CN208800900U - A kind of big width laser cutting processing system - Google Patents
A kind of big width laser cutting processing system Download PDFInfo
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- CN208800900U CN208800900U CN201821518406.9U CN201821518406U CN208800900U CN 208800900 U CN208800900 U CN 208800900U CN 201821518406 U CN201821518406 U CN 201821518406U CN 208800900 U CN208800900 U CN 208800900U
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- movement mechanism
- axis movement
- laser cutting
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Abstract
The utility model discloses a kind of big width laser cutting processing systems, including master control set and rack, rack is equipped with the laser cutting module connecting with master control set, CCD locating module, vacuum evacuation device, X-axis movement mechanism, Y-axis movement mechanism and Z axis movement mechanism, laser cutting module includes laser and laser galvanometer, X-axis movement mechanism and Y-axis movement mechanism form two-dimensional surface sports platform, it which is provided with material carrier platform, cavity is equipped in material carrier platform, the material containing face of material carrier platform provides the through-hole being connected to cavity, and form scaling board structure, cavity is also connected to vacuum evacuation device, laser galvanometer and CCD locating module are located on Z axis movement mechanism.The utility model can calibrate position control information, and then the splicing precision and processing effect of large format processing can be improved, especially suitable for large format, the processing of diversity, personalized product, whole process can accomplish without any letup, and processing capacity is small, no material consumption, use cost are low, high in machining efficiency.
Description
Technical field
The utility model relates to flexible boards to be cut by laser field, and in particular to a kind of big width laser cutting processing system,
Especially suitable for the cutting of flexible circuit board, such as the cutting of shape cutting, tie point, cover film windowing, FR4 cutting processing.
Background technique
Cutting to flexible circuit board, traditional way have die cut and laser cutting.
Die cut mode, it is one time punching molded using mold using press machine, disadvantage is that mold is processed
It cannot achieve small lot production, cost and process-cycle not can guarantee, and be suitable only for large batch of production, mould therefor has
The limitation of service life can not be competent at diversified cutting demand.
Laser cutting mode can be suitable for small lot personalization and produce, disadvantage is that nanosecond is mostly used to swash
The disadvantages of radiant, for stage correction without full width face, it is poor that there are cutting effects, low efficiency, splices low precision, carries out large format cutting
When disadvantages mentioned above it is more obvious.With the precision of the development of flexible circuit board industry, the application of laser cutting and laser cutting
It is required that higher and higher, the deficiency of above-mentioned laser cutting in the urgent need to address.
Summary of the invention
In order to improve the above deficiency, the utility model provides a kind of big width laser cutting processing system, can or extremely
Few overall processing precision for improving large format flexible circuit board to a certain extent.The utility model is real by the following technical programs
Existing: a kind of big width laser cutting processing system, including master control set and rack, the rack are equipped with and the master control set
Laser cutting module, CCD locating module, vacuum evacuation device, X-axis movement mechanism, Y-axis movement mechanism and the Z axis fitness machine of connection
Structure, the laser cutting module include laser and laser galvanometer, the fortune of the X-axis movement mechanism and the Y-axis movement mechanism
Dynamic direction is vertical, and cooperates to form two-dimensional surface sports platform, and the two-dimensional surface sports platform is equipped with material carrier platform, described
Cavity is equipped in material carrier platform, the material containing face of the material carrier platform provides several through-holes being connected to the cavity, and forms calibration
Hardened structure, the cavity are also connected to the vacuum evacuation device, the direction of motion and the material carrier platform of the Z axis movement mechanism
Material containing face is vertical, and the laser galvanometer and the CCD locating module are located on the sports platform of the Z axis movement mechanism.
Preferably, the material containing face of the material carrier platform also provides the index aperture being connected to the cavity.
Preferably, the material containing face of the material carrier platform is also formed with indicia framing, and the indicia framing is in square shape or matrix pattern.
Preferably, limit plate is additionally provided on the material carrier platform, the limit plate is disposed around the material containing face four of the material carrier platform
Week.
Preferably, the material containing face of the material carrier platform is square or rectangle.
Preferably, the laser is picosecond laser, and frequency is 100KHZ~2000KHZ, the CCD locating module
Including COMS camera and focusing lens.
The utility model passes through the scaling board structure formed, can be used for calibrating position control information, and then can mention
The splicing precision and processing effect of high large format processing, the processing especially suitable for large format, diversity, personalized product are raw
It produces, whole process can accomplish without any letup, and processing capacity is small, no material consumption, use cost are low, high in machining efficiency.
Detailed description of the invention
The utility model is described in further detail in the following with reference to the drawings and specific embodiments.
Fig. 1 is the structural schematic diagram of the utility model embodiment.
Corresponding as follows, the material carrier platform 10 of each label, limit plate 100, through-hole 101, index aperture 102, indicia framing 103, Y-axis in figure
Movement mechanism 20, X-axis movement mechanism 30, laser galvanometer 40, laser 50, vacuum evacuation device 60, CCD locating module 70, optical path
System 80, Z axis movement mechanism 90.
Specific embodiment
With reference to the accompanying drawing and the utility model is further described in embodiment:
As an example, the big width laser cutting processing system of the present embodiment, as shown in Figure 1, including master control set
And rack, master control set include PC software and hardware control system, rack be equipped with the laser cutting module being connect with master control set,
CCD locating module 70, vacuum evacuation device 60, X-axis movement mechanism 30, Y-axis movement mechanism 20 and Z axis movement mechanism 90, laser is cut
Cutting module includes laser 50, light path system 80 and laser galvanometer 40, the movement of X-axis movement mechanism 30 and Y-axis movement mechanism 20
Direction is vertical, and cooperates to form two-dimensional surface sports platform, and two-dimensional surface sports platform is equipped with material carrier platform 10, material carrier platform 10
Interior to be equipped with cavity, the material containing face of material carrier platform 10 provides several through-holes 101 being connected to cavity, and forms scaling board structure, empty
Chamber is also connected to vacuum evacuation device 60, and the direction of motion of Z axis movement mechanism 90 is vertical with the material containing face of material carrier platform 10, laser galvanometer
40 and CCD locating module 70 is located on the sports platform of Z axis movement mechanism 90.
In use, flexible circuit board to be processed to be placed in the material containing face of material carrier platform 10, the figure processed will be needed to deposit
Enter master control set, according to the calibration between CCD locating module 70 and the scaling board structure formed, sets cutting subregion, each
The size of subregion is the range that laser galvanometer 40 can be processed effectively；Vacuum evacuation device 60 is controlled by master control set to operate, it will
Flexible circuit board is entirely absorbed and fixed at material containing face；X-axis movement mechanism 30 and Y-axis movement mechanism 20 are controlled by master control set
Operating, and control CCD locating module 70 carry out vision-based detection target, positioning flexible circuit board position；Pass through CCD positioning mould
The original graphics processing comparison saved in the data and PC that block 70 is clapped, adjusts separately X-direction pantograph ratio, the pantograph ratio of Y-direction,
Angle automatching makes the cutting pattern of software control match practical cutting products size and location, to complete effectively processing；Passing through needs
The information for wanting the information of graphics processing to acquire with CCD locating module 70 is compared, and may also function as the effect that discovery product is put back；
Z axis movement mechanism 90 is controlled by master control set, the focus of laser galvanometer 40 is made to be registered to Working position, starts laser 50,
It is transmitted to laser galvanometer 40 through light path system 80, the flexible circuit board for being located at the subregion can be processed, when the subregion adds
Work finishes, and laser 50 is closed, and by the operating of X-axis movement mechanism 30 and Y-axis movement mechanism 20, continues next subregion
Processing, can be repeated several times according to actual needs, until entire breadth completion of processing.Due to through-hole 101 setting and shape
At scaling board structure accurate location information is provided to the operating of each movement mechanism, therefore improve machining accuracy, make big
Breadth processing and splicing precision is higher, splicing effect is more preferable, with traditional large format process operation compared with, centre do not need pause, it is right
Product to be processed are shifted and are calibrated again, and whole process is accomplished without any letup, and processing efficiency is improved.When it is implemented, may be used also
Calibration accuracy is further increased by scaling board correcting algorithm, compared with the limited fixed position compensation of conventional dry interferometer, essence
Du Genggao.
The material containing face of material carrier platform 10 also provides the index aperture 102 being connected to cavity as a preferred implementation manner,.This
Embodiment includes four index apertures 102, each includes a macropore and two apertures, and at right angles, symmetrically arrange, four
The setting of a index aperture 102 square four horn shape.The location information of index aperture 102 for CCD locating module 70 acquire after, for pair
The movement position of entire large format range compensates, and further calibrates to position control information, cuts down 30 He of X-axis movement mechanism
Location error caused by the verticality and straightness of Y-axis movement mechanism 20, to adapt to large format process requirements.
The material containing face of material carrier platform 10 also provides the indicia framing 103 being connected to cavity as a preferred implementation manner,.This
The indicia framing 103 of embodiment is in matrix pattern, in other embodiments or square shape.The setting of indicia framing 103 can be played
The effect of similar index aperture 102 improves calibration accuracy further to adapt to large format process requirements.It is preferred that through-hole 101, label
Hole 102 and indicia framing 103 are implemented together, to ensure the splicing precision and processing effect of large format processing.
Limit plate 100 is additionally provided on material carrier platform 10 as a preferred implementation manner,.The limit plate 100 of the present embodiment encloses
It is located at the material containing face surrounding of material carrier platform 10.The setting of limit plate 100 can be used for position control information and further calibrate, and may be used also
It is limited with treating processed goods, can also realize putting for specific position by way of opposite side when putting product to be processed, disappear
Subtract the deficiency arbitrarily put.When it is implemented, the material containing face of material carrier platform 10 preferably square or rectangle, to be moved with X-axis
The operating of mechanism 30 and Y-axis movement mechanism 20 is adapted.
The laser of the present embodiment is preferably 355 ultraviolet picosecond grade lasers, laser pulse width 15PS, frequency 100KHZ
~2000KHZ, cutting efficiency is high, and cut quality is good；CCD locating module preferably includes the COMS camera and focusing lens of 500W
Head, operating distance can be adjusted flexibly, and cost is relatively low, and performance is stablized, and positioning accuracy can meet actual demand.Picosecond laser
Laser action on product, cut portion can be made to gasify, make product appearance Non-carbonized, burr, size line, cutting efficiency can also
It doubles, has evaded micro- short problem caused by traditional nanosecond laser processing once in a while.
The X-axis movement mechanism 30, Y-axis movement mechanism 20 and Z axis movement mechanism 90 of the present embodiment are linear motor transmission
Linear platform, platform positioning accuracy can achieve +/- 0.002mm, platform movement speed maximum 1m/s.The positioning accuracy and movement
Speed can preferably match user demand.Corresponding, there are many platform implementations, as toothed belt transmission, ball-screw pass
Dynamic or linear motor transmission etc. can be according to particular user in terms of the main distinction is the positioning accuracy and cost of platform
Demand and do optimal selection.
It should be understood that for those of ordinary skills, it can be modified or changed according to the above description,
And all these modifications and variations all should belong to the protection scope of the appended claims for the utility model.
Illustrative description has been carried out to the utility model patent above, it is clear that the realization of the utility model patent not by
The limitation of aforesaid way, if the method concept of the utility model patent and the various improvement of technical solution progress are used, or
It is not improved that the conception and technical scheme of the utility model patent are directly applied into other occasions, in the utility model
In protection scope.
Claims (6)
1. a kind of big width laser cutting processing system, which is characterized in that including master control set and rack, the rack is equipped with
Laser cutting module, CCD locating module, vacuum evacuation device, X-axis movement mechanism, the Y-axis fitness machine being connect with the master control set
Structure and Z axis movement mechanism, the laser cutting module include laser and laser galvanometer, the X-axis movement mechanism and the Y-axis
The direction of motion of movement mechanism is vertical, and cooperates to form two-dimensional surface sports platform, sets on the two-dimensional surface sports platform
Have a material carrier platform, be equipped with cavity in the material carrier platform, the material containing face of the material carrier platform provide it is several be connected to the cavity lead to
Hole, and scaling board structure is formed, the cavity is also connected to the vacuum evacuation device, the direction of motion of the Z axis movement mechanism
Vertical with the material containing face of the material carrier platform, the laser galvanometer and the CCD locating module are located at the fortune of the Z axis movement mechanism
On dynamic platform.
2. a kind of big width laser cutting processing system according to claim 1, which is characterized in that the material containing of the material carrier platform
Face also provides the index aperture being connected to the cavity.
3. a kind of big width laser cutting processing system according to claim 1, which is characterized in that the material containing of the material carrier platform
Face is also formed with indicia framing, and the indicia framing is in square shape or matrix pattern.
4. a kind of big width laser cutting processing system according to claim 1, which is characterized in that also set on the material carrier platform
There is limit plate, the limit plate is disposed around the material containing face surrounding of the material carrier platform.
5. a kind of big width laser cutting processing system according to claim 1, which is characterized in that the material containing of the material carrier platform
Face is square or rectangle.
6. a kind of big width laser cutting processing system according to claim 1, which is characterized in that the laser is picosecond
Grade laser, frequency are 100KHZ~2000KHZ, and the CCD locating module includes COMS camera and focusing lens.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821518406.9U CN208800900U (en) | 2018-09-14 | 2018-09-14 | A kind of big width laser cutting processing system |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821518406.9U CN208800900U (en) | 2018-09-14 | 2018-09-14 | A kind of big width laser cutting processing system |
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| CN208800900U true CN208800900U (en) | 2019-04-30 |
Family
ID=66237373
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| CN201821518406.9U Active CN208800900U (en) | 2018-09-14 | 2018-09-14 | A kind of big width laser cutting processing system |
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Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110076463A (en) * | 2019-05-05 | 2019-08-02 | 南京市罗奇泰克电子有限公司 | A kind of circuit board laser cutting machine |
| CN111001956A (en) * | 2019-12-17 | 2020-04-14 | 苏州领鹿智能科技有限公司 | Large-breadth positioning marking system and using method thereof |
| CN111505992A (en) * | 2020-05-06 | 2020-08-07 | 清华大学 | Multichannel laser galvanometer motion control system with multiple connection modes |
| CN111618442A (en) * | 2020-04-28 | 2020-09-04 | 深圳市东赢激光设备有限公司 | Method for splicing and cutting large-width thick glass by vibrating mirror type laser |
| CN112945102A (en) * | 2021-03-09 | 2021-06-11 | 武汉先河激光技术有限公司 | Precision platform precision metering and compensating method based on glass cutting technology |
| CN114193006A (en) * | 2022-01-21 | 2022-03-18 | 武汉元禄光电技术有限公司 | Multi-head multi-wavelength PCB laser drilling device and method |
| CN117697126A (en) * | 2023-12-29 | 2024-03-15 | 武汉元禄光电技术有限公司 | Method and device for laser precision machining of 3D nonmetallic forming part |
-
2018
- 2018-09-14 CN CN201821518406.9U patent/CN208800900U/en active Active
Cited By (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110076463A (en) * | 2019-05-05 | 2019-08-02 | 南京市罗奇泰克电子有限公司 | A kind of circuit board laser cutting machine |
| CN110076463B (en) * | 2019-05-05 | 2021-09-28 | 南京市罗奇泰克电子有限公司 | Circuit board laser cutting machine |
| CN111001956A (en) * | 2019-12-17 | 2020-04-14 | 苏州领鹿智能科技有限公司 | Large-breadth positioning marking system and using method thereof |
| CN111618442A (en) * | 2020-04-28 | 2020-09-04 | 深圳市东赢激光设备有限公司 | Method for splicing and cutting large-width thick glass by vibrating mirror type laser |
| CN111505992A (en) * | 2020-05-06 | 2020-08-07 | 清华大学 | Multichannel laser galvanometer motion control system with multiple connection modes |
| CN111505992B (en) * | 2020-05-06 | 2021-05-18 | 清华大学 | Multichannel laser galvanometer motion control system with multiple connection modes |
| CN112945102A (en) * | 2021-03-09 | 2021-06-11 | 武汉先河激光技术有限公司 | Precision platform precision metering and compensating method based on glass cutting technology |
| CN114193006A (en) * | 2022-01-21 | 2022-03-18 | 武汉元禄光电技术有限公司 | Multi-head multi-wavelength PCB laser drilling device and method |
| CN117697126A (en) * | 2023-12-29 | 2024-03-15 | 武汉元禄光电技术有限公司 | Method and device for laser precision machining of 3D nonmetallic forming part |
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