CN110006903A - Printed circuit board rechecks system, marker method and reinspection method - Google Patents

Printed circuit board rechecks system, marker method and reinspection method Download PDF

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Publication number
CN110006903A
CN110006903A CN201810011022.6A CN201810011022A CN110006903A CN 110006903 A CN110006903 A CN 110006903A CN 201810011022 A CN201810011022 A CN 201810011022A CN 110006903 A CN110006903 A CN 110006903A
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CN
China
Prior art keywords
printed circuit
circuit board
image
symbol
rechecks
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
CN201810011022.6A
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Chinese (zh)
Inventor
邱诗彰
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hao Qi Polytron Technologies Inc
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Hao Qi Polytron Technologies Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hao Qi Polytron Technologies Inc filed Critical Hao Qi Polytron Technologies Inc
Priority to CN201810011022.6A priority Critical patent/CN110006903A/en
Publication of CN110006903A publication Critical patent/CN110006903A/en
Pending legal-status Critical Current

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Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/8803Visual inspection
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/8806Specially adapted optical and illumination features
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/8851Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/95Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956Inspecting patterns on the surface of objects
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/8806Specially adapted optical and illumination features
    • G01N2021/8809Adjustment for highlighting flaws
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/8806Specially adapted optical and illumination features
    • G01N2021/8829Shadow projection or structured background, e.g. for deflectometry
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/8851Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8854Grading and classifying of flaws
    • G01N2021/8861Determining coordinates of flaws
    • G01N2021/8864Mapping zones of defects
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/8851Scan or image signal processing specially adapted therefor, e.g. for scan signal adjustment, for detecting different kinds of defects, for compensating for structures, markings, edges
    • G01N2021/8854Grading and classifying of flaws
    • G01N2021/888Marking defects
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/95Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956Inspecting patterns on the surface of objects
    • G01N2021/95638Inspecting patterns on the surface of objects for PCB's

Abstract

A kind of printed circuit board reinspection system, marker method and reinspection method are made of for detecting the defective locations of printed circuit board an arithmetic element, a display unit, a projecting cell and a workbench.Wherein, arithmetic element generates reference coordinate image and plane coordinate system according to the original design image of printed circuit board, the coordinate of plane coordinate system is scaled according to the size of printed circuit board and defective locations and generates symbol, projecting cell is projected out reference coordinate image and symbol towards the printed circuit board being located on workbench, so that the reference coordinate image and the size of printed circuit board that are located on workbench are substantially equal.In this way, staff can directly carry out the reinspection operation of defective locations using symbol, it is more efficiently also more accurate.

Description

Printed circuit board rechecks system, marker method and reinspection method
Technical field
The present invention is related with the defect detecting technique of printed circuit board, specifically refers to that a kind of utilization projection device is assisted Staff carries out reinspection system, marker method and the reinspection method of printed circuit board reinspection operation, and it is multiple to promote printed circuit board Examine the efficiency and correctness of operation.
Background technique
Automatic optical detecting system (AutomaticOptical can be utilized in the manufacturing process of existing printed circuit board Inspection, AOI) it is detected, defect whether there is with machine vision Fast Identification printed circuit board, then examine for AOI It surveys the PCB under-test that result is existing defects manually to be rechecked, it is true lack that confirmation AOI, which detects found defect, The machine for falling into either automatic optical detecting system judges (Artifact) by accident.
The AOI testing result of the PCB under-test and corresponding PCB under-test that need manually to be rechecked, The PCB under-test image that detects comprising AOI compares the data such as difference results image and defective locations and can transmit It stands to reinspection, using the aforementioned comparison difference results image of a display unit simultaneous display, and utilizes PCB under-test figure As the defective locations image of collocation symbol.
Therefore, the staff for rechecking station, which can first observe, compares difference results image, as that can not judge indicated defect Position is real defect or Artifact, then has to take the real product identification of PCB under-test progress, that is, first observe simultaneously The defective locations that memory display unit is indicated find corresponding position on PCB under-test in mobile sight, with judgement Whether defect present in the defective locations is Artifact.When AOI detection judges that PCB under-test has more several defects When, staff must just execute real product identification step repeatedly, confirm one by one to defective locations, and will confirm that be true The sunken defective locations of powerful position are marked.After all defective locations of PCB under-test, which all confirm, to be finished, has and lack The PCB under-test for falling into label can be identified as defective products, otherwise should regard as non-defective unit and send the subsequent work of producing line progress back to Industry.After staff must complete all reinspection steps, reinspection operation could be carried out to another PCB under-test again.
Since staff must carry out observation and memory repeatedly in the real product identification step of reinspection process, in addition to expending Except a large amount of activity duration, it is also possible to have the situation manually judged by accident because of fatigue.Manually rechecking operating efficiency not In the case where evident, current a set of automatic optical detecting system usually may require that 3 to 4 reinspection systems of collocation, so that printed circuit The detection device of plate is significantly increased with human cost.
Summary of the invention
The purpose of the present invention is to provide a kind of printed circuit board reinspection systems and reinspection method, during can be shortened reinspection The number of working processes of real product identification, promotes operating efficiency and correctness.
The present invention provides a kind of printed circuit board reinspection system, for detecting the defective locations of printed circuit board, it includes Have: an arithmetic element, for the electronic equipment with information operation Yu data storage function, according to the original design of printed circuit board Image generates reference coordinate image and plane coordinate system, is scaled plane coordinates according to the size of printed circuit board and defective locations The coordinate of system, and in Coordinate generation symbol;One display unit is electrically connected with arithmetic element and is controlled by arithmetic element And show that one compares difference results image;One projecting cell is electrically connected with arithmetic element and is controlled and throw by arithmetic element Shadow goes out reference coordinate image and symbol;And a workbench, multiply load printed circuit board, receives what projecting cell was projected Reference coordinate image and symbol, the size essence phase of reference coordinate image and printed circuit board on workbench Deng.
Therefore, aforementioned printed circuit board reinspection system is located at the printed circuit board on workbench using projecting cell direction It is projected, the symbol projected can clearly indicate the defective locations of printed circuit board, and staff is allowed not need instead Multiple observation can soon be judged that confirmation defective locations whether there is Artifact with memory.
The present invention also provides a kind of printed circuit boards to recheck marker method, and step includes: according to printed circuit board Original design image generates plane coordinate system and reference coordinate image;Then, according to the size of printed circuit board image and extremely Few defective locations, operation obtain defective locations in the coordinate of plane coordinate system, and generate symbol in corresponding on coordinate;Most Afterwards, reference coordinate image and symbol are projected in printed circuit board, and the size of reference coordinate image and printed circuit board Essence is equal, and symbol is incident upon defective locations.
Aforementioned marker method is that plane coordinate system and reference coordinate image are generated using original design image, therefore can be with It quickly generates accurate as a result, avoiding error from generating simultaneously, so that the symbol projected can accurately be shown in defective bit It sets.
The present invention also provides a kind of printed circuit boards to recheck method, and step includes: printed circuit board is placed in work Make on platform, generates reference coordinate image and an at least symbol, and reference coordinate using reinspection marker method as the aforementioned Image coincide printed circuit board;Observation display unit shown by comparison difference results image and judge printed circuit board whether be Artifact then judges whether the next defect for checking printed circuit board if YES, on the contrary then enter next step;Observation It is projected on the symbol of printed circuit board, judges whether it is Artifact, if NO, is just marked and enters back into next step Suddenly, on the contrary then be just directly entered next step;And judge whether to check next defect, if so, under returning to previous step just One defect recognizes whether again as Artifact, on the contrary then terminate.
In the present invention, reference coordinate image can quickly proofread the actual size and ratio with printed circuit board, in turn Ensure that symbol can be shown in defective locations.Therefore reference coordinate image can be the simple appearance profile of printed circuit board, contracting Short proof time, while determining the correctness of projected symbol.
Detailed description of the invention
Fig. 1 is the system block diagram that embodiment printed circuit board rechecks system.
Fig. 2 is the schematic diagram of projecting cell and workbench in embodiment printed circuit board reinspection system.
Fig. 3 is the projection mark flow chart that embodiment printed circuit board rechecks system.
Fig. 4 is the reinspection operation process chart that embodiment printed circuit board rechecks system.
Description of symbols:
10 arithmetic element, 20 display unit
30 display unit, 40 workbench
41 locating piece A reference coordinate images
B symbol S11~S13 step
S21~S29 step
Specific embodiment
For clear expression specific structure of the invention, technical characteristic and realization technical effect, embodiment presented below is simultaneously Cooperation attached drawing is specifically described.Referring to FIG. 1, the present embodiment is that a printed circuit board rechecks system, there is an arithmetic element 10, a display unit 20, projecting cell 30 and a workbench 40, wherein display unit 20 and projecting cell 30 and arithmetic element 10 are electrically connected and are controlled by it and show or project specific image.
Arithmetic element 10 is the electronic equipment with information operation Yu data storage function, can be in a wired or wireless fashion It is connect with automatic optical detecting system (AOI System), receives PCB under-test figure related with PCB under-test Picture compares difference results image and defective locations, additionally it is possible to store the original design figure of PCB under-test in advance Picture, but not limited to this.
Display unit 20 receives the control of arithmetic element 10 and shows the comparison difference results for corresponding to PCB under-test Image enables operating personnel to observe and recognize and compares whether defect shown on difference results image is evident as machine erroneous judgement (Artifact) otherwise just has to carry out real product identification.
When operating personnel thinks to need to be implemented the identification of real product, arithmetic element 10 can read the original of PCB under-test Designed image generates plane coordinate system along the length direction and width direction of original design image, according to original design image Length and width dimensions generate reference coordinate image A (as shown in Figure 2), according to the size of PCB under-test and defective locations conversion For the coordinate of aforesaid plane coordinate system, and in applying symbol B (as shown in Figure 2) on the coordinate of defective locations.Aforementioned basic The appearance profile (being rectangular in the present embodiment) that image coordinate A can be as original design image.Aforementioned symbol B can be The color lump (such as red spots, color are different from the color of printed circuit board surface) of specific pattern (such as X) or particular color, but simultaneously It is not limited.
It, can be with since arithmetic element 10 is to generate coordinate system and reference coordinate image A according to original design image It quickly generates accurate as a result, avoiding error from generating simultaneously.If using PCB under-test image or comparing difference results Image, will inevitably because automatic optical detecting system itself generated micro using the resolution ratio of image capturing element Error is unfavorable for rechecking the progress of operation.
Projecting cell 30 receive the control of arithmetic element 10 and project aforementioned basic image coordinate A and symbol B at least its One of in workbench 40.It is noted that being projected on the reference coordinate image A and tested printed circuit of workbench 40 The size of plate is substantially equal.Therefore, PCB under-test can be directly placed in workbench 40 and be aligned base by staff Quasi coordinates image A, so that symbol B is correctly projected in the defective locations of PCB under-test.In the present embodiment, when When PCB under-test has multiple defective locations, arithmetic element 10 will control projecting cell 30 and sequentially project symbol One of B, and can sequentially be projected along the sequence of zigzag, to meet the mobile habit of human visual, facilitate Raising efficiency simultaneously reduces fatigue.
In order to facilitate the storing operation of PCB under-test, workbench 40 is equipped with positioning piece 41, in this example For a right angle L-type convex block, facilitates PCB under-test to contact when placing with locating piece 41 and complete positioning.Aforementioned locating piece It is not limited to the convex block of the present embodiment, is also possible to groove or other provides the structure of identical function.
Referring to Fig. 3, the present embodiment printed circuit board reinspection system projection marker method comprise the steps of: first in Step S11 generates plane coordinate system and reference coordinate image A according to the original design image of PCB under-test, then in step Rapid S12 is from PCB under-test image and compares difference results image, obtains the letter such as printed circuit board sizes and defective locations Breath, and then operation obtains each defective locations in the coordinate on aforesaid plane coordinate system, in applying mark on the coordinate of defective locations Symbol B.Step S13 is finally executed, is projected out reference coordinate image A and an at least symbol B using projecting cell 30, and Reference coordinate image A and the size of PCB under-test for being projected on workbench 40 are substantially equal.Tested circuit board at this time On will have symbol B and accurately be incident upon each defective locations, convenient working personnel carry out operation.
When the practical reinspection operation for carrying out printed circuit board, referring to Fig. 4, step S21 is first carried out, corresponding print of taking Printed circuit board is placed on workbench 40, generates reference coordinate image A by projection marker method above-mentioned, and allow benchmark Image coordinate A coincide printed circuit board;Then the comparison difference results image shown in step S22 observation display unit 20, in Step S23 judges whether it is Artifact according to image, picks out Artifact (i.e. machine erroneous judgement) when image can understand, just directly Judge whether to next defect identification (step S27).If can not determine or have doubt (result is no), carry out with that Subsequent reality product identification, that is, execute step S24.
Staff directly observes the symbol B being projected on printed circuit board in step 24, then sentences in step S25 Whether the defective locations where disconnected symbol B are Artifact;If YES, S27 is entered step;If NO, then enter step Rapid S26 is marked in the defective locations where symbol B, just enters step S27 later and decides whether to check next lack It falls into.
If the judging result of step S27 be it is yes, enter step S28 switching display unit and show next defect image, It re-execute the steps S22 again;If NO, then S29 is entered step, carries out subsequent job according to non-defective unit or defective products.Wherein, step S29 is the final process of printed circuit board reinspection.If all confirming by multiple checks, the defective locations of AOI testing result are equal For Artifact, then non-defective unit is regarded as.Conversely, if printed circuit board defective label, is identified as defective products.Non-defective unit can It sends producing line back to and carries out subsequent job, defective products is directly scrapped according to situation, or is moved to repair station and repaired, and reduces loss whereby. It can restart to carry out the reinspection operation of another printed circuit board later.
It in the present invention, is to project to generate symbol in the defective locations of PCB under-test using projection pattern, Operating personnel is set not need to observe and remember repeatedly, reduction personnel are tired and improve operating efficiency and correctness.When tested printing The more, the present invention more can play effect to defect counts on circuit board, substantially shorten working hour, save human cost, and promote life Produce efficiency.

Claims (13)

1. a kind of printed circuit board rechecks system, for detecting an at least defective locations for a printed circuit board, the printed circuit Plate reinspection system includes:
One arithmetic element, for the electronic equipment with information operation Yu data storage function;
One display unit is electrically connected with the arithmetic element and is controlled by the arithmetic element and show that one compares difference results figure Picture;
One projecting cell is electrically connected with the arithmetic element and is controlled by the arithmetic element and be projected out the reference coordinate image With an at least symbol;And
One workbench multiplies and carries the printed circuit board, receive the reference coordinate image that the projecting cell is projected and this at least One symbol;
Wherein, which can generate a plane coordinate system and a base according to an original design image of the printed circuit board Quasi coordinates image is scaled at least the one of the plane coordinate system according to the size of the printed circuit board and an at least defective locations Coordinate, and in an an at least Coordinate generation at least symbol, which can make way for being somebody's turn to do on the workbench Reference coordinate image and the size of the printed circuit board are substantially equal.
2. printed circuit board as described in claim 1 rechecks system, wherein the arithmetic element in a wired or wireless fashion with one from Dynamic Systems for optical inspection connection.
3. printed circuit board as described in claim 1 rechecks system, wherein the arithmetic element stores the original design figure in advance Picture.
4. printed circuit board as described in claim 1 rechecks system, wherein the workbench has positioning piece, which is One convex block or a groove.
5. printed circuit board rechecks system as described in Claims 1-4 any item, wherein the symbol is a specific symbol Number or a color lump.
6. printed circuit board as claimed in claim 5 rechecks system, when wherein the quantity of an at least symbol is multiple It waits, which sequentially projects one of the multiple symbol.
7. a kind of printed circuit board rechecks marker method, step includes:
A plane coordinate system and a reference coordinate image are generated according to an original design image of a printed circuit board;
According to the size of the printed circuit board image and an at least defective locations, operation obtains an at least defective locations in this An at least coordinate for plane coordinate system, and an at least symbol is generated in corresponding on this at least a coordinate;And
The reference coordinate image and an at least symbol are projected in the printed circuit board, and the reference coordinate image with should The size of printed circuit board is substantially equal, which is incident upon an at least defective locations.
8. printed circuit board as claimed in claim 7 rechecks marker method, wherein the quantity of an at least symbol is multiple When, sequentially project one of the multiple symbol.
9. printed circuit board as claimed in claim 8 rechecks marker method, wherein the multiple symbol is along the suitable of zigzag Sequence is sequentially projected.
10. printed circuit board as claimed in claim 7 rechecks marker method, wherein an at least symbol is a special symbol An or color lump.
11. printed circuit board as claimed in claim 7 rechecks marker method, wherein the plane coordinate system is along the original design One length direction of image is generated with a width direction, which is the appearance profile of the original design image.
12. a kind of printed circuit board rechecks method, step includes:
One printed circuit board is placed on a workbench, generates one using reinspection marker method as claimed in claim 6 Reference coordinate image and an at least symbol, and the reference coordinate image coincide the printed circuit board;
It observes a comparison difference results image shown by a display unit and judges whether the printed circuit board is Artifact, such as Fruit be it is yes, then judge whether the next defect for checking the printed circuit board, it is on the contrary then enter next step;
Observation is projected on an at least symbol for the printed circuit board, judges whether it is Artifact, if NO, with regard to carrying out Label enters back into next step, on the contrary then be just directly entered next step;And
Judge whether to check next defect, next defect recognized whether again as Artifact if so, returning to previous step, It is on the contrary then terminate.
13. printed circuit board reinspection method as claimed in claim 12 switches the display list when next defect is checked in judgement Member shows the image of next defect.
CN201810011022.6A 2018-01-05 2018-01-05 Printed circuit board rechecks system, marker method and reinspection method Pending CN110006903A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN201810011022.6A CN110006903A (en) 2018-01-05 2018-01-05 Printed circuit board rechecks system, marker method and reinspection method

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Application Number Priority Date Filing Date Title
CN201810011022.6A CN110006903A (en) 2018-01-05 2018-01-05 Printed circuit board rechecks system, marker method and reinspection method

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Publication Number Publication Date
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Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110579479A (en) * 2019-08-09 2019-12-17 康代影像科技(苏州)有限公司 PCB maintenance system and maintenance method based on false point defect detection
CN113805365A (en) * 2020-06-16 2021-12-17 艾聚达信息技术(苏州)有限公司 Marking apparatus and defect marking method
WO2022104585A1 (en) * 2020-11-18 2022-05-27 苏州康代智能科技股份有限公司 Remote optical inspection and maintenance method and system for printed circuit board

Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09264727A (en) * 1996-03-27 1997-10-07 Adomon Sci Kk Inspecting instrument
JP2002267620A (en) * 2001-03-09 2002-09-18 Hitachi Kokusai Electric Inc Apparatus for visually examining plate-shaped object
CN1677118A (en) * 2004-03-31 2005-10-05 安立株式会社 Printed circuit board checking device
TW201009326A (en) * 2007-03-29 2010-03-01 Camtek Ltd Method and system for verifying suspected defects of a printed circuit board
CN102331429A (en) * 2010-07-13 2012-01-25 奥林巴斯株式会社 Substrate inspection device and substrate inspection method
CN102339334A (en) * 2010-07-14 2012-02-01 英业达股份有限公司 Method for preventing wrong marking of polarity of element
CN103389308A (en) * 2012-05-11 2013-11-13 牧德科技股份有限公司 Optical reinspection system and detection method thereof
CN104777176A (en) * 2015-03-25 2015-07-15 广州视源电子科技股份有限公司 PCB detection method and apparatus thereof
US20160238381A1 (en) * 2015-02-17 2016-08-18 National Sun Yat-Sen University System for measuring three-dimensional profile of transparent object or refractive index by fringe projection
TWI585398B (en) * 2016-06-08 2017-06-01 Projection-type printed circuit board re-inspection system and methods, and marking the location of the defect
CN206411034U (en) * 2017-01-17 2017-08-15 广州市福邑连发光学科技有限公司 A kind of detection device of mobile phone glass piece
CN207717640U (en) * 2018-01-05 2018-08-10 皓琪科技股份有限公司 Printed circuit board rechecks system

Patent Citations (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH09264727A (en) * 1996-03-27 1997-10-07 Adomon Sci Kk Inspecting instrument
JP2002267620A (en) * 2001-03-09 2002-09-18 Hitachi Kokusai Electric Inc Apparatus for visually examining plate-shaped object
CN1677118A (en) * 2004-03-31 2005-10-05 安立株式会社 Printed circuit board checking device
TW201009326A (en) * 2007-03-29 2010-03-01 Camtek Ltd Method and system for verifying suspected defects of a printed circuit board
CN102331429A (en) * 2010-07-13 2012-01-25 奥林巴斯株式会社 Substrate inspection device and substrate inspection method
CN102339334A (en) * 2010-07-14 2012-02-01 英业达股份有限公司 Method for preventing wrong marking of polarity of element
CN103389308A (en) * 2012-05-11 2013-11-13 牧德科技股份有限公司 Optical reinspection system and detection method thereof
US20160238381A1 (en) * 2015-02-17 2016-08-18 National Sun Yat-Sen University System for measuring three-dimensional profile of transparent object or refractive index by fringe projection
CN104777176A (en) * 2015-03-25 2015-07-15 广州视源电子科技股份有限公司 PCB detection method and apparatus thereof
TWI585398B (en) * 2016-06-08 2017-06-01 Projection-type printed circuit board re-inspection system and methods, and marking the location of the defect
CN206411034U (en) * 2017-01-17 2017-08-15 广州市福邑连发光学科技有限公司 A kind of detection device of mobile phone glass piece
CN207717640U (en) * 2018-01-05 2018-08-10 皓琪科技股份有限公司 Printed circuit board rechecks system

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN110579479A (en) * 2019-08-09 2019-12-17 康代影像科技(苏州)有限公司 PCB maintenance system and maintenance method based on false point defect detection
WO2021027184A1 (en) * 2019-08-09 2021-02-18 苏州康代智能科技股份有限公司 Pcb maintenance system and maintenance method based on false point defect detection
CN113805365A (en) * 2020-06-16 2021-12-17 艾聚达信息技术(苏州)有限公司 Marking apparatus and defect marking method
WO2022104585A1 (en) * 2020-11-18 2022-05-27 苏州康代智能科技股份有限公司 Remote optical inspection and maintenance method and system for printed circuit board

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