface of the copper foil.
In one embodiment, after the step of cleaning and visually inspecting the circuit board semi-finished product, the method further comprises the following steps: and polishing the surface of the bonding pad. After the circuit board is cleaned, the surface of the copper foil is exposed again, in the laser ablation process, the copper foil can be subjected to the ablation effect of laser, the absorption of the copper foil on the laser energy is weak, so the ablation effect of the laser on the copper foil is weak, however, in order to ensure that the solder resist ink and the incomplete plating layer on the copper foil are completely clear, the intensity of the laser can ablate part of the copper foil, the surface of the copper foil is uneven, the surface of the copper foil can be in poor contact with a welding part, and the signal transmission efficiency of the circuit board is affected, therefore, after the welding pad is cleaned, the copper foil of the welding pad needs to be polished, the surface of the welding pad is enabled to be leveled again, the welding pad can be stably connected with the welding part, and the transmission efficiency of the circuit board. When the copper foil is excessively ablated and the thickness of the copper foil is too low, the copper foil needs to be electroplated and thickened, and then the copper foil bonding pad is polished.
In one embodiment, in the step of laser ablating the dark photosensitive ink on the pad, a laser machine uses a flat-top beam for laser irradiation. A flat-topped beam means that the laser beam intensity is flat over a large area of the cross-section. This is in contrast to a gaussian beam, whose intensity decreases smoothly from a maximum value to 0 along the beam axis outward. The dark photosensitive ink is irradiated through the flat-top light beam, and because the intensity difference of each point of the light beam cross section of the flat-top light beam is not large, when the flat-top light beam irradiates the dark photosensitive ink, the absorption uniformity of the laser by the dark photosensitive ink is better, the ablation degree of the dark photosensitive ink, the solder resist ink and the incomplete bonding pad at each position on the bonding pad can be more even, the better ablation effect is facilitated, and the surface of the ablated bonding pad is smoother.
In one embodiment, the dark photosensitive ink is a black photosensitive ink. Dark sensitization printing ink's effect is for improving the absorptive capacity to laser and prevent laser reflection in this application, in order to strengthen sensitization printing ink's laser absorptivity and antireflection ability, in this embodiment, dark sensitization printing ink specifically is black sensitization printing ink, black is at the colour strongest to light absorptivity, sensitization printing ink uses black, can make sensitization printing ink absorb laser more rapidly, reach quick hinder the printing ink with the printing ink bottom, incomplete cladding material melts the effect, black sensitization printing ink is the weakest to the reflective capacity of light simultaneously, help further antireflection, in addition, because black sensitization printing ink's strong absorption light energy, can accelerate the curing speed and the improvement curing effect of exposure process, make efficiency and the quality of doing over again obtain the improvement.
In one embodiment, after the step of coating the dark photosensitive ink on the wiring board, the method further comprises the following steps: and baking the dark photosensitive ink covered on the surface of the circuit board. After the deep color photosensitive ink is coated on the circuit board, in order to accelerate the subsequent exposure and development efficiency, in the embodiment, the coated deep color photosensitive ink is baked, the deep color photosensitive ink can form a semi-cured state after being baked, the deep color photosensitive ink in the semi-cured state is not easy to flow, and can be stably attached to the circuit board, thereby being beneficial to the subsequent exposure and development operation of the circuit board.
In one embodiment, in the step of baking the dark photosensitive ink covered on the surface of the circuit board, the baking temperature is 75-80 ℃, and the baking time is 25-30 min. Time and the temperature of toasting have the important influence to dark sensitization printing ink's exposure development quality, when the baking time overlength or toast the high temperature, dark sensitization printing ink layer's pre-cure degree is too high, when washing non-exposure area in the development process, non-exposure area's dark sensitization printing ink just can't be washed by totally because the degree of curing is too high, cause the not clean phenomenon of development, when the baking time is too short or toast the low temperature, dark sensitization printing ink layer's pre-cure degree is crossed lowly, subsequent exposure process can't make dark sensitization printing ink thoroughly cure, the dark sensitization printing ink of part on the well pad of development process will be washed away. In order to improve the quality of the exposure and development of the dark photosensitive ink, in the embodiment, the baking temperature of the dark photosensitive ink is 75-80 ℃, the baking time is 25-30 min, and within the range of the baking temperature and the baking time, the dark photosensitive ink can have a good semi-curing degree, so that the dark photosensitive ink on the pad can be fully cured in the exposure process, and the dark photosensitive ink in the non-pad area can be thoroughly washed clean in the development process, namely, the exposure and development quality of the dark photosensitive ink can be effectively improved.
In one embodiment, before the step of applying the dark photosensitive ink to the wiring board, the method further comprises the steps of: and cleaning the circuit board. When the plate body cleanliness factor is not good, dark sensitization printing ink will unable complete cover on the pad, because dark sensitization printing ink does not thoroughly cover on the pad for the ink layer after the solidification is not high with the combination degree of pad, leads to in subsequent development process, and dark sensitization printing ink layer on the pad is washed easily by the developer and is dropped, and then can't play a role in laser ablation. Therefore, in this embodiment, before the dark photosensitive ink is applied, the circuit board needs to be cleaned to wash away impurities and dust on the circuit board, so that the photosensitive ink can be tightly attached to the circuit board and the pad when the dark photosensitive ink is subsequently applied. The cleaning method comprises the following steps: and immersing the circuit board into cleaning liquid of a cleaning tank, wherein an ultrasonic cleaner is externally connected with the cleaning tank and continuously vibrates the cleaning liquid, so that the cleaning effect of the cleaning liquid on the circuit board is further enhanced, wherein the cleaning time is 2-4 minutes, and the cleaning temperature is 25-40 ℃. It should be noted that, after cleaning, the circuit board is also required to be dried, so that the circuit board is restored to a dry state, and subsequent ink coating work is facilitated.
In one embodiment, in the step of performing laser ablation on the dark photosensitive ink on the pad, the laser used for laser ablation is a carbon dioxide laser. In PCB manufacturing field, laser processing mainly uses two kinds of practical carbon dioxide laser and UV laser, and it is carbon dioxide laser to use more, and this technology is fast, efficient, with low costs, simultaneously, because the copper foil is very weak to the absorption of carbon dioxide laser, consequently can effectively reduce the damage degree of laser to the pad copper foil in the laser ablation in-process, furthest's improvement laser ablation back pad copper foil's surface quality to alleviate follow-up polishing work to the copper foil surface.
In one embodiment, after the circuit board is developed to remove the dark photosensitive ink covering the pads, the method further comprises the following steps: and polishing the cured dark photosensitive ink on the bonding pad. Because the surface smoothness of dark sensitization printing ink after the development is not enough, in the follow-up laser ablation process, each point position on the surface that will lead to dark sensitization printing ink is uneven to the absorption degree of laser, therefore, in this embodiment, polish dark sensitization printing ink after the development, make the surface of dark sensitization printing ink level and more smooth, make the surface of dark sensitization printing ink everywhere of dark sensitization printing ink more even to the absorption of laser, and then on making on the pad hinder the basis that welding ink and incomplete plating coat are ablated completely and melt, the damage of maximum reduction to the pad copper foil.
In one embodiment, in the step of polishing the cured dark photosensitive ink on the pad, the thickness of the dark photosensitive ink after polishing is 2mm to 3 mm. In the laser ablation process, the dark photosensitive ink, the solder resist ink and the incomplete plating layer are melted together, and due to the shielding of the dark photosensitive ink layer, the laser emitted by the laser machine can not act on the solder resist ink and the incomplete plating layer on the bonding pad, so that the laser can be prevented from being reflected by the gold plating layer. Before the paper is burned by laser, if the thickness of the dark photosensitive ink is insufficient, the dark photosensitive ink is ablated and vaporized before the heat of the dark photosensitive ink is not conducted to the gold plating layer, and the gold plating layer is exposed to cause the laser reflection. In this embodiment, the thickness of the dark photosensitive ink after polishing is 2mm-3mm, and the dark photosensitive ink layer with the thickness can melt the gold plating layer before the gold plating layer is exposed, so that the gold plating layer loses the reflection capability, and the conditions that the removal effect of the incomplete gold plating layer caused by the fact that the incomplete gold plating layer reflects laser light is poor and the light after reflection damages equipment and a human body are prevented are generated.
In one embodiment, as shown in fig. 2, the laser processing apparatus includes an anti-reflection laser processing device 10, and the anti-reflection laser processing device 10 includes a laser emitter 100 and an anti-reflection mechanism 200. The anti-reflection mechanism 200 comprises a connecting pipe 210 and an anti-reflection light shield component 220, the anti-reflection light shield component 220 comprises a light shield 221 and a distance sensor 222, the distance sensor 222 is connected with the light shield 221, the distance sensor 222 is used for measuring the distance between the light shield 221 and a circuit board, and generates a sensing signal when the distance between the light shield 221 and the circuit board is a preset value, two ends of the connecting pipe 210 are respectively connected with the laser emitter 100 and the light shield 221, the emitting end of the laser emitter 100 faces towards the light inlet of the connecting pipe 210, the light shield 221 is provided with a through hole 221a, the through hole 221a is communicated with the light outlet of the connecting pipe 210, and the surface of the light shield 221, which is far away from the laser emitter.
In this embodiment, laser emitter 100 is used to emit laser light to ablate the solder resist ink on the solder pads. The laser reflector is connected with an anti-reflection mechanism 200, and the anti-reflection mechanism 200 is used for preventing laser from being reflected on equipment or a human body and improving the safety of a processing process. The anti-reflection mechanism 200 includes a connection pipe 210 and an anti-reflection mask assembly 220, the connection pipe 210 is mainly used for connecting the anti-reflection mask assembly 220 with the laser emitter 100, two ends of the connection pipe are respectively connected with the laser reflector and the light blocking cover 221, pipe orifices are respectively formed at two ends of the connection pipe, one end of the connection pipe is a light inlet, the other end of the connection pipe is a light outlet, the light blocking cover 221 is provided with a through hole 221a, and the light outlet of the connection pipe is communicated with the through hole 221a of the light blocking cover. The laser emitted from the laser emitter 100 passes through the light inlet and the light outlet of the communication pipe in sequence, and is finally emitted from the light blocking cover 221.
Further, before laser ablation, the laser emitter 100 is aligned with a pad of a circuit board, so that the light path of the laser emitter 100 can irradiate the pad, and the light blocking cover 221 is located right above the pad, and further the light blocking cover 221 can be covered on the pad, when the laser emitter 100 moves to be aligned, the light blocking cover 221 is firstly driven to move to the upper side of the pad, and the light blocking cover 221 is gradually driven to move towards the direction close to the circuit board, a distance sensor 222 connected to the light blocking cover 221 detects the distance between the light blocking cover 221 and the circuit board to prevent the collision between the light blocking cover 221 and the circuit board, when the light blocking cover 221 moves down to the position close to the circuit board, the alignment operation is completed, and laser ablation processing can be started.
Further, the laser emitter 100 emits laser, the laser irradiates on the pad, the solder resist ink and the metal coating on the pad are ablated, when the laser irradiates on the metal coating, the metal coating reflects part of laser energy, because the light blocking cover 221 is located above the pad and covers the pad in all directions, the energy reflected by the metal coating on the pad acts on the inner wall of the light blocking cover 221, and because the light blocking cover 221 is provided with the light blocking layer 221c, the laser is blocked in the light blocking cover 221 and cannot be emitted out of the light blocking cover 221, thereby preventing the reflected laser from being emitted to cause the situation of threatening the equipment or personal safety, and effectively improving the safety of the laser ablation process.
As shown in FIG. 2, in one embodiment, the connection tube 210 is removably coupled to the laser emitting device 100. After the laser processing equipment is used for a long time, the laser processing equipment needs to be checked or maintained, in order to facilitate checking or maintaining the laser emitter 100 and the connecting light, in the embodiment, the connecting pipe 210 and the laser emitter 100 are detachably connected, so that the connection between the connecting pipe 210 and the laser emitter 100 is more convenient and faster to disassemble and assemble, and the process of checking and maintaining is facilitated to be simplified.
As shown in fig. 2, in one embodiment, a first thread 231 is provided on an inner wall of the connection pipe 210, a second thread 232 adapted to the first thread 231 is provided on an outer wall of the laser emitter 100, and the outer wall of the laser emitter 100 is at least partially located in the connection pipe 210 and is in threaded connection with the connection pipe 210. In order to facilitate the inspection or maintenance of the laser emitter 100 and the connection light, the connection pipe 210 and the laser emitter 100 are detachably connected, in this embodiment, the outer wall of the laser emitter 100 is connected with the first thread 231, the inner wall of the connection pipe 210 is connected with the second thread 232, through the mutual matching of the first thread 231 and the second thread 232, the connection pipe 210 and the laser emitter 100 can directly realize threaded connection, and further can be assembled and disassembled quickly and conveniently.
As shown in fig. 2, in one embodiment, the anti-reflection mechanism 200 further includes a magnetic connection assembly 230, the magnetic connection assembly 230 includes a first magnetic ring 233 and a second magnetic ring 234, the first magnetic ring 2344 is sleeved on the outer wall of the laser transmitter 100 and connected to the outer wall of the laser transmitter 100, the second magnetic ring 234 is connected to the end of the connection pipe 210 adjacent to the laser transmitter 100, and the first magnetic ring 233 and the second magnetic ring 234 are correspondingly disposed and magnetically connected. In this embodiment, after the laser emitter 100 is screwed to the connection pipe 210, the first magnetic ring 233 and the second magnetic ring 234 contact each other, and the first magnetic ring 233 and the second magnetic ring 234 attract each other due to the magnetic field force, so that the laser reflector and the communication pipe have a tendency to approach each other, thereby contributing to increase the connection stability between the laser emitter 100 and the communication pipe.
As shown in fig. 2, in one embodiment, the inner wall of the light-blocking cover 221 has a frosted surface structure. When laser irradiates on the metal coating, the metal coating can reflect part of laser energy, because the light blocking cover 221 is located above the bonding pad, and the bonding pad is covered in all directions, the energy reflected by the metal coating on the bonding pad will act on the inner wall of the light blocking cover 221, in order to prevent the situation that the laser irradiated on the inner wall of the light blocking cover 221 is reflected again, which causes the laser to be reflected on the circuit board and damages the circuit board, in this embodiment, the inner wall of the light blocking cover 221 is a frosted surface structure, the laser irradiates on the frosted surface and then will be reflected diffusely, the laser energy after diffuse reflection is very dispersed, which is not enough to damage the circuit board, and further can play a role in protecting the circuit board.
As shown in FIG. 2, in one embodiment, the apparatus 10 further comprises a cooling liquid circulation module 300, the cooling liquid circulation module 300 comprising a circulation pipe 310; the light blocking cover 221 includes a cover body 221b and a cooling cover body 241, the cooling cover body 241 is connected with the cover body 221b, the cooling cover body 241 covers the outer wall of the cover body 221b, so that a cooling cavity 243 is formed between the inner wall of the cooling cover body 241 and the outer wall of the cover body 221b, the connecting pipe 210 is connected with the cover body 221b, the light shielding layer 221c is arranged on the surface of the cover body 221b away from the laser emitter 100, the through hole 221a is opened in the cover body 221b, the cooling cover body 241 is provided with a liquid inlet 241a and a liquid outlet 241b, the liquid inlet 241a and the liquid outlet 241b are both communicated with the cooling cavity 243, both ends of the circulating pipe 310 are both connected with the outer wall of the cooling cover body 241, and both. The laser light reflected by the metal plating layer will act on the inner wall of the light-blocking cover 221, and thus the local temperature of the light-blocking cover 221 will rise, and when the irradiation time is too long, it will be possible to damage the light-blocking cover 221, in this embodiment, the cooling cover 241 is covered on the outer wall of the cover 221b, a cooling cavity 243 is formed between the inner wall of the cooling cover 241 and the outer wall of the cover 221b, the cooling cavity 243 is filled with cooling liquid, the cooling liquid directly contacts with the outer wall of the cover 221b, the cover 221b can be effectively cooled, the cover 221b can be prevented from being damaged due to overheating, and the circulation pipe 310 is connected with the liquid inlet 241a and the liquid outlet 241b of the cooling cover 241, the circulation pipe 310 continuously replaces the cooling liquid in the cooling cavity 243 to improve the cooling effect of the cooling liquid on the cover body 221b, thereby effectively preventing the cover 221b from being damaged due to overheating and improving the reliability of the light blocking cover 221. Furthermore, the cooling cover 241 is provided with a space-avoiding groove communicated with the through hole 221a, and the connecting pipe 210 is located in the space-avoiding groove, so that the connection between the connecting pipe 210 and the cooling cover 241 is firmer. Furthermore, the connecting pipe 210 is further connected to the cooling cover 241, and the cooling cover 241 can dissipate heat of the connecting pipe 210 and the emitting end of the laser emitter 100 at the same time, so that the service life of the antireflection laser processing apparatus 10 is prolonged. Further, the outer wall of the connecting pipe 210 is provided with heat dissipation ribs, and the heat dissipation ribs extend to the cooling cover body, so that the heat dissipation efficiency is improved. Further, the figure of heat dissipation rib is a plurality of, and a plurality of heat dissipation ribs set up along the axial interval of connecting pipe, have further improved the radiating efficiency of the outer wall of laser emitter's transmitting terminal.
As shown in fig. 2, in one embodiment, the cooling cover 241 and the cover 221b are integrally formed. Because the cooling cavity 243 is composed of the inner wall of the cooling cover 241 and the outer wall of the cover 221b, in order to increase the sealing performance of the cooling cavity 243, in this embodiment, the cooling cover 241 and the cover 221b which constitute the cooling cavity 243 are integrally formed, and because of the integrally formed mechanism, the connection between the cooling cover 241 and the cover 221b is tighter, and a gap is less likely to be formed, and further the sealing performance of the cooling cavity 243 is better and is not likely to leak. The cooling cover 241 and the cover 221b are not limited to being integrally formed, and may be connected by welding the cooling cover 241 and the cover 221b to each other or by fastening the cooling cover 241 and the cover 221b to each other.
As shown in fig. 2, in one embodiment, the liquid inlet 241a and the liquid outlet 241b are symmetrically disposed on two sides of the cooling cover 241. The liquid inlet 241a and the liquid outlet 241b are respectively used for conveying cooling liquid to the cooling cavity 243 and discharging the cooling liquid from the cooling cavity 243, in order to improve the cooling effect of the cooling liquid on the light blocking cover 221, in this embodiment, the liquid inlet 241a and the liquid outlet 241b are respectively symmetrically arranged on two sides of the cooling cover 241, through this structure, the cooling liquid entering from the liquid inlet 241a must flow from one side of the cooling cavity 243 to the other side of the cooling cavity 243 to flow out from the liquid outlet 241b, and in the process that the cooling liquid flows from one side of the cooling cavity 243 to the other side of the cooling cavity 243, the cooling liquid can fully exchange heat with the light blocking cover 221, fully take away the heat of the light blocking cover 221, and further achieve a better cooling effect on the light blocking cover 221.
As shown in FIG. 2, in one embodiment, the anti-reflective mask assembly 220 further comprises a rubber gasket 223, the rubber gasket 223 being attached to the mouth of the light shield 221. In the alignment operation before laser ablation, the light blocking cover 221 needs to be covered on the circuit board, and in order to prevent the light blocking cover 221 from generating a large collision when covered on the circuit board, in this embodiment, the rubber gasket 223 is connected with the cover opening of the light blocking cover 221, so that the rubber gasket 223 can play a good buffering role in the process of covering the circuit board by the light blocking cover 221, so as to prevent the cover opening of the light blocking cover 221 from colliding with the circuit board, and further play a role in protecting the light blocking cover 221 and the circuit board. It should be noted that the rubber gasket 223 can be connected with the light blocking cover in various ways, for example, the rubber gasket 223 is connected at the opening of the light blocking cover 221 by an adhesive connection way, or a positioning groove is formed at the opening of the light blocking cover 221, and the rubber gasket 223 is located in the positioning groove and is clamped with the light blocking cover 221.
As shown in fig. 2, in one embodiment, the inner wall of the light-blocking cover 221 is a spherical structure. Since the flatness of each point on the metal plating layer is not completely uniform, when the laser is irradiated on the metal plating layer, the radiation angle of the laser is also random, and the position of the reflected laser acting on the light blocking cover 221 is also random, when the square light blocking cover 221 is used, because the probability that the side plate of the light blocking cover 221 is irradiated is smaller than that of the top plate of the light blocking cover 221, the top plate of the light blocking cover 221 is more easily damaged, and in order to make the intensity of each position of the inner wall of the light blocking cover 221 more uniform, in the present embodiment, the inner wall of the light blocking cover 221 is spherical, and because the inner wall of the light blocking cover 221 is spherical, the probability that the reflected laser is irradiated on each position of the light blocking cover 221 is more uniform compared with the square light blocking cover 221, thereby contributing to the improvement of the service life of the light blocking cover 221.
The above-mentioned embodiments only express several embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (10)
1. A laser oil burning reworking method of a circuit board is characterized by comprising the following steps:
coating the dark photosensitive ink on a circuit board to cover the dark photosensitive ink on the surface of the circuit board;
manufacturing an exposure negative film according to the position of the bonding pad of the circuit board;
exposing the circuit board according to the exposure negative film to solidify the dark photosensitive ink on the bonding pad;
developing the circuit board to remove the dark photosensitive ink covering the bonding pad;
performing laser ablation on the dark photosensitive ink on the bonding pad to remove the dark photosensitive ink, the solder resist ink and the incomplete plating layer on the bonding pad to obtain a semi-finished circuit board product;
cleaning and visually inspecting the circuit board semi-finished product;
and carrying out surface treatment on the bonding pad to enable the bonding pad to be covered with the metal plating layer again.
2. The laser oil-burning reworking method of a circuit board according to claim 1, further comprising the following steps after the steps of cleaning and visually inspecting the semi-finished circuit board product:
and polishing the surface of the bonding pad.
3. The method of claim 1 wherein in the step of laser ablating the dark sensitive ink on the pads, the dark sensitive ink on the pads is laser ablated by a laser processing device using a flat-top beam.
4. The laser oil-burning reworking method of a circuit board according to claim 3, wherein the laser processing apparatus is a carbon dioxide laser machine.
5. The laser oil-burning reworking method of a circuit board according to claim 1, wherein the dark photosensitive ink is a black photosensitive ink.
6. The method of claim 1, wherein after the step of applying the dark photosensitive ink to the circuit board and before the step of creating an exposure negative according to the pad position of the circuit board, the method further comprises the steps of:
and baking the dark photosensitive ink covered on the surface of the circuit board.
7. The laser oil-burning reworking method of a circuit board according to claim 6, wherein: in the step of baking the dark photosensitive ink covered on the surface of the circuit board, the baking temperature is 75-80 ℃, and the baking time is 25-30 min.
8. The laser oil-burning reworking method of a circuit board according to claim 1, wherein: before the step of coating the dark photosensitive ink on the circuit board, the laser oil burning reworking method further comprises the following steps:
and cleaning the circuit board.
9. The laser oil-burning reworking method of a circuit board according to claim 1, wherein: after the step of developing the circuit board to remove the dark photosensitive ink covering the pads, the method further comprises the following steps:
and polishing the cured dark photosensitive ink on the bonding pad.
10. The laser oil-burning reworking method of a circuit board according to claim 9, wherein: and in the step of polishing the cured dark photosensitive ink on the bonding pad, the thickness of the polished dark photosensitive ink is 2-3 mm.
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| CN112601374B (en) | 2021-12-07 |
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Application publication date: 20210402 Assignee: Huizhou techuang Electronic Technology Co.,Ltd. Assignor: HUAI'AN TECHUANG TECHNOLOGY Co.,Ltd. Contract record no.: X2023980050223 Denomination of invention: Laser oil burning rework method for circuit boards Granted publication date: 20211207 License type: Common License Record date: 20231205 |
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