CN114900965A - FPC die cutting production method - Google Patents
FPC die cutting production method Download PDFInfo
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- CN114900965A CN114900965A CN202210532681.0A CN202210532681A CN114900965A CN 114900965 A CN114900965 A CN 114900965A CN 202210532681 A CN202210532681 A CN 202210532681A CN 114900965 A CN114900965 A CN 114900965A
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- 238000005520 cutting process Methods 0.000 title claims abstract description 69
- 238000004519 manufacturing process Methods 0.000 title claims abstract description 42
- 239000010408 film Substances 0.000 claims abstract description 83
- 238000012545 processing Methods 0.000 claims abstract description 41
- 238000010030 laminating Methods 0.000 claims abstract description 36
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 34
- 239000011889 copper foil Substances 0.000 claims abstract description 34
- 238000000034 method Methods 0.000 claims abstract description 33
- 238000007731 hot pressing Methods 0.000 claims abstract description 31
- 239000002699 waste material Substances 0.000 claims abstract description 30
- 238000005553 drilling Methods 0.000 claims abstract description 22
- 230000001681 protective effect Effects 0.000 claims abstract description 18
- CURLTUGMZLYLDI-UHFFFAOYSA-N Carbon dioxide Chemical compound O=C=O CURLTUGMZLYLDI-UHFFFAOYSA-N 0.000 claims abstract description 16
- 239000011241 protective layer Substances 0.000 claims abstract description 10
- 239000013039 cover film Substances 0.000 claims abstract description 9
- 229910002092 carbon dioxide Inorganic materials 0.000 claims abstract description 8
- 239000001569 carbon dioxide Substances 0.000 claims abstract description 8
- 238000007747 plating Methods 0.000 claims abstract description 4
- 238000003825 pressing Methods 0.000 claims description 38
- JNDMLEXHDPKVFC-UHFFFAOYSA-N aluminum;oxygen(2-);yttrium(3+) Chemical compound [O-2].[O-2].[O-2].[Al+3].[Y+3] JNDMLEXHDPKVFC-UHFFFAOYSA-N 0.000 claims description 10
- 229910019901 yttrium aluminum garnet Inorganic materials 0.000 claims description 10
- 239000003795 chemical substances by application Substances 0.000 claims description 7
- 238000003475 lamination Methods 0.000 claims description 4
- 239000012787 coverlay film Substances 0.000 claims 1
- 238000013461 design Methods 0.000 abstract description 5
- 230000002829 reductive effect Effects 0.000 abstract description 5
- 239000010410 layer Substances 0.000 abstract description 2
- 238000012544 monitoring process Methods 0.000 abstract 1
- 238000004804 winding Methods 0.000 description 11
- 238000005530 etching Methods 0.000 description 8
- 239000011248 coating agent Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 239000002131 composite material Substances 0.000 description 3
- 239000002648 laminated material Substances 0.000 description 3
- 230000003628 erosive effect Effects 0.000 description 2
- 230000000670 limiting effect Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000005096 rolling process Methods 0.000 description 2
- 238000006467 substitution reaction Methods 0.000 description 2
- 239000002253 acid Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 239000003153 chemical reaction reagent Substances 0.000 description 1
- 238000004140 cleaning Methods 0.000 description 1
- 238000010924 continuous production Methods 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000007613 environmental effect Effects 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 239000002351 wastewater Substances 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0044—Mechanical working of the substrate, e.g. drilling or punching
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/10—Greenhouse gas [GHG] capture, material saving, heat recovery or other energy efficient measures, e.g. motor control, characterised by manufacturing processes, e.g. for rolling metal or metal working
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Perforating, Stamping-Out Or Severing By Means Other Than Cutting (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention discloses a FPC die cutting production method, and belongs to the technical field of circuit board processing production. The FPC die-cutting production process comprises the steps of unreeling a protective film and a copper foil, and laminating; performing circuit die cutting; covering a film on the copper foil, and opening a window to be covered with the copper foil; receiving a protective film, unreeling and laminating a lower cover film, unreeling a support film and a waste discharge film, processing a head through hole, a shape and a through hole according to design, and reeling the waste discharge film and the support film; hot pressing; and plating a protective layer at the exposed positions of the shape, the through hole and the like by adopting an OSP process. According to the technical process, the impact type carbon dioxide laser drilling machine is used for drilling and windowing the insulating layer, so that the precision and the processing speed can be improved, burrs are reduced, and additional damage is reduced. According to the technical process, the high-precision CCD sensor is used for monitoring the whole processing process of the product, so that the processing precision and the yield can be effectively improved. The invention has the characteristics of high automation degree, and has the advantages of high production efficiency, high process precision, low cost and the like.
Description
Technical Field
The invention belongs to the technical field of circuit board processing production, and particularly relates to a FPC die cutting production method.
Background
With the rapid development of new energy automobiles, the cost of automobile electronics in the whole automobile is increased continuously, the automobile electronics is divided into automobile body automobile electronics and vehicle-mounted automobile electronics, and after the automobile FPC replaces a wiring harness step by step, the using amount of the automobile body part is increased greatly. The ratio of the automobile electronics to the whole automobile cost in 2010 reaches 29.6%, the ratio of the whole automobile cost in 2020 reaches 34.3%, and the ratio of the whole automobile cost in 2030 is close to 50%.
At present, the common production mode of the FPC is an etching method, the etching method is used for producing the FPC by laminating, exposing, developing, etching, cleaning, gold plating, punching and the like, the processing technology is complicated, and the manufacturing period is about one week. The etching method is limited by the size of production equipment, and the FPC cannot be made very long and very wide; in addition, strong acid or strong alkaline etching solution used in the production process of the etching method has certain danger, and the treatment cost of waste water after the production is finished is higher; the etching method also has the phenomena of lateral erosion and concave erosion, which causes the unevenness of the circuit and further influences the quality of the FPC.
Most of the existing die cutting processes adopt a die cutting machine for die cutting, the positions needing drilling or windowing cannot be accurately processed, collateral damage is easy to cause, and the product percent of pass is reduced. And most of the existing die cutting machines adopt flat-pressing parallel die cutting machines, but the existing die cutting machines need to have large pressure during working, so that the labor intensity is high, the continuous production speed is low, and the production efficiency is low. The size of an FPC product produced by the existing die cutting machine is smaller and is mostly below 0.25m by 0.35m, and the application requirement of the new energy automobile industry which is developed rapidly at present cannot be met.
Disclosure of Invention
In order to solve the above problems in the prior art, the present invention aims to provide a method for producing an FPC by die cutting.
The technical scheme adopted by the invention is as follows: a die-cutting production method of FPC comprises the following steps:
cold pressing and laminating the protective film and the copper foil, and then performing circuit die cutting;
after the upper covering film is windowed, the upper covering film and the copper foil are subjected to hot pressing and laminating, the protecting film is removed, and the lower covering film is subjected to hot pressing and laminating on the copper foil;
processing the through hole, the shape and the through hole of the head part of the circuit by the carrier film and the waste discharge film, integrally pressing, plating a protective layer on the exposed part of the shape and the through hole, and finishing the processing of a finished product;
and the lamination processing process, the die cutting processing process, the windowing processing process, the hot-pressing lamination processing process and the pressing processing are respectively connected with the sensor to monitor the size and the position of a product in the FPC production method process.
And a CCD sensor is arranged after each die cutting procedure to monitor the size and the position of the product.
And a CCD sensor is arranged behind each lamination process to monitor the size and the position of the product.
Preferably, the cold pressing pressure is 30-150N during cold pressing.
Preferably, the line die cutting is processed by a circular die cutting machine.
Preferably, the upper covering film is windowed by adopting an impact type carbon dioxide picosecond laser drilling machine.
A CCD sensor is arranged behind each laser drilling machine to monitor the size and the position of the product.
Preferably, when the upper and lower covering films and the copper foil are subjected to hot pressing and covering, the hot pressing temperature is 65-150 ℃;
the hot pressing pressure is 50-200N.
Preferably, when the processing of the through hole, the shape and the through hole of the line head part is carried out, an yttrium aluminum garnet picosecond laser drilling machine is adopted for processing.
Preferably, during the pressing treatment, the pressing temperature is 80-220 ℃, and the pressing pressure is 80-280N.
Preferably, the protective layer is plated by using an OSP process;
the protective layer is made of a film forming agent;
the film forming agent is 2- (3 ', 4' -methyl phenyl) -4-phenyl-5-methylimidazole.
Preferably, the sensor is a CCD sensor.
Preferably, the processing speed is 0.3-30 m/min.
The invention has the beneficial effects that:
the invention provides a FPC die cutting production method which has the characteristics of environmental protection, safety, high production efficiency, high processing precision and high automation degree.
According to the die-cutting production method, the impact type carbon dioxide picosecond laser drilling machine is used for drilling and windowing the insulating layer, so that the precision and the processing speed can be improved, burrs are reduced, and additional damage is reduced; the circular pressing type die cutting machine has the advantages that the required pressure is low, and the speed is high; the whole process of processing the product is monitored by using the high-precision CCD sensor, so that the processing precision and the yield can be effectively improved.
The die cutting production method has the characteristic of high automation degree, has the advantages of high production efficiency, high process precision, low cost and the like, and the comprehensive cost is 40-70% lower than that of an etching method. The die-cutting machine can be increased or decreased according to the design condition of a product, and the purpose of processing a large-size FPC (flexible printed circuit) can be achieved.
Drawings
FIG. 1 is a schematic structural view of the FPC die-cutting production method;
FIG. 2 is a schematic structural view of the FPC die-cutting production method.
In the figure, 1, copper foil is unreeled; 2. unwinding a protective film; 3. cold pressing the clad roller; 4. a circular press circular die cutting machine; 5. a CCD sensor; 6. a traction roller; 7. a copper foil waste collecting roller; 8. covering the film and unreeling; 9. unwinding the bottom supporting film; 10. unreeling the waste discharge film; 11. winding the waste discharge film; 12. an impact type carbon dioxide picosecond laser drilling machine; 13. hot pressing laminating rollers; 14. rolling the protective film; 15. unwinding the lower covering film; 16. unwinding the bottom supporting film; 17. unreeling the waste discharge film; 18. winding the waste discharge film; 19. rolling the bottom supporting film; 20. YAG (yttrium aluminum garnet) picosecond laser drill; 21. an OSP processor.
Detailed Description
The present invention is further illustrated below with reference to specific examples. It will be appreciated by those skilled in the art that the following examples, which are set forth to illustrate the present invention, are intended to be part of the present invention, but not to be construed as limiting the scope of the present invention. The reagents used are all conventional products which are commercially available.
Example 1:
as shown in fig. 1 and 2, the FPC die cutting production method has the following flow:
the protective film unreels 1 and the copper foil unreels 2, and the protective film and the copper foil are pre-pressed through a cold pressing laminating roller 3. Under the traction of a traction roller 6, die cutting the pre-laminated material through a circular die cutting machine 4 according to a designed circuit to obtain a circuit; the copper foil waste left by die cutting is recycled by a copper foil waste collecting roller 7.
Unwinding 8 an upper covering film, windowing through an impact type carbon dioxide picosecond laser drilling machine 12, unwinding 9 a supporting film, unwinding 10 a waste discharge film, hot-pressing and laminating the upper covering film and a copper foil through a hot-pressing laminating roller 13, and winding 11 the waste material generated by drilling a hole through the waste discharge film; the production process comprises the following steps of (1) winding a protective film 14, unwinding a lower cover film 15, laminating a product with the lower cover film through a hot pressing roller under the traction of a traction roller 6, unwinding a bottom supporting film 16, unwinding a waste discharge film 17, processing a head through hole through a circular die cutting machine 5 according to the design of the product, processing the appearance and the through hole through a YAG (yttrium aluminum garnet) picosecond laser drilling machine 20, and winding the waste discharge film 18 and the bottom supporting film 19 after the processing is finished. And the pressing treatment is carried out by a hot-pressing composite roller 13 under the traction of a traction roller 6.
The exposed locations of the features and vias are coated with a protective layer of 2- (3 ', 4' -methyl phenyl) -4-phenyl-5-methyl imidazole by OSP processing using an OSP processor 21.
The laminating mode of the protective film and the copper foil is cold pressing laminating, and the cold pressing pressure is 50N.
The hot-pressing laminating temperature of the upper covering film, the lower covering film and the copper foil is 120 ℃, the hot-pressing pressure is 160N, and a CCD sensor 5 is arranged after the laminating process to monitor the size and the position of the product.
All the die cutting processes are die cutting through the circular die cutting machine 4, and a CCD sensor is arranged after each die cutting process to monitor the size and the position of a product.
A CCD sensor 5 is arranged behind each laser drilling machine to monitor the size and the position of the product.
The pressing temperature is 160 ℃, and the pressing pressure is 100N.
The OSP process film-forming agent 2- (3 ', 4' -methyl phenyl) -4-phenyl-5 methyl imidazole coating has a thickness of 0.3 μm.
The processing speed was 3.5 m/min.
Example 2:
as shown in fig. 1 and 2, the FPC die cutting production method has the following flow:
the protective film unreels 1 and the copper foil unreels 2, and the protective film and the copper foil are pre-pressed through a cold pressing laminating roller 3. Under the traction of a traction roller 6, the pre-laminated material is subjected to die cutting by a circular die cutting machine 4 according to a designed circuit to obtain a circuit; the copper foil waste left by die cutting is recycled by a copper foil waste collecting roller 7.
Unwinding an upper covering film 8, windowing through an impact type carbon dioxide picosecond laser drilling machine 12, simultaneously unwinding a bottom supporting film 9, unwinding a waste discharge film 10, hot-pressing and laminating the upper covering film and a copper foil through a hot-pressing laminating roller 13, and winding waste materials generated by drilling holes in the waste discharge film 11; the production process comprises the following steps of (1) winding a protective film 14, unwinding a lower cover film 15, laminating a product with the lower cover film through a hot pressing roller under the traction of a traction roller 6, unwinding a bottom supporting film 16, unwinding a waste discharge film 17, processing a head through hole through a circular die cutting machine 5 according to the design of the product, processing the appearance and the through hole through a YAG (yttrium aluminum garnet) picosecond laser drilling machine 20, and winding the waste discharge film 18 and the bottom supporting film 19 after the processing is finished. And the pressing treatment is carried out by a hot-pressing composite roller 13 under the traction of a traction roller 6.
The exposed locations of the features and vias are coated with a protective layer of 2- (3 ', 4' -methyl phenyl) -4-phenyl-5-methyl imidazole by OSP processing using an OSP processor 21.
The laminating mode of the protective film and the copper foil is cold pressing laminating, and the cold pressing pressure is 30N.
The hot-pressing laminating temperature of the upper covering film, the lower covering film and the copper foil is 65 ℃, the hot-pressing pressure is 200N, and a CCD sensor 5 is arranged after the laminating process to monitor the size and the position of the product.
All the die cutting processes are die cutting through the circular die cutting machine 4, and a CCD sensor is arranged after each die cutting process to monitor the size and the position of a product.
A CCD sensor 5 is arranged behind each laser drilling machine to monitor the size and the position of the product.
The pressing temperature is 80 ℃, and the pressing pressure is 280N.
The OSP process film-forming agent 2- (3 ', 4' -methyl phenyl) -4-phenyl-5 methyl imidazole coating has a thickness of 0.3 μm.
The processing speed is 0.3 m/min.
Example 3:
as shown in fig. 1 and 2, the FPC die cutting production method has the following flow:
the protective film unreels 1 and the copper foil unreels 2, and the protective film and the copper foil are pre-pressed through a cold pressing laminating roller 3. Under the traction of a traction roller 6, die cutting the pre-laminated material through a circular die cutting machine 4 according to a designed circuit to obtain a circuit; the copper foil waste left by die cutting is recycled by a copper foil waste collecting roller 7.
Unwinding 8 an upper covering film, windowing through an impact type carbon dioxide picosecond laser drilling machine 12, unwinding 9 a supporting film, unwinding 10 a waste discharge film, hot-pressing and laminating the upper covering film and a copper foil through a hot-pressing laminating roller 13, and winding 11 the waste material generated by drilling a hole through the waste discharge film; the production process comprises the following steps of (1) winding a protective film 14, unwinding a lower cover film 15, laminating a product with the lower cover film through a hot pressing roller under the traction of a traction roller 6, unwinding a bottom supporting film 16, unwinding a waste discharge film 17, processing a head through hole through a circular die cutting machine 5 according to the design of the product, processing the appearance and the through hole through a YAG (yttrium aluminum garnet) picosecond laser drilling machine 20, and winding the waste discharge film 18 and the bottom supporting film 19 after the processing is finished. And the pressing treatment is carried out by a hot-pressing composite roller 13 under the traction of a traction roller 6.
The exposed locations of the features and vias are coated with a protective layer of 2- (3 ', 4' -methyl phenyl) -4-phenyl-5-methyl imidazole by OSP processing using an OSP processor 21.
The laminating mode of the protective film and the copper foil is cold pressing laminating, and the cold pressing pressure is 150N.
The hot-pressing laminating temperature of the upper covering film, the lower covering film and the copper foil is 150 ℃, the hot-pressing pressure is 50N, and a CCD sensor 5 is arranged after the laminating process to monitor the size and the position of the product.
All the die cutting processes are die cutting through the circular die cutting machine 4, and a CCD sensor is arranged after each die cutting process to monitor the size and the position of a product.
A CCD sensor 5 is arranged behind each laser drilling machine to monitor the size and the position of the product.
The pressing temperature is 220 ℃, and the pressing pressure is 80N.
The OSP process film-forming agent 2- (3 ', 4' -methyl phenyl) -4-phenyl-5 methyl imidazole coating has a thickness of 0.3 μm.
The processing speed is 30 m/min.
The present invention is not limited to the above alternative embodiments, and any other products in various forms can be obtained by the present invention, and the present invention is within the protection scope of the present invention. The above embodiments should not be construed as limiting the scope of the present invention, and it will be understood by those skilled in the art that modifications may be made to the technical solutions described in the above embodiments, or equivalent substitutions may be made to some or all of the technical features thereof, without departing from the scope of the present invention, and at the same time, such modifications or substitutions may not make the essence of the corresponding technical solutions depart from the scope of the embodiments of the present invention.
Claims (10)
1. The FPC die-cutting production method is characterized by comprising the following steps of:
cold pressing and laminating the protective film and the copper foil, and then performing circuit die cutting;
after the upper covering film is windowed, the upper covering film and the copper foil are subjected to hot pressing and laminating, the protecting film is removed, and the lower covering film is subjected to hot pressing and laminating on the copper foil;
processing the through hole, the shape and the through hole of the head part of the circuit by the carrier film and the waste discharge film, integrally pressing, plating a protective layer on the exposed part of the shape and the through hole, and finishing the processing of a finished product;
the cold pressing laminating treatment process, the die cutting treatment process, the windowing treatment process, the hot pressing laminating treatment process and the pressing treatment are respectively connected with the sensor to monitor the size and the position of a product in the FPC production method process.
2. The FPC die-cutting production method of claim 1, wherein the cold pressing pressure is 30-150N during the cold pressing lamination.
3. The FPC die-cutting production method according to claim 1, wherein the circuit die-cutting is processed by a circular die-cutting machine.
4. The FPC die-cutting production method according to claim 1, wherein the upper coverlay film is windowed by using an impact carbon dioxide picosecond laser drill.
5. The FPC die-cutting production method according to claim 1, wherein when the upper cover film and the lower cover film are respectively hot-pressed and laminated with the copper foil, the hot-pressing temperature is 65-150 ℃;
the hot pressing pressure is 50-200N.
6. The FPC die-cutting production method of claim 1, wherein the processing of the through hole, the shape and the through hole of the circuit head is carried out by using an yttrium aluminum garnet picosecond laser drilling machine.
7. The FPC die-cutting production method of claim 1, wherein during the pressing treatment, the pressing temperature is 80-220 ℃ and the pressing pressure is 80-280N.
8. The FPC die-cutting production method of claim 1, wherein the protective layer is plated by an OSP process;
the protective layer is made of a film forming agent;
the film forming agent is 2- (3 ', 4' -methyl phenyl) -4-phenyl-5-methylimidazole.
9. The FPC die-cutting production method according to claim 1, wherein the sensor employs a CCD sensor.
10. The FPC die-cutting production method according to claim 1, wherein the processing production speed is 0.3-30 m/min.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202210532681.0A CN114900965A (en) | 2022-05-10 | 2022-05-10 | FPC die cutting production method |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202210532681.0A CN114900965A (en) | 2022-05-10 | 2022-05-10 | FPC die cutting production method |
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Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201998545U (en) * | 2010-12-17 | 2011-10-05 | 玉溪誉诚科技有限公司 | Rotary die cutting and bronzing combined machine |
| CN103929905A (en) * | 2014-03-18 | 2014-07-16 | 深圳崇达多层线路板有限公司 | Manufacturing method of step circuit board |
| CN210308194U (en) * | 2019-06-20 | 2020-04-14 | 广州八邦科技有限公司 | FPC cross cutting production facility |
| CN112045323A (en) * | 2020-09-15 | 2020-12-08 | 英诺激光科技股份有限公司 | Double-laser-head windowing method and device |
-
2022
- 2022-05-10 CN CN202210532681.0A patent/CN114900965A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN201998545U (en) * | 2010-12-17 | 2011-10-05 | 玉溪誉诚科技有限公司 | Rotary die cutting and bronzing combined machine |
| CN103929905A (en) * | 2014-03-18 | 2014-07-16 | 深圳崇达多层线路板有限公司 | Manufacturing method of step circuit board |
| CN210308194U (en) * | 2019-06-20 | 2020-04-14 | 广州八邦科技有限公司 | FPC cross cutting production facility |
| CN112045323A (en) * | 2020-09-15 | 2020-12-08 | 英诺激光科技股份有限公司 | Double-laser-head windowing method and device |
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