CN112045323A - Double-laser-head windowing method and device - Google Patents
Double-laser-head windowing method and device Download PDFInfo
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- CN112045323A CN112045323A CN202010967385.4A CN202010967385A CN112045323A CN 112045323 A CN112045323 A CN 112045323A CN 202010967385 A CN202010967385 A CN 202010967385A CN 112045323 A CN112045323 A CN 112045323A
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- laser
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- 238000000034 method Methods 0.000 title claims abstract description 21
- 239000000463 material Substances 0.000 claims abstract description 21
- 238000003763 carbonization Methods 0.000 claims abstract description 17
- 238000005520 cutting process Methods 0.000 claims abstract description 8
- 230000003287 optical effect Effects 0.000 claims description 11
- 229910000679 solder Inorganic materials 0.000 description 4
- 238000004519 manufacturing process Methods 0.000 description 3
- 238000004080 punching Methods 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 230000001771 impaired effect Effects 0.000 description 1
- 238000011417 postcuring Methods 0.000 description 1
- 238000005096 rolling process Methods 0.000 description 1
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Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/36—Removing material
- B23K26/38—Removing material by boring or cutting
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K26/00—Working by laser beam, e.g. welding, cutting or boring
- B23K26/70—Auxiliary operations or equipment
- B23K26/702—Auxiliary equipment
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention relates to a double laser head windowing method and a device, wherein the method comprises the steps of cutting a windowed outline by adopting ultraviolet picosecond laser to obtain an outline without carbonization; a CO2 laser is used to remove material from the windowed areas in the non-carbonized profile to window the windowed areas in the non-carbonized profile. According to the invention, the window-opening profile is cut thoroughly by ultraviolet picosecond laser to obtain a clean and non-carbonized profile, the material is directly removed by filling CO2 laser in the window-opening area, the window-opening edge is free from carbonization and residue, the base material is not damaged, the performance and the use of a circuit board are not influenced, and dense window opening and precise window opening can be processed, so that the problems that dense window opening cannot be processed, the precision window opening efficiency is low and the speed is low in the prior art are solved.
Description
Technical Field
The invention relates to a windowing method, in particular to a double-laser-head windowing method and a double-laser-head windowing device.
Background
The wire on the circuit board is provided with a covering film layer or a solder resist ink layer, so that the device can be prevented from being damaged by short circuit, and windowing is to remove the corresponding covering film layer or the solder resist ink layer on the bonding pad of the wire, so that the bonding pad of the wire is exposed and can be tinned.
If the film layer is covered, before the covering film is attached to the circuit board, windowing is firstly carried out, the windowing mode generally comprises die punching or windowing by using a common nanosecond laser or a picosecond laser, the diameter of a processed minimum hole of the die punching is 0.8mm, the size of a minimum rectangular window is 0.8 x 0.8mm, the precision is +/-50 mu m, and dense windows cannot be processed; the performance of the circuit board is affected by edge carbonization or substrate damage caused by the influence of thermal effect when the ordinary nanosecond laser is used for windowing. And dense holes cannot be processed, and the adoption of picosecond laser windowing has low efficiency and low speed.
If the solder resist ink layer is subjected to exposure, development, post-curing and other processes to manufacture windows, the diameter of the minimum hole is 0.2mm, the size of the minimum rectangular window is 0.2 x 0.2mm, the precision is +/-25 mu m, and intensive windows can be processed in the conventional mode, but the process is multiple, the production cost is high, and the production efficiency is low.
Therefore, it is necessary to design a new method to solve the problems of the prior art that dense windowing, precise windowing, low efficiency and low speed cannot be processed.
Disclosure of Invention
The invention aims to overcome the defects of the prior art and provides a double-laser-head windowing method and device.
In order to achieve the purpose, the invention adopts the following technical scheme: the double-laser-head windowing method comprises the following steps:
cutting the windowed profile by using ultraviolet picosecond laser to obtain a non-carbonized profile;
a CO2 laser is used to remove material from the windowed areas in the non-carbonized profile to window the windowed areas in the non-carbonized profile.
The further technical scheme is as follows: the cutting of the windowed profile with an ultraviolet picosecond laser to obtain a non-carbonized profile, comprising:
an ultraviolet picosecond laser is used to emit an ultraviolet picosecond laser to cut the windowed profile to obtain a profile without carbonization.
The further technical scheme is as follows: the removing material from the windowed area in the non-carbonized profile using a CO2 laser to window the windowed area in the non-carbonized profile, comprising:
a CO2 laser is used to emit a CO2 laser to remove material from the windowed areas in the non-carbonized profile to window the windowed areas in the non-carbonized profile.
The further technical scheme is as follows: the minimum dimension of the fenestration is less than 0.1 mm.
The further technical scheme is as follows: the accuracy of windowing is less than ± 10 μm.
The invention also provides a double-laser-head windowing device which comprises a CO2 laser, an ultraviolet picosecond laser and an optical device, wherein the CO2 laser and the ultraviolet picosecond laser are respectively connected with the optical device, and a working platform is arranged below the optical device.
The further technical scheme is as follows: still include the industrial computer, the industrial computer respectively with the CO2 laser instrument the ultraviolet picosecond laser instrument and work platform are connected.
The further technical scheme is as follows: optics includes at least one speculum, at least one beam expander, at least one mirror and at least one lens shake, the beam expander respectively with CO2 laser and the ultraviolet picosecond laser is connected, the beam expander and the mirror that shakes respectively with the speculum is connected, the below of the mirror that shakes is connected with lens.
The further technical scheme is as follows: the working platform is positioned below the lens.
The further technical scheme is as follows: the galvanometer is positioned below the reflecting mirror.
Compared with the prior art, the invention has the beneficial effects that: according to the invention, the window-opening profile is cut thoroughly through by ultraviolet picosecond laser to obtain a clean and non-carbonized profile, the material is directly removed by filling CO2 laser in the window-opening area, the window-opening edge is free from carbonization and residue, the base material is not damaged, the performance and use of the circuit board are not affected, and the dense window opening can be processed, so that the problems that the dense window opening cannot be processed, the window-opening efficiency is low and the speed is low in the prior art are solved.
The invention is further described below with reference to the accompanying drawings and specific embodiments.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings based on these drawings without creative efforts.
Fig. 1 is a schematic flow chart of a double laser head windowing method according to an embodiment of the present invention;
fig. 2 is a schematic structural diagram of a double laser head windowing device according to an embodiment of the present invention.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in detail with reference to the accompanying drawings and the detailed description.
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", and the like, indicate orientations and positional relationships based on those shown in the drawings, and are used only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be considered as limiting the present invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise.
In the present invention, unless otherwise expressly stated or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be connected or detachably connected or integrated; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
In the present invention, unless otherwise expressly stated or limited, "above" or "below" a first feature means that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact with each other via another feature therebetween. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the invention. In this specification, the schematic representations of the terms used above should not be understood to necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples. Furthermore, various embodiments or examples described in this specification can be combined and combined by one skilled in the art.
As shown in fig. 1-2, the double laser head windowing method provided in this embodiment can be applied to the process of processing dense windowing and high-precision circuit board windowing.
Referring to fig. 1, the double laser head windowing method includes steps S110 to S120.
And S110, cutting the windowed profile by using ultraviolet picosecond laser to obtain a profile without carbonization.
In this embodiment, the contour without carbonization refers to the outer edge of the windowed area, and the edge is clean and free of carbonization.
Specifically, an ultraviolet picosecond laser 10 is used to emit an ultraviolet picosecond laser to cut the windowed profile to obtain a profile without carbonization. The edge of the window is free from carbonization and residue, the base material is not damaged, and the performance and the use of the circuit board are not influenced.
And S120, removing materials from the windowing area in the profile without carbonization by using a CO2 laser so as to window the windowing area in the profile without carbonization.
In this embodiment, a CO2 laser 20 is used to emit a CO2 laser to remove material from the windowed areas in the profile that are not carbonized, primarily to remove the coverlay or solder mask ink layer on the FPC pads.
In particular, the minimum dimension of the fenestration is less than 0.1 mm. The accuracy of windowing is less than ± 10 μm.
The windowing area is removed by CO2 laser, and the copper material of the base material does not absorb the laser, so that the base material is not affected, and intensive windowing and precise windowing can be processed.
The window is opened by combining the ultraviolet picosecond laser and the CO2 laser, so that the efficiency and the speed of the whole window opening can be improved.
According to the double-laser windowing method, the outline of the windowing is cut through by ultraviolet picosecond laser, the clean outline without carbonization is obtained, materials are directly removed by filling CO2 laser in the windowing area, the edge of the windowing has no carbonization and residue, the base material is not damaged, the performance and the use of a circuit board are not influenced, and dense holes can be machined, so that the problems that dense windowing, precise windowing, low windowing efficiency and low speed cannot be machined in the prior art are solved.
In an embodiment, referring to fig. 2, a double laser head windowing device is further provided, and includes a CO2 laser 10, an ultraviolet picosecond laser 10, and an optical device, the CO2 laser 20 and the ultraviolet picosecond laser 10 are respectively connected to the optical device, and a working platform 70 is disposed below the optical device.
Specifically, the device further comprises an industrial personal computer 80, wherein the industrial personal computer 80 is respectively connected with the CO2 laser 20, the ultraviolet picosecond laser 10 and the working platform 70. The working platform 70 is a rolling platform and can be controlled by the industrial personal computer 80 to move the circuit board, and the operations of the CO2 laser 20, the ultraviolet picosecond laser 10 and the like are controlled by the industrial personal computer 80.
Referring to fig. 2, the optical device includes at least one reflector 40, at least one beam expander 30, at least one polarizer 50, and at least one lens 60, the beam expander 30 is connected to the CO2 laser 20 and the ultraviolet picosecond laser 10, the beam expander 30 and the polarizer 50 are connected to the reflector 40, and the lens 60 is connected below the polarizer 50.
Specifically, the work platform 70 is located below the lens 60.
Specifically, the galvanometer 50 is positioned below the mirror 40.
In the present embodiment, the number of the reflecting mirror 40, the beam expander 30, the galvanometer 50, and the lens 60 is two.
Specifically, the ultraviolet picosecond laser 10 provides an ultraviolet picosecond laser beam, the emitted laser beam passes through the ultrahigh frequency light beam expander 30, the beam expander 30 is used for expanding the diameter of a parallel input light beam to a larger parallel output light beam, the parallel output light beam is transmitted to the reflector, is deflected by the reflector, enters the vibrating mirror 50, is focused by the lens 60 and is projected to a workpiece to be machined on the surface of the working platform 70; the CO2 laser 20 provides a CO2 laser beam, the emitted laser beam passes through the ultra-high frequency beam expander 30, the beam expander 30 is used for expanding the diameter of a parallel input beam to a larger parallel output beam, the parallel output beam is transmitted to the reflector 40, is deflected by the reflector 40 and enters the vibrating mirror 50, and then is focused by the lens 60 and is projected to a workpiece to be machined on the surface of the working platform 70.
The optical device includes one or more of a beam expander 30, a collimator, a mirror 40, a galvanometer 50, an objective lens, and a lens 60.
Adopt CO2 laser 20 and ultraviolet picosecond laser 10 to combine and open the window, the edge of windowing does not have carbonization and remains, and the substrate is not impaired, does not influence circuit board performance and use, and the workable intensive windowing, the accurate windowing have advantages of cutting speed is fast, with low costs, the simple nimble of equipment, and cutting speed has promoted by a wide margin to solve among the prior art unable processing intensive windowing, accurate windowing, the problem that the windowing is efficient, slow.
The technical contents of the present invention are further illustrated by the examples only for the convenience of the reader, but the embodiments of the present invention are not limited thereto, and any technical extension or re-creation based on the present invention is protected by the present invention. The protection scope of the invention is subject to the claims.
Claims (10)
1. A double-laser-head windowing method is characterized by comprising the following steps:
cutting the windowed profile by using ultraviolet picosecond laser to obtain a non-carbonized profile;
a CO2 laser is used to remove material from the windowed areas in the non-carbonized profile to window the windowed areas in the non-carbonized profile.
2. The double-laser-head windowing method according to claim 1, characterized in that said cutting of the windowed profile with an ultraviolet picosecond laser, so as to obtain a profile without carbonization, comprises:
an ultraviolet picosecond laser is used to emit an ultraviolet picosecond laser to cut the windowed profile to obtain a profile without carbonization.
3. The double laser head windowing method of claim 1, wherein said removing material with a CO2 laser of the windowed area in the non-carbonized profile to window the windowed area in the non-carbonized profile comprises:
a CO2 laser is used to emit a CO2 laser to remove material from the windowed areas in the non-carbonized profile to window the windowed areas in the non-carbonized profile.
4. The double laser head windowing process according to claim 3 wherein the minimum dimension of the window is less than 0.1 mm.
5. The double laser head windowing method according to claim 4, characterized in that the precision of windowing is less than ± 10 μm.
6. Double laser head windowing facility, its characterized in that includes CO2 laser instrument, ultraviolet picosecond laser instrument and optical device, CO2 laser instrument and ultraviolet picosecond laser instrument respectively with optical device connects, optical device's below is equipped with work platform.
7. The double-laser-head windowing device according to claim 6, further comprising an industrial personal computer connected with the CO2 laser, the ultraviolet picosecond laser and the working platform respectively.
8. The double laser head windowing device according to claim 7, wherein said optics comprise at least one mirror, at least one beam expander, at least one galvanometer and at least one lens, said beam expander being connected to said CO2 laser and said uv picosecond laser, respectively, said beam expander and said galvanometer being connected to said mirror, respectively, said lens being connected below said galvanometer.
9. The double laser head windowing device according to claim 8, wherein said work platform is located below said lens.
10. The double laser head windowing device according to claim 9, wherein the galvanometer is located below the mirror.
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| CN202010967385.4A CN112045323A (en) | 2020-09-15 | 2020-09-15 | Double-laser-head windowing method and device |
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| CN202010967385.4A CN112045323A (en) | 2020-09-15 | 2020-09-15 | Double-laser-head windowing method and device |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113727526A (en) * | 2021-08-31 | 2021-11-30 | 深圳市大族数控科技股份有限公司 | Windowing method for protective layer of circuit board |
| CN113795087A (en) * | 2021-11-15 | 2021-12-14 | 深圳市大族数控科技股份有限公司 | Windowing method and windowing equipment |
| CN113923886A (en) * | 2021-10-26 | 2022-01-11 | 新华三信息安全技术有限公司 | Method for removing solder resist ink on printed board and solder resist ink removing equipment |
| CN114193006A (en) * | 2022-01-21 | 2022-03-18 | 武汉元禄光电技术有限公司 | Multi-head multi-wavelength PCB laser drilling device and method |
| CN114799492A (en) * | 2022-03-21 | 2022-07-29 | 武汉华工激光工程有限责任公司 | Efficient high-precision Mini LED panel windowing method and system |
| CN114900965A (en) * | 2022-05-10 | 2022-08-12 | 深圳市普利司德高分子材料有限公司 | FPC die cutting production method |
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