CN116967615B - Circuit board reinspection marking method, device, equipment and storage medium - Google Patents
Circuit board reinspection marking method, device, equipment and storage medium Download PDFInfo
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- 238000000034 method Methods 0.000 title claims abstract description 57
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- 238000002372 labelling Methods 0.000 claims description 14
- 238000007689 inspection Methods 0.000 claims description 12
- 238000013102 re-test Methods 0.000 claims description 6
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- 238000004590 computer program Methods 0.000 description 2
- 238000012790 confirmation Methods 0.000 description 2
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- 238000010330 laser marking Methods 0.000 description 2
- 238000004806 packaging method and process Methods 0.000 description 2
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/362—Laser etching
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- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
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Abstract
The application discloses a circuit board reinspection marking method, device, equipment and storage medium, which relate to the field of image chip detection and comprise the steps of displaying a reinspection marking interface, wherein the interface comprises a panoramic material display area and a real-time marking area; the panoramic material display area displays a panoramic material image which is scanned by a scanning camera and transmitted back, and the real-time marking area displays a defective pcs particle image which needs marking in real time; in response to receiving a marking instruction for the target pcs particle image, positioning target pcs particles and marking display in the panoramic material map; and controlling the marking machine to move to the position of the target pcs particle based on the marked target pcs particle image to perform marking operation, and displaying marking pictures in the real-time marking area. The matched display of the marked panoramic material graph and the real-time marking area is contrasted, so that an operator can conveniently and rapidly and accurately execute the marking, the marking efficiency can be improved, and the product yield can be improved.
Description
Technical Field
The embodiment of the application relates to the field of semiconductor detection, in particular to a circuit board reinspection marking method, device and equipment and a storage medium.
Background
In the semiconductor chip production process, a strip material board needs to be stamped on a PCB, and a plurality of pcs particles are distributed on the material board, wherein the region comprises a plurality of electronic components. However, due to the influence of the production process, the machine precision, external factors and the like, flaws, blemishes, defects and the like are inevitably generated in the punching production process of the pcs particles, so that the defective points need to be identified and screened.
The traditional defect detection is based on machine image recognition or manual rechecking, the defect position is required to be marked after rechecking, and the packaging treatment is not carried out in the subsequent wafer process, so that the defect chips are prevented from flowing into a production line to influence the yield. In the related art, the defect is often stored and marked after being identified by a machine, but due to complex production line linkage and operation flow, a defective chip and a normal chip are inevitably produced in a mixed mode in a subsequent process and cannot be identified; the mode of adopting manual marking processing can guarantee the yields to a certain extent, but the cost of labor that manual marking produced is higher, and efficiency can be influenced.
Disclosure of Invention
The embodiment of the application provides a circuit board reinspection marking method, device, equipment and storage medium, which solve the problem of low efficiency of manual reinspection marking.
In one aspect, the present application provides a circuit board review marking method, the method including:
displaying a reinspection marking interface, wherein the reinspection marking interface comprises a panoramic material display area and a real-time marking area; the panoramic material display area is used for displaying a panoramic material image which is scanned by the scanning camera and transmitted back, the panoramic material image comprises a plurality of pcs particles, the real-time marking area is used for displaying a pcs particle image which needs marking in real time, and the pcs particle image corresponds to the defective pcs particles on the material substrate;
responding to a marking instruction of a target pcs particle image, positioning the corresponding target pcs particles in the panoramic material image, and displaying marks;
and controlling a marking machine to move to the position of the target pcs particle based on the marked target pcs particle image to execute marking operation, and displaying marking pictures in the real-time marking area.
Further, the reinspection marking interface is provided with a manual marking control, and the manual marking control is used for controlling reinspection marking modes, including a reinspection mode and a marking mode;
responding to receiving a reinspection switching instruction of the manual marking control, and directly controlling a marking machine and a line scanning camera to switch a next material substrate to execute reinspection operation after finishing reinspection operation of the material substrate;
and responding to the received marking switching instruction of the manual marking control, entering a manual marking mode after finishing the reinspection operation of the material substrate, and performing marking operation based on the marking instruction of the target pcs particles.
Further, in response to completion of the rechecking operation on the material substrate, constructing a defect image list based on the defect image set identified and intercepted from the panoramic material map, and displaying the defect image list on the rechecking marking interface; one defect image corresponds to one defect pcs particle;
and in response to receiving a selection operation of a target defect image in the defect image list, determining the target pcs particles to be marked, and executing marking operation on the target pcs particles based on a marking instruction.
Further, the defect image list further comprises marking position labels, and the marking position labels and the defect images are stored in an associated mode; the marking positioning label comprises an image coordinate and a pcs number of each defect image in the panoramic material map;
determining the target pcs particles and marking instructions for the target pcs particle images based on the pcs number in response to receiving the selection operation for the target defect images;
and positioning and labeling display are carried out in the panoramic material map according to the image coordinates.
Further, the marking is performed by controlling the marking machine to move to the position of the target pcs particle based on the marked target pcs particle, including:
establishing a coordinate system based on the position relation between the marking machine and the material substrate;
calculating the position coordinates of the target pcs particles on the material substrate according to the position relation of the target pcs particle image relative to the panoramic material image;
and controlling the marking machine to move to the position coordinates of the target pcs particles to perform marking operation, and collecting real-time images of the target pcs particles.
Further, the defect image set comprises front and back defect images of the pcs particles, the defect images in the defect image list are arranged according to the number sequence of the pcs, and back marking is performed after one board marking is completed; the reinspection marking is also provided with a marking control which is used for controlling the marking process;
after the target pcs particles on the material substrate are positioned, responding to the click operation of the marking control, starting to etch the unqualified marks on the target pcs particles, and displaying marking pictures in the real-time marking area.
Further, merging the defect images with the same pcs numbers in the defect image set after the recheck, and reserving only one defect image with the same pcs numbers in the defect image list;
after the target pcs particles on the material substrate are positioned, the target pcs particles are directly subjected to marking breakdown in response to the click operation of the marking control, and pictures are displayed in the real-time marking area.
In another aspect, the present application provides a circuit board review marking device, the device comprising:
the first display module is used for displaying a reinspection marking interface, and the reinspection marking interface comprises a panoramic material display area and a real-time marking area; the panoramic material display area is used for displaying a panoramic material image which is scanned by the scanning camera and transmitted back, the panoramic material image comprises a plurality of pcs particles, the real-time marking area is used for displaying a pcs particle image which needs marking in real time, and the pcs particle image corresponds to the defective pcs particles on the material substrate;
the second labeling display module is used for responding to the received labeling instruction of the target pcs particle image, positioning the corresponding target pcs particles in the panoramic material diagram and displaying the labeling;
and the third display module is used for controlling the marking machine to move to the position of the target pcs particle based on the marked target pcs particle image to execute marking operation, and displaying marking pictures in the real-time marking area.
In yet another aspect, the application provides a computer device, where the computer device includes a processor and a memory, where at least one instruction, at least one program, a code set, or an instruction set is stored in the memory, where the at least one instruction, the at least one program, the code set, or the instruction set is loaded and executed by the processor to implement the circuit board review marking method described in the foregoing aspect.
In yet another aspect, the present application provides a computer readable storage medium having stored therein at least one instruction, at least one program, a code set, or an instruction set, where the at least one instruction, the at least one program, the code set, or the instruction set is loaded and executed by a processor to implement the circuit board review marking method described in the above aspect.
The beneficial effects that technical scheme that this application embodiment provided include at least: the semiconductor chip production process uses a reinspection marking system, after reinspection determining the defect pcs particles is completed, a panoramic material display area and a real-time marking area are arranged on a reinspection marking interface, and a panoramic image of a complete material substrate scanned by a line scanning camera is displayed through the panoramic material display area. When the marking task is executed, marking and displaying the target pcs particle image to be marked in the panoramic material image, the defect position can be intuitively known, the setting of the real-time marking area is fine-grained to the marking picture, the marking picture of the target pcs is displayed in real time, and the defect and marking content are checked. The two display areas are matched for display to form contrast, so that an operator can conveniently and rapidly execute the marking process, marking efficiency can be improved, and product yield can be improved.
Drawings
Fig. 1 is a schematic view of a circuit board re-inspection marking system according to an embodiment of the present application;
fig. 2 is a flowchart of a circuit board reinspection marking method provided in an embodiment of the present application;
FIG. 3 is a schematic illustration of one possible review marking interface;
FIG. 4 is an interface schematic diagram of a marking display in a panoramic material display area and a marking screen in a real-time marking area;
FIG. 5 is an interface diagram of a pop-up confirmation box after switching the marking mode and completing the review;
FIG. 6 is an interface schematic diagram showing a list of defect images at a review mark interface;
fig. 7 shows a block diagram of a circuit board re-inspection marking device according to an embodiment of the present application;
fig. 8 shows a block diagram of a computer device according to an exemplary embodiment of the present application.
Detailed Description
For the purpose of making the objects, technical solutions and advantages of the present application more apparent, the embodiments of the present application will be described in further detail below with reference to the accompanying drawings.
References herein to "a plurality" means two or more. "and/or", describes an association relationship of an association object, and indicates that there may be three relationships, for example, a and/or B, and may indicate: a exists alone, A and B exist together, and B exists alone. The character "/" generally indicates that the context-dependent object is an "or" relationship.
Fig. 1 is a schematic view of a circuit board re-inspection marking system according to an embodiment of the present application, where the system includes a computer device for controlling re-inspection marking, a line scanning camera, and a marking machine. Alternatively, the marking machine and the line scan camera may be an all-in-one device. The line scanning camera part is responsible for scanning the material substrate to obtain a panoramic material image, namely the front and back images of the whole substrate, and the panoramic material image is transmitted to the computer equipment for rechecking and marking. The marking machine part is used for marking defective target pcs particles at the target position of the material substrate according to the instruction, and particularly can be a laser marking or etching method and the like. Optionally, the line scanning camera and the mechanical arm of the marking machine synchronously move, or camera equipment is additionally arranged on the arm of the marking machine, and when marking, the corresponding target pcs particle picture is transmitted to computer equipment for display.
The computer device is a device with a display, and the display displays a reinspection marking interface for the visual operation of the manual marking process. The computer equipment is connected with the line scanning camera and the marking machine in a wired or wireless communication manner, receives the scanned material panorama and the real-time marking picture, and simultaneously sends marking instructions and positioning scanning instructions to the marking machine and the line scanning camera.
Fig. 2 is a flowchart of a circuit board rechecking and marking method provided in an embodiment of the present application, including the following steps:
step 201, displaying a reinspection marking interface, wherein the reinspection marking interface comprises a panoramic material display area and a real-time marking area;
the review marking interface is a display interface of the review marking system carried by the computer device in fig. 1, and an operator can complete linkage operation only through the computer device because the visual and contrast operation is to be realized.
Referring to fig. 3, a schematic diagram of a review marking interface is shown, and the review marking interface 300 includes at least a panoramic material display area 310 and a real-time marking area 320. The computer device receives the panoramic view of the scanned material substrate from the line scan camera and displays it in the panoramic material display area 310. A plurality of pcs particles are distributed in the displayed panoramic material diagram, wherein the defective pcs particles determined in the previous rechecking step are distributed, namely pcs which need to be marked by marking. The real-time marking area 320 is used for displaying the image of the pcs particles to be marked in real time, that is, the pcs particles with defects on the actual material substrate, the displaying is used for conveniently seeing the specific content of the defects, the defective pcs particles can be positioned and marking control can be performed, and the interface is further provided with a marking control 340 for controlling the marking process, for example, laser marking is started after clicking the opening control after selecting and moving to the target pcs position.
And 202, in response to receiving a marking instruction for the target pcs granule image, positioning the corresponding target pcs granule in the panoramic material diagram, and displaying the marking.
Because there are many pcs particles arranged in an array or randomly, the defective pcs usually occupy a small part, and the line scanning camera and the marking process need to position the actual space coordinates after receiving the instruction, and then the line scanning camera and the marking process can be executed. In the same reason, in order to facilitate operators to know the positions of the marked target pcs particles, positioning and marking display are carried out on marked pcs particle images in the panoramic material diagram.
In one possible implementation mode, the labeling frames in the panoramic material map are selected to be cumulative, and each time a pcs particle image is labeled, the distribution condition and the quantity of defect points on the whole material substrate can be visually displayed.
And 203, controlling the marking machine to move to the position of the target pcs particle based on the marked target pcs particle image to perform marking operation, and displaying a marking picture in the real-time marking area.
As shown in fig. 4, when the marking is started, after the target pcs granule image 410 is positioned and marked in the panoramic material image, the position coordinates of the target pcs granule to be marked on the actual material substrate on the whole substrate can be determined, and then the marking component or the mechanical arm of the line scanning camera and the marking machine is controlled to move to the corresponding position for marking, and the marking process scans and transmits the marking picture 420 through the line scanning camera or other components, or displays the marked picture in the real-time marking area 420 after the marking is completed, so as to indicate that the waste marking is completed. The marking screen in fig. 4 has cross marks as marking indicia (marking elements not shown), but may also be marked with letters or other patterns in some other embodiments.
In summary, the application uses the retest marking system in the semiconductor chip production process, and after retest confirms that defect pcs granule is accomplished, sets up panorama material display area and real-time marking area at retest marking interface, demonstrates the panoramic image of the complete material base plate that the line scanned camera was swept through panorama material display area. When the marking task is executed, marking and displaying the target pcs particle image to be marked in the panoramic material image, the defect position can be intuitively known, the setting of the real-time marking area is fine-grained to the marking picture, the marking picture of the target pcs is displayed in real time, and the defect and marking content are checked. The two display areas are matched for display to form contrast, so that an operator can conveniently and rapidly execute the marking process, marking efficiency can be improved, and product yield can be improved.
Because the manual marking process requires human intervention, in order to maintain the normal operation of the system without human operation, the modes of the system, namely, the manual marking mode and the rechecking mode, need to be controlled. Based on this, as shown in fig. 3, the present application sets a manual marking control 330 at the recheck marking interface, where the manual marking control 330 is used to control the system to execute the recheck mode or the marking mode.
And after the computer equipment receives a reinspection switching instruction of the manual marking control, namely closing the marking mode, and finishing reinspection operation of the material substrate, directly controlling the marking machine and the line scanning camera to switch the next material substrate to execute reinspection operation.
And after the computer equipment receives a marking switching instruction of the manual marking control, namely starting a marking mode, the system enters the manual marking mode after finishing the rechecking operation of the material substrate, and performs marking operation based on the marking instruction of the target pcs particles.
Optionally, a confirmation box may be popped up after the marking mode is switched and the reinspection is completed, as shown in the upper graph in fig. 5, and after the reinspection of a complete material substrate, the reinspection marking interface displays a manual marking pop-up window 510 to prompt that the manual marking process is about to begin. When the marking mode is turned off and the re-inspection is completed, a re-inspection popup window 520 is displayed at the lower part in fig. 5, which prompts the re-inspection process of other material substrates to be continuously performed.
Since there are many pcs particles on the material substrate, and there may be a plurality of defect points on one pcs, for example, defects may occur on both the front and the back, the marking mode needs to be performed in units of the material substrate, so the present application also intercepts defect images for the defect pcs particles identified on each material substrate, one defect image represents one defect point on the pcs, and all the defect images form a defect image set.
When the computer equipment completes the rechecking operation of the material substrate, a defect image list is constructed based on the defect image set identified and intercepted from the panoramic material diagram and is displayed on a rechecking marking interface;
when the computer equipment receives the selection operation of the target defect images in the defect image list, determining target pcs particles needing marking, and executing marking operation on the target pcs particles based on the marking instruction.
Referring specifically to fig. 6, after the pop-up window is finished and enters a marking state, a defect image list 610 is displayed at the reinspection marking interface, and preview images or thumbnails of all defect images cut from the panoramic material view are displayed in the list. When an operator selects a certain defect image, a corresponding target pcs is determined according to the selection operation, and then marking operation is executed. Alternatively, the marking operation may be automatically performed in the list order.
Marking and labeling after the target pcs particles are selected are performed with positioning operation, marking positioning labels are further included in a defect image list in the method, and the marking positioning labels and the defect images are stored in an associated mode; the marking location label comprises an image coordinate and a pcs number of each defect image in the panoramic material map. Marking the positioning label can number and generate the pcs particles to which each defect image belongs in the defect identification process.
When the computer device receives a selection operation of the target defect image, determining target pcs particles based on the pcs number and marking instructions of the target pcs particle image. And then positioning and labeling display are carried out in the panoramic material map according to the image coordinates. Because the coordinates are established based on the panoramic material map to determine the image size when the defect image is intercepted, the positioning process can directly restore and position based on the coordinates.
Based on the above positioning principle, the process of controlling the marking machine to move to the position of the target pcs particle to perform marking operation is realized by the following steps:
a, establishing a coordinate system based on the position relation between a marking machine and a material substrate;
the position coordinate system can be established by the geometric center or corners of the panoramic material map, and the outline edge coordinates of each pcs particle are determined.
b, calculating the position coordinates of the target pcs particles on the material substrate according to the position relation of the target pcs particle image relative to the panoramic material image;
under the condition of establishing a coordinate system, determining the coordinates of the target pcs particles in the real space mapped by the target pcs particle image according to the proportional relation with the actual material substrate.
And c, controlling the marking machine to move to the position coordinates of the target pcs particles to perform marking operation, and collecting real-time images of the target pcs particles.
The acquired real-time images are transmitted to a computer device for display in a real-time marking area for operator observation.
As mentioned above, because pcs are punched on the material substrate in an array, defects may occur on both the front and back sides, and any defect on either side must be eliminated, otherwise the chip yield is affected. Considering the turn-over operation of the line scanning camera and the marking machine or the transfer platform, the marking is usually performed on one surface, and then the turn-over operation is performed, so that the defect image set of the line scanning camera and the marking machine or the transfer platform should comprise the front and back defect images of the pcs particles in a manner of printing or etching marks on the pcs surface, and the defect images in the defect image list are arranged according to the number sequence of the pcs, so that the back marking after the surface marking is completed.
After the target pcs particles on the material substrate are positioned, responding to the click operation of the marking control, starting to etch the unqualified marks on the target pcs particles, and displaying marking pictures in the real-time marking area.
The method fully considers the marking of the front and back surfaces, avoids the condition that one surface is qualified and the other surface is unqualified and omitted, and improves the detection precision and accuracy.
However, in view of marking efficiency, the method of etching the disqualification mark needs to detect each surface at least twice, and if more than one defect type exists on one pcs, a plurality of defect images with the same pcs number may exist, and repeated marking may occur. Even if there is only one defect per side, the front and back sides need to be marked twice, which generally affects the marking efficiency.
Based on the above problems, after rechecking and determining all the defect images, the present application performs merging processing on the defect images with the same pcs number in the defect image set, that is, only one defect image is reserved for the defects with the same pcs number in the defect image list, and the reserved image is randomly selected one, because only one mark is needed for marking and invalidation. In order to avoid secondary printing or etching, after the target pcs particles on the material substrate are selected and positioned, when clicking operation of the marking control is received, the target pcs particles are directly marked and broken down, namely the material substrate is directly penetrated, secondary detection on the material substrate is not needed, and packaging operation is not naturally executed when the pcs are not detected in the subsequent flow process. This approach is simpler and more efficient than double sided marking.
Fig. 7 shows a block diagram of a circuit board re-inspection marking device according to an embodiment of the present application, where the device is used in a computer device, and the device includes:
the first display module is used for displaying a reinspection marking interface, and the reinspection marking interface comprises a panoramic material display area and a real-time marking area; the panoramic material display area is used for displaying a panoramic material image which is scanned by the scanning camera and transmitted back, the panoramic material image comprises a plurality of pcs particles, the real-time marking area is used for displaying a pcs particle image which needs marking in real time, and the pcs particle image corresponds to the defective pcs particles on the material substrate;
the second labeling display module is used for responding to the received labeling instruction of the target pcs particle image, positioning the corresponding target pcs particles in the panoramic material diagram and displaying the labeling;
and the third display module is used for controlling the marking machine to move to the position of the target pcs particle based on the marked target pcs particle image to execute marking operation, and displaying marking pictures in the real-time marking area.
In addition, the application further provides a computer device, which comprises a processor and a memory, wherein at least one instruction, at least one section of program, a code set or an instruction set is stored in the memory, and the at least one instruction, the at least one section of program, the code set or the instruction set is loaded and executed by the processor to realize the circuit board reinspection marking method in the aspect.
In addition, the application further provides a computer readable storage medium, wherein at least one instruction, at least one section of program, a code set or an instruction set is stored in the readable storage medium, and the at least one instruction, the at least one section of program, the code set or the instruction set is loaded and executed by a processor to realize the circuit board rechecking and marking method in the aspect.
The circuit board reinspection marking device provided by the embodiment of the application can be applied to the circuit board reinspection marking method provided by the embodiment, and related details refer to the method embodiment, so that the implementation principle and the technical effect are similar, and the description is omitted.
It should be noted that, when the circuit board review marking device provided in the embodiment of the present application performs the caliper operation, only the division of the above functional modules/functional units is used for illustration, and in practical application, the above functional allocation may be completed by different functional modules/functional units according to needs, that is, the internal structure of the circuit board review marking device is divided into different functional modules/functional units, so as to complete all or part of the functions described above. In addition, the implementation manner of the circuit board re-inspection marking method provided by the above method embodiment and the implementation manner of the circuit board re-inspection marking device provided by the present embodiment belong to the same conception, and the specific implementation process of the circuit board re-inspection marking device provided by the present embodiment is detailed in the above method embodiment, and is not repeated here.
Fig. 8 shows a block diagram of a computer device according to an exemplary embodiment of the present application. Is a computer device such as a desktop computer, a notebook computer, a palm computer, a cloud server, and the like. The computer device may include, but is not limited to, a processor and a memory. Wherein the processor and the memory may be connected by a bus or other means. The processor may be a central processing unit (Central Processing Unit, CPU). The processor may also be other general purpose processors, digital signal processors (Digital Signal Processor, DSP), application specific integrated circuits (Application Specific Integrated Circuit, ASIC), field programmable gate arrays (Field-Programmable Gate Array, FPGA) or other programmable logic devices, graphics processors (Graphics Processing Unit, GPU), embedded Neural network processors (Neural-network Processing Unit, NPU) or other specialized deep learning coprocessors, discrete gate or transistor logic devices, discrete hardware components, or a combination of the above.
The processor may include one or more processing cores, such as a 4-core processor, an 8-core processor, and the like. The processor may be implemented in at least one hardware form of DSP (Digital Signal Processing ), FPGA (Field-Programmable Gate Array, field programmable gate array), PLA (Programmable Logic Array ). The processor 1701 may also include a main processor and a coprocessor, the main processor being a processor for processing data in an awake state, also referred to as a CPU (Central Processing Unit ); a coprocessor is a low-power processor for processing data in a standby state. In some embodiments, the processor may be integrated with a GPU (Graphics Processing Unit, image processor) for taking care of rendering and rendering of the content that the display screen is required to display. In some embodiments, the processor may also include an AI (Artificial Intelligence ) processor for processing computing operations related to machine learning.
The memory is used as a non-transitory computer readable storage medium for storing non-transitory software programs, non-transitory computer executable programs, and modules, such as program instructions/modules corresponding to the methods in the above embodiments of the present application. The processor executes various functional applications of the processor and data processing, i.e., implements the methods of the method embodiments described above, by running non-transitory software programs, instructions, and modules stored in memory. The memory may include a memory program area and a memory data area, wherein the memory program area may store an operating system, at least one application program required for a function; the storage data area may store data created by the processor, etc. In addition, the memory may include high-speed random access memory, and may also include non-transitory memory, such as at least one magnetic disk storage device, flash memory device, or other non-transitory solid state storage device. In some implementations, the memory optionally includes memory remotely located relative to the processor, the remote memory being connectable to the processor through a network. Examples of such networks include, but are not limited to, the internet, intranets, local area networks, mobile communication networks, and combinations thereof.
In some embodiments, the computer device may further optionally include: a peripheral interface and at least one peripheral. The processor, memory, and peripheral interfaces may be connected by buses or signal lines. The individual peripheral devices may be connected to the peripheral device interface via buses, signal lines or circuit boards. Specifically, the peripheral device includes: at least one of a radio frequency circuit, a display screen and a keyboard.
The peripheral interface may be used to connect at least one Input/Output (I/O) related peripheral to the processor and the memory. In some embodiments, the processor, memory, and peripheral interfaces are integrated on the same chip or circuit board; in some other embodiments, either or both of the processor, memory, and peripheral interface may be implemented on separate chips or circuit boards, which is not limiting in this embodiment.
The display screen is used to display a UI (User Interface). The UI may include graphics, text, icons, video, and any combination thereof. When the display is a touch display, the display also has the ability to collect touch signals at or above the surface of the display. The touch signal may be input to the processor for processing as a control signal. At this time, the display screen may also be used to provide virtual buttons and/or virtual keyboards, also referred to as soft buttons and/or soft keyboards. In some embodiments, the display screen may be one, disposed on the front panel of the computer device; in other embodiments, the display screen may be at least two, respectively disposed on different surfaces of the computer device or in a folded design; in other embodiments, the display may be a flexible display disposed on a curved surface or a folded surface of the computer device. Even more, the display screen may be arranged in a non-rectangular irregular pattern, i.e. a shaped screen. The display screen may be made of LCD (Liquid Crystal Display ), OLED (Organic Light-Emitting Diode) or other materials.
The power supply is used to power the various components in the computer device. The power source may be alternating current, direct current, disposable or rechargeable. When the power source comprises a rechargeable battery, the rechargeable battery may be a wired rechargeable battery or a wireless rechargeable battery. The wired rechargeable battery is a battery charged through a wired line, and the wireless rechargeable battery is a battery charged through a wireless coil. The rechargeable battery may also be used to support fast charge technology.
Those skilled in the art will appreciate that the architecture shown in fig. 8 is not limiting of the computer device and may include more or fewer components than shown, or may combine certain components, or employ a different arrangement of components.
The embodiment of the application also discloses a computer readable storage medium. In particular, a computer readable storage medium is used for storing a computer program which, when executed by a processor, implements the method of the above-described method embodiments. It will be appreciated by those skilled in the art that implementing all or part of the processes in the methods of the embodiments described above may be accomplished by way of a computer program to instruct the relevant hardware, and the program may be stored in a computer readable storage medium, and the program may include processes in the embodiments of the methods described above when executed. Wherein the storage medium may be a magnetic Disk, an optical Disk, a Read-Only Memory (ROM), a random access Memory (Random Access Memory, RAM), a Flash Memory (Flash Memory), a Hard Disk (HDD), or a Solid State Drive (SSD); the storage medium may also comprise a combination of memories of the kind described above.
The present embodiment is only for explanation of the present invention and is not to be construed as limiting the present invention, and modifications to the present embodiment, which may not creatively contribute to the present invention as required by those skilled in the art after reading the present specification, are all protected by patent laws within the scope of claims of the present invention.
Claims (6)
1. A circuit board retest marking method, the method comprising:
displaying a reinspection marking interface, wherein the reinspection marking interface comprises a panoramic material display area and a real-time marking area; the panoramic material display area is used for displaying a panoramic material image which is scanned by the scanning camera and transmitted back, the panoramic material image comprises a plurality of pcs particles, the real-time marking area is used for displaying a pcs particle image which needs marking in real time, and the pcs particle image corresponds to the defective pcs particles on the material substrate;
a manual marking control is arranged on the reinspection marking interface and used for controlling reinspection marking modes, including reinspection modes and marking modes; responding to receiving a reinspection switching instruction of the manual marking control, and directly controlling a marking machine and a line scanning camera to switch a next material substrate to execute reinspection operation after finishing reinspection operation of the material substrate; in response to receiving a marking switching instruction of the manual marking control, entering a manual marking mode after finishing the reinspection operation of the material substrate, and performing marking operation based on the marking instruction of the target pcs particles;
responding to the completion of the rechecking operation of the material substrate, constructing a defect image list based on a defect image set identified and intercepted from the panoramic material image, and displaying the defect image list on the rechecking marking interface; wherein one defect image corresponds to one defect pcs particle; determining the target pcs particles to be marked in response to receiving a selection operation of target defect images in the defect image list, and executing marking operation on the target pcs particles based on a marking instruction;
responding to a marking instruction of a target pcs particle image, positioning the corresponding target pcs particles in the panoramic material image, and displaying marks;
based on the marked target pcs particle image, controlling a marking machine to move to the position of the target pcs particle to perform marking operation, and displaying marking pictures in the real-time marking area; specifically, the re-inspection marking interface is further provided with a marking control for controlling the marking process, the defect image set comprises front and back defect images of the pcs particles, and the defect images in the defect image list are arranged according to the number sequence of the pcs;
after the target pcs particles on the material substrate are positioned, responding to the click operation of the marking control, and starting to etch the unqualified marks on the target pcs particles;
or combining the defect images with the same pcs number in the defect image set after the recheck, and reserving only one defect image with the same pcs number in the defect image list; after the target pcs particles on the material substrate are positioned, the target pcs particles are directly subjected to marking breakdown in response to the click operation of the marking control, and pictures are displayed in the real-time marking area.
2. The method of claim 1, wherein the defect image list further comprises a marking location tag, and wherein the marking location tag is stored in association with the defect image; the marking positioning label comprises an image coordinate and a pcs number of each defect image in the panoramic material map;
determining the target pcs particles and marking instructions for the target pcs particle images based on the pcs number in response to receiving the selection operation for the target defect images;
and positioning and labeling display are carried out in the panoramic material map according to the image coordinates.
3. The method of claim 2, wherein the controlling the marking machine to move to the position of the target pcs particle to perform the marking operation based on the marked target pcs particle comprises:
establishing a coordinate system based on the position relation between the marking machine and the material substrate;
calculating the position coordinates of the target pcs particles on the material substrate according to the position relation of the target pcs particle image relative to the panoramic material image;
and controlling the marking machine to move to the position coordinates of the target pcs particles to perform marking operation, and collecting real-time images of the target pcs particles.
4. A circuit board retest marking device, characterized in that the device is used for the circuit board retest marking method as claimed in any one of claims 1-3, the device comprising:
the first display module is used for displaying a reinspection marking interface, and the reinspection marking interface comprises a panoramic material display area and a real-time marking area; the panoramic material display area is used for displaying a panoramic material image which is scanned by the scanning camera and transmitted back, the panoramic material image comprises a plurality of pcs particles, the real-time marking area is used for displaying a pcs particle image which needs marking in real time, and the pcs particle image corresponds to the defective pcs particles on the material substrate;
the second labeling display module is used for responding to the received labeling instruction of the target pcs particle image, positioning the corresponding target pcs particles in the panoramic material diagram and displaying the labeling;
and the third display module is used for controlling the marking machine to move to the position of the target pcs particle based on the marked target pcs particle image to execute marking operation, and displaying marking pictures in the real-time marking area.
5. A computer device comprising a processor and a memory, wherein the memory stores at least one instruction, at least one program, a set of codes, or a set of instructions, the at least one instruction, the at least one program, the set of codes, or the set of instructions being loaded and executed by the processor to implement the circuit board review marking method of any one of claims 1 to 3.
6. A computer readable storage medium having stored therein at least one instruction, at least one program, a set of codes, or a set of instructions, the at least one instruction, the at least one program, the set of codes, or the set of instructions being loaded and executed by a processor to implement the circuit board review marking method of any one of claims 1 to 3.
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| CN117554385B (en) * | 2023-11-02 | 2024-07-12 | 上海感图网络科技有限公司 | Method, device, equipment and storage medium for permitting and alarming in same-direction continuous scrapping |
| CN117790349B (en) * | 2023-12-27 | 2024-09-06 | 上海感图网络科技有限公司 | Pcs electrical measurement bad defect display method, device, equipment and storage medium |
Citations (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0304943A2 (en) * | 1987-08-28 | 1989-03-01 | müt-GMBH | Device for marking faults on printed circuit boards |
| JP2007064642A (en) * | 2005-08-29 | 2007-03-15 | Mega Trade:Kk | Visual inspection device |
| CN101076805A (en) * | 2004-11-15 | 2007-11-21 | 电子科学工业公司 | Tracing and marking sample with defect |
| CN101101857A (en) * | 2006-07-03 | 2008-01-09 | 奥林巴斯株式会社 | Defect repairing device |
| JP2010117285A (en) * | 2008-11-14 | 2010-05-27 | Omron Corp | Defect inspection device for substrate |
| KR101241036B1 (en) * | 2011-11-04 | 2013-03-11 | 한국기술교육대학교 산학협력단 | Apparatus for inspecting pcb |
| CN110579479A (en) * | 2019-08-09 | 2019-12-17 | 康代影像科技(苏州)有限公司 | PCB maintenance system and maintenance method based on false point defect detection |
| CN110672626A (en) * | 2019-11-14 | 2020-01-10 | 上海感图网络科技有限公司 | Method for detecting particle defects on surface of middle frame of mobile phone shell |
| CN110763703A (en) * | 2018-07-27 | 2020-02-07 | 皓琪科技股份有限公司 | Projection type system for assisting printed circuit board in quick positioning, fixed-point amplification and observation |
| CN112453716A (en) * | 2020-12-14 | 2021-03-09 | 珠海格力智能装备有限公司 | Control method and device of laser marking machine and laser marking system |
| CN113310997A (en) * | 2021-07-30 | 2021-08-27 | 苏州维嘉科技股份有限公司 | PCB defect confirmation method and device, automatic optical detection equipment and storage medium |
| CN114782431A (en) * | 2022-06-20 | 2022-07-22 | 苏州康代智能科技股份有限公司 | Printed circuit board defect detection model training method and defect detection method |
-
2023
- 2023-07-31 CN CN202310954277.7A patent/CN116967615B/en active Active
Patent Citations (13)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0304943A2 (en) * | 1987-08-28 | 1989-03-01 | müt-GMBH | Device for marking faults on printed circuit boards |
| DE3728818A1 (en) * | 1987-08-28 | 1989-03-16 | Muet Gmbh | ARRANGEMENT FOR DETERMINING AND ELIMINATING PRODUCTION FAULTS OF AN ELECTRICAL ASSEMBLY |
| CN101076805A (en) * | 2004-11-15 | 2007-11-21 | 电子科学工业公司 | Tracing and marking sample with defect |
| JP2007064642A (en) * | 2005-08-29 | 2007-03-15 | Mega Trade:Kk | Visual inspection device |
| CN101101857A (en) * | 2006-07-03 | 2008-01-09 | 奥林巴斯株式会社 | Defect repairing device |
| JP2010117285A (en) * | 2008-11-14 | 2010-05-27 | Omron Corp | Defect inspection device for substrate |
| KR101241036B1 (en) * | 2011-11-04 | 2013-03-11 | 한국기술교육대학교 산학협력단 | Apparatus for inspecting pcb |
| CN110763703A (en) * | 2018-07-27 | 2020-02-07 | 皓琪科技股份有限公司 | Projection type system for assisting printed circuit board in quick positioning, fixed-point amplification and observation |
| CN110579479A (en) * | 2019-08-09 | 2019-12-17 | 康代影像科技(苏州)有限公司 | PCB maintenance system and maintenance method based on false point defect detection |
| CN110672626A (en) * | 2019-11-14 | 2020-01-10 | 上海感图网络科技有限公司 | Method for detecting particle defects on surface of middle frame of mobile phone shell |
| CN112453716A (en) * | 2020-12-14 | 2021-03-09 | 珠海格力智能装备有限公司 | Control method and device of laser marking machine and laser marking system |
| CN113310997A (en) * | 2021-07-30 | 2021-08-27 | 苏州维嘉科技股份有限公司 | PCB defect confirmation method and device, automatic optical detection equipment and storage medium |
| CN114782431A (en) * | 2022-06-20 | 2022-07-22 | 苏州康代智能科技股份有限公司 | Printed circuit board defect detection model training method and defect detection method |
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Denomination of invention: Method, device, equipment, and storage medium for re inspection and marking of circuit boards Granted publication date: 20240412 Pledgee: Industrial Bank Co.,Ltd. Shanghai Shangnan Sub branch Pledgor: Shanghai Gantu Network Technology Co.,Ltd. Registration number: Y2024310000600 |