CN113923886A - Method for removing solder resist ink on printed board and solder resist ink removing equipment - Google Patents
Method for removing solder resist ink on printed board and solder resist ink removing equipment Download PDFInfo
- Publication number
- CN113923886A CN113923886A CN202111249969.9A CN202111249969A CN113923886A CN 113923886 A CN113923886 A CN 113923886A CN 202111249969 A CN202111249969 A CN 202111249969A CN 113923886 A CN113923886 A CN 113923886A
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- Prior art keywords
- solder resist
- printed board
- resist ink
- laser
- ink
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- 229910000679 solder Inorganic materials 0.000 title claims abstract description 88
- 238000000034 method Methods 0.000 title claims abstract description 24
- 230000000007 visual effect Effects 0.000 claims abstract description 21
- 230000003287 optical effect Effects 0.000 claims abstract description 14
- 239000007789 gas Substances 0.000 claims description 16
- IJGRMHOSHXDMSA-UHFFFAOYSA-N Atomic nitrogen Chemical compound N#N IJGRMHOSHXDMSA-UHFFFAOYSA-N 0.000 claims description 6
- 239000011261 inert gas Substances 0.000 claims description 3
- 229910052757 nitrogen Inorganic materials 0.000 claims description 3
- 239000003570 air Substances 0.000 claims 1
- 238000005507 spraying Methods 0.000 claims 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 abstract description 17
- 229910052802 copper Inorganic materials 0.000 abstract description 16
- 239000010949 copper Substances 0.000 abstract description 16
- 239000010410 layer Substances 0.000 description 22
- 238000012360 testing method Methods 0.000 description 12
- 238000000149 argon plasma sintering Methods 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000012545 processing Methods 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 238000013461 design Methods 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- 238000005245 sintering Methods 0.000 description 3
- 239000007921 spray Substances 0.000 description 3
- 239000012670 alkaline solution Substances 0.000 description 2
- 238000004891 communication Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 229910052751 metal Inorganic materials 0.000 description 2
- 229910052755 nonmetal Inorganic materials 0.000 description 2
- 238000011056 performance test Methods 0.000 description 2
- 238000005498 polishing Methods 0.000 description 2
- 230000008054 signal transmission Effects 0.000 description 2
- 238000012546 transfer Methods 0.000 description 2
- 244000137852 Petrea volubilis Species 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000007664 blowing Methods 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000008676 import Effects 0.000 description 1
- 238000013532 laser treatment Methods 0.000 description 1
- 239000000523 sample Substances 0.000 description 1
- 239000000243 solution Substances 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000002344 surface layer Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/288—Removal of non-metallic coatings, e.g. for repairing
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
The invention relates to a method for removing solder resist ink on a printed board, which comprises the following steps: acquiring graphic data and position data of a solder resist ink part needing to be removed on a printed board; importing the graphic data and the position data into a control system of the solder resist ink removing equipment, and then programming according to the imported graphic data and the imported position data to form a numerical control program; placing the printed board into the apparatus; performing visual positioning by using a visual positioning system and an optical positioning point on the printed board so as to determine the relative position of the solder resist ink to be removed on the printed board; starting a laser transmitter in the equipment, and removing the solder resist ink to be removed on the printed board according to the numerical control program; removing debris formed by the laser operation; and after the solder resist ink to be removed is completely removed, withdrawing the printed board from the equipment. The laser is adopted to remove the solder resist ink on the surface part of the copper layer, so that the copper layer is not damaged. The invention also relates to solder resist ink removing equipment.
Description
Technical Field
The invention relates to the technical field of printed board processing and manufacturing, in particular to a method for removing solder resist ink on a printed board and solder resist ink removing equipment.
Background
When electronic products are developed, in a prototype stage, electrical performance tests need to be performed on all links on a printed board, but test points (such as test holes, routing copper foils and the like) on the links are not used in a subsequent product mass production stage. Therefore, in order to ensure the workability of the printed board and its reliability in the environment, these test points are mostly covered with solder resist ink having a thickness of about 25 μm, which is not electrically conductive and not easily punctured. Before the electronic product is debugged, the solder resist ink on the test point needs to be removed to expose the copper layer below, so that the test probe can be well contacted with the solder resist ink, and then the electrical performance test is carried out. At present, the method for removing the solder resist ink mainly comprises the steps of polishing by adopting mechanical modes such as a knife, tweezers, sand paper and the like, and removing the solder resist ink on a point to be tested; or, the solder resist ink on the surface layer of the printed board is completely removed by adopting an alkaline solution.
However, the existing method for removing solder resist ink mainly has the following disadvantages. Firstly, the thickness of the solder resist ink is about 25 μm, the thickness of the copper layer covered by the solder resist ink is generally very thin (about 50 μm), and in addition, the printed board is not completely flat and is not easy to control when mechanical polishing is adopted, so that the copper layer is easy to scrape off or abrade off, the open circuit of the whole link is caused, and the performance of the circuit board is influenced. Secondly, at present, single boards are more and more dense, via holes and lines are more and more dense, small and numerous, and testers need to spend a long time to remove solder resist ink before testing, so that the efficiency is extremely low. In addition, the solder resist ink can be removed only on the whole surface by the alkaline solution, and can not be removed locally, so that subsequent assembly processing can not be carried out after removal.
Disclosure of Invention
The present invention is directed to overcoming at least one of the problems of the prior art and providing a method for removing solder resist ink from a printed circuit board. The method adopts a non-mechanical contact mode, namely, laser is adopted to remove the solder resist ink on the surface of the copper layer, so that the copper layer is not damaged.
Another object of the present invention is to provide a solder resist ink removing apparatus.
In order to achieve the above object, the present invention provides the following technical solutions.
A method for removing solder resist ink on a printed board comprises the following steps:
acquiring graphic data and position data of a solder resist ink part needing to be removed on a printed board;
importing the graphic data and the position data into a control system of the solder resist ink removing equipment, and then programming according to the imported graphic data and the imported position data to form a numerical control program;
placing the printed board into the apparatus;
performing visual positioning by using a visual positioning system and an optical positioning point on the printed board so as to determine the relative position of the solder resist ink to be removed on the printed board;
starting a laser transmitter in the equipment, and removing the solder resist ink to be removed on the printed board according to the numerical control program;
removing debris formed by the laser operation; and
and after the solder resist ink required to be removed is completely removed, the printed board is withdrawn from the equipment.
The invention also provides solder resist ink removing equipment which comprises a control system, a display, a laser emitter, a guide rail, a visual positioning system and a gas spray pipe.
Compared with the prior art, the invention has the beneficial effects that:
1. the method of the invention uses a non-mechanical contact mode, i.e. uses a laser, especially C02And removing part of the solder resist ink on the surface of the copper layer by laser without damaging the copper layer. The method can automatically and quickly remove part of the solder resist ink on the printed board, thereby improving the testing efficiency of the prototype debugging and testing stage. In addition, the method is simple to operate and high in repeatability.
2. The method of the invention utilizes the optical automatic positioning technology, adopts the existing graphic format (such as AutoCAD or Geber) to program, and can accurately remove the local solder resist ink on the printed board.
3. The method does not change the design and the production process flow of the prior circuit board, thereby not needing to additionally increase the cost.
Drawings
Various other advantages and benefits will become apparent to those of ordinary skill in the art upon reading the following detailed description of the preferred embodiments. The drawings are only for purposes of illustrating the preferred embodiments and are not to be construed as limiting the invention. Also, like reference numerals are used to refer to like parts throughout the drawings. In the drawings:
FIG. 1 is a schematic diagram of a solder resist ink removal apparatus of the present invention.
Fig. 2 is a flow chart of the method for removing solder resist ink on a printed board according to the present invention.
Fig. 3 is a schematic diagram of test points and optical positioning points on a printed board, where solder resist ink needs to be removed.
Description of the reference numerals
100 is a control system, 200 is a display, 300 is a clamping device, 400 is a printed board, 401 is solder resist ink, and 500 is CO2Laser emitter, 501 is CO2The laser 600 is a guide rail, 700 is a visual positioning system, 800 is a gas spray pipe, 900 is a test point needing to remove solder resist ink, and 1000 is an optical positioning point.
Detailed Description
Hereinafter, embodiments of the present disclosure will be described with reference to the accompanying drawings. It should be understood that the description is illustrative only and is not intended to limit the scope of the present disclosure. Moreover, in the following description, descriptions of well-known structures and techniques are omitted so as to not unnecessarily obscure the concepts of the present disclosure.
Various structural schematics according to embodiments of the present disclosure are shown in the figures. The figures are not drawn to scale, wherein certain details are exaggerated and possibly omitted for clarity of presentation. The shapes of various regions, layers, and relative sizes and positional relationships therebetween shown in the drawings are merely exemplary, and deviations may occur in practice due to manufacturing tolerances or technical limitations, and a person skilled in the art may additionally design regions/layers having different shapes, sizes, relative positions, as actually required.
In the context of the present disclosure, when a layer/element is referred to as being "on" another layer/element, it can be directly on the other layer/element or intervening layers/elements may be present. In addition, if a layer/element is "on" another layer/element in one orientation, then that layer/element may be "under" the other layer/element when the orientation is reversed.
The invention will be further described with reference to the accompanying drawings.
FIG. 1 shows a schematic diagram of the solder resist ink removal apparatus of the present invention. Specifically, as shown in FIG. 1, the apparatus of the present invention includes a control system 100, a display 200, a laser emitter 500, a guide rail 600, a visual positioning system 700, and a gas lance 800, as shown in FIG. 1.
The control system 100 includes a memory and a processor. The processor can convert the graphic data and the position data of the solder resist ink to be removed on the introduced printed board 400 into a numerical control program. The control system 100 directly controls each module through the signal transmission system, and can transmit the designed numerical control program to the laser transmitter 500 through the optical signal, and control the position accuracy of the laser sintering according to the visual positioning system 700.
The display 200 is in electrical communication with the control system 100. Graphic data and positional data as well as adjusting parameters such as laser output power may be input through the display 200. The display 200 can display the set parameters and the sintering condition of the solder resist ink to be removed on the printed board in the laser sintering process.
In one embodiment, the apparatus of the present invention further comprises a holding device 300 for fixing the printed board for subsequent positioning using the vision positioning system 700. The clamping device 300 may be a clamping device for clamping both ends of the printed board.
Preferably, the laser transmitter 500 may be CO2Laser emitter, CO2The wavelength of the laser may be 10.6 μm or 9.3 μm; CO 22The laser may be a continuous wave. C02The laser has good sintering effect on non-metal substances (solder resist ink and the like), and basically does not sinter metal substances (such as copper), so that a copper layer on a printed board is not damaged.
The laser transmitter 500 is secured to a beam (not shown in fig. 1) of the apparatus and is in electrical communication with the control system 100. The guide rail 600 is driven by a motor, so that the laser emitter 500 can be rapidly moved to any position above the printed board. Laser emitter 500 emits laser to remove solder resist ink on the printed board.
In one embodiment, the printed board is fixed in the apparatus and laser transmitter 500 can be moved rapidly to any position above the printed board by guide 600. In another embodiment, both the print plate and laser emitter 500 are movable within the apparatus.
The visual positioning system 700 may be a high precision industrial camera or a digital smart camera. The vision positioning system 700 can capture the graphic data and position data of several (e.g., 3) optical positioning points (also called MARK points) on the printed board, and import the captured graphic data and position data into the control system 100 in a conventional software graphic format (e.g., AutoCAD or Geber, etc.) through a signal transmission system. The control system 100 performs programmed processing on the imported graphic data and the position data to realize the visual positioning of the printed board, so as to determine the relative position of the solder resist ink to be removed on the printed board.
In one embodiment, the visual positioning system 700 is integrated with the laser transmitter 500. The visual positioning system 700 moves as the laser transmitter 500 moves.
The exit of gas jet 800 is directed towards the intersection of the printed board and the laser. The gas nozzle 800 can be adjusted in height at will and can spray compressed gas with a certain pressure. The residual solder resist ink residue on the surface of the copper layer after laser sintering can be blown away by high-speed airflow. In one embodiment, gas lance 800 is assembled with laser emitter 500.
Preferably, the gas stream ejected by the gas lance 800 is an air stream, a nitrogen stream, or an inert gas stream.
The method for removing solder resist ink on the printed board can be carried out by the equipment according to the flow shown in the figure 2, and the method is specifically as follows.
Firstly, acquiring the graphic data and the position data of the solder resist ink part needing to be removed on the printed board.
The method for acquiring the graphic data and the position data is not particularly limited, and the method is mainly from product design files or drawing graphics according to the position of the positioning points.
And then, importing the graphic data and the position data into a control system of the solder resist ink removing equipment, and then programming according to the imported graphic data and the position data to form a numerical control program.
The graphic data and position data may be imported into the control system of the device in a conventional software graphic format (e.g., AutoCAD or Geber, etc.) for programmed processing.
And programming parameters such as laser output power and the like according to the thickness of the solder resist ink to be removed while programming the graphic data and the position data.
Thereafter, the printed board is placed into the apparatus.
In one embodiment, the printed board is moved to a designated position of the apparatus by a transfer device and is fixed by a holding device 300.
Preferably, the device can be initialized before the printed board is put in, so as to ensure that the device can be used normally.
Preferably, after the printed board is put in, the surface of the printed board may be purged using the gas nozzle 800 to remove dust adhered to the surface of the printed board.
And then, performing visual positioning by using a visual positioning system and optical positioning points on the printed board, thereby determining the relative position of the solder resist ink to be removed on the printed board.
In one embodiment, 3-5 optical positioning points are used for visual positioning. The optical locating point is a trigger pointer for subsequent laser sintering. The control system 100 controls the position accuracy of the solder resist ink to be removed according to the optical positioning points.
And then, starting a laser transmitter in the equipment, and removing the solder resist ink required to be removed on the printed board according to the numerical control program.
In the present invention, the laser may be CO2And (4) laser. CO 22The laser may be continuous wave, CO2The laser wavelength can be 9.2-10.6 μm, preferably 10.6. mu.m. C02The laser has good sintering effect on non-metal substances (solder resist ink and the like), and basically does not sinter metal substances (such as copper), so that a copper layer on a printed board is not damaged.
In the present invention, the output power of the laser may be determined according to the thickness of the solder resist ink to be removed. Parameters such as the output power/frequency, the moving speed, and the spot size of the laser can be adjusted by the control system 100.
Then, the residue formed by the laser operation is removed.
In one embodiment, the laser-treated solder mask ink spots are cleaned by a high velocity air stream to blow away post-fired residue of the solder mask ink that is coated on the copper layer. The gas stream used in the present invention may be an air stream, a nitrogen stream or an inert gas stream. Preferably, an inexpensive compressed air stream is used.
In a specific embodiment of the present invention, solder resist ink at multiple positions on the printed board needs to be removed, after the solder resist ink at one position is removed, the laser emitter 500 may be moved to an initial position first, and then moved to another position where the solder resist ink needs to be removed; alternatively, laser emitter 500 may be moved directly from a location where solder mask ink is removed to another location where solder mask ink needs to be removed.
And after the solder resist ink required to be removed is completely removed, the printed board is withdrawn from the equipment.
The invention will be further described with reference to specific embodiments and drawings, but the invention is not limited thereto.
This example was carried out with the aid of an apparatus as shown in FIG. 1, in the following steps:
first, the graphic data and the position data of the test points 800 (shown in fig. 3) on the printed board 400 provided with the solder resist ink 401 on the surface thereof, from which the solder resist ink needs to be removed, are acquired.
Then, the graphic data and the position data are imported into the control system 100 of the device in an AutoCAD graphic format, and then programmed according to the imported graphic data and position data to form a numerical control program. All in oneIn time, the thickness of the solder resist ink removed as required is relative to CO2The parameters of laser output power (30%)/frequency (15KHZ), moving speed (500mm/s) and spot size (0.05mm) are programmed.
After that, the printed board 400 is placed to a designated position in the apparatus shown in fig. 1 by a transfer device and fixed by a holding device 300.
Next, an optical positioning point 900 (shown in fig. 3) on the printed board 400 and the industrial camera 600 are used for visual positioning, so as to determine the relative position of the test point 800 on the printed board 400, which needs to remove the solder resist ink.
Then, the continuous wave CO is started2 Laser transmitter 500 emits CO2And the laser 501 removes the solder resist ink on the printed board according to the position and the pattern of the solder resist ink part needing to be removed, which are set in the numerical control program.
Thereafter, the high velocity gas stream (about 00.8 standard gas pressures) emitted from the gas nozzle 700 is directed at the CO to be treated2And cleaning the solder mask ink points subjected to laser treatment, and blowing off residues coated on the copper layer after the solder mask ink is sintered.
After all the solder resist ink to be removed is removed, the printed board 400 is taken out of the apparatus.
The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any changes or substitutions that can be easily conceived by those skilled in the art within the technical scope of the present invention are included in the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the appended claims.
Claims (9)
1. A method for removing solder resist ink on a printed board is characterized by comprising the following steps:
acquiring graphic data and position data of a solder resist ink part needing to be removed on a printed board;
importing the graphic data and the position data into a control system of the solder resist ink removing equipment, and then programming according to the imported graphic data and the imported position data to form a numerical control program;
placing the printed board into the apparatus;
performing visual positioning by using a visual positioning system and an optical positioning point on the printed board so as to determine the relative position of the solder resist ink to be removed on the printed board;
starting a laser transmitter in the equipment, and removing the solder resist ink to be removed on the printed board according to the numerical control program;
removing debris formed by the laser operation; and
and after the solder resist ink required to be removed is completely removed, the printed board is withdrawn from the equipment.
2. The method of claim 1, wherein solder resist ink is required to be removed from a plurality of locations on the printed board; after the solder mask ink at one position is removed, the laser transmitter is firstly moved to the initial position and then moved to another position where the solder mask ink needs to be removed, or the laser transmitter is directly moved from the position where the solder mask ink is removed to another position where the solder mask ink needs to be removed.
3. Method according to claim 1 or 2, characterized in that 3-5 optical positioning points are used for visual positioning.
4. A solder resist ink removing device is characterized by comprising a control system, a display, a laser emitter, a guide rail, a visual positioning system and a gas spraying pipe.
5. The apparatus of claim 4, wherein the laser emitter is CO2A laser emitter.
6. The apparatus of claim 5, wherein the CO is2The wavelength of the laser is 10.6 μm or 9.3 μm; CO 22The laser is a continuous wave.
7. The apparatus according to claim 4 or 5, characterized in that the gas jet is a stream of air, nitrogen or inert gas.
8. The apparatus of claim 4 or 5, wherein the visual positioning system is an industrial camera or a digital smart camera.
9. The apparatus of claim 4 or 5, further comprising a clamping device for fixing the printed board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111249969.9A CN113923886A (en) | 2021-10-26 | 2021-10-26 | Method for removing solder resist ink on printed board and solder resist ink removing equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202111249969.9A CN113923886A (en) | 2021-10-26 | 2021-10-26 | Method for removing solder resist ink on printed board and solder resist ink removing equipment |
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| CN113923886A true CN113923886A (en) | 2022-01-11 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202111249969.9A Pending CN113923886A (en) | 2021-10-26 | 2021-10-26 | Method for removing solder resist ink on printed board and solder resist ink removing equipment |
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|---|---|---|---|---|
| JPH01218787A (en) * | 1988-02-26 | 1989-08-31 | Ushio Inc | Method for removing resist |
| CN101296570A (en) * | 2007-04-25 | 2008-10-29 | 富葵精密组件(深圳)有限公司 | Circuit board and production method thereof |
| CN104117778A (en) * | 2014-08-04 | 2014-10-29 | 中山新诺科技股份有限公司 | Method for machining solder mask of circuit board through laser |
| CN109688723A (en) * | 2019-01-31 | 2019-04-26 | 东莞三润田智能科技股份有限公司 | The manufacturing method of pcb board welding resistance spray printing windowing automatic assembly line |
| CN110719696A (en) * | 2019-10-22 | 2020-01-21 | 东莞三润田智能科技股份有限公司 | PCB solder-resisting windowing method and PCB laser windowing machine |
| CN111299842A (en) * | 2018-12-11 | 2020-06-19 | 深圳市百柔新材料技术有限公司 | Method for high-precision laser engraving of solder mask |
| CN211661336U (en) * | 2019-12-03 | 2020-10-13 | 武汉华工激光工程有限责任公司 | Special laser equipment for forming PCB solder mask |
| CN112045323A (en) * | 2020-09-15 | 2020-12-08 | 英诺激光科技股份有限公司 | Double-laser-head windowing method and device |
| CN112601374A (en) * | 2020-11-16 | 2021-04-02 | 淮安特创科技有限公司 | Laser oil burning reworking method for circuit board |
-
2021
- 2021-10-26 CN CN202111249969.9A patent/CN113923886A/en active Pending
Patent Citations (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH01218787A (en) * | 1988-02-26 | 1989-08-31 | Ushio Inc | Method for removing resist |
| CN101296570A (en) * | 2007-04-25 | 2008-10-29 | 富葵精密组件(深圳)有限公司 | Circuit board and production method thereof |
| CN104117778A (en) * | 2014-08-04 | 2014-10-29 | 中山新诺科技股份有限公司 | Method for machining solder mask of circuit board through laser |
| CN111299842A (en) * | 2018-12-11 | 2020-06-19 | 深圳市百柔新材料技术有限公司 | Method for high-precision laser engraving of solder mask |
| CN109688723A (en) * | 2019-01-31 | 2019-04-26 | 东莞三润田智能科技股份有限公司 | The manufacturing method of pcb board welding resistance spray printing windowing automatic assembly line |
| CN110719696A (en) * | 2019-10-22 | 2020-01-21 | 东莞三润田智能科技股份有限公司 | PCB solder-resisting windowing method and PCB laser windowing machine |
| CN211661336U (en) * | 2019-12-03 | 2020-10-13 | 武汉华工激光工程有限责任公司 | Special laser equipment for forming PCB solder mask |
| CN112045323A (en) * | 2020-09-15 | 2020-12-08 | 英诺激光科技股份有限公司 | Double-laser-head windowing method and device |
| CN112601374A (en) * | 2020-11-16 | 2021-04-02 | 淮安特创科技有限公司 | Laser oil burning reworking method for circuit board |
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