CN103987196A - Method for manufacturing wet film circuit board free of roast - Google Patents
Method for manufacturing wet film circuit board free of roast Download PDFInfo
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- CN103987196A CN103987196A CN201410224572.8A CN201410224572A CN103987196A CN 103987196 A CN103987196 A CN 103987196A CN 201410224572 A CN201410224572 A CN 201410224572A CN 103987196 A CN103987196 A CN 103987196A
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- compoboard
- wet film
- toast
- carry out
- film circuit
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Abstract
The invention discloses a method for manufacturing a wet film circuit board free of roast. The method comprises the following steps: step 1, manufacturing an engineering and light painting material; step 2, cutting a material and drilling a hole; step 3, manufacturing a surface pattern; step 4, etching; step 5, welding preventing and surface weldability processing; step 6, forming. The method for manufacturing the wet film circuit board free of roast is high in manufacturing precision and further effectively improves product quality and working efficiency. In addition, the manufactured circuit board is stable in performance.
Description
Technical field
The present invention relates to a kind of manufacture method of exempting to toast wet film circuit plate.
Background technology
Along with the day by day anxiety of world energy sources resource, save energy and reduce the cost and become an important topic.Energy savings, raising energy utilization rate, be to ensure the normal production and operation of enterprise, realizes the long-term plan of company's sustainable health development, and Ye Shi enterprise adapts to market demand, reduces costs, increases benefit, improves environment, improves the inevitable choice of enterprise competitiveness.
Summary of the invention
The invention provides a kind of manufacture method of exempting to toast wet film circuit plate, it is high that it not only makes precision, also effectively improved product quality and operating efficiency, and the stable performance of the circuit board making.
The present invention has adopted following technical scheme: a kind of manufacture method of exempting to toast wet film circuit plate, it is characterized in that it comprises the following steps: step 1: carry out engineering, light is painted data make: first template is carried out to graphic designs, then will design figure and carry out project file processing according to processing parameter, then according to working condition, the file of handling well is carried out layout, makes black egative film, the egative film that light is painted rinses, development, photographic fixing, cleaning, air-dry; The egative film of completing is checked, the egative film that checks of finally take again carries out diazo sheet copy as female parent, and the diazo sheet copying is checked again; Step 2: the making of sawing sheet, boring: first output and produce needed copper-clad plate by flow process list requirement size with electric plate shearer; Then according to thickness of slab, carry out wrapper sheet and form compoboard, pin hole is got in the minor face position at compoboard after wrapping; The compoboard of accomplishing fluently pin hole is fixed on numerical control drilling machine work top, then carries out digital control hole drilling, bored burr and batch cutting edge of a knife or a sword of Kong Houzai effects on surface and processed, finally check; Step 3: the making of surfacial pattern: first polish-brush processing is carried out in the surface of compoboard, then wet film circuit printing is exempted to toast in its surface, finish printing laggard row line maintenance of standing a period of time; Step 4: etched making: by the plate having overhauled according to design figure by unwanted partially-etched removal in surfacial pattern; Again the plate surface after etching is exempted to toast wet film stripping, finally the compoboard after etching is checked, repaiies plate; Step 5: anti-welding and surperficial solderability is processed: slight polish-brush is carried out in compoboard surface and process, then the compoboard after polish-brush is carried out to anti-solder ink printing, baking sheet; Then according to location hole and figure, carry out contraposition, by the good combination board to explosure of contraposition; Adopt the sodium carbonate liquor that volume ratio is 1.0-1.2% to develop to the compoboard after exposing, and overhaul; By carrying out anti-welding compoboard, carry out character making, then carry out pre-electroplating treatment, first carry out acid deoiling headed by the process of pre-electroplating treatment, alligatoring after two-stage washing, then through two-stage washing, last pickling; Then dip-coating oxygen-proof film, completes after washing and dries and check dip-coating effect; Step 6: moulding is made: first adopt numerical control mill software to programme to the shape fabricating of compoboard, and simulation test is carried out in the profile path after programming, then adopt CNC milling machine to carry out moulding making; After moulding completes, use jetting machine cleans, dries, checks.
In described step 1, adopting resolution is that the high precision laser drawing mechanism of 20240dpi is made black egative film, uses 100 times of magnifying glasses to check egative film, uses 5KW exposure machine copy diazo sheet; During boring in described step 2, in the minor face position of compoboard, get out the pin hole that aperture is 3.2mm, numerical control drilling machine adopts the brill cutter of 110 degree, the drilling hole amount that bores cutter is less than 1800 holes, uses sand paper more than 2000 orders to process the burr on compoboard surface, batch cutting edge of a knife or a sword; In described step 3, adopt 500 object running roller scrubbers to carry out polish-brush processing; Finish printing standing 30-45 minute laggard row line maintenance; In described step 4, adopting volume ratio is that the sodium hydroxide solution of 3-5% exempts from the plate surface after etching from toast wet film stripping; In described step 5, adopting 800 object running roller scrubbers to carry out slight polish-brush to compoboard surface processes; Adopt 7KW exposure machine to expose to anti-welding figure; In described step 6, the CNC milling cutter of CNC milling machine is two blade milling cutters.
The present invention has following beneficial effect: the present invention not only can produce the product that precision is high, has effectively improved product quality and operating efficiency, and the stable performance of the circuit board making.
Accompanying drawing explanation
Fig. 1 is process chart of the present invention.
Embodiment
As shown in Figure 1, the present invention is a kind of manufacture method of exempting to toast wet film circuit plate, it comprises the following steps: step 1: carry out engineering, light is painted data make: first template is carried out to graphic designs, then will design figure and carry out project file processing according to processing parameter, then according to working condition, the file of handling well is carried out layout, makes black egative film, the egative film that light is painted rinses, development, photographic fixing, cleaning, air-dry; The egative film of completing is checked, the egative film that checks of finally take again carries out diazo sheet copy as female parent, and the diazo sheet copying is checked again; In described step 1, adopting resolution is that the high precision laser drawing mechanism of 20240dpi is made black egative film, uses 100 times of magnifying glasses to check egative film, uses 5KW exposure machine copy diazo sheet.Step 2: the making of sawing sheet, boring: first output and produce needed copper-clad plate by flow process list requirement size with electric plate shearer; Then according to thickness of slab, carry out wrapper sheet and form compoboard, pin hole is got in the minor face position at compoboard after wrapping; The compoboard of accomplishing fluently pin hole is fixed on numerical control drilling machine work top, then carries out digital control hole drilling, bored burr and batch cutting edge of a knife or a sword of Kong Houzai effects on surface and processed, finally check; During boring in described step 2, in the minor face position of compoboard, get out the pin hole that aperture is 3.2mm, numerical control drilling machine adopts the brill cutter of 110 degree, the drilling hole amount that bores cutter is less than 1800 holes, uses sand paper more than 2000 orders to process the burr on compoboard surface, batch cutting edge of a knife or a sword.Step 3: the making of surfacial pattern: first polish-brush processing is carried out in the surface of compoboard, then wet film circuit printing is exempted to toast in its surface, finish printing laggard row line maintenance of standing a period of time; In described step 3, adopt 500 object running roller scrubbers to carry out polish-brush processing; Finish printing standing 30-45 minute laggard row line maintenance.Step 4: etched making: by the plate having overhauled according to design figure by unwanted partially-etched removal in surfacial pattern; Again the plate surface after etching is exempted to toast wet film stripping, finally the compoboard after etching is checked, repaiies plate; In described step 4, adopting volume ratio is that the sodium hydroxide solution of 3-5% exempts from the plate surface after etching from toast wet film stripping.Step 5: anti-welding and surperficial solderability is processed: slight polish-brush is carried out in compoboard surface and process, then the compoboard after polish-brush is carried out to anti-solder ink printing, baking sheet; Then according to location hole and figure, carry out contraposition, by the good combination board to explosure of contraposition; Adopt the sodium carbonate liquor that volume ratio is 1.0-1.2% to develop to the compoboard after exposing, and overhaul; By carrying out anti-welding compoboard, carry out character making, then carry out pre-electroplating treatment, first carry out acid deoiling headed by the process of pre-electroplating treatment, alligatoring after two-stage washing, then through two-stage washing, last pickling; Then dip-coating oxygen-proof film, completes after washing and dries and check dip-coating effect; In described step 5, adopting 800 object running roller scrubbers to carry out slight polish-brush to compoboard surface processes; Adopt 7KW exposure machine to expose to anti-welding figure.Step 6: moulding is made: first adopt numerical control mill software to programme to the shape fabricating of compoboard, and simulation test is carried out in the profile path after programming, then adopt CNC milling machine to carry out moulding making, the CNC milling cutter of described CNC milling machine is two blade milling cutters; After moulding completes, use jetting machine cleans, dries, checks.
Claims (7)
1. exempt to toast a manufacture method for wet film circuit plate, it is characterized in that it comprises the following steps:
Step 1: carry out engineering, light is painted data make: first template is carried out to graphic designs, then will design figure and carry out project file processing according to processing parameter, then according to working condition, the file of handling well is carried out layout, makes black egative film, the egative film that light is painted rinses, development, photographic fixing, cleaning, air-dry; The egative film of completing is checked, the egative film that checks of finally take again carries out diazo sheet copy as female parent, and the diazo sheet copying is checked again;
Step 2: the making of sawing sheet, boring: first output and produce needed copper-clad plate by flow process list requirement size with electric plate shearer; Then according to thickness of slab, carry out wrapper sheet and form compoboard, pin hole is got in the minor face position at compoboard after wrapping; The compoboard of accomplishing fluently pin hole is fixed on numerical control drilling machine work top, then carries out digital control hole drilling, bored burr and batch cutting edge of a knife or a sword of Kong Houzai effects on surface and processed, finally check;
Step 3: the making of surfacial pattern: first polish-brush processing is carried out in the surface of compoboard, then wet film circuit printing is exempted to toast in its surface, finish printing laggard row line maintenance of standing a period of time;
Step 4: etched making: by the plate having overhauled according to design figure by unwanted partially-etched removal in surfacial pattern; Again the plate surface after etching is exempted to toast wet film stripping, finally the compoboard after etching is checked, repaiies plate;
Step 5: anti-welding and surperficial solderability is processed: slight polish-brush is carried out in compoboard surface and process, then the compoboard after polish-brush is carried out to anti-solder ink printing, baking sheet; Then according to location hole and figure, carry out contraposition, by the good combination board to explosure of contraposition; Adopt the sodium carbonate liquor that volume ratio is 1.0-1.2% to develop to the compoboard after exposing, and overhaul; By carrying out anti-welding compoboard, carry out character making, then carry out pre-electroplating treatment, first carry out acid deoiling headed by the process of pre-electroplating treatment, alligatoring after two-stage washing, then through two-stage washing, last pickling; Then dip-coating oxygen-proof film, completes after washing and dries and check dip-coating effect;
Step 6: moulding is made: first adopt numerical control mill software to programme to the shape fabricating of compoboard, and simulation test is carried out in the profile path after programming, then adopt CNC milling machine to carry out moulding making; After moulding completes, use jetting machine cleans, dries, checks.
2. a kind of manufacture method of exempting to toast wet film circuit plate according to claim 1, it is characterized in that adopting in described step 1 resolution is that the high precision laser drawing mechanism of 20240dpi is made black egative film, use 100 times of magnifying glasses to check egative film, use 5KW exposure machine copy diazo sheet.
3. a kind of manufacture method of exempting to toast wet film circuit plate according to claim 1, while it is characterized in that the boring in described step 2, in the minor face position of compoboard, get out the pin hole that aperture is 3.2mm, numerical control drilling machine adopts the brill cutter of 110 degree, the drilling hole amount that bores cutter is less than 1800 holes, uses sand paper more than 2000 orders to process the burr on compoboard surface, batch cutting edge of a knife or a sword.
4. a kind of manufacture method of exempting to toast wet film circuit plate according to claim 1, is characterized in that adopting 500 object running roller scrubbers to carry out polish-brush processing in described step 3; Finish printing standing 30-45 minute laggard row line maintenance.
5. a kind of manufacture method of exempting to toast wet film circuit plate according to claim 1, it is characterized in that adopting in described step 4 volume ratio is that the sodium hydroxide solution of 3-5% exempts from the plate surface after etching from toast wet film stripping.
6. a kind of manufacture method of exempting to toast wet film circuit plate according to claim 1, is characterized in that in described step 5, adopting 800 object running roller scrubbers to carry out slight polish-brush to compoboard surface processes; Adopt 7KW exposure machine to expose to anti-welding figure.
7. a kind of manufacture method of exempting to toast wet film circuit plate according to claim 1, the CNC milling cutter that it is characterized in that CNC milling machine in described step 6 is two blade milling cutters.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410224572.8A CN103987196A (en) | 2014-05-26 | 2014-05-26 | Method for manufacturing wet film circuit board free of roast |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410224572.8A CN103987196A (en) | 2014-05-26 | 2014-05-26 | Method for manufacturing wet film circuit board free of roast |
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| Publication Number | Publication Date |
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| CN103987196A true CN103987196A (en) | 2014-08-13 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410224572.8A Pending CN103987196A (en) | 2014-05-26 | 2014-05-26 | Method for manufacturing wet film circuit board free of roast |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002252446A (en) * | 2001-02-23 | 2002-09-06 | Sony Chem Corp | Manufacturing method of flexible wiring board |
| CN2847796Y (en) * | 2005-11-28 | 2006-12-13 | 志圣科技（广州）有限公司 | Coating machine for wet film circuit |
| CN102638940A (en) * | 2012-04-19 | 2012-08-15 | 蔡新民 | Preparation method of polytetrafluoroethylene high-frequency circuit board |
-
2014
- 2014-05-26 CN CN201410224572.8A patent/CN103987196A/en active Pending
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2002252446A (en) * | 2001-02-23 | 2002-09-06 | Sony Chem Corp | Manufacturing method of flexible wiring board |
| CN2847796Y (en) * | 2005-11-28 | 2006-12-13 | 志圣科技（广州）有限公司 | Coating machine for wet film circuit |
| CN102638940A (en) * | 2012-04-19 | 2012-08-15 | 蔡新民 | Preparation method of polytetrafluoroethylene high-frequency circuit board |
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Application publication date: 20140813 |