CN102036505A - Welding pad structure of circuit board and manufacturing method of welding pad structure - Google Patents
Welding pad structure of circuit board and manufacturing method of welding pad structure Download PDFInfo
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- CN102036505A CN102036505A CN2009101773913A CN200910177391A CN102036505A CN 102036505 A CN102036505 A CN 102036505A CN 2009101773913 A CN2009101773913 A CN 2009101773913A CN 200910177391 A CN200910177391 A CN 200910177391A CN 102036505 A CN102036505 A CN 102036505A
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Abstract
The invention discloses a method for manufacturing a welding pad structure of a circuit board. The method comprises the following steps: firstly, providing the circuit board on which is at least one copper cushion structure is provided; then, forming a sold-mask layer on the surface of the circuit board; and forming a welding-pad opening on the sold-mask layer by laser by way of ablation so as to expose part of the copper cushion structure, and simultaneously, and forming a laser activation layer on the side wall of the welding-pad opening by the laser; and finally, simultaneously growing smelting coppers on the laser activation layer on two opposite side walls of the welding-pad opening and the welding pad structure.
Description
Technical field
The invention relates to circuit board manufacturing technology field, particularly relevant for a kind of circuit board welding pad structure and method for making thereof.
Background technology
In recent years, along with making rapid progress of electronics and semiconductor technology, electronic product more humane, with better function is constantly weeded out the old and bring forth the new, and towards light, thin, short, little trend design.For meeting this trend and trend, the circuit on circuit board or the base plate for packaging must be done thinner and thinner, does more intensive and more intensive, so could constitute the package structure of tool high density and many pinizations characteristic.
See also Fig. 1 to Fig. 5, shown in it is the paste solder printing process schematic representation of existing anti-welding technology and anti-postwelding.As shown in Figure 1, on circuit board 1 surface, be formed with a surface lines structure 1a, comprised a plurality of welding pad structures 2 and fine rule line structure 3.Be simplified illustration, conductive through hole and other internal layer circuit structure in the circuit board 1 are not drawn especially.
As shown in Figure 2; after finishing surface lines structure 1a; then on circuit board 1 surface, be coated with an anti-welding blocking layer 4; wherein; anti-welding blocking layer 4 normally is made of a kind of high-molecular photosensitive printing ink; it can be liquid state or dry film kenel, is mainly used to cover or protect not zinc-plated circuit, makes it avoid the destruction of contingent chemical erosion and grinding agent in etching, welding and electroplating process.
As shown in Figure 3, after the coating of finishing anti-welding blocking layer 4, then utilize exposure and developing process, the part surface of the welding pad structure 2 below a plurality of anti-welding opening 4a of formation expose respectively in anti-welding blocking layer 4.
As shown in Figure 4, before changing the nickel gold process, need carry out a chemical microetch and a cleaning, dispose the oxide on surface and the pollutant of the welding pad structure 2 in the anti-welding opening 4a in advance, yet this step can form a undercutting (undercut) 4b in anti-welding opening 4a bottom.
As shown in Figure 5, then change the nickel gold process, form the change nickel-gold layer 5 that a thickness is about 0.5 to 1.5 micron (micrometer) on the surface of the welding pad structure 2 in anti-welding opening 4a earlier, utilize printing process in each anti-welding opening 4a, to insert soldering tin material 6 then, follow-up through processing such as reflow and pressings, promptly finish structure as shown in Figure 5.
Aforementioned prior art comprises following shortcoming: (1) makes the yield of print solder paste technology descend because the line pitch of the welding pad structure 2 on brilliant (Flip Chip) contact face of circuit board is more and more littler; (2) engaging force is not good between soldering tin material 6 and the anti-welding blocking layer 4; (3) before changing the nickel gold process, chemical microetch of carrying out and cleaning cause the undercutting 4b that forms in anti-welding opening 4a bottom to form a high stress point in subsequent technique, cause the reliability issues of circuit board.Hence one can see that, and industry still needs a kind of method of manufacturing circuit board of improvement, to solve above-mentioned the deficiencies in the prior art and shortcoming.
Summary of the invention
The invention provides a kind of circuit board welding pad structure and method for making thereof of improvement, can solve above-mentioned the deficiencies in the prior art and shortcoming.
One embodiment of the invention provides a kind of method for making of circuit board welding pad structure, and a circuit board at first is provided, and is provided with a copper packing structure on it at least; Then on the surface of this circuit board, form a welding resisting layer; Then, expose this copper packing structure of part, and this laser forms a laser activation layer simultaneously on the sidewall of this welded gasket opening with the laser welded gasket opening of in this welding resisting layer, ablating out; Growthization copper (claiming chemical copper again, chemical copper) simultaneously on this laser activation layer on this welded gasket opening two opposite side walls and this copper packing structure then.
Another embodiment of the present invention discloses a kind of method for making of circuit board welding pad structure, and a circuit board at first is provided, and is provided with a copper packing structure on it at least; Then on the surface of this circuit board, form a welding resisting layer; Then on this welding resisting layer, form a release film; Then, expose this copper packing structure of part with the laser welded gasket opening of in this release film and this welding resisting layer, ablating out; Then the inwall in this welded gasket opening forms a Seed Layer; Then the surface of this release film from this welding resisting layer removed; Insert this welded gasket opening to change copper then.
The present invention another embodiment again discloses a kind of method for making of circuit board welding pad structure, includes: a circuit board is provided, is provided with a copper packing structure on it at least; On the surface of this circuit board, form a welding resisting layer; On this welding resisting layer, form a protective layer; Wherein this protective layer is a nano paint; In this protective layer and this welding resisting layer, form a welded gasket opening, expose this copper packing structure of part; Optionally the inwall in this welded gasket opening forms a Seed Layer; And insert this welded gasket opening to change copper.
For above-mentioned purpose of the present invention, feature and advantage can be become apparent, preferred embodiment cited below particularly, and cooperate appended graphicly, be described in detail below.Yet following preferred implementation and graphic only for reference and explanation usefulness are not to be used for the present invention is limited.
Description of drawings
What Fig. 1 was extremely shown in Figure 5 is the paste solder printing process schematic representation of existing anti-welding technology and anti-postwelding.
Fig. 6 to Fig. 9 is the manufacture method schematic diagram according to welding pad structure on the circuit board shown in one embodiment of the present invention.
Figure 10 to Figure 15 is the manufacture method schematic diagram according to welding pad structure on the circuit board shown in another preferred embodiment of the present invention.
Figure 16 to Figure 19 is according to the present invention's manufacture method schematic diagram of welding pad structure on the circuit board shown in another preferred embodiment again.
Wherein, description of reference numerals is as follows:
1 circuit board, 80 welding pad structures
1a surface lines structure 120 non-conductor welding resisting layers
2 welding pad structure 120a welded gasket openings
3 fine rule line structure 120b laser activation layers
4 anti-welding blocking layer 220 welding resisting layers
The anti-welding opening 220a of 4a welded gasket opening
4b undercutting 230 release films
5 change nickel-gold layer 240 Seed Layer
6 soldering tin materials 260 are changed copper
10 circuit boards, 320 welding resisting layers
10a surface lines structure 320a welded gasket opening
20 copper packing structures, 330 protective layers
30 fine rule line structures, 340 Seed Layer
60 change copper 360 changes copper
70 projection cube structures
Embodiment
See also Fig. 6 to Fig. 9, it is the manufacture method schematic diagram according to welding pad structure on the circuit board shown in one embodiment of the present invention.At first, as shown in Figure 6, on circuit board 10 surfaces, be formed with a surface lines structure 10a, comprised a plurality of copper packing structures 20 and fine rule line structure 30.Circuit board 10 can be individual layer wiring board, double-deck wiring board or multilayer circuit board.Be simplified illustration, conductive through hole and other internal layer circuit structure in the circuit board 10 are not drawn especially.
After finishing surface lines structure 10a, then on circuit board 10 surfaces, be coated with a non-conductor welding resisting layer 120.Wherein, but non-conductor welding resisting layer 120 can comprise the catalysed particulate of a dielectric substrate and laser activation.Wherein, aforesaid catalysed particulate is to be dispersed in the dielectric substrate, and in case for example use after the laser activation, non-conductor welding resisting layer 120 can be induced the deposition of an electric conducting material under the help of this catalysed particulate.
According to a preferred embodiment of the invention, aforesaid dielectric substrate can comprise a macromolecular material, for example, epoxy resin, the epoxy resin of upgrading, polyester, acrylate, the plain polymer of fluorine, polyphenylene oxide, polyimides, phenolic resins, polysulfones, the plain polymer of silicon, BT resin (bismaleimide triazinemodified epoxy resin), the cyanic acid polyester, polyethylene, polycarbonate resin, acrylonitrile-butadiene-styrene copolymer, polyethylene terephthalate (PET), polybutylene terephthalate (PBT), liquid crystal polymer (liquid crystal polyester, LCP), polyamide (PA), nylon 6, kematal (POM), polyphenylene sulfide (PPS) or cyclic olefin copolymer (COC) or the like.
According to a preferred embodiment of the invention, aforesaid catalysed particulate can comprise metal or the formed a plurality of nano particles of its complex.The proper metal complex can be metal oxide, metal nitride, metal misfit thing and/or metallo-chelate.Metal in the metal complex can be zinc, copper, silver, gold, nickel, palladium, platinum, cobalt, rhodium, iridium, indium, iron, manganese, aluminium, chromium, tungsten, vanadium, tantalum and/or titanium or the like.
Then, as shown in Figure 7, with specific laser beam, for example UV laser is beaten on non-conductor welding resisting layer 120, and the welded gasket opening 120a that directly ablates out in non-conductor welding resisting layer 120 makes it expose the copper packing structure 20 of part.At this moment, the glue slag may be left on the surface that copper packing structure 20 is exposed, the electric connection quality of follow-up formation can be hindered, therefore can select to carry out in addition a clear hole step, for example make the electricity consumption slurry, or oxidant, as permanganate, carry out the step of these clear hole de-smears.At this moment, the catalysed particulate in the welded gasket opening 120a is by laser activation, and forms a laser activation layer 120b on the sidewall of welded gasket opening 120a.
As shown in Figure 8, owing on the sidewall of welded gasket opening 120a, formed laser activation layer 120b, it can directly form bond with change copper, change copper deposition process so then carry out one, change copper 60 directly on the surface that the laser activation layer 120b on the welded gasket opening 120a two opposite side walls and copper packing structure 20 expose three different directions grow up simultaneously.Change copper 60 and can continue to grow up, up to the upper surface that protrudes from non-conductor welding resisting layer 120, and constitute a projection cube structure 70, as shown in Figure 9, projection cube structure 70 constitutes a welding pad structure 80 with copper packing structure 20.
Advantage of the present invention comprises at least: (1) goes out welded gasket opening 120a with laser ablation, possesses preferable precision; (2) changing copper 60 can grow up from three directions simultaneously, so its growth rate is fast, can increase production capacity; (3) the present invention does not adopt typography, directly to change copper and the existing print solder material of projection cube structure 70 replacements, has avoided the not good problem of typography yield; And the direct bond of laser activation layer 120b of (4) change copper 60 or projection cube structure 70 and sidewall, so have preferable adhesion, so can promote the reliability of welding pad structure 80.
See also Figure 10 to Figure 15, it is the manufacture method schematic diagram according to welding pad structure on the circuit board shown in another preferred embodiment of the present invention.At first, as shown in figure 10, on circuit board 10 surfaces, be formed with a surface lines structure 10a equally, comprised a plurality of copper packing structures 20 and fine rule line structure 30.Be simplified illustration, conductive through hole and other internal layer circuit structure in the circuit board 10 are not drawn especially.
After finishing surface lines structure 10a, then on circuit board 10 surfaces, be coated with a welding resisting layer 220.Wherein, but welding resisting layer 220 can comprise the catalysed particulate of a dielectric substrate and laser activation.Wherein, aforesaid catalysed particulate is to be dispersed in the dielectric substrate, and in case for example use after the laser activation, welding resisting layer 220 can be induced the deposition of an electric conducting material under the help of this catalysed particulate.In addition, in this embodiment, welding resisting layer 220 is made of high-molecular photosensitive printing ink.
Aforesaid dielectric substrate can comprise a macromolecular material, for example, epoxy resin, the epoxy resin of upgrading, polyester, acrylate, the plain polymer of fluorine, polyphenylene oxide, polyimides, phenolic resins, polysulfones, the plain polymer of silicon, BT resin (bismaleimide triazine modified epoxy resin), the cyanic acid polyester, polyethylene, polycarbonate resin, acrylonitrile-butadiene-styrene copolymer, polyethylene terephthalate (PET), polybutylene terephthalate (PBT), liquid crystal polymer (liquid crystalpolyester, LCP), polyamide (PA), nylon 6, kematal (POM), polyphenylene sulfide (PPS) or cyclic olefin copolymer (COC) or the like.
Aforesaid catalysed particulate can comprise metal or the formed a plurality of nano particles of its complex.The proper metal complex can be metal oxide, metal nitride, metal misfit thing and/or metallo-chelate.Metal in the metal complex can be zinc, copper, silver, gold, nickel, palladium, platinum, cobalt, rhodium, iridium, indium, iron, manganese, aluminium, chromium, tungsten, vanadium, tantalum and/or titanium or the like.
As shown in figure 11, then form a release film that can remove (peelablefilm) 230 on welding resisting layer 220, wherein release film 230 can be a macromolecule membrane, for example, polyethylene terephthalate (PET) release film or the like, its thickness is preferable between the 1-2 micron, but is not limited thereto.
As shown in figure 12, then with specific laser beam, UV laser for example, the welded gasket opening 220a that ablates out in release film 230 and welding resisting layer 220 makes it expose the copper packing structure 20 of part.At this moment, the glue slag may be left on the surface that copper packing structure 20 is exposed, the electric connection quality of follow-up formation can be hindered, therefore can select to carry out in addition a clear hole step, for example make the electricity consumption slurry, or oxidant, as permanganate, carry out the step of these clear hole de-smears.
As shown in figure 13, in release film 230 surfaces, the inwall of welded gasket opening 220a and the surface that copper packing structure 20 exposes form a Seed Layer 240, for example, palladium (Pd), titanium (Ti), tungsten (W) or the like.Seed Layer 240 conformal being deposited on the circuit board 10, and can not fill up welded gasket opening 220a.According to a preferred embodiment of the invention, Seed Layer 240 can be organic Seed Layer or inorganic seed layer.
As shown in figure 14, after the depositing operation of finishing Seed Layer 240, subsequently the surface of release film 230 from welding resisting layer 220 removed, at this moment, only stay the Seed Layer 240 that is formed on the welded gasket opening 220a inwall.
As shown in figure 15, utilizationization copper 260 fills up welded gasket opening 220a, wherein, changes the surface that copper 260 can be lower than welding resisting layer 220, perhaps changes the surface that copper 260 can be higher than welding resisting layer 220.Because the Seed Layer 240 that is formed on the welded gasket opening 220a inwall is arranged, can grow up from three directions simultaneously so change copper, growth rate is accelerated, and then increased production capacity.
See also Figure 16 to Figure 19, its for according to the present invention again another preferred embodiment illustrate the manufacture method schematic diagram of welding pad structure on the circuit board.At first, as shown in figure 16, on circuit board 10 surfaces, be formed with a surface lines structure 10a equally, comprised a plurality of copper packing structures 20 and fine rule line structure 30.Be simplified illustration, conductive through hole and other internal layer circuit structure in the circuit board 10 are not drawn especially.After finishing surface lines structure 10a, then on circuit board 10 surfaces, be coated with a welding resisting layer 320.Wherein, welding resisting layer 320 is made of high-molecular photosensitive printing ink.Then, coating one protective layer 330 on welding resisting layer 320 surfaces, it can be to be formed on welding resisting layer 320 surfaces by modes such as printing, sprinklings, thickness is preferably nano paint approximately less than 2 microns.
As shown in figure 17, then with specific laser beam, UV laser for example, the welded gasket opening 320a that ablates out in protective layer 330 and welding resisting layer 320 makes it expose the copper packing structure 20 of part.At this moment, the glue slag may be left on the surface that copper packing structure 20 is exposed, the electric connection quality of follow-up formation can be hindered, therefore can select to carry out in addition a clear hole step, for example make the electricity consumption slurry, or oxidant, as permanganate, carry out the step of these clear hole de-smears.
As shown in figure 18, after forming welded gasket opening 320a, then optionally on the surface that inwall and the copper packing structure 20 of welded gasket opening 320a exposes, form a Seed Layer 340, for example, palladium (Pd), titanium (Ti), tungsten (W) or the like.On the surface that inwall that is deposited on welded gasket opening 320a that Seed Layer 340 is conformal and copper packing structure 20 expose, and can not be deposited on the protective layer 330, can not fill up welded gasket opening 320a yet.According to a preferred embodiment of the invention, Seed Layer 340 can be organic Seed Layer or inorganic seed layer.
As shown in figure 19, utilizationization copper 360 fills up welded gasket opening 320a, wherein, changes the surface that copper 360 can be lower than protective layer 330, perhaps changes the surface that copper 360 can be higher than protective layer 330.Because the Seed Layer 340 that is formed on the welded gasket opening 320a inwall is arranged, can grow up from three directions simultaneously so change copper, growth rate is accelerated, and then increased production capacity.
The above only is the preferred embodiments of the present invention, and all equalizations of doing according to claim of the present invention change and modify, and all should belong to covering scope of the present invention.
Claims (13)
1. the method for making of a circuit board welding pad structure is characterized in that including:
Circuit board is provided, is provided with a copper packing structure on it at least;
On the surface of this circuit board, form welding resisting layer;
With the laser welded gasket opening of in this welding resisting layer, ablating out, expose this copper packing structure of part, and this laser forms the laser activation layer simultaneously on the sidewall of this welded gasket opening; And
Growthization copper simultaneously on this laser activation layer on this welded gasket opening two opposite side walls and this copper packing structure.
2. the method for making of circuit board welding pad structure as claimed in claim 1 is characterized in that this welding resisting layer comprises dielectric substrate and the laser activation catalysed particulate that is scattered in this dielectric substrate.
3. the method for making of circuit board welding pad structure as claimed in claim 2 is characterized in that this catalysed particulate includes metal or the formed nano particle of its complex.
4. the method for making of a circuit board welding pad structure is characterized in that including:
Circuit board is provided, is provided with the copper packing structure on it at least;
On the surface of this circuit board, form welding resisting layer;
On this welding resisting layer, form release film;
With the laser welded gasket opening of in this release film and this welding resisting layer, ablating out, expose this copper packing structure of part;
Inwall in this welded gasket opening forms Seed Layer;
The surface of this release film from this welding resisting layer removed; And
Insert this welded gasket opening to change copper.
5. the method for making of circuit board welding pad structure as claimed in claim 4 is characterized in that this welding resisting layer comprises dielectric substrate and the laser activation catalysed particulate that is scattered in this dielectric substrate.
6. the method for making of circuit board welding pad structure as claimed in claim 5 is characterized in that this catalysed particulate includes metal or the formed nano particle of its complex.
7. the method for making of circuit board welding pad structure as claimed in claim 4 is characterized in that this release film comprises the polyethylene terephthalate release film.
8. the method for making of circuit board welding pad structure as claimed in claim 4 is characterized in that this Seed Layer includes palladium, titanium or tungsten.
9. the method for making of a circuit board welding pad structure is characterized in that including:
Circuit board is provided, is provided with the copper packing structure on it at least;
On the surface of this circuit board, form welding resisting layer;
On this welding resisting layer, form protective layer;
In this protective layer and this welding resisting layer, form the welded gasket opening, expose this copper packing structure of part;
Optionally the inwall in this welded gasket opening forms Seed Layer; And
Insert this welded gasket opening to change copper.
10. the method for making of circuit board welding pad structure as claimed in claim 9 is characterized in that this protective layer is a nano paint.
11. the method for making of circuit board welding pad structure as claimed in claim 9 is characterized in that this Seed Layer includes palladium, titanium or tungsten.
12. the formed a kind of circuit board welding pad structure of the method for making of circuit board welding pad structure as claimed in claim 1.
13. the formed a kind of circuit board welding pad structure of the method for making of circuit board welding pad structure as claimed in claim 8.
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| Application Number | Priority Date | Filing Date | Title |
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| CN 200910177391 CN102036505B (en) | 2009-09-29 | 2009-09-29 | Welding pad structure of circuit board and manufacturing method of welding pad structure |
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| CN 200910177391 CN102036505B (en) | 2009-09-29 | 2009-09-29 | Welding pad structure of circuit board and manufacturing method of welding pad structure |
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| CN102036505A true CN102036505A (en) | 2011-04-27 |
| CN102036505B CN102036505B (en) | 2012-12-12 |
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Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103079366A (en) * | 2011-10-25 | 2013-05-01 | 青岛长弓塑模有限公司 | Method for manufacturing casing with circuit by spraying and laser carving |
| CN103917057A (en) * | 2012-12-31 | 2014-07-09 | 深南电路有限公司 | Manufacturing method of printed circuit board small windowing pad |
| CN104117778A (en) * | 2014-08-04 | 2014-10-29 | 中山新诺科技股份有限公司 | Method for machining solder mask of circuit board through laser |
| CN105570736A (en) * | 2015-12-11 | 2016-05-11 | 苏州达方电子有限公司 | Light source device |
| CN105570736B (en) * | 2015-12-11 | 2018-08-31 | 苏州达方电子有限公司 | Light supply apparatus |
Family Cites Families (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2001135941A (en) * | 1999-08-26 | 2001-05-18 | Matsushita Electric Works Ltd | Method for manufacturing printed wiring board |
| JP2008258309A (en) * | 2007-04-03 | 2008-10-23 | Hitachi Chem Co Ltd | Punching method for printed circuit board, and printed circuit board |
| CN101296570A (en) * | 2007-04-25 | 2008-10-29 | 富葵精密组件(深圳)有限公司 | Circuit board and production method thereof |
| CN100593963C (en) * | 2007-07-17 | 2010-03-10 | 欣兴电子股份有限公司 | Inside imbedded type line structure and technique thereof |
| JP5404010B2 (en) * | 2007-11-22 | 2014-01-29 | 味の素株式会社 | Multilayer printed wiring board manufacturing method and multilayer printed wiring board |
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2009
- 2009-09-29 CN CN 200910177391 patent/CN102036505B/en active Active
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103079366A (en) * | 2011-10-25 | 2013-05-01 | 青岛长弓塑模有限公司 | Method for manufacturing casing with circuit by spraying and laser carving |
| CN103917057A (en) * | 2012-12-31 | 2014-07-09 | 深南电路有限公司 | Manufacturing method of printed circuit board small windowing pad |
| CN104117778A (en) * | 2014-08-04 | 2014-10-29 | 中山新诺科技股份有限公司 | Method for machining solder mask of circuit board through laser |
| CN104117778B (en) * | 2014-08-04 | 2016-06-15 | 中山新诺科技股份有限公司 | A kind of circuit board welding resisting layer laser processing |
| CN105570736A (en) * | 2015-12-11 | 2016-05-11 | 苏州达方电子有限公司 | Light source device |
| CN105570736B (en) * | 2015-12-11 | 2018-08-31 | 苏州达方电子有限公司 | Light supply apparatus |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102036505B (en) | 2012-12-12 |
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