CN112045323A - Double laser head window opening method and device - Google Patents

Abstract

The invention relates to a method and a device for opening a window with a double laser head. The method comprises using an ultraviolet picosecond laser to cut the outline of a window to obtain a contour without carbonization; Windowed areas within contours that are not carbonized. In the present invention, the outline of the window opening is firstly cut through the ultraviolet picosecond laser to obtain a clean outline without carbonization, and CO2 laser is used for the internal filling of the window opening area to directly remove the material, so that the edge of the opening window is free of carbonization and residue, and the substrate is not affected. It does not affect the performance and use of the circuit board, and can process intensive windowing and precision windowing to solve the problems of inability to process intensive windowing, low precision windowing efficiency and slow speed in the prior art.

Description

Double laser head window opening method and device

technical field

The present invention relates to a window opening method, and more particularly to a double laser head window opening method and device.

Background technique

The wires on the circuit board are provided with a cover film layer or a solder mask ink layer, which can prevent the short circuit from causing damage to the device. Opening the window is to remove the corresponding cover film layer or solder mask ink layer on the pads of the wires, so that the pads of the wires are exposed. Can be tinned.

In the case of the cover film layer, before the cover film is pressed on the circuit board, the window is made first. The window opening method generally includes die punching or window opening with ordinary nanosecond laser or picosecond laser, and the processing of die punching is the smallest. The hole diameter is 0.8mm, the minimum rectangular window size is 0.8*0.8mm, the accuracy is ±50μm, and it is impossible to process intensive windowing; ordinary nanosecond lasers for windowing lead to edge carbonization or damage to the substrate due to thermal effects, which affects the performance of the circuit board. And it is impossible to process dense holes, and the use of picosecond lasers to open windows is inefficient and slow.

In the case of the solder mask ink layer, a window is made on the solder mask ink layer through exposure, development, post-curing and other processes. At present, the minimum hole diameter is 0.2mm, the minimum rectangular window size is 0.2*0.2mm, and the accuracy is ±25μm. , can be processed intensively to open windows, but with multiple processes, high production cost and low production efficiency.

Therefore, it is necessary to design a new method to solve the problems of inability to process intensive windowing, precise windowing, low efficiency and slow speed in the prior art.

SUMMARY OF THE INVENTION

The purpose of the present invention is to overcome the defects of the prior art, and to provide a method and device for opening a window with dual laser heads.

In order to achieve the above object, the present invention adopts the following technical solutions: a double laser head window opening method, comprising:

Use UV picosecond laser to cut the profile of the window to get the profile without carbonization;

A CO2 laser was used to remove material from the fenestrated areas within the non-carbonized contours to fenestrate the fenestrated areas within the non-carbonized contours.

Its further technical scheme is: the profile of the window is cut by the ultraviolet picosecond laser to obtain the profile without carbonization, including:

A UV picosecond laser is used to emit a UV picosecond laser to cut the profile of the fenestration to obtain a profile without carbonization.

Its further technical solution is: the CO2 laser is used to remove material from the windowed area in the contour without carbonization, so as to open the windowed area in the contour without carbonization, including:

A CO2 laser is used to emit a CO2 laser to remove material from the fenestration area within the contour without carbonization to fenestrate the fenestration area within the contour without carbonization.

Its further technical solution is: the minimum size of the opening window is less than 0.1mm.

Its further technical solution is: the precision of opening the window is less than ±10μm.

The present invention also provides a double-laser head window opening device, including a CO2 laser, an ultraviolet picosecond laser and an optical device, wherein the CO2 laser and the ultraviolet picosecond laser are respectively connected to the optical device, and a lower part of the optical device is arranged There are working platforms.

Its further technical scheme is as follows: it further comprises an industrial computer, and the industrial computer is respectively connected with the CO2 laser, the ultraviolet picosecond laser and the working platform.

Its further technical scheme is: the optical device includes at least one mirror, at least one beam expander, at least one galvanometer and at least one lens, and the beam expander is respectively connected with the CO2 laser and the ultraviolet picosecond laser , the beam expander and the galvanometer are respectively connected with the reflector, and the lens is connected below the galvanometer.

A further technical solution is: the working platform is located below the lens.

Its further technical solution is: the galvanometer is located below the reflector.

Compared with the prior art, the present invention has the following beneficial effects: the present invention first cuts the outline of the window through the ultraviolet picosecond laser to obtain a clean outline without carbonization, and CO2 laser is used to directly remove the material for the internal filling of the window area. , There is no carbonization and residue on the edge of the window opening, the substrate is not damaged, it does not affect the performance and use of the circuit board, and it can be processed intensively to open the window to solve the existing technology. .

The present invention will be further described below with reference to the accompanying drawings and specific embodiments.

Description of drawings

In order to explain the technical solutions of the embodiments of the present invention more clearly, the following briefly introduces the accompanying drawings used in the description of the embodiments. Obviously, the drawings in the following description are some embodiments of the present invention, which are of great significance to the art For those of ordinary skill, other drawings can also be obtained from these drawings without any creative effort.

1 is a schematic flowchart of a method for opening a window with a dual laser head provided by a specific embodiment of the present invention;

FIG. 2 is a schematic structural diagram of a double laser head window opening device provided by a specific embodiment of the present invention.

Detailed ways

In order to make the objectives, technical solutions and advantages of the present invention clearer, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, but not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative efforts shall fall within the protection scope of the present invention.

In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", " Orientation or position indicated by rear, left, right, vertical, horizontal, top, bottom, inside, outside, clockwise, counterclockwise, etc. The relationship is based on the orientation or positional relationship shown in the drawings, only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore It should not be construed as a limitation of the present invention.

In addition, the terms "first" and "second" are only used for descriptive purposes, and should not be construed as indicating or implying relative importance or implying the number of indicated technical features. Thus, a feature defined as "first" or "second" may expressly or implicitly include one or more of that feature. In the description of the present invention, "plurality" means two or more, unless otherwise expressly and specifically defined.

In the present invention, unless otherwise expressly specified and limited, the terms "installation", "connection", "connection", "fixing" and other terms should be understood in a broad sense, for example, it may be a connection or a detachable connection, It can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be the internal communication between the two elements or the interaction relationship between the two elements. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific situations.

In the present invention, unless otherwise expressly specified and limited, a first feature "on" or "under" a second feature may include the first and second features in direct contact, or may include the first and second features Not directly but through additional features between them. Also, the first feature being "above", "over" and "above" the second feature includes the first feature being directly above and obliquely above the second feature, or simply means that the first feature is level higher than the second feature. The first feature is "below", "below" and "below" the second feature includes the first feature being directly below and diagonally below the second feature, or simply means that the first feature has a lower level than the second feature.

In the description of this specification, description with reference to the terms "one embodiment," "some embodiments," "example," "specific example," or "some examples", etc., mean specific features described in connection with the embodiment or example , structure, material or feature is included in at least one embodiment or example of the present invention. In this specification, schematic representations of the above terms should not be construed as necessarily referring to the same embodiment or example. Furthermore, the particular features, structures, materials or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, those skilled in the art may combine and combine the different embodiments or examples described in this specification.

As shown in the specific embodiments shown in FIGS. 1 to 2 , the double laser head window opening method provided in this embodiment can be used in the process of processing intensive window opening and high-precision circuit board window opening.

Please refer to FIG. 1 , the above-mentioned double laser head window opening method includes steps S110 - S120 .

S110, using an ultraviolet picosecond laser to cut the profile of the window to obtain a profile without carbonization.

In this example, the outline without carbonation refers to the outer edge of the fenestration area, and the edge is clean and free of carbonation.

Specifically, the contour of the window opening is cut by using the ultraviolet picosecond laser 10 to emit an ultraviolet picosecond laser, so as to obtain the contour without carbonization. There is no carbonization and residue on the edge of the window opening, the substrate is not damaged, and the performance and use of the circuit board are not affected.

S120, using a CO2 laser to remove material from the windowed area within the contour without carbonization, so as to open the windowed area within the contour without carbonization.

In this embodiment, the CO2 laser 20 is used to emit CO2 laser to remove the material in the window area within the outline without carbonization, mainly to remove the cover film layer or the solder resist ink layer on the FPC pad.

Specifically, the minimum size of the fenestration is less than 0.1 mm. The fenestration accuracy is less than ±10μm.

The CO2 laser is used to remove the window area. Since the copper material of the base material does not absorb the laser, it will not affect the base material. It can process intensive window opening and precise window opening.

The combination of UV picosecond laser and CO2 laser for window opening can improve the efficiency and speed of the entire window opening.

The above-mentioned dual-laser window opening method first cuts the outline of the window through the ultraviolet picosecond laser to obtain a clean outline without carbonization. Residues, the substrate is not damaged, the performance and use of the circuit board are not affected, and dense holes can be processed to solve the problems of inability to process intensive windowing, precision windowing, low windowing efficiency and slow speed in the prior art.

In one embodiment, referring to FIG. 2, a double-laser head window opening device is also provided, including a CO2 laser 10, an ultraviolet picosecond laser 10 and an optical device, and the CO2 laser 20 and the ultraviolet picosecond laser 10 are respectively connected with the optical device, A working platform 70 is provided below the optical device.

Specifically, the above-mentioned device further includes an industrial computer 80 , which is connected to the CO 2 laser 20 , the ultraviolet picosecond laser 10 and the working platform 70 respectively. The working platform 70 is a rolling platform, which can be controlled by the industrial computer 80 to move the circuit board.

Please refer to FIG. 2, the above-mentioned optical device includes at least one mirror 40, at least one beam expander 30, at least one galvanometer 50 and at least one lens 60, and the beam expander 30 is respectively connected with the CO2 laser 20 and the ultraviolet picosecond laser 10 , the beam expander 30 and the galvanometer 50 are respectively connected with the reflector 40 , and a lens 60 is connected below the galvanometer 50 .

Specifically, the working platform 70 is located below the lens 60 .

Specifically, the galvanometer 50 is located below the mirror 40 .

In this embodiment, the number of the reflecting mirror 40 , the beam expander 30 , the galvanometer 50 and the lens 60 is two respectively.

Specifically, the ultraviolet picosecond laser 10 provides an ultraviolet picosecond laser beam, and the emitted laser beam is passed through an ultra-high frequency optical beam expander 30. The beam expander 30 is used to expand the diameter of the parallel input beam to a larger parallel output beam, and the parallel output beam It is transmitted to the reflector, deflected by the reflector, and then enters the galvanometer 50, which is then focused by the lens 60 and projected to the workpiece to be processed on the surface of the working platform 70; the CO2 laser 20 provides a CO2 laser beam, and the emitted laser beam is subjected to ultra-high frequency optical expansion. The beam mirror 30 and the beam expander 30 are used to expand the diameter of the parallel input beam to a larger parallel output beam, and the parallel output beam is transmitted to the reflector 40, which is deflected by the reflector 40 and then enters the galvanometer 50, which is then focused and focused by the lens 60. Projected to the workpiece to be processed disposed on the surface of the work platform 70 .

The optical device includes one or more of a beam expander 30 , a collimating mirror, a reflecting mirror 40 , a galvanometer 50 , an objective lens, and a lens 60 .

Using CO2 laser 20 and UV picosecond laser 10 for combined windowing, there is no carbonization and residue on the edge of the window, the substrate is not damaged, and the performance and use of the circuit board are not affected. It can process intensive windowing, precision windowing, and cutting speed. With the advantages of fast, low cost, simple and flexible equipment, the cutting speed has been greatly improved to solve the problems of inability to process intensive window opening, precise window opening, low window opening efficiency and slow speed in the prior art.

The above only uses examples to further illustrate the technical content of the present invention, so that readers can understand it more easily, but it does not mean that the embodiments of the present invention are limited to this, and any technical extension or re-creation made according to the present invention is subject to the protection of. The protection scope of the present invention is subject to the claims.

Claims (10)

1. The double laser head window opening method is characterized in that, comprising: Use UV picosecond laser to cut the profile of the window to get the profile without carbonization; A CO2 laser was used to remove material from the fenestrated areas within the non-carbonized contours to fenestrate the fenestrated areas within the non-carbonized contours. 2. The method for opening a window with dual laser heads according to claim 1, wherein the outline of the window opening is cut by an ultraviolet picosecond laser to obtain an outline without carbonization, comprising: A UV picosecond laser is used to emit a UV picosecond laser to cut the profile of the fenestration to obtain a profile without carbonization. 3. The double laser head window opening method according to claim 1, characterized in that, the CO2 laser is used to remove material from the window opening area in the outline without carbonization, so that the window opening area in the outline without carbonization is removed. Open windows, including: A CO2 laser is used to emit a CO2 laser to remove material from the fenestration area within the contour without carbonization to fenestrate the fenestration area within the contour without carbonization. 4 . The method for opening a window with dual laser heads according to claim 3 , wherein the minimum size of the opening window is less than 0.1 mm. 5 . 5 . The method for opening a window with dual laser heads according to claim 4 , wherein the precision of opening the window is less than ±10 μm. 6 . 6. A double-laser head window opening device, characterized in that it comprises a CO2 laser, an ultraviolet picosecond laser and an optical device, the CO2 laser and the ultraviolet picosecond laser are respectively connected with the optical device, and the lower part of the optical device is connected to the optical device. There is a working platform. 7 . The double laser head window opening device according to claim 6 , further comprising an industrial computer, which is respectively connected to the CO2 laser, the ultraviolet picosecond laser and the working platform. 8 . 8. The double laser head window opening device according to claim 7, wherein the optical device comprises at least one reflecting mirror, at least one beam expander, at least one galvanometer and at least one lens, the beam expander are respectively connected with the CO2 laser and the ultraviolet picosecond laser, the beam expander and the galvanometer are respectively connected with the reflection mirror, and the lens is connected under the galvanometer. 9 . The double laser head window opening device according to claim 8 , wherein the working platform is located below the lens. 10 . 10 . The double laser head window opening device according to claim 9 , wherein the galvanometer mirror is located below the reflection mirror. 11 .

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