CN107333394A - Preparation method, circuit board and the electronic equipment of circuit board - Google Patents
Preparation method, circuit board and the electronic equipment of circuit board Download PDFInfo
- Publication number
- CN107333394A CN107333394A CN201710535256.6A CN201710535256A CN107333394A CN 107333394 A CN107333394 A CN 107333394A CN 201710535256 A CN201710535256 A CN 201710535256A CN 107333394 A CN107333394 A CN 107333394A
- Authority
- CN
- China
- Prior art keywords
- circuit board
- pad
- copper foil
- foil layer
- preparation
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Laser Beam Processing (AREA)
Abstract
The invention provides a kind of preparation method of circuit board.The preparation method of the circuit board comprises the following steps：Substrate layer is provided；Copper foil layer is provided to be layed on the substrate layer；Diaphragm is provided to be layed on the copper foil layer；Spill copper foil layer to form pad by laser removal part diaphragm.The present invention also provides a kind of circuit board and a kind of electronic equipment.Compared with correlation technique, the preparation method for the circuit board that the present invention is provided solves the relatively low technical problem of pad precision.
Description
【Technical field】
The present invention relates to electronics field, more particularly to a kind of preparation method of circuit board, circuit board and electronic equipment.
【Background technology】
Flexible PCB (Flexible Printed Circuit Board, FPC) is made of flexible insulating substrate
Printed circuit, have the advantages that many rigid printed circuit boards do not possess.For example it can be with free bend, winding, folding, can
Require any according to space layout to arrange, and arbitrarily moved and flexible in three dimensions, so as to reach components and parts assembling and wire
The integration of connection.The volume of electronic product can be substantially reduced using FPC, electronic product is applicable to high density, miniaturization, Gao Ke
The need for developing by direction.Therefore, FPC is in space flight, military affairs, mobile communication, laptop computer, computer peripheral equipment, PDA, digital phase
It is widely used on the fields such as machine or product.
The need for meeting product contact or welding, flexible PCB is provided with pad, correlation technique, using protection
Layer anchor pad and solid mask anchor pad, the former first discharges corresponding opening from diaphragm according to the size for installing pad,
Then copper foil is covered by way of laminating, the formed precision of the pad is 0.2mm, and the latter is after printing-ink, by exposing
The mode of photodevelopment, it would be desirable to exposed pads at ink remove, to form pad, the formed precision of the pad is 0.1mm,
The formed precision of above two pad is not high, it is impossible to meet the demand of higher precision.
Therefore, it is necessary that providing a kind of preparation method of new circuit board solves the above problems in fact.
【The content of the invention】
It is an object of the invention to provide a kind of preparation method for the circuit board for meeting high-quality pad precision.
The preparation method of circuit board comprises the following steps：Substrate layer is provided；Copper foil layer is provided to be layed on the substrate layer；
Diaphragm is provided to be layed on the copper foil layer；Spill copper foil layer to form pad by laser removal part diaphragm.
It is preferred that, the pad is outwards diffuseed to form by the center from coil to coil of laser self-brazing pad.
It is preferred that, the pad is inwardly diffuseed to form from the edge of laser self-brazing pad to center from coil to coil.
The present invention also provides a kind of circuit board, and the circuit board is made of the preparation method of described circuit board, described
Circuit board includes substrate layer, the copper foil layer being layed on the substrate layer and the diaphragm being layed on the copper foil layer, part
The copper foil layer exposes the diaphragm formation pad.
It is preferred that, the pad is rounded or ellipse.
It is preferred that, the error of distance is less than or equal to 0.06 between the edge of the center of the pad and the circuit board
Millimeter.
It is preferred that, the quantity of the pad is four.
It is preferred that, the diaphragm is fixed on the copper foil layer by glue.
The present invention also provides a kind of electronic equipment, including housing and the circuit board as described above located at the housing.
Compared with correlation technique, the preparation method for the circuit board that the present invention is provided has the advantages that：
The preparation method of circuit board comprises the following steps：Substrate layer is provided；Copper foil layer is provided to be layed on the substrate layer；
Diaphragm is provided to be layed on the copper foil layer；Spill copper foil layer to form pad by laser removal diaphragm.So as to
The formed precision of the pad is greatly improved, realizes that the precision of pad reaches 0.06mm.
【Brief description of the drawings】
The workflow diagram of the preparation method for the circuit board that Fig. 1 provides for the present invention；
A kind of structural representation of the angle for the circuit board that the preparation method of circuit boards of the Fig. 2 to be provided using the present invention is made
Figure；
The structure of another angle for the circuit board that the preparation method of circuit boards of the Fig. 3 to be provided using the present invention is made is shown
It is intended to.；
The path profile of laser in the preparation method for the circuit board that Fig. 4 provides for the present invention.
【Embodiment】
Below in conjunction with the accompanying drawing in the embodiment of the present invention, the technical scheme in the embodiment of the present invention is carried out clear, complete
Site preparation is described, it is clear that described embodiment is only embodiment of the invention a part of, rather than whole embodiments.It is based on
Embodiment in the present invention, it is every other that those of ordinary skill in the art are obtained under the premise of creative work is not made
Embodiment, belongs to the scope of protection of the invention.
Refer to combine and refer to Fig. 1, Fig. 2 and Fig. 3, wherein, the work of the preparation method for the circuit board that Fig. 1 provides for the present invention
Make flow chart, a kind of structure of the angle for the circuit board that Fig. 2 is made for the preparation method using the circuit board of the invention provided is shown
It is intended to, the structural representation of another angle for the circuit board that Fig. 3 is made for the preparation method using the circuit board of the invention provided
Figure.The preparation method of circuit board comprises the following steps：Substrate layer 1 is provided；Copper foil layer 2 is provided to be layed on the substrate layer 1；Carry
It is layed in for diaphragm 3 on the copper foil layer 2；Spill copper foil layer 2 to form pad by laser removal part diaphragm 1
4。
The diaphragm 3 is polyimide film, and the diaphragm 3 is fixed on the copper foil layer 2 by glue 5, the copper
Layers of foil 2 is supported in the substrate layer 1.Certainly, the diaphragm 3 can also be anti-solder ink film or without glue polyimide film.
Specifically, as shown in figure 4, the pad 4 is outwards diffuseed to form by the center from coil to coil of laser self-brazing pad 4.This
In embodiment, the pad 4 is formed by multiple circular or elliptical laser path is radium-shine, and the path of laser is certainly
The center of the pad 4 is to external diffusion, and the spacing in the path of adjacent two lasers is equal.Certainly, laser
Path can also spread from the edge of the pad 4 to center from coil to coil.
The pad 4 is rounded or ellipse.Distance between the center of the pad 4 and the edge of the circuit board 100
Error be less than or equal to 0.06 millimeter.Certainly, the shape of the pad 4 can be arranged as required to as arbitrary shape.
Specifically, the quantity of the pad 4 is four, wherein, three pads 4 are oval, a pad 4
It is rounded.Certainly, in each specific embodiment, the pad 4 of respective numbers can be set according to the actual needs.
The present invention also provides a kind of circuit board 100, the preparation method system that the circuit board 100 uses described circuit board
Into the circuit board 100 includes substrate layer 1, the copper foil layer 2 being layed on the substrate layer 1 and is layed on the copper foil layer 2
Diaphragm 3, the part copper foil layer 2 exposes the diaphragm 1 formation pad 4, and the protective layer 3 is fixed on institute by glue 5
State on copper foil layer 2.When the diaphragm 1 is made up of protective film without incohesion, the diaphragm 3 is just directly anchored on copper foil layer 2.
The circuit board 100 has all technical characteristic of above-described embodiment, therefore, whole beneficial effects with above-described embodiment,
This is not repeated one by one.
The present invention also provides a kind of electronic equipment, including housing and located at the circuit board 100 described in the housing, the circuit
Plate 100 has all technical characteristic of above-described embodiment, and therefore, whole beneficial effects with above-described embodiment differ herein
One repeats.
Compared with correlation technique, the preparation method for the circuit board that the present invention is provided has the advantages that：
The preparation method of circuit board comprises the following steps：Substrate layer is provided；Copper foil layer is provided to be layed on the substrate layer；
Diaphragm is provided to be layed on the copper foil layer；Spill copper foil layer to form pad by laser removal part diaphragm.
So as to greatly improve the formed precision of the pad, realize that the precision of pad reaches 0.06mm.
Above-described is only embodiments of the present invention, it should be noted here that for one of ordinary skill in the art
For, without departing from the concept of the premise of the invention, improvement can also be made, but these belong to the protection model of the present invention
Enclose.
Claims (9)
1. a kind of preparation method of circuit board, it is characterised in that comprise the following steps：
Substrate layer is provided；
Copper foil layer is provided to be layed on the substrate layer；
Diaphragm is provided to be layed on the copper foil layer；
Spill copper foil layer to form pad by laser removal part diaphragm.
2. the preparation method of circuit board as claimed in claim 1, it is characterised in that the pad is by laser self-brazing pad
Center from coil to coil is outwards diffuseed to form.
3. the preparation method of circuit board as claimed in claim 1, it is characterised in that the pad is by laser self-brazing pad
Edge is inwardly diffuseed to form to center from coil to coil.
4. a kind of circuit board, it is characterised in that the circuit board uses the making side of circuit board as claimed in claim 1 or 2
Method is made, and the circuit board includes substrate layer, the copper foil layer being layed on the substrate layer and is layed on the copper foil layer
Diaphragm, the part copper foil layer exposes the diaphragm formation pad.
5. circuit board as claimed in claim 4, it is characterised in that the pad is rounded or ellipse.
6. circuit board as claimed in claim 4, it is characterised in that between the center of the pad and the edge of the circuit board
The error of distance is less than or equal to 0.06 millimeter.
7. circuit board as claimed in claim 4, it is characterised in that the quantity of the pad is four.
8. circuit board as claimed in claim 4, it is characterised in that the diaphragm is fixed on the copper foil layer by glue.
9. a kind of electronic equipment, it is characterised in that including housing and located at the circuit as claimed in claim 4 of the housing
Plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710535256.6A CN107333394A (en) | 2017-07-03 | 2017-07-03 | Preparation method, circuit board and the electronic equipment of circuit board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201710535256.6A CN107333394A (en) | 2017-07-03 | 2017-07-03 | Preparation method, circuit board and the electronic equipment of circuit board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN107333394A true CN107333394A (en) | 2017-11-07 |
Family
ID=60198851
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201710535256.6A Withdrawn CN107333394A (en) | 2017-07-03 | 2017-07-03 | Preparation method, circuit board and the electronic equipment of circuit board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN107333394A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20190198475A1 (en) * | 2017-12-21 | 2019-06-27 | Continental Automotive Systems, Inc. | Laser ablation for wire bonding on organic solderability preservative surface |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000022326A (en) * | 1998-07-07 | 2000-01-21 | Sankyo Seiki Mfg Co Ltd | Apparatus and method for inspecting solder |
| CN103917057A (en) * | 2012-12-31 | 2014-07-09 | 深南电路有限公司 | Manufacturing method of printed circuit board small windowing pad |
| CN106793584A (en) * | 2016-11-29 | 2017-05-31 | 维沃移动通信有限公司 | A kind of flexible PCB and preparation method thereof |
-
2017
- 2017-07-03 CN CN201710535256.6A patent/CN107333394A/en not_active Withdrawn
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2000022326A (en) * | 1998-07-07 | 2000-01-21 | Sankyo Seiki Mfg Co Ltd | Apparatus and method for inspecting solder |
| CN103917057A (en) * | 2012-12-31 | 2014-07-09 | 深南电路有限公司 | Manufacturing method of printed circuit board small windowing pad |
| CN106793584A (en) * | 2016-11-29 | 2017-05-31 | 维沃移动通信有限公司 | A kind of flexible PCB and preparation method thereof |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20190198475A1 (en) * | 2017-12-21 | 2019-06-27 | Continental Automotive Systems, Inc. | Laser ablation for wire bonding on organic solderability preservative surface |
| US10833043B2 (en) * | 2017-12-21 | 2020-11-10 | Vitesco Technologies USA, LLC | Laser ablation for wire bonding on organic solderability preservative surface |
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|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| WW01 | Invention patent application withdrawn after publication |
Application publication date: 20171107 |
|
| WW01 | Invention patent application withdrawn after publication |