CN108696985B - Printed circuit board manufacturing method for improving oil resistance welding contraposition of recognition cover - Google Patents
Printed circuit board manufacturing method for improving oil resistance welding contraposition of recognition cover Download PDFInfo
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- CN108696985B CN108696985B CN201810536695.3A CN201810536695A CN108696985B CN 108696985 B CN108696985 B CN 108696985B CN 201810536695 A CN201810536695 A CN 201810536695A CN 108696985 B CN108696985 B CN 108696985B
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- alignment
- circle
- circuit board
- printed circuit
- point
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
- H05K3/287—Photosensitive compositions
Abstract
The invention discloses a method for preparing a printed circuit board for improving oil resistance welding contraposition of an identification cover, which comprises the following steps: carrying out front part of the process on the single-sided aluminum substrate; then developing and etching, and drawing copper around the solder-resisting alignment point, wherein the solder-resisting alignment point comprises an alignment ring and a middle circular PAD positioned in the middle of the alignment ring, and the copper is drawn between the alignment ring and the middle circular PAD; then performing resistance welding pretreatment, and coating/spraying according to the requirement of the thickness of the ink on the line surface; pre-baking in a tunnel furnace; the plate is collected to be aligned; designing a windowing circle at a position corresponding to the resistance welding counterpoint point of the circuit film on the resistance welding film, wherein the diameter of the windowing circle is smaller than that of the middle circle PAD; and identifying the alignment production by using a CCD (charge coupled device) exposure machine, and identifying the windowing circle of the solder mask film and the solder mask alignment point by using the CCD exposure machine. The invention has the advantages that: design 8mm draw the copper region, draw the copper region bigger than traditional 3mm, 8mm draws the copper region and hinders the white oil height drop on the counterpoint centre circle more obvious, has slight false dew copper to the counterpoint ring external diameter, has strengthened the effect that CCD discerned.
Description
Technical Field
The invention relates to the technical field of printed circuit board manufacturing, in particular to a technology for identifying oil resistance welding contraposition points in a printed circuit board manufacturing process.
Background
Solder resist ink is a coat of a printed circuit board, and can play a role in preventing short circuit and edge junction between conductors caused by moisture, chemicals and the like, resisting various severe environments, ensuring functions of the printed circuit board and the like. At present, liquid solder resist ink is basically used in the industry, the coating mode is traditionally screen printing, and with the continuous increase of the productivity of various manufacturers and the development of industry 4.0, the solder resist coating is also imported to be automatic, and is commonly roller coating and electrostatic/low-pressure spraying. During screen printing, the solder resist contraposition points on the technical edge can be subjected to edge sealing treatment, so that the contraposition points have no ink, and manual contraposition or automatic contraposition grabbing is facilitated; however, no effective scheme is available in the coating and spraying industry at present for edge sealing of the technical edge to reserve a solder resist alignment point, so that the whole board surface is coated with ink after coating and spraying, and the solder resist alignment point is also covered. The green oil has transparency, the green oil covers the position point without influence, and the alignment can be normally identified, but with the introduction of white oil coating/spraying, the white oil covers the solder resist to cause alignment identification difficulty, and the circuit PAD can not be manually aligned. The existing improvement method comprises the following steps: firstly, as shown in FIG. 1, a hole 1 is used for replacing a line PAD for alignment, but a slight ink is coated and sprayed into the hole, so that the hole diameter is changed, and the accuracy of alignment by using a PIN nail and the alignment of a recognition hole is poor; secondly, as shown in fig. 2, the copper-digging area 21 of the circuit PAD is 3mm by 3mm, the diameter of the middle circle PAD 22 is 1.5mm, the periphery 23 and the middle circle 22 are copper sheets, and the rest copper-digging area 21 is a dielectric layer, and a special light source is adopted to grab the circuit PAD, so that the effect improvement is not obvious, therefore, the recognition method of the white oil covering to the position point is a special case improved in the industry.
Disclosure of Invention
The invention provides a printed circuit board manufacturing method for improving the recognition of a solder resist contraposition point, aiming at solving the problem of difficult contraposition recognition caused by white oil covering the solder resist contraposition point in the prior art.
The invention is realized by the following technical scheme:
a printed circuit board preparation method for improving the oil resistance welding contraposition of the identification cover comprises the following steps:
(1) pre-treating, coating and baking a single-sided aluminum substrate;
(2) designing a solder resist alignment point at a position corresponding to each corner of a process edge on a circuit film and preventing fool, aligning and exposing the circuit film, and then carrying out development etching to obtain a desired pattern, so that copper is drawn around the solder resist alignment point, the size of the copper drawing area is 8mm to 8mm, the solder resist alignment point comprises an alignment ring and a middle circular PAD positioned in the middle of the alignment ring, and copper is drawn between the alignment ring and the middle circular PAD;
(3) performing AOI and solder mask manufacturing pretreatment of the printed circuit board according to the steps, and coating/spraying according to the requirement of the thickness of the ink on the circuit surface;
(4) pre-baking in a tunnel furnace;
(5) the plate is collected to be aligned;
(6) solder mask film design: designing a windowing circle at a position corresponding to the resistance welding alignment point of the circuit film, wherein the diameter of the windowing circle is smaller than that of the middle circle PAD;
(7) and identifying alignment production by using a CCD (charge coupled device) exposure machine, and identifying a film windowing circle and a solder mask alignment point by using the CCD exposure machine at the same time.
Further, the outer diameter of the alignment ring is 2.5mm, the inner diameter thereof is 1.9mm, and the diameter of the middle circle PAD is 1.5 mm.
Further, the diameter of the windowing circle of the solder resist film is 1.0 mm.
Further, the pre-baking temperature of the tunnel furnace is 100 ℃, 105 ℃, 110 ℃, 100 ℃ in sequence from the initial temperature to the outlet temperature, and the conveying speed is 3.5 m/min.
Further, setting parameters of the CCD exposure machine: the diameter of a solder resist contraposition point of the printed circuit board is 2.5mm, and the diameter of the solder resist contraposition point of the solder resist film is 1.0 mm; the whiteness/gray level of the black is set to be 80-100, the brightness is set to be 10-20, the edge of a resistance welding point with the diameter of 2.5mm presents a clear regular circle, and CCD judgment and identification are facilitated.
It should be noted that, the middle circle PAD is a PAD, the AOI is an automatic optical inspection, and the etched circuit pattern is scanned to compare the engineering data, and defects such as a notch, an open circuit, a short circuit, etc. are scanned.
The invention has the beneficial effects that: design 8mm draw the copper region, draw the copper region bigger than traditional 3mm, when the same amount white oil covers on drawing the copper region, 8mm draws the white oil thickness in the copper region and draws the copper region thinner than 3mm, so 8mm draws the copper region and welds the white oil height drop more obvious on counterpoint centre circle with hindering, white oil thickness is different, its reflection of light effect is different, be equipped with the counterpoint ring simultaneously, its outside diameter has slight false dew copper, has strengthened the effect that CCD discerned.
Drawings
FIG. 1 is a schematic diagram of a positioning hole in the prior art;
FIG. 2 is a diagram illustrating a PAD alignment structure of a circuit in the prior art;
FIG. 3 is a schematic diagram of a PAD alignment structure of the circuit of the present invention.
DETAILED DESCRIPTION OF EMBODIMENT (S) OF INVENTION
A printed circuit board manufacturing method for improving oil resistance welding contraposition of a recognition cover comprises the following steps:
(1) pre-treating, coating and baking a single-sided aluminum substrate;
(2) designing a solder resist alignment point at a position corresponding to each corner of a process edge on a circuit film and preventing fool, carrying out proper compensation according to different copper thickness etching parameters of various industries, aligning the circuit film, exposing and then carrying out development etching to obtain a desired pattern, as shown in fig. 3, drawing copper around the solder resist alignment point, wherein the size of a copper drawing area 31 is 8mm x 8mm, the solder resist alignment point comprises an alignment ring 32 and a middle circular PAD 33 positioned in the middle of the alignment ring 32, the outer diameter of the alignment ring is 2.5mm, the inner diameter of the alignment ring is 1.9mm, and the diameter of the middle circular PAD is 1.5 mm. Copper is also drawn between the alignment ring and the middle circular PAD;
(3) performing AOI and solder mask manufacturing pretreatment of the printed circuit board according to the steps, and coating/spraying according to the requirement of the thickness of the ink on the circuit surface;
(4) pre-baking in a tunnel furnace, wherein the pre-baking temperature is 100 ℃, 105 ℃, 110 ℃, 100 ℃ in sequence from the beginning to the outlet, and the conveying speed is 3.5 m/min; the ink on the circuit surface and the ink on the substrate are quickly cured, the flow of the ink from a high position to a low position is reduced, and the height difference of the ink is ensured.
(5) The plate is collected to be aligned;
(6) solder mask film design: designing a windowing circle at a position corresponding to the resistance welding counterpoint point of the circuit film, wherein the diameter of the windowing circle is 1.0 mm;
(7) identifying alignment production by using a CCD (charge coupled device) exposure machine, and identifying a film windowing circle and a solder resist alignment point by using the CCD exposure machine;
setting parameters of the CCD exposure machine: the diameter of a solder resist contraposition point (the diameter of the printed circuit board after etching) for grabbing the printed circuit board is 2.5mm, and the diameter of the solder resist contraposition point for grabbing the solder resist film is 1.0 mm; the whiteness/gray level of the black is set to be 80-100, the brightness is set to be 10-20 (white oil has light reflectivity), so that the edge of a solder resist contraposition point with the diameter of 2.5mm presents a clear regular circle, and CCD judgment and identification are facilitated.
The solder resist film is located above the printed circuit board, the CCD is simultaneously aligned to the solder resist alignment point of the solder resist film and the solder resist alignment point of the printed circuit board, the white oil reflecting effect is different due to the fact that the thickness of the white oil on the copper drawing area and the thickness of the white oil on the middle circle are different, the design of the alignment ring is adopted, the outer diameter of the alignment ring has slight false copper exposure, and the effect of the CCD on identifying the solder resist alignment point is improved.
The invention has the advantages that:
firstly, white oil cover oil resistance welding alignment PAD can be identified for alignment, and the alignment precision meets +/-2 mil;
identifying and aligning by adopting a common CCD;
and thirdly, the flow and the cost are not required to be increased.
The technical solutions provided by the embodiments of the present invention are described in detail above, and the principles and embodiments of the present invention are explained herein by using specific examples, and the descriptions of the embodiments are only used to help understanding the principles of the embodiments of the present invention; meanwhile, for a person skilled in the art, according to the embodiments of the present invention, there may be variations in the specific implementation manners and application ranges, and in summary, the present disclosure should not be construed as limiting the invention.
Claims (5)
1. A printed circuit board manufacturing method for improving oil resistance welding contraposition of a recognition cover is characterized by comprising the following steps: the printed circuit board manufacturing steps are as follows:
(1) pre-treating, coating and baking a single-sided aluminum substrate;
(2) designing a solder resist alignment point at a position corresponding to each corner of a process edge on a circuit film and preventing fool, aligning and exposing the circuit film, and then carrying out development etching to obtain a desired pattern, so that copper is drawn around the solder resist alignment point, the size of the copper drawing area is 8mm to 8mm, the solder resist alignment point comprises an alignment ring and a middle circular PAD positioned in the middle of the alignment ring, and copper is drawn between the alignment ring and the middle circular PAD;
(3) performing AOI and solder mask manufacturing pretreatment of the printed circuit board according to the steps, and coating/spraying according to the requirement of the thickness of the ink on the circuit surface;
(4) pre-baking in a tunnel furnace;
(5) the plate is collected to be aligned;
(6) solder mask film design: designing a windowing circle at a position corresponding to the resistance welding alignment point of the circuit film, wherein the diameter of the windowing circle is smaller than that of the middle circle PAD;
(7) and identifying alignment production by using a CCD (charge coupled device) exposure machine, and identifying a film windowing circle and a solder mask alignment point by using the CCD exposure machine at the same time.
2. The method for manufacturing a printed circuit board with improved recognition of oil-blocking soldering pair sites according to claim 1, wherein the method comprises the following steps: the outer diameter of the alignment ring is 2.5mm, the inner diameter of the alignment ring is 1.9mm, and the diameter of the middle circle PAD is 1.5 mm.
3. The method for manufacturing a printed circuit board for improving the recognition of the oil-blocking soldering pair point of the cover according to claim 2, wherein the method comprises the following steps: the diameter of the windowing circle of the solder mask film is 1.0 mm.
4. The method for manufacturing a printed circuit board with improved recognition of oil-blocking soldering pair sites according to claim 1, wherein the method comprises the following steps: the pre-baking temperature of the tunnel furnace is 100 ℃, 105 ℃, 110 ℃, 100 ℃ in sequence from the beginning to the outlet, and the conveying speed is 3.5 m/min.
5. The method for manufacturing a printed circuit board with improved recognition of oil-blocking soldering pair sites according to claim 1, wherein the method comprises the following steps: setting parameters of the CCD exposure machine: the diameter of a solder resist contraposition point of the printed circuit board is 2.5mm, and the diameter of the solder resist contraposition point of the solder resist film is 1.0 mm; the whiteness/gray level of the black is set to be 80-100, the brightness is set to be 10-20, the edge of a resistance welding point with the diameter of 2.5mm presents a clear regular circle, and CCD judgment and identification are facilitated.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201810536695.3A CN108696985B (en) | 2018-05-30 | 2018-05-30 | Printed circuit board manufacturing method for improving oil resistance welding contraposition of recognition cover |
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| CN201810536695.3A CN108696985B (en) | 2018-05-30 | 2018-05-30 | Printed circuit board manufacturing method for improving oil resistance welding contraposition of recognition cover |
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| CN108696985A CN108696985A (en) | 2018-10-23 |
| CN108696985B true CN108696985B (en) | 2021-06-04 |
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Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN109862693B (en) * | 2019-02-01 | 2022-01-07 | 奥士康精密电路（惠州）有限公司 | Annular welding disk and control method thereof |
| CN110099507B (en) * | 2019-05-29 | 2022-04-05 | 广东依顿电子科技股份有限公司 | Thick copper circuit board and manufacturing method thereof |
| CN112867281B (en) * | 2021-01-04 | 2022-05-10 | 深圳市景旺电子股份有限公司 | Flexible circuit board and manufacturing method thereof |
| CN114245575A (en) * | 2021-11-16 | 2022-03-25 | 龙南骏亚电子科技有限公司 | Design method of PCB resistance welding zigzag circuit board |
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| JPS608705A (en) * | 1983-06-29 | 1985-01-17 | Hitachi Ltd | Pattern detector |
| CN1980522A (en) * | 2005-11-29 | 2007-06-13 | 比亚迪股份有限公司 | Optical identifying welding plate for printed circuit board and mfg. method |
| CN103025064A (en) * | 2012-12-05 | 2013-04-03 | 深圳市兴达线路板有限公司 | Circuit board contraposition method |
| CN105307412A (en) * | 2015-10-23 | 2016-02-03 | 深圳市强达电路有限公司 | Thick copper foil PCB printing processing method |
| KR20160070592A (en) * | 2014-12-10 | 2016-06-20 | 삼성전기주식회사 | Method for recognizing of alignment mark and board having alignment mark |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US6668449B2 (en) * | 2001-06-25 | 2003-12-30 | Micron Technology, Inc. | Method of making a semiconductor device having an opening in a solder mask |
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2018
- 2018-05-30 CN CN201810536695.3A patent/CN108696985B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS608705A (en) * | 1983-06-29 | 1985-01-17 | Hitachi Ltd | Pattern detector |
| CN1980522A (en) * | 2005-11-29 | 2007-06-13 | 比亚迪股份有限公司 | Optical identifying welding plate for printed circuit board and mfg. method |
| CN103025064A (en) * | 2012-12-05 | 2013-04-03 | 深圳市兴达线路板有限公司 | Circuit board contraposition method |
| KR20160070592A (en) * | 2014-12-10 | 2016-06-20 | 삼성전기주식회사 | Method for recognizing of alignment mark and board having alignment mark |
| CN105307412A (en) * | 2015-10-23 | 2016-02-03 | 深圳市强达电路有限公司 | Thick copper foil PCB printing processing method |
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