CN110763703A - Projection type system for assisting printed circuit board in quick positioning, fixed-point amplification and observation - Google Patents
Projection type system for assisting printed circuit board in quick positioning, fixed-point amplification and observation Download PDFInfo
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- CN110763703A CN110763703A CN201810844495.4A CN201810844495A CN110763703A CN 110763703 A CN110763703 A CN 110763703A CN 201810844495 A CN201810844495 A CN 201810844495A CN 110763703 A CN110763703 A CN 110763703A
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N21/95607—Inspecting patterns on the surface of objects using a comparative method
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
- G01N2021/95638—Inspecting patterns on the surface of objects for PCB's
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- General Physics & Mathematics (AREA)
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- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
Abstract
A projection system for assisting printed circuit board to quickly position, fix a point and magnify and observe comprises a working platform for placing the printed circuit board; an observation unit for magnifying and observing suspected defect positions of the printed circuit board; a receiving unit for receiving the detection information obtained by the automatic optical detection system in the manufacturing process of the printed circuit board; the display unit displays the comparison difference result image; the computing unit computes and converts, calculates a coordinate message according to the size of the printed circuit board and the suspected defect position, and corrects the coordinate message according to the offset value; the projection unit receives the coordinate information, and projects a marking image on the working platform in a side projection mode by avoiding the observation unit, wherein the marking image comprises a positioning image and a marking symbol, the marking symbol is imaged under the observation unit, and the positioning image is used for enabling the printed circuit board to be close to and matched with the positioning image; the operator moves the position of the printed circuit board to be matched with the positioning image, and the observation unit sees the image of the suspected defect position so as to judge the subsequent rechecking operation.
Description
Technical Field
The invention relates to the technical field of printed circuit board rechecking operation, in particular to a method for displaying a mark symbol on a printed circuit board by using a projection mode so that an operator can observe and judge the correctness of a suspected defect position by an observation unit with a fixed position.
Background
In the electronic industry, electronic components such as printed circuit boards are inspected by an Automated Optical Inspection (AOI) system during the manufacturing process to detect suspected defects on the surface of the printed circuit board. And then, the good products continue to carry out subsequent detection operation, the defective products with suspected defects and related detection results are transmitted to a re-detection station, and operators of the re-detection station enlarge and identify the defective products and the related detection results by using an optical microscope or an electronic microscope to confirm whether the detection results are real defects or misjudgments of the automatic optical detection system.
The inventor of the present invention has applied for the system and method for rechecking a projection printed circuit board and the method for marking the position of a defect in the invention No. I585398 in the past, which displays a mark on the printed circuit board by projection so that the operator can quickly find the position of a suspected defect on the printed circuit board and visually check the correctness of the suspected defect with human eyes. However, since the size of the defect on some high-level printed circuit boards is very small, the operator must assist the optical microscope or the electron microscope to observe right above the suspected defect position to clearly see the suspected defect, which will block the forward projection operation of the projection unit of the prior invention, so that if the review operation of the optical microscope or the electron microscope is needed, the method of the prior invention cannot be applied, and the inventor thinks to design a corresponding improved system.
Disclosure of Invention
The invention mainly aims to provide a projection type system for assisting a printed circuit board in quick positioning and fixed point magnifying observation, which is mainly characterized in that at least one projection unit is arranged around a fixed observation unit, the observation unit can be an optical microscope or an electronic microscope, the projection unit is used for avoiding the observation unit in a side projection mode, suspected defect positions are displayed on the printed circuit board, and an operator is assisted to easily and quickly identify the correctness of suspected defects on the printed circuit board in a rechecking procedure, so that the detection working hour is shortened, the efficiency of production rate is improved, and the expenditure cost of manpower and equipment can be reduced.
To achieve the above object, the projection system for assisting the quick positioning, fixed point magnifying observation of the printed circuit board of the present invention comprises: a working platform for placing a printed circuit board thereon; the observation unit is positioned right above the working platform and can observe the suspected defect position of the printed circuit board in an amplifying way; a receiving unit for receiving information, wherein the information is an original design image, a printed circuit board image to be detected, a comparison difference result image and suspected defect position data, which are obtained by detecting the printed circuit board by using an automatic optical detection system in the manufacturing process; a display unit connected with the receiving unit for displaying the comparison difference result image; an arithmetic unit connected to the display unit for converting the pixel unit to the size unit, converting the size unit to the projection unit, calculating a coordinate information according to the size of the printed circuit board and the suspected defect position data, and correcting the coordinate information according to an offset value; the projection unit is connected with the arithmetic unit and is offset by an angle, the projection unit receives the coordinate information and projects a marking image on the working platform in a side projection mode, the marking image comprises at least one positioning image and a marking symbol, the projected marking symbol is imaged under the observation unit, and the positioning image is used for correspondingly positioning the printed circuit board and the positioning image.
In an embodiment of the invention, the indication image further includes a reference correction image, the reference correction image corresponds to the size of the printed circuit board, is a simple outline of the printed circuit board, or is the length of the X and Y coordinates of the printed circuit board, the reference correction image can be projected during the initial correction, and cooperates with the inclined image generated by the projection unit in the side projection mode to perform the "trapezoidal correction" to correct the original inclined image to the square shape. The "ladder correction" can be calculated by the computing unit, or some projection units can have the function to perform correction adjustment. Allowing the operator to confirm the projected size and position with correct ratio by matching the reference calibration image with the printed circuit board; the correction operation can further correct and move the relative position of the observation unit and the projection unit, so that the mark symbol is positioned right below the observation unit.
The positioning image is used for the close positioning of the printed circuit board, so as to conveniently and rapidly identify whether the printed circuit board is at the correct position; the positioning image can be a simple L shape, which is convenient for the printed circuit board to approach with a specific corner to make the printed circuit board and the positioning image inosculate, or a specific notch shape of the printed circuit board, so as to carry out approaching, inosculating and positioning procedures. The positioning image can use a color different from the colors of the working platform and the surface of the printed circuit board, so that an operator can easily identify whether the positioning image is aligned.
The mark symbol is used to preliminarily display the symbol of the suspected defect position, so that an operator can conveniently observe the symbol by the observation unit, the mark symbol is a simple symbol or a block with a specific color, and the block with the specific color comprises a red dot or a dot with a color different from that of the surface of the printed circuit board, but not limited thereto.
In an embodiment of the present invention, the offset value is a direction and a distance of the suspected defect position from a reference point directly below the observation unit, so that the coordinate information is corrected to allow the sub-projection and the mark symbol to be imaged on the working platform directly below the observation unit.
In an embodiment of the present invention, the projection unit has a plurality of projection units, the arithmetic unit outputs different coordinate information according to the projection unit at different positions after arithmetic operation, each projection unit projects a mark image on the working platform, the mark image includes the positioning image and the mark symbol, the mark symbols are overlapped together, and the positioning images form a plurality of positioning points for the printed circuit board to be matched with.
Drawings
FIG. 1 is a block diagram of a projection system for assisting printed circuit boards in fast positioning, fixed point magnification observation according to a first embodiment of the present invention;
FIG. 2 is a schematic diagram of a projection system for assisting printed circuit board quick positioning, fixed point magnification observation according to a first embodiment of the present invention;
FIG. 3 is a schematic diagram of a first embodiment of a projection system for assisting PCB positioning, fixed-point magnification and observation according to the present invention;
FIG. 4A is a schematic diagram of a position of a marking image projected on a working platform according to the present invention before a coordinate message is not corrected;
FIG. 4B is a schematic diagram of the position of the coordinate information of the invention after being corrected, projected on the working platform to form a mark image;
FIG. 5 is a flowchart illustrating a review operation performed by the first embodiment of the projection system for assisting printed circuit board quick positioning, fixed point magnification observation according to the present invention;
FIG. 6 is a diagram of a projection system for supporting fast positioning, fixed point magnification viewing of a printed circuit board according to a second embodiment of the present invention.
Description of reference numerals:
11-working platform, 12-observation unit, 13-receiving unit, 14-display unit, 15-arithmetic unit, 16-projection unit, 16A-projection unit, 16B-projection unit, 20-marking image, 21-positioning image, 22-marking symbol, 23-benchmark correction image, A-printed circuit board and L-offset value.
Detailed Description
The embodiments of the present invention will be described in more detail with reference to the drawings and the reference numerals, so that those skilled in the art can implement the embodiments after reading the description.
Fig. 1 and 2 are block diagrams and schematic diagrams of a projection system for assisting a printed circuit board to perform fast positioning, fixed-point magnifying observation according to the present invention. The projection system of the present invention includes a working platform 11, an observation unit 12, a receiving unit 13, a display unit 14, a computing unit 15 and a projection unit 16. The invention adopts the side projection mode to avoid the observation unit 12 by the projection unit 16, a mark image 20 is displayed on the working platform 1, the mark image 20 comprises at least a positioning image 21 and a mark symbol 22, wherein the mark symbol 22 must be positioned under the observation unit 12, a printed circuit board A (shown by a phantom line in the figure) is moved and matched with the positioning image 21 when the reinspection operation is carried out, the mark symbol 22 is displayed at the suspected defect position of the printed circuit board, and an operator magnifies and observes the suspected defect position by the observation unit 12 so as to quickly identify and confirm the correctness of the defect.
The working platform 11 is used for placing a printed circuit board a thereon, so that the projection unit 16 projects the indication image 20 on the upper surface of the working platform 11. The size of the working platform 11 is sufficient to adjust the defect positions of the carried printed circuit board a to be within the observation area of the observation unit 12.
The observation unit 12 is used for magnifying and observing the printed circuit board a, in the embodiment, the observation unit 12 may be one of an optical microscope and an electron microscope (schematically shown in the figure in a simple manner), and can clearly observe the image of the suspected defect position in a high-magnification manner to determine whether the position is correct or not. The observation unit 12 is fixed directly above the work table 11.
The receiving unit 13 is used for receiving the information, which is the original design image, the printed circuit board image to be tested, the comparison difference result image, the suspected defect position data, etc. obtained by the detection of the printed circuit board a by the automatic optical detection system in the manufacturing process. The receiving unit 13 may be a storage unit within a computer.
The display unit 14 is connected to the receiving unit 13, and the display unit 14 can display the comparison difference result image; the display unit 14 is used for the operator to observe and identify whether the suspected defect of the printed circuit board a is correct or not, and whether further confirmation and identification are needed or not. The display unit 14 may be a display screen.
The computing unit 15, which is connected to the display unit 14, converts the pixel unit to the size unit according to the received original design image, the to-be-tested printed circuit board image, the comparison difference result image, and the suspected defect position data, and calculates a coordinate information according to the size of the printed circuit board a and the suspected defect position data, and corrects the coordinate information according to an offset value, wherein the offset value is the direction and distance of the suspected defect position from the reference point in the observation area under the observation unit 12, so that the mark symbol 22 is displayed under the observation unit 12 during each subsequent projection, and the position of the positioning image 21 changes accordingly; the operation portion can be generated by executing a computer program.
The projection unit 16 is connected to the operation unit 15 and located around the observation unit 12, i.e. the projection direction of the projection unit 16 is not perpendicular to the working platform 1, but is offset by an angle to avoid the projection unit 16. The projection unit 16 projects a mark image 20 on the working platform 11 by side projection according to the received coordinate information, and performs a "ladder correction" in the correction process to correct the original tilted image back to the square state. The indication image 20 includes the positioning image 21 and the indication symbol 22, wherein the indication symbol 22 projected must be imaged on the working platform 11 directly below the observation unit 12. The positioning image 21 is used for the close positioning of the printed circuit board a, so as to conveniently and rapidly identify whether the printed circuit board a is in the correct position, the positioning image 21 can be in a simple L shape, so that the printed circuit board a can be conveniently closed by a specific corner to enable the printed circuit board to be matched with the positioning image, or the positioning image 21 is in a specific notch shape of the printed circuit board a, so as to carry out the closing, matching and positioning procedures, and the positioning image 21 can use different colors from the surface of the working platform 11 and the printed circuit board a, so that an operator can easily identify whether the printed circuit board a is aligned. The indication symbol 22 is used to preliminarily display the suspected defect position for the operator to observe by the observation unit 12, the indication symbol 22 is a simple symbol or a block with a specific color, and the block with the specific color includes a red dot or a dot with a color different from that of the surface of the printed circuit board.
After the projection unit 16 projects the indication image 20, the operator moves the pcb a placed on the working platform 11 horizontally to make the pcb a fit with the positioning image 21, so that the operator can observe the suspected defect position of the pcb a through the observation unit 12 in an enlarged manner.
As shown in fig. 3, the indication image 20 further includes a reference correction image 23, wherein the reference correction image 23 corresponds to the size of the printed circuit board a, and is a simple outline of the printed circuit board a or X and Y coordinate lengths (shown as thick straight lines in fig. 3) of the printed circuit board a. The reference corrected image 23 can be projected during the initial correction, and the tilted image generated by the projection unit 16 by the side projection method is used to perform a "ladder correction" to correct the original tilted image back to the square state. The "ladder correction" can be calculated by the computing unit 15, or some projection units 16 can have this function inside to perform correction adjustment. Allowing the operator to confirm the projected size and position with correct ratio by matching the reference calibration image 23 with the printed circuit board A; in addition, during the calibration operation, the relative position of the observation unit 12 or the projection unit 16 can be further corrected and moved so that the indication symbol 22 is positioned directly below the observation unit 12.
As shown in fig. 4A and 4B, in the design of the present invention, the arithmetic unit 15 calculates a coordinate information according to the size of the pcb a and the suspected defect position data, and corrects the finally outputted coordinate information according to an offset value L, where the offset value L is the direction and distance of the suspected defect position from the reference point in the observation area right below the observation unit 12, so that the marking image 20 shown in fig. 4A may be originally projected, and after being corrected, the marking image 22 is projected in the state shown in fig. 4B, and the marking image 22 is right below the observation unit 12, and after the user aligns the pcb a with the positioning image 21, the defect position of the pcb a can be ensured to be right below the observation unit 12.
Fig. 5 is a flow chart of a review operation performed by the projection system for assisting the pcb in fast positioning, fixed-point magnifying observation according to the present invention. In the present invention, under the observation unit 12 with a fixed position, the projection unit 16 projects the marking image 20 on the working platform 11, and the observation unit 12 can magnify and observe the image of the suspected defect position by moving the printed circuit board a to fit the positioning image 21, thereby rapidly performing the re-inspection operation. The operation flow of the reinspection operation comprises the following steps:
301, taking a corresponding printed circuit board and placing the printed circuit board on a working platform;
304, projecting a marking image on the working platform by the projection unit in a side projection mode, wherein the marking symbol is imaged under the observation unit;
in step 311, a subsequent operation is performed according to the good or bad products, which is the final process of the re-inspection of the printed circuit board. If the printed circuit board is checked for multiple times and is determined to be a false defect, the printed circuit board is determined to be a good product, if the printed circuit board has a defective mark, the printed circuit board is determined to be a defective product, the good product can be sent back to a production line for subsequent operation, and the defective product is directly scrapped according to the condition or is moved to a repair station for repair, so that the loss is reduced. After that, the re-inspection operation of another printed circuit board can be restarted.
In the above embodiment, in order to avoid the interference of the projected images, the projection unit 16 projects the indication image 20 by side projection, and although the indication symbol 22 is not interfered, the positioning image 21 is still interfered and blocked due to the low height of the observation unit 12, so that the positioning image 21 forms a defective image.
In the above situation, some operators still want to provide a complete positioning image, so that the operators are more convenient and reassuring when the printed circuit board a is completely fitted into the positioning image 21, and therefore the present invention provides a second embodiment, as shown in fig. 6, which is a schematic diagram of the second embodiment of the present invention. In the second embodiment, the projection system of the present invention still includes a working platform 11, an observation unit 12, a receiving unit 13, a display unit 14, a computing unit 15, and a plurality of projection units 16A and 16B. In the present embodiment, there are two projection units 16A and 16B, which are respectively located at the left and right sides of the observation unit 12. The operation unit 15 provides different coordinate information according to different projection units 16A and 16B, the projection units 16A and 16B project the indication images 20 with the same position and shape on the working platform 11, and the indication symbols 22 are completely overlapped, if the positioning image 21 projected from left to right interferes with the observation unit 12 to form a defective image, the defective part can be complemented by the positioning image 21 projected from right to left, thereby forming a complete positioning image 21, and the operator can move the printed circuit board a to make the printed circuit board a fit in the approaching, matching and positioning operations of the positioning image 21, which is more convenient and safe.
In summary, the present invention forms the marking image 20 on the working platform 11 in a side-projection manner under the observation unit 12 with a fixed position, and then moves the printed circuit board a to coincide with the positioning image 21 each time, so that the operator can conveniently use the observation unit 12 to enlarge and observe the position of the suspected defect position, and the operator can quickly judge the correctness of the suspected defect.
The foregoing is illustrative of the preferred embodiment of the present invention and is not to be construed as limiting thereof, since any modification and variation of the present invention disclosed herein may be made within the spirit and scope of the invention.
Claims (7)
1. A projective system for assisting printed circuit board in rapidly positioning, pointing, magnifying and viewing, the projective system comprising:
a working platform for placing the printed circuit board thereon;
the observation unit is positioned right above the working platform and can observe the suspected defect position of the printed circuit board in an amplifying way;
a receiving unit for receiving information, wherein the information is an original design image, a printed circuit board image to be detected, a comparison difference result image and suspected defect position data, which are obtained by detecting the printed circuit board by using an automatic optical detection system in the manufacturing process;
a display unit connected with the receiving unit for displaying the comparison difference result image;
an arithmetic unit connected to the display unit for converting the pixel unit to the size unit, converting the size unit to the projection unit, calculating a coordinate message according to the size of the printed circuit board and the suspected defect position data, and correcting the coordinate message according to an offset value;
the projection unit receives the coordinate information and projects a marking image on the working platform in a side projection mode, the marking image comprises at least one positioning image and a marking symbol, the marking symbol is required to be imaged under the observation unit, the positioning image is used for correspondingly positioning the printed circuit board and the positioning image, an operator can move the printed circuit board to enable the printed circuit board to be matched with the positioning image, and the operator can clearly see the image of the suspected defect position through the observation unit.
2. The projection system of claim 1, wherein the positioning image is a simple L-shape or a specific notch shape of the PCB to allow the PCB to be approached, matched and positioned.
3. The projection system of claim 1, wherein the symbol is a simple symbol or a block of at least one specific color, the color being different from the color of the surface of the printed circuit board.
4. The projection system of claim 1, wherein the offset is a direction and distance that the suspected defect location is offset directly below the viewing unit.
5. The projection system of claim 1, wherein the projection units have a plurality of positioning points, the computing unit outputs different coordinate information according to the projection units at different positions after computing, each projection unit projects a mark image on the working platform, and the positioning images form a plurality of positioning points for the printed circuit board to fit with.
6. The projection system of claim 5, wherein a plurality of said symbols are projected by a plurality of said projection units, and said symbols are overlapped.
7. The projective system of claim 1, wherein the observation unit is at least one of an optical microscope or an electron microscope.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810844495.4A CN110763703A (en) | 2018-07-27 | 2018-07-27 | Projection type system for assisting printed circuit board in quick positioning, fixed-point amplification and observation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810844495.4A CN110763703A (en) | 2018-07-27 | 2018-07-27 | Projection type system for assisting printed circuit board in quick positioning, fixed-point amplification and observation |
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| CN110763703A true CN110763703A (en) | 2020-02-07 |
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| CN201810844495.4A Pending CN110763703A (en) | 2018-07-27 | 2018-07-27 | Projection type system for assisting printed circuit board in quick positioning, fixed-point amplification and observation |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116967615A (en) * | 2023-07-31 | 2023-10-31 | 上海感图网络科技有限公司 | Circuit board reinspection marking method, device, equipment and storage medium |
| CN117147570A (en) * | 2023-10-30 | 2023-12-01 | 深圳硬之城信息技术有限公司 | Manufacturing control method, device, equipment and storage medium based on machine vision |
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| CN117147570A (en) * | 2023-10-30 | 2023-12-01 | 深圳硬之城信息技术有限公司 | Manufacturing control method, device, equipment and storage medium based on machine vision |
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Application publication date: 20200207 |