CN111223077A - Test method and test system of circuit board - Google Patents
Test method and test system of circuit board Download PDFInfo
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- CN111223077A CN111223077A CN201911401895.9A CN201911401895A CN111223077A CN 111223077 A CN111223077 A CN 111223077A CN 201911401895 A CN201911401895 A CN 201911401895A CN 111223077 A CN111223077 A CN 111223077A
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T7/00—Image analysis
- G06T7/0002—Inspection of images, e.g. flaw detection
- G06T7/0004—Industrial image inspection
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06V—IMAGE OR VIDEO RECOGNITION OR UNDERSTANDING
- G06V10/00—Arrangements for image or video recognition or understanding
- G06V10/20—Image preprocessing
- G06V10/22—Image preprocessing by selection of a specific region containing or referencing a pattern; Locating or processing of specific regions to guide the detection or recognition
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/10—Image acquisition modality
- G06T2207/10004—Still image; Photographic image
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/20—Special algorithmic details
- G06T2207/20081—Training; Learning
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/20—Special algorithmic details
- G06T2207/20084—Artificial neural networks [ANN]
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- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06T—IMAGE DATA PROCESSING OR GENERATION, IN GENERAL
- G06T2207/00—Indexing scheme for image analysis or image enhancement
- G06T2207/30—Subject of image; Context of image processing
- G06T2207/30108—Industrial image inspection
- G06T2207/30141—Printed circuit board [PCB]
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Abstract
The invention provides a test method of a circuit board, which comprises the following steps: and collecting a top surface sampling image of the sampling circuit board through image collecting equipment. A plurality of integrated circuit area images of the plurality of integrated circuit portions are acquired from the top surface sample image. A top frame image is acquired. A top frame model and a plurality of integrated circuit image models are obtained. And establishing an integrated circuit model library. And acquiring a current top surface image. And acquiring a top surface frame identification result. A corresponding current set of integrated circuit models is obtained. And finally, obtaining the test result information of the circuit board. The invention aims to provide a test method of a circuit board, which can effectively ensure the consistency and stability of image detection in the process of detecting large batches of circuit boards by identifying images of the circuit board through a neural network model. Meanwhile, the invention also provides a test system of the circuit board.
Description
Technical Field
The invention is applied to the manufacturing and detecting process of the circuit board. The invention relates to a test method and a test system of a circuit board.
Background
In the manufacturing process of the wiring board, many processes such as phototypesetting, etching, and plating are generally performed. The final etching precision of the circuit board depends on the precision of each process and the operating environment. With the demands of integration and miniaturization, the wiring density of the circuit board is increased and the width of the lead is reduced, thereby bringing greater difficulty to the processing of the circuit board. In the manufacturing process of the circuit board, the short circuit or short circuit between lines caused by local imaging or impurity defects is easy to occur. The later use of the circuit board is seriously influenced. Aiming at the problems, in the prior art, the defects of the circuit board are mostly checked in a mode of manually detecting through an optical box, but the mode has the problems that when lines are dense, detection omission is easily caused, the detection time is long, the yield is low, and much labor is consumed. The manual detection mode is also not beneficial to the detection of the circuit board after welding.
Disclosure of Invention
The invention aims to provide a test method of a circuit board, which can effectively ensure the consistency and stability of image detection in the process of detecting large batches of circuit boards by identifying images of the circuit board through a neural network model. Meanwhile, the image learning library of the integrated circuit is independently established, so that the image of the integrated circuit is convenient to update, the circuit board of a welding device can be detected while the graph of the printed circuit board can be effectively identified, the applicability of the method is improved, the integration of the system is identified, and the efficiency is improved.
Another object of the present invention is to provide a circuit board testing system, which can effectively detect a printed circuit board, can detect a circuit board of a soldered integrated circuit module, can be applied to various detection environments, and can improve the detection range and the detection precision of the system by identifying circuit images through a convolutional neural network.
The invention provides a test method of a circuit board, which is realized by image acquisition equipment capable of acquiring top surface images and bottom surface images of the circuit board. The test method of the circuit board comprises the following steps:
and S101, acquiring a top surface sampling image of the sampling circuit board through image acquisition equipment.
Step S102, a plurality of integrated circuit area images of a plurality of integrated circuit parts are obtained from the top surface sampling image, two-dimensional coordinate values corresponding to the plurality of integrated circuit area images are obtained, and identification number information of the plurality of integrated circuits is obtained respectively.
Step S103, removing a plurality of integrated circuit area images from the top surface sampling image, and acquiring a top surface frame image.
And step S104, training the top surface frame image through a convolutional neural network to obtain a top surface frame model. And respectively training a plurality of integrated circuit area images through a convolutional neural network to obtain a plurality of integrated circuit image models.
Step S105, establishing an integrated circuit model library corresponding to the integrated circuit image models according to the identification number information of the integrated circuits.
And step S106, the image acquisition equipment acquires the current top surface image of the current circuit board.
And S107, identifying the current top surface image through the top surface frame model, and acquiring a top surface frame identification result.
And step S108, driving the image acquisition equipment to acquire the corresponding current integrated circuit area images according to the two-dimensional coordinate values corresponding to the integrated circuit area images. And acquiring a corresponding current integrated circuit model set from the integrated circuit model library according to the prestored identification numbers of the current integrated circuits.
Step S109, through the integrated circuit model library, each current integrated circuit in the multiple current integrated circuit model sets is identified one by one, and the identification result of the top surface integrated circuit is obtained.
Step S110, test result information of the circuit board is obtained according to the top surface frame identification result and the top surface integrated circuit identification result.
In one embodiment of the method for testing a circuit board according to the invention, the image recording device has a recording camera.
Step S101 includes: and driving the acquisition camera to move in the acquisition sampling circuit board area according to the set stepping moving direction and the set moving stepping distance to acquire a plurality of sampling images which can be mutually connected.
And splicing the plurality of sampling images into a top surface sampling image according to the set stepping moving direction and the set moving stepping distance.
In one embodiment of the method for testing a circuit board of the present invention, the top surface sampling image further includes a circuit board character identification image. Step S101 further includes obtaining a character identification image of the circuit board from the top surface sampling image.
In an embodiment of the method for testing a circuit board of the present invention, step S110 further includes: and judging whether the test result information is a set result, and if so, generating detection passing information. If not, judging whether the top frame identification result is a set result, if so, generating qualified information of the circuit board part, and if not, generating abnormal information of the circuit board part.
In an embodiment of the method for testing a circuit board of the present invention, after step S110, the method further includes: step S111, the display device displays the detection pass information, the circuit board portion pass information, and the circuit board portion abnormality information.
In an embodiment of the method for testing a circuit board of the present invention, step S104 further includes:
and respectively training a plurality of integrated circuit area images to be updated through a convolutional neural network to obtain a plurality of integrated circuit image models to be updated. Step S105 further includes: and obtaining the identification number information of the integrated circuits to be updated, and updating the integrated circuit model library corresponding to the image models of the integrated circuits to be updated.
Meanwhile, the invention also provides a test system of the circuit board, which is realized by image acquisition equipment capable of acquiring the top surface image and the bottom surface image of the circuit board. The test system of the circuit board includes:
and the top surface sampling image unit is configured to acquire a top surface sampling image of the sampling circuit board through an image acquisition device. An integrated circuit image acquisition unit configured to acquire a plurality of integrated circuit region images of the plurality of integrated circuit portions from the top surface sampling image, acquire two-dimensional coordinate values corresponding to the plurality of integrated circuit region images, and acquire identification number information of the plurality of integrated circuits, respectively.
And a top surface frame image acquisition unit configured to remove the plurality of integrated circuit region images from the top surface sample image, and acquire a top surface frame image. And the image model acquisition unit is configured to train the top surface frame image through a convolutional neural network to acquire a top surface frame model. And respectively training a plurality of integrated circuit area images through a convolutional neural network to obtain a plurality of integrated circuit image models.
And the integrated circuit model library obtaining unit is configured to establish an integrated circuit model library corresponding to the plurality of integrated circuit image models according to the identification number information of the plurality of integrated circuits. And the current image acquisition unit is configured to acquire a current top surface image of the current circuit board by the image acquisition equipment.
And the top surface frame identification result acquisition unit is configured to identify the current top surface image through the top surface frame model and acquire a top surface frame identification result. And the calling unit is configured to drive the image acquisition equipment to acquire each corresponding current integrated circuit area image according to the two-dimensional coordinate values corresponding to the plurality of integrated circuit area images. And acquiring a corresponding current integrated circuit model set from the integrated circuit model library according to the prestored identification numbers of the current integrated circuits.
And the top surface integrated circuit identification result acquisition unit is configured to identify each current integrated circuit in the multiple current integrated circuit model sets one by one through the integrated circuit model library to acquire the top surface integrated circuit identification result. And the test result acquisition unit is configured to acquire the test result information of the circuit board according to the top surface frame identification result and the top surface integrated circuit identification result.
In one embodiment of the method for testing a circuit board according to the invention, the image recording device has a recording camera. And the top surface sampling image unit is also configured to drive the acquisition camera to move in the acquisition sampling circuit board area according to the set stepping moving direction and the set moving stepping distance so as to acquire a plurality of sampling images which can be mutually connected. And splicing the plurality of sampling images into a top surface sampling image according to the set stepping moving direction and the set moving stepping distance.
In one embodiment of the method for testing a circuit board of the present invention, the top surface sampling image further includes a circuit board character identification image. And the top surface sampling image unit is also configured to acquire a circuit board character identification image from the top surface sampling image.
In one embodiment of the method for testing a circuit board of the present invention, the top surface sampling image unit is further configured to:
and judging whether the test result information is a set result, and if so, generating detection passing information. If not, judging whether the top frame identification result is a set result, if so, generating qualified information of the circuit board part, and if not, generating abnormal information of the circuit board part. A test system further configured to: and a display unit configured to display the detection passing information, the circuit board portion passing information, and the circuit board portion abnormality information by a display device.
The features, technical characteristics, advantages and implementation of the preferred embodiments will be further described in a clear and understandable manner by referring to the attached drawings.
Drawings
Fig. 1 is a schematic flowchart for explaining a method of testing a circuit board in one embodiment of the present invention.
Fig. 2 is a schematic flowchart for explaining a method of testing a circuit board in another embodiment of the present invention;
fig. 3 is a schematic diagram for explaining the composition of a test system of a circuit board in one embodiment of the present invention.
Detailed Description
In order to more clearly understand the technical features, objects and effects of the present invention, embodiments of the present invention will now be described with reference to the accompanying drawings, in which the same reference numerals indicate the same or structurally similar but functionally identical elements.
"exemplary" means "serving as an example, instance, or illustration" herein, and any illustration, embodiment, or steps described as "exemplary" herein should not be construed as a preferred or advantageous alternative. For the sake of simplicity, the drawings only schematically show the parts relevant to the present exemplary embodiment, and they do not represent the actual structure and the true scale of the product.
The invention provides a test method of a circuit board, which is realized by image acquisition equipment capable of acquiring top surface images and bottom surface images of the circuit board. As shown in fig. 1, the method for testing a circuit board includes:
step S101, collecting a top surface image.
In this step, the top surface sampling image of the sampling circuit board is collected by the image collecting device.
Step S102, acquiring an integrated circuit image.
In this step, a plurality of integrated circuit area images of the plurality of integrated circuit portions are obtained from the top surface sampling image, two-dimensional coordinate values corresponding to the plurality of integrated circuit area images are obtained, and identification number information of the plurality of integrated circuits is obtained respectively. The integrated circuit image referred to above may be a soldered integrated circuit image, or may be a planar frame and character image of an integrated circuit drawn from graphite on the surface of a circuit board.
Step S103, a top surface frame image is acquired.
In this step, the plurality of integrated circuit area images are removed from the top surface sampling image, and a top surface frame image is acquired. The top frame image in this step is the image from which the integrated circuit image in step S102 is removed.
Step S104, a plurality of integrated circuit images and frame models are obtained.
In this step, a top frame model is obtained by training a top frame image through a convolutional neural network. And respectively training a plurality of integrated circuit area images through a convolutional neural network to obtain a plurality of integrated circuit image models.
Step S105, an integrated circuit model base is established.
In this step, an integrated circuit model library is established corresponding to the plurality of integrated circuit image models according to the identification number information of the plurality of integrated circuits.
And step S106, acquiring the current top surface image.
In this step, the image acquisition device acquires a current top surface image of the current circuit board.
In step S107, a top surface frame recognition result is acquired.
In this step, the current top surface image is identified through the top surface frame model, and a top surface frame identification result is obtained.
Step S108, acquiring a current integrated circuit model set.
In this step, the image acquisition device is driven to acquire each corresponding current integrated circuit area image according to the two-dimensional coordinate values corresponding to the plurality of integrated circuit area images. And acquiring a corresponding current integrated circuit model set from the integrated circuit model library according to the prestored identification numbers of the current integrated circuits.
In step S109, a top surface integrated circuit recognition result is obtained.
In this step, each current integrated circuit in the multiple current integrated circuit model sets is identified one by one through the integrated circuit model library, and a top surface integrated circuit identification result is obtained.
Step S110, obtaining test result information of the circuit board.
In this step, test result information of the circuit board is obtained according to the top surface frame identification result and the top surface integrated circuit identification result.
Therefore, by establishing a plurality of integrated circuit images and frame models, the current identification image can be effectively identified, and particularly, under the condition of updating the integrated circuit images, the integrated circuit image library can be locally updated, so that the learning amount and the updating time of the models are reduced, the identification efficiency is improved, and the maintenance cost is reduced.
In one embodiment of the method for testing a circuit board according to the invention, the image recording device has a recording camera. Step S101 includes: and driving the acquisition camera to move in the acquisition sampling circuit board area according to the set stepping moving direction and the set moving stepping distance to acquire a plurality of sampling images which can be mutually connected.
And splicing the plurality of sampling images into a top surface sampling image according to the set stepping moving direction and the set moving stepping distance. Therefore, the circuit board with the large surface pair can be effectively identified.
In one embodiment of the method for testing a circuit board of the present invention, the top surface sampling image further includes a circuit board character identification image. Step S101 further includes obtaining a character identification image of the circuit board from the top surface sampling image. Therefore, the circuit board identification can be effectively used, the type of the circuit board can be identified, and the identification precision is improved.
In an embodiment of the method for testing a circuit board of the present invention, step S110 further includes: and judging whether the test result information is a set result, and if so, generating detection passing information. If not, judging whether the top frame identification result is a set result, if so, generating qualified information of the circuit board part, and if not, generating abnormal information of the circuit board part.
In an embodiment of the testing method of the circuit board of the present invention, as shown in fig. 2, after step S110, the method further includes:
step S111, the result information is displayed.
In this step, the detection passing information, the circuit board portion qualification information, and the circuit board portion abnormality information are displayed by the display device.
In an embodiment of the method for testing a circuit board of the present invention, step S104 further includes: and respectively training a plurality of integrated circuit area images to be updated through a convolutional neural network to obtain a plurality of integrated circuit image models to be updated. Step S105 further includes: and obtaining the identification number information of the integrated circuits to be updated, and updating the integrated circuit model library corresponding to the image models of the integrated circuits to be updated. Thereby facilitating rapid updating of portions of the integrated circuit image.
Meanwhile, the invention also provides a test system of the circuit board, which is realized by image acquisition equipment capable of acquiring top surface images and bottom surface images of the circuit board as shown in fig. 3. The test system of the circuit board includes:
and a top surface sampling image unit 10 configured to acquire a top surface sampling image of the sampling circuit board by an image acquisition apparatus. An integrated circuit image acquisition unit configured to acquire a plurality of integrated circuit region images of the plurality of integrated circuit portions from the top surface sampling image, acquire two-dimensional coordinate values corresponding to the plurality of integrated circuit region images, and acquire identification number information of the plurality of integrated circuits, respectively.
A top surface frame image obtaining unit 20 configured to remove the plurality of integrated circuit region images from the top surface sample image, and obtain a top surface frame image. And the image model acquisition unit is configured to train the top surface frame image through a convolutional neural network to acquire a top surface frame model. And respectively training a plurality of integrated circuit area images through a convolutional neural network to obtain a plurality of integrated circuit image models.
The integrated circuit model library obtaining unit 30 is configured to build an integrated circuit model library corresponding to the plurality of integrated circuit image models according to the identification number information of the plurality of integrated circuits. And the current image acquisition unit is configured to acquire a current top surface image of the current circuit board by the image acquisition equipment.
And a top surface frame identification result acquisition unit 40 configured to acquire a top surface frame identification result by identifying the current top surface image by the top surface frame model. And the calling unit is configured to drive the image acquisition equipment to acquire each corresponding current integrated circuit area image according to the two-dimensional coordinate values corresponding to the plurality of integrated circuit area images. And acquiring a corresponding current integrated circuit model set from the integrated circuit model library according to the prestored identification numbers of the current integrated circuits.
A top integrated circuit identification result obtaining unit 50 configured to obtain the top integrated circuit identification result by identifying each current integrated circuit in the multiple current integrated circuit model sets one by one through the integrated circuit model library. And the test result acquisition unit is configured to acquire the test result information of the circuit board according to the top surface frame identification result and the top surface integrated circuit identification result.
In one embodiment of the method for testing a circuit board according to the invention, the image recording device has a recording camera. The top surface sampling image unit 10 is further configured to drive the collection camera to move in the collection sampling circuit board area according to the set step moving direction and the set moving step distance, so as to obtain a plurality of sampling images which can be connected with each other. And splicing the plurality of sampling images into a top surface sampling image according to the set stepping moving direction and the set moving stepping distance.
In one embodiment of the method for testing a circuit board of the present invention, the top surface sampling image further includes a circuit board character identification image. And the top surface sampling image unit 10 is also configured to acquire a circuit board character identification image from the top surface sampling image.
In one embodiment of the method for testing a circuit board of the present invention, the top surface sampling image unit 10 is further configured to: and judging whether the test result information is a set result, and if so, generating detection passing information. If not, judging whether the top frame identification result is a set result, if so, generating qualified information of the circuit board part, and if not, generating abnormal information of the circuit board part. A test system further configured to: and a display unit configured to display the detection passing information, the circuit board portion passing information, and the circuit board portion abnormality information by a display device.
It should be understood that although the present description is described in terms of various embodiments, not every embodiment includes only a single embodiment, and such description is for clarity purposes only, and those skilled in the art will recognize that the embodiments described herein as a whole may be suitably combined to form other embodiments as will be appreciated by those skilled in the art.
The above-listed detailed description is only a specific description of a possible embodiment of the present invention, and they are not intended to limit the scope of the present invention, and equivalent embodiments or modifications made without departing from the technical spirit of the present invention should be included in the scope of the present invention.
Claims (10)
1. The test method of the circuit board is characterized in that the test method is realized by image acquisition equipment capable of acquiring top surface images and bottom surface images of the circuit board; the test method of the circuit board comprises the following steps:
step S101, collecting a top surface sampling image of a sampling circuit board through the image collecting equipment;
step S102, acquiring a plurality of integrated circuit area images of a plurality of integrated circuit parts from the top surface sampling image, acquiring two-dimensional coordinate values corresponding to the plurality of integrated circuit area images and respectively acquiring identification number information of the plurality of integrated circuits;
step S103, removing the integrated circuit area images from the top surface sampling image to obtain a top surface frame image;
step S104, training the top surface frame image through a convolutional neural network to obtain a top surface frame model; respectively training the plurality of integrated circuit area images through a convolutional neural network to obtain a plurality of integrated circuit image models;
step S105, establishing an integrated circuit model library corresponding to the integrated circuit image models according to the identification number information of the integrated circuits;
step S106, the image acquisition equipment acquires a current top surface image of the current circuit board;
step S107, recognizing the current top surface image through the top surface frame model, and acquiring a top surface frame recognition result;
step S108, driving the image acquisition equipment to acquire corresponding current integrated circuit area images according to the two-dimensional coordinate values corresponding to the integrated circuit area images; acquiring a corresponding current integrated circuit model set from the integrated circuit model library according to the pre-stored identification numbers of the current integrated circuits;
step S109, identifying each current integrated circuit in the current integrated circuit model set one by one through the integrated circuit model library to obtain a top surface integrated circuit identification result;
and step S110, obtaining the test result information of the circuit board according to the top surface frame identification result and the top surface integrated circuit identification result.
2. The test method of claim 1, wherein the image capture device has one capture camera;
the step S101 includes:
driving the acquisition camera to move in the acquisition sampling circuit board area according to the set stepping movement direction and the set movement stepping distance to acquire a plurality of sampling images which can be mutually connected;
and splicing the plurality of sampling images into a top surface sampling image according to the set stepping moving direction and the set moving stepping distance.
3. The test method of claim 1, wherein the top surface sample image further comprises a circuit board character identification image;
the step S101 further includes obtaining a character identification image of the circuit board from the top surface sampling image.
4. The testing method of claim 1, wherein the step S110 further comprises:
judging whether the test result information is a set result or not, and if so, generating detection passing information; if not, judging whether the top frame identification result is a set result, if so, generating qualified information of the circuit board part, and if not, generating abnormal information of the circuit board part.
5. The testing method of claim 4, wherein the step S110 is followed by further comprising:
and step S111, displaying the detection passing information, the circuit board part qualified information and the circuit board part abnormal information through a display device.
6. The testing method of claim 1, wherein the step S104 further comprises:
respectively training a plurality of integrated circuit area images to be updated through a convolutional neural network to obtain a plurality of integrated circuit image models to be updated;
the step S105 further includes:
and obtaining the identification number information of the integrated circuits to be updated, and updating the integrated circuit model library corresponding to the image models of the integrated circuits to be updated.
7. A test system of a circuit board is characterized in that the test system is realized by an image acquisition device which can acquire a top surface image and a bottom surface image of the circuit board; the test system of the circuit board comprises:
a top surface sampling image unit configured to acquire a top surface sampling image of a sampling circuit board by the image acquisition device; an integrated circuit image acquisition unit configured to acquire a plurality of integrated circuit region images of a plurality of integrated circuit parts from the top surface sampling image, acquire two-dimensional coordinate values corresponding to the plurality of integrated circuit region images, and acquire identification number information of a plurality of integrated circuits, respectively;
a top surface frame image obtaining unit configured to remove the plurality of integrated circuit region images from the top surface sample image, and obtain a top surface frame image;
an image model obtaining unit configured to train the top surface frame image through a convolutional neural network to obtain a top surface frame model; respectively training the plurality of integrated circuit area images through a convolutional neural network to obtain a plurality of integrated circuit image models;
an integrated circuit model library obtaining unit configured to establish an integrated circuit model library corresponding to the plurality of integrated circuit image models according to the identification number information of the plurality of integrated circuits;
the current image acquisition unit is configured to acquire a current top surface image of a current circuit board by the image acquisition equipment; a top surface frame identification result acquisition unit configured to acquire a top surface frame identification result by identifying the current top surface image by the top surface frame model;
the calling unit is configured to drive the image acquisition equipment to acquire corresponding current integrated circuit area images according to the two-dimensional coordinate values corresponding to the integrated circuit area images; acquiring a corresponding current integrated circuit model set from the integrated circuit model library according to the pre-stored identification numbers of the current integrated circuits;
a top integrated circuit identification result obtaining unit configured to obtain a top integrated circuit identification result by identifying each current integrated circuit in the plurality of current integrated circuit model sets one by one through the integrated circuit model library;
and the test result acquisition unit is configured to acquire the test result information of the circuit board according to the top surface frame identification result and the top surface integrated circuit identification result.
8. The test system of claim 7, wherein the image capture device has one capture camera;
the top surface sampling image unit is also configured to drive the acquisition camera to move in the acquisition sampling circuit board area according to a set stepping moving direction and a set moving stepping distance so as to acquire a plurality of sampling images which can be mutually connected; and splicing the plurality of sampling images into a top surface sampling image according to the set stepping moving direction and the set moving stepping distance.
9. The test system of claim 8, wherein the top surface sample image further comprises a circuit board character identification image; the top surface sampling image unit is also configured to acquire a circuit board character identification image from the top surface sampling image.
10. The test system of claim 7, wherein the top surface sampling image unit is further configured to:
judging whether the test result information is a set result or not, and if so, generating detection passing information; if not, judging whether the top surface frame identification result is a set result or not, if so, generating qualified information of the circuit board part, and if not, generating abnormal information of the circuit board part;
the test system is further configured to: a display unit configured to display the detection passing information, the circuit board part passing information, and the circuit board part abnormality information by a display device.
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| CN201911401895.9A CN111223077A (en) | 2019-12-30 | 2019-12-30 | Test method and test system of circuit board |
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| CN201911401895.9A CN111223077A (en) | 2019-12-30 | 2019-12-30 | Test method and test system of circuit board |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113945830A (en) * | 2021-10-21 | 2022-01-18 | 上海华岭集成电路技术股份有限公司 | Detection method of integrated circuit |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113945830A (en) * | 2021-10-21 | 2022-01-18 | 上海华岭集成电路技术股份有限公司 | Detection method of integrated circuit |
| CN113945830B (en) * | 2021-10-21 | 2024-04-26 | 上海华岭集成电路技术股份有限公司 | Method for detecting integrated circuit |
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