CN112020205B - Printed circuit board and manufacturing method thereof - Google Patents
Printed circuit board and manufacturing method thereof Download PDFInfo
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- CN112020205B CN112020205B CN202010810643.8A CN202010810643A CN112020205B CN 112020205 B CN112020205 B CN 112020205B CN 202010810643 A CN202010810643 A CN 202010810643A CN 112020205 B CN112020205 B CN 112020205B
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
- H05K3/0017—Etching of the substrate by chemical or physical means
- H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/282—Applying non-metallic protective coatings for inhibiting the corrosion of the circuit, e.g. for preserving the solderability
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/288—Removal of non-metallic coatings, e.g. for repairing
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
- H05K2201/09—Shape and layout
- H05K2201/09818—Shape or layout details not covered by a single group of H05K2201/09009 - H05K2201/09809
- H05K2201/09927—Machine readable code, e.g. bar code
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
- H05K2203/107—Using laser light
Abstract
The invention discloses a printed circuit board and a manufacturing method thereof, wherein the printed circuit board comprises a surface layer, a substrate and a bottom layer which are sequentially stacked, a solder resist ink layer and a laser etching ink layer are covered on the surface layer, the solder resist ink layer and the laser etching ink layer are arranged on the same layer, a copper sheet is arranged in the area of the surface layer corresponding to the laser etching ink layer, and hollowed points are carved in the laser etching ink layer, so that the copper sheet leaks out of the hollowed points to form a two-dimensional code pattern. Or the surface layer comprises a routing layer and a laser etching ink layer, the routing layer and the laser etching ink layer are arranged on the same layer, and the solder resist ink layer is covered on the routing layer. The substrate is an insulating substrate and is white, and hollowed-out points are laser-etched in the laser-etched ink area, so that the substrate leaks out of the hollowed-out points to form a two-dimensional code pattern; or the substrate is a conductive substrate, an insulating layer is arranged between the surface layer and the substrate and is white, and hollowed-out points are formed in the laser etching ink area in a laser etching mode, so that the insulating layer leaks out of the hollowed-out points to form a two-dimensional code pattern. The invention has the advantages of high production efficiency, high product percent of pass and the like.
Description
Technical Field
The invention relates to the technical field of printed circuit board design and manufacture, in particular to a printed circuit board and a manufacture method thereof.
Background
In the electronic industry, in order to trace each product, a unique code, that is, a currently common two-dimensional code, needs to be identified on the product to identify the identity information of the product. And binding the key work station test items and test results of the products in the production process of the production line with the two-dimensional code of each product so as to facilitate later inquiry. Traditional product two-dimensional code is the paper two-dimensional code usually, and the paper two-dimensional code pastes on the product, but the paper two-dimensional code drops easily, wastes manpower and material resources, consequently has basically eliminated at present.
At present, the product two-dimensional code is generally obtained by a laser method on a PCB (printed circuit board). Specifically, a layer of white ink is printed on the PCB, then a layer of black ink is printed, and then laser is performed to remove part of the black ink in a laser mode to expose the white ink on the bottom layer, so that a two-dimensional code graph is formed. However, the method needs to print two layers of printing ink, and the printing of the two layers of printing ink has many disadvantages, firstly, two printing procedures are needed to print the two layers of printing ink, and each printing procedure needs to be kept still for a certain time, so that the plate manufacturing procedures are more, the production time is long, and the production efficiency is low; secondly, the risk of dust pollution exists in the ink standing process, and foreign matters are easily formed on the surface of the laser etching ink to cause bad code scanning; moreover, when the combination between the two layers of printing ink is poor, the printing ink can fall off, or the bubbling phenomenon can occur between the two layers of printing ink; and two-layer printing ink need accurate counterpoint at the in-process of printing, otherwise can expose the regional of bottom white oil or radium carving time radium-shine to not having bottom white oil at the printing ink edge, cause two-dimensional code figure incomplete or figure to interfere, therefore no matter in PCB board factory or radium carving production site, all cause production efficiency to hang down, the product percent of pass is low, the condition that the defective products are many.
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Disclosure of Invention
The invention mainly aims to provide a printed circuit board and a manufacturing method thereof, and aims to solve the technical problems of low production efficiency and more defective products of a PCB laser two-dimensional code.
In order to achieve the above object, the present invention provides a printed circuit board, which comprises a surface layer, a substrate and a bottom layer, wherein the surface layer, the substrate and the bottom layer are sequentially stacked, the surface layer is covered with a solder resist ink layer and a laser etching ink layer, the solder resist ink layer and the laser etching ink layer are arranged on the same layer, wherein,
the area, corresponding to the laser etching ink layer, of the surface layer is provided with a copper sheet, and hollowed points are formed in the laser etching ink layer in a laser etching mode, so that the copper sheet leaks out of the hollowed points to form a two-dimensional code pattern.
Preferably, the laser etching ink layer is arranged on one side of the solder resist ink layer.
Preferably, the thickness of the solder resist ink layer is the same as that of the laser etching ink layer.
Preferably, the laser etching ink layer is a black ink layer; the resistance welding ink layer is a green ink layer, or the resistance welding ink layer is a black ink layer and is integrally arranged with the laser etching ink layer.
The invention also provides a manufacturing method of the printed circuit board, the printed circuit board comprises a surface layer, a substrate and a bottom layer which are sequentially stacked, and the manufacturing method of the printed circuit board comprises the following steps:
etching a copper sheet on the surface layer, and separating the copper sheet from other circuits on the surface layer;
printing ink on the surface layer in an area which avoids the copper sheet to form a solder mask ink layer covering the surface layer except the copper sheet; printing ink on the surface layer in an area corresponding to the copper sheet to form a laser etching ink layer covering the copper sheet;
and carrying out laser etching on the laser etching ink layer to form hollowed-out points, so that the copper sheet leaks out of the hollowed-out points to form a two-dimensional code pattern.
The invention also provides a printed circuit board, which comprises a surface layer, a substrate and a bottom layer which are sequentially stacked;
the surface layer comprises a routing layer and a laser etching ink layer, the routing layer and the laser etching ink layer are arranged on the same layer, and a solder resist ink layer covers the routing layer;
the substrate is an insulating substrate and is white, and hollowed-out points are laser-engraved in the laser-engraved ink area, so that the substrate leaks out of the hollowed-out points to form a two-dimensional code pattern;
or the substrate is a conductive substrate, an insulating layer is arranged between the surface layer and the substrate, the insulating layer is white, and hollowed points are laser-etched in the laser-etched ink area, so that the insulating layer leaks out of the hollowed points to form a two-dimensional code pattern.
Preferably, the laser etching ink layer is arranged on one side of the routing layer.
Preferably, the routing layer and the laser etching ink layer have the same thickness.
Preferably, the laser etching ink layer is a black ink layer; the solder resist ink layer is a green ink layer or a black ink layer.
The invention also provides a manufacturing method of the printed circuit board, the printed circuit board comprises a surface layer, a substrate and a bottom layer which are sequentially stacked, the substrate is an insulating substrate and is white, and the manufacturing method of the printed circuit board comprises the following steps:
etching a copper sheet on the surface layer to form a routing layer and a blank area except the routing layer on the surface layer;
printing ink on the wiring layer to form a solder mask ink layer covering the wiring layer; printing ink on the blank area on the surface layer to form a laser etching ink layer;
performing laser etching on the laser etching ink layer to form hollowed-out points, so that the substrate is exposed out of the hollowed-out points to form a two-dimensional code pattern;
alternatively, the first and second electrodes may be,
the printed circuit board comprises a surface layer, a substrate and a bottom layer which are sequentially stacked, wherein the substrate is a conductive substrate, an insulating layer is arranged between the surface layer and the substrate, the insulating layer is white, and the manufacturing method of the printed circuit board comprises the following steps:
etching a copper sheet on the surface layer to form a routing layer and a blank area except the routing layer on the surface layer;
printing ink on the wiring layer to form a solder mask ink layer covering the wiring layer; printing ink on the blank area on the surface layer to form a laser etching ink layer;
and carrying out laser etching on the laser etching ink layer to form hollowed-out points, so that the insulating layer is leaked from the hollowed-out points to form a two-dimensional code pattern.
According to the printed circuit board and the manufacturing method thereof, the copper sheet on the surface layer can be used, or the white or almost white substrate can be used, and the white or almost white insulating layer can be used as the bottom layer of the two-dimensional code, so that two layers of printing ink are not required to be manufactured, the plate manufacturing process is reduced, the production time is shortened, the production efficiency is improved, the risk that the printing ink is polluted by dust is avoided, the problems that the two printing ink layers swell and cannot be aligned accurately are prevented, the product yield is high, and the reliability of product recording and tracking is effectively improved. Moreover, when a white or nearly white insulating substrate and a white or nearly white insulating layer are utilized, even under a high-temperature and high-humidity environment, the substrate or the insulating layer is not corroded, the brightness of the surface light is not deteriorated, the definition of the two-dimensional code is ensured, and the normal scanning and identification of the two-dimensional code pattern are further ensured. The invention can be applied to various common printed circuit boards such as FR-4, ceramics, metal substrates and the like, has wide application range, saves manpower and material resources, reduces the production cost of products, improves the yield of the products and increases the profit of the products.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.
FIG. 1 is a schematic diagram of a structure of a printed circuit board according to a first embodiment of the present invention, in which a solder resist ink layer and a laser etching ink layer are printed sequentially;
FIG. 2 is a schematic diagram of a structure of a printed circuit board with a solder resist ink layer and a laser etching ink layer printed together according to a first embodiment of the present invention;
FIG. 3 is a schematic flow chart of a method for manufacturing a printed circuit board according to a first embodiment of the present invention;
FIG. 4 is a schematic diagram of a structure of a printed circuit board according to a second embodiment of the present invention, in which a solder resist ink layer and a laser etching ink layer are printed sequentially;
FIG. 5 is a schematic diagram of a structure of a second embodiment of the present invention for printing a solder resist ink layer and a laser etching ink layer together;
FIG. 6 is a schematic flow chart of a method for manufacturing a printed circuit board according to a second embodiment of the present invention;
FIG. 7 is a schematic diagram of a structure of a third embodiment of the present invention in which a solder resist ink layer and a laser etching ink layer are printed sequentially;
FIG. 8 is a schematic diagram of a structure of a third embodiment of the present invention for printing a solder resist ink layer and a laser etching ink layer together;
fig. 9 is a schematic flow chart of a method for manufacturing a printed circuit board according to a third embodiment of the invention.
The reference numbers illustrate:
| reference numerals | Name (R) | Reference numerals | Name (R) |
| 100 | Printed |
40 | Solder |
| 10 | |
50 | Laser |
| 11 | |
60 | |
| 20 | |
70 | |
| 30 | Bottom layer |
The implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that, if directional indications (such as up, down, left, right, front, and back … …) are involved in the embodiment of the present invention, the directional indications are only used to explain the relative positional relationship between the components, the movement situation, and the like in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indications are changed accordingly.
In addition, if there is a description of "first", "second", etc. in an embodiment of the present invention, the description of "first", "second", etc. is for descriptive purposes only and is not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.
As shown in fig. 1 to 3, in a first embodiment of the present invention, a printed circuit board 100 is provided, where the printed circuit board 100 includes a surface layer 10, a substrate 20, and a bottom layer 30, which are sequentially stacked, a solder resist ink layer 40 and a laser etching ink layer 50 cover the surface layer 10, and the solder resist ink layer 40 and the laser etching ink layer 50 are disposed on the same layer, where a copper sheet 11 is disposed in a region of the surface layer 10 corresponding to the laser etching ink layer 50, and a hollow point is laser-etched in the laser etching ink layer 50, so that the copper sheet 11 leaks out of the hollow point to form a two-dimensional code pattern.
The substrate 20 is made of FR-4, ceramic, metal, such as copper, aluminum, etc., the upper and lower surfaces of the substrate 20 are respectively coated with copper to form copper layers, then photosensitive films are laminated on the copper layers, film sheets representing circuit patterns are covered on the surfaces of the photosensitive films, light polymerization reaction is performed under ultraviolet irradiation, the films which do not undergo polymerization reaction are dissolved by developing solution to expose copper, the films which undergo polymerization reaction are not dissolved, and the copper is still covered. And plating copper on the exposed copper and the via hole again to reach the required thickness, and plating a protective tin layer on the surface of the via hole. The dry film covering the copper layer is then removed and the unprotected copper is etched away with an etching solution to form the desired copper skin or traces of the top layer 10(top layer) and bottom layer 30(bottom layer). If FR-4 or ceramic material is used as the material of the substrate 20, it is not conductive, so that copper can be directly plated on the substrate 20 for wiring. If the material of the substrate 20 is selected from metals such as copper and aluminum, that is, the substrate 20 is a copper substrate 20 or an aluminum substrate 20, and in order to prevent the surface layer 10, the bottom layer 30 and the substrate 20 from being electrically conductive, an insulating medium layer is required to be disposed between the substrate 20 and the surface layer 10 and the bottom layer 30, and the material of the insulating medium is usually PP (pre, prepreg).
When the existing printed circuit board 100 is manufactured, solder resist ink needs to be printed on the upper surface of the surface layer 10 and the lower surface of the bottom layer 30 respectively to form a solder resist ink layer 40, the most common solder resist ink is green, and in addition, common ink such as black, blue and the like exists. The solder resist ink layer 40 covers a copper sheet or a circuit that needs to be insulated and protected for the Surface layer 10 and the bottom layer 30, exposes a pad that needs to be subjected to SMT (Surface Mounting Technology), and performs gold plating/immersion plating and other treatments on the Surface of the pad to facilitate subsequent processes such as chip Mounting. Finally, the printed circuit board 100 is processed to form a double-sided PCB board. When the two-dimensional code needs to be laser-etched, two layers of printing ink need to be printed on the solder resist ink layer 40 more, for example, firstly, one layer of white printing ink is printed on the solder resist ink layer 40 more, a white ink layer is formed, then one layer of black printing ink is printed on the white ink layer, a black ink layer is formed, then the black ink layer is laser-etched, the white ink layer is exposed, and the two-dimensional code is formed.
In the manufacturing process of the printed circuit board 100 of this embodiment, a position to be subjected to laser etching is selected, a copper sheet 11 is etched on the surface layer 10 corresponding to the position to be subjected to laser etching, and the copper sheet 11 is separated from other circuits on the surface layer 10, so as to avoid affecting other circuits. Then avoid on the top layer 10 the regional printing ink of copper sheet 11 forms and covers in on the top layer 10 except that the outer solder mask ink layer 40 of copper sheet 11, printing ink can select for use green, blue or black etc. correspond respectively and form green solder mask ink layer 40, blue solder mask ink layer 40, black solder mask ink layer 40, solder mask ink layer 40 covers the region except that copper sheet 11 on with top layer 10 to insulate and protect this region. It will be appreciated that the solder resist ink layer 40 exposes the pads that require SMT. Printing ink on the surface layer 10 in the area corresponding to the copper sheet 11 to form a laser etching ink layer 50 covering the copper sheet 11, specifically, for the formation of the subsequent two-dimensional code, printing black ink on the surface layer 10 in the area corresponding to the copper sheet 11 to form a black laser etching ink layer 50, wherein the black laser etching ink layer 50 insulates and protects the area of the surface layer 10 where the copper sheet 11 is located. Finally, performing laser etching on the laser etching ink layer 50 to form hollowed-out points, so that the copper sheet 11 leaks out of the hollowed-out points to form a two-dimensional code pattern. Specifically, the copper sheet 11 is used as the bottom layer of the two-dimensional code, the laser etching ink layer 50 is partially laser-etched during laser etching to form hollow points, the copper sheet 11 below is exposed, and a two-dimensional code pattern is formed. Because the surface of the copper sheet 11 is very bright, the two-dimensional code pattern is very clear and easy to sweep, and the laser etching effect is good.
In the first embodiment, the printed circuit board 100 can utilize the copper sheet 11 of the surface layer 10 as the bottom layer of the two-dimensional code, only the laser etching ink layer 50 is printed in the area corresponding to the copper sheet 11, and clear and easily-scanned two-dimensional code patterns can be formed by laser etching in the laser etching ink layer 50, so that the plate manufacturing process is reduced, the production time is shortened, the production efficiency is improved, the risk that the ink is polluted by dust is avoided, the problems that the ink is bulged between two ink layers and cannot be accurately aligned are prevented, and the product yield is high.
In this embodiment, the laser etching ink layer 50 is disposed on one side of the solder resist ink layer 40. As shown in fig. 1 and fig. 2, the laser etching ink layer 50 and the solder resist ink layer 40 cover the surface layer 10 together, the laser etching ink layer 50 is arranged on the right side of the solder resist ink layer 40, the area division is reasonable, the mutual interference during the separate printing is avoided, and the laser etching ink layer 50 does not influence the area of the pad of the solder resist ink layer 40. The thickness of the solder resist ink layer 40 and the laser etching ink layer 50 in this embodiment is the same, so as to ensure the flatness of the printed circuit board 100.
In this embodiment, the laser etching ink layer 50 is a black ink layer; the solder resist ink layer 40 is a green ink layer, or the solder resist ink layer 40 is a black ink layer and is integrally arranged with the laser etching ink layer 50. Specifically, if the solder resist ink layer 40 and the laser etching ink layer 50 have different colors, for example, in a general case, the solder resist ink layer 40 is a green ink layer, and the laser etching ink layer 50 is a black ink layer, as shown in fig. 1, the solder resist ink layer 40 is formed by printing a green ink, and then the laser etching ink layer 50 is formed by printing a black ink. If solder mask ink layer 40 with when radium carving printing ink layer 50 colour is unanimous, for example, solder mask ink layer 40 with radium carving printing ink layer 50 is black printing ink layer, as shown in fig. 2, then solder mask ink layer 40 with radium carving printing ink layer 50 an organic whole sets up, promptly, solder mask printing ink layer 40 with radium carving printing ink layer 50 adopts black printing ink to print formation together, need not make radium carving printing ink layer 50 alone again, further shortens the process, has saved manufacturing cost and time, improves production efficiency, guarantees radium carving effect simultaneously.
In fig. 1 to 9 of this embodiment, the hatching only distinguishes the solder resist ink layer 40 and the laser etching ink layer 50 from other layers, and the hatching angles of the solder resist ink layer 40 and the laser etching ink layer 50 are not the same, which indicates that the solder resist ink layer 40 and the laser etching ink layer 50 are printed successively; the hatching angles of the solder resist ink layer 40 and the laser carving ink layer 50 are consistent, which means that the solder resist ink layer 40 and the laser carving ink layer 50 are printed together.
As shown in fig. 3, the present invention further provides a method for manufacturing a printed circuit board 100, where the printed circuit board 100 includes a surface layer 10, a substrate 20, and a bottom layer 30, which are sequentially stacked, and the method for manufacturing the printed circuit board 100 includes the following steps:
step S100, etching a copper sheet on the surface layer, and arranging the copper sheet and other circuits on the surface layer in a separated manner;
when the printed circuit board 100 of this embodiment is manufactured, a position to be subjected to laser etching is selected, a copper sheet 11 is etched on the surface layer 10 corresponding to the position to be subjected to laser etching, and the copper sheet 11 is separated from other circuits on the surface layer 10, so that influence on other circuits is avoided.
Step S200, printing ink on the surface layer in an area avoiding the copper sheet to form a solder mask ink layer covering the surface layer except the copper sheet; printing ink on the surface layer in an area corresponding to the copper sheet to form a laser etching ink layer covering the copper sheet;
avoid on the top layer 10 the regional printing ink of copper sheet 11 forms to cover in on the top layer 10 except that the outer solder mask ink layer 40 of copper sheet 11, printing ink can select for use green, blue or black etc. corresponds respectively and forms green solder mask ink layer 40, blue solder mask ink layer 40, black solder mask ink layer 40, solder mask ink layer 40 covers the region except that copper sheet 11 on with top layer 10 to insulate and protect this region. It will be appreciated that the solder resist ink layer 40 exposes the pads that require SMT. Printing ink on the surface layer 10 in the area corresponding to the copper sheet 11 to form a laser etching ink layer 50 covering the copper sheet 11, specifically, for the formation of the subsequent two-dimensional code, printing black ink on the surface layer 10 in the area corresponding to the copper sheet 11 to form a black laser etching ink layer 50, wherein the black laser etching ink layer 50 insulates and protects the area of the surface layer 10 where the copper sheet 11 is located.
Step S300, performing laser etching on the laser etching ink layer to form hollowed-out points, so that the copper sheet leaks out of the hollowed-out points to form a two-dimensional code pattern.
The copper sheet 11 is used as the bottom layer of the two-dimensional code, the laser etching ink layer 50 is partially laser-etched during laser etching, hollow points are formed, the copper sheet 11 below is exposed, and a two-dimensional code pattern is formed. Because the surface of the copper sheet 11 is very bright, the two-dimensional code pattern is very clear and easy to sweep, and the laser etching effect is good.
In the manufacturing method of the printed circuit board 100 of the embodiment, the copper sheet 11 on the surface layer 10 is used as the bottom layer of the two-dimensional code, the laser etching ink layer 50 is only required to be printed in the area corresponding to the copper sheet 11, the clear and easily-scanned two-dimensional code pattern can be formed by laser etching in the laser etching ink layer 50, the plate manufacturing process is reduced, the length of production is shortened, the production efficiency is improved, the risk that the ink is polluted by dust is avoided, the problems that the ink is bulged between two ink layers and cannot be accurately aligned are solved, and the product yield is high.
As shown in fig. 4 to 6, in another embodiment of the present invention, a printed circuit board 100 is provided, where the printed circuit board 100 includes a surface layer 10, a substrate 20, and a bottom layer 30, which are sequentially stacked, the surface layer 10 includes a routing layer 70 and a laser etching ink layer 50, the routing layer 70 and the laser etching ink layer 50 are disposed at the same layer, and a solder resist ink layer 40 covers the routing layer 70; the substrate 20 is an insulating substrate 20, the substrate 20 is white, and hollowed-out points are laser-engraved in the laser-engraved ink area, so that the substrate 20 leaks out of the hollowed-out points to form a two-dimensional code pattern.
The substrate 20 of the second embodiment is made of FR-4 and ceramic, that is, the substrate 20 is an FR-4 board or a ceramic board, the color of the substrate 20 is white or nearly white, and the substrate 20 can be used as a bottom layer of a two-dimensional code, and the substrate 20 has insulation property, and there is no need to provide an insulating layer 60 between the substrate 20 and the surface layer 10.
When the printed circuit board 100 of the second embodiment is manufactured, a position to be subjected to laser etching is selected, a copper sheet 11 is etched on the surface layer 10 corresponding to the position to be subjected to laser etching, an area on the surface layer 10 where the copper sheet 11 is not etched is a wiring layer 70 for normal wiring, the area where the copper sheet 11 is etched becomes a blank area, and the substrate 20 is exposed, so that the blank area is exposed out of the substrate 20 and serves as a bottom layer of the two-dimensional code. Then printing ink on the routing layer 70, forming and covering the solder mask ink layer 40 on the routing layer 70, wherein the printing ink can be selected from green, blue or black, and the printing ink can be respectively and correspondingly formed into the green solder mask ink layer 40, the blue solder mask ink layer 40 and the black solder mask ink layer 40, the solder mask ink layer 40 covers the routing layer 70 to insulate and protect the routing layer 70. It will be appreciated that the solder resist ink layer 40 exposes the pads that require SMT. And printing ink on the blank area on the surface layer 10 to form a laser etching ink layer 50, specifically, printing black ink on the blank area for the formation of the subsequent two-dimensional code to form a black laser etching ink layer 50, wherein the black laser etching ink layer 50 insulates and protects the corresponding area. Finally, performing laser etching on the laser etching ink layer 50 to form hollowed-out points, so that the substrate 20 leaks out of the hollowed-out points to form a two-dimensional code pattern. Specifically, the substrate 20 with a white or nearly white color is used as the bottom layer of the two-dimensional code, and the laser etching ink layer 50 is partially removed during laser etching to form a hollow point, so that the substrate 20 below is exposed to form a two-dimensional code pattern. Because base plate 20 is white or nearly white, and the surface is bright, and the two-dimensional code pattern is very clear easily to be swept, and radium carving is effectual to, base plate 20 is FR-4 board or ceramic plate, even under the environment of high temperature and high humidity, also can not take place to corrode, and surface luminance can not worsen, guarantees the definition of two-dimensional code, and then guarantees the normal scanning discernment of two-dimensional code pattern.
In the second embodiment, the printed circuit board 100 can regard white or nearly white insulating substrate 20 as the bottom of two-dimensional code, only need etch away a copper sheet 11 when the routing layer 70 on preparation top layer 10, form the blank, print radium carving printing ink layer 50 in blank, and radium carving just can form clear easy two-dimensional code pattern of sweeping at radium carving printing ink layer 50 radium carving, the system board process has been reduced, long time when having shortened production, and the production efficiency is improved, and the risk of printing ink by dust pollution has been avoided, prevent the problem of bulging and can not accurate counterpoint between the two-layer printing ink layer, the product percent of pass is high. Meanwhile, even in a high-temperature and high-humidity environment, the substrate 20 is not corroded, the brightness of the surface of the substrate is not deteriorated, the definition of the two-dimensional code is guaranteed, and the normal scanning and recognition of the two-dimensional code pattern are further guaranteed.
As shown in fig. 6, the present invention further provides a method for manufacturing a printed circuit board 100, where the printed circuit board 100 includes a surface layer 10, a substrate 20, and a bottom layer 30, which are sequentially stacked, the substrate 20 is an insulating substrate 20, and the substrate 20 is white, and the method for manufacturing the printed circuit board 100 includes the following steps:
s400, etching a copper sheet on the surface layer to form a routing layer and a blank area except the routing layer on the surface layer;
when the printed circuit board 100 of this embodiment is manufactured, the position to be subjected to laser etching is selected, and a copper sheet 11 is etched away on the surface layer 10 corresponding to the position to be subjected to laser etching, and the area on the surface layer 10 where the copper sheet 11 is not etched away is the routing layer 70, so that normal wiring is performed, the area where the copper sheet 11 is etched away becomes a blank area, and the substrate 20 is exposed, so that the substrate 20 exposed in the blank area is used as the bottom layer of the two-dimensional code.
S500, printing ink on the routing layer to form a solder mask ink layer covering the routing layer; printing ink on the blank area on the surface layer to form a laser etching ink layer;
printing ink on the routing layer 70 forms and covers the solder mask ink layer 40 on the routing layer 70, the printing ink can select green, blue or black and the like, and the green solder mask ink layer 40, the blue solder mask ink layer 40 and the black solder mask ink layer 40 are correspondingly formed respectively, the solder mask ink layer 40 covers the routing layer 70 to insulate and protect the routing layer 70. It will be appreciated that the solder resist ink layer 40 exposes the pads that require SMT. And printing ink on the blank area on the surface layer 10 to form a laser etching ink layer 50, specifically, printing black ink on the blank area for the formation of the subsequent two-dimensional code to form a black laser etching ink layer 50, wherein the black laser etching ink layer 50 insulates and protects the corresponding area.
S600, performing laser etching on the laser etching ink layer to form hollowed-out points, so that the substrate is exposed out of the hollowed-out points to form a two-dimensional code pattern.
The substrate 20 with the white color or the nearly white color is used as the bottom layer of the two-dimensional code, the laser etching ink layer 50 is partially laser-etched during laser etching to form hollow points, the substrate 20 below is exposed, and a two-dimensional code pattern is formed. Because base plate 20 is white or nearly white, and the surface is bright, and the two-dimensional code pattern is very clear easily to be swept, and radium carving is effectual to, base plate 20 is FR-4 board or ceramic plate, even under the environment of high temperature and high humidity, also can not take place to corrode, and surface luminance can not worsen, guarantees the definition of two-dimensional code, and then guarantees the normal scanning discernment of two-dimensional code pattern.
In the manufacturing method of the printed circuit board 100 of the embodiment, the white or nearly white insulating substrate 20 can be used as the bottom layer of the two-dimensional code, only one copper sheet 11 needs to be etched away when the routing layer 70 of the surface layer 10 is manufactured, a blank area is formed, the laser etching ink layer 50 is printed on the blank area, a clear and easily-scanned two-dimensional code pattern can be formed by laser etching in the laser etching ink layer 50, the plate manufacturing process is reduced, the production time is shortened, the production efficiency is improved, the risk that the ink is polluted by dust is avoided, the problems that the ink is bulged between two ink layers and cannot be accurately aligned are prevented, and the product yield is high. Meanwhile, even in a high-temperature and high-humidity environment, the substrate 20 is not corroded, the brightness of the surface of the substrate is not deteriorated, the definition of the two-dimensional code is guaranteed, and the normal scanning and recognition of the two-dimensional code pattern are further guaranteed.
As shown in fig. 7 to 9, based on the second embodiment, in a third embodiment of the present invention, a printed circuit board 100 is provided, where the printed circuit board 100 includes a surface layer 10, a substrate 20, and a bottom layer 30, which are sequentially stacked, the surface layer 10 includes a routing layer 70 and a laser etching ink layer 50, the routing layer 70 and the laser etching ink layer 50 are disposed on the same layer, and a solder resist ink layer 40 covers the routing layer 70; the substrate 20 is a conductive substrate 20, an insulating layer 60 is arranged between the surface layer 10 and the substrate 20, the insulating layer 60 is white, and hollowed-out points are laser-engraved in the laser-engraved ink area, so that the insulating layer 60 leaks out of the hollowed-out points to form a two-dimensional code pattern.
The substrate 20 of the third embodiment is made of metal, such as copper, aluminum, etc., that is, the substrate 20 is a copper substrate 20 or an aluminum substrate 20, and the copper substrate 20 is taken as an example to be described below, since the copper substrate 20 is conductive, an insulating layer 60 needs to be disposed between the copper substrate 20 and the surface layer 10, and the insulating layer 60 is white or nearly white in color, and can be used as a bottom layer of the two-dimensional code.
When the printed circuit board 100 of the third embodiment is manufactured, a position to be subjected to laser etching is selected, a copper sheet 11 is etched on the surface layer 10 corresponding to the position to be subjected to laser etching, an area on the surface layer 10 where the copper sheet 11 is not etched is a wiring layer 70 for normal wiring, the area where the copper sheet 11 is etched becomes a blank area, and the insulating layer 60 is exposed, so that the insulating layer 60 exposed in the blank area is used as a bottom layer of the two-dimensional code. Then printing ink on the routing layer 70, forming and covering the solder mask ink layer 40 on the routing layer 70, wherein the printing ink can be selected from green, blue or black, and the printing ink can be respectively and correspondingly formed into the green solder mask ink layer 40, the blue solder mask ink layer 40 and the black solder mask ink layer 40, the solder mask ink layer 40 covers the routing layer 70 to insulate and protect the routing layer 70. It will be appreciated that the solder resist ink layer 40 exposes the pads that require SMT. And printing ink on the blank area on the surface layer 10 to form a laser etching ink layer 50, specifically, printing black ink on the blank area for the formation of the subsequent two-dimensional code to form a black laser etching ink layer 50, wherein the black laser etching ink layer 50 insulates and protects the corresponding area. Finally, performing laser etching on the laser etching ink layer 50 to form hollowed-out points, so that the insulating layer 60 leaks out of the hollowed-out points to form a two-dimensional code pattern. Specifically, the insulating layer 60 with a white or nearly white color is used as the bottom layer of the two-dimensional code, and when laser etching is performed, the laser etching ink layer 50 is partially laser-etched to form hollow points, so that the underlying insulating layer 60 is exposed, and a two-dimensional code pattern is formed. Because insulating layer 60 is white or nearly white, the surface is bright, and the two-dimensional code pattern is very clear easily to be swept, and radium carving is effectual, and, insulating layer 60 can choose for use high temperature resistant and corrosion-resistant material to make, even under the environment of high temperature and high humidity, also can not take place to corrode, and surface luminance can not worsen, guarantees the definition of two-dimensional code, and then guarantees the normal scanning discernment of two-dimensional code pattern.
In the third embodiment, the printed circuit board 100 can be white or nearly white the insulating layer 60 is used as the bottom layer of the two-dimensional code, only one copper sheet 11 needs to be etched away during the routing layer 70 of the surface layer 10 to form a blank area, the laser etching ink layer 50 is printed on the blank area, and a clear and easily-scanned two-dimensional code pattern can be formed by laser etching the laser etching ink layer 50, so that the plate making process is reduced, the production time is shortened, the production efficiency is improved, the risk that the ink is polluted by dust is avoided, the problems that the ink is bulged between two ink layers and can not be accurately aligned are prevented, and the product yield is high. Meanwhile, even in a high-temperature and high-humidity environment, the insulating layer 60 is not corroded, the brightness of the surface of the insulating layer is not deteriorated, the definition of the two-dimensional code is guaranteed, and the normal scanning and recognition of the two-dimensional code pattern are guaranteed.
As shown in fig. 9, the present invention further provides a method for manufacturing a printed circuit board 100, where the printed circuit board 100 includes a surface layer 10, a substrate 20, and a bottom layer 30, which are sequentially stacked, the substrate 20 is a conductive substrate 20, an insulating layer 60 is disposed between the surface layer 10 and the substrate 20, the insulating layer 60 is white, and the method for manufacturing the printed circuit board 100 includes the following steps:
step S700, etching a copper sheet on the surface layer to form a routing layer and a blank area except the routing layer on the surface layer;
when the printed circuit board 100 of this embodiment is manufactured, the position to be subjected to laser etching is selected, and the position to be subjected to laser etching corresponds to the position to be subjected to laser etching, a copper sheet 11 is etched away from the surface layer 10, the area on the surface layer 10 where the copper sheet 11 is not etched away is a wiring layer 70, normal wiring is performed, the area where the copper sheet 11 is etched away becomes a blank area, and the insulating layer 60 is exposed, so that the insulating layer 60 exposed from the blank area is used as a bottom layer of the two-dimensional code.
Step S800, printing ink on the routing layer to form a solder mask ink layer covering the routing layer; printing ink on the blank area on the surface layer to form a laser etching ink layer;
printing ink on the routing layer 70 forms and covers the solder mask ink layer 40 on the routing layer 70, the printing ink can select green, blue or black and the like, and the green solder mask ink layer 40, the blue solder mask ink layer 40 and the black solder mask ink layer 40 are correspondingly formed respectively, the solder mask ink layer 40 covers the routing layer 70 to insulate and protect the routing layer 70. It will be appreciated that the solder resist ink layer 40 exposes the pads that require SMT. And printing ink on the blank area on the surface layer 10 to form a laser etching ink layer 50, specifically, printing black ink on the blank area for the formation of the subsequent two-dimensional code to form a black laser etching ink layer 50, wherein the black laser etching ink layer 50 insulates and protects the corresponding area.
And S900, performing laser etching on the laser etching ink layer to form hollowed-out points, so that the insulating layer leaks out of the hollowed-out points to form a two-dimensional code pattern.
The insulating layer 60 with the white color or the nearly white color is used as the bottom layer of the two-dimensional code, when in laser etching, the laser etching ink layer 50 is partially laser-etched to form hollow points, the insulating layer 60 below is exposed, and a two-dimensional code pattern is formed. Because the insulating layer 60 is white or nearly white, the surface is bright, the two-dimensional code pattern is very clear and easy to scan, and the laser etching effect is good. Moreover, the insulating layer 60 can be made of a high-temperature-resistant and corrosion-resistant material, so that corrosion does not occur even in a high-temperature and high-humidity environment, the brightness of the surface is not deteriorated, the definition of the two-dimensional code is ensured, and the normal scanning and identification of the two-dimensional code pattern are further ensured.
In the method for manufacturing the printed circuit board 100 according to this embodiment, the insulating layer 60 which is white or nearly white can be used as the bottom layer of the two-dimensional code, only one copper sheet 11 needs to be etched away during the manufacturing of the routing layer 70 of the surface layer 10 to form a blank area, the laser etching ink layer 50 is printed on the blank area, a clear and easily-scanned two-dimensional code pattern can be formed by laser etching on the laser etching ink layer 50, the board manufacturing process is reduced, the production time is shortened, the production efficiency is improved, the risk that the ink is polluted by dust is avoided, the problems that the two-dimensional code pattern is bulged between the two ink layers and the two-dimensional code pattern cannot be accurately aligned are prevented, and the product yield is high. Meanwhile, even in a high-temperature and high-humidity environment, the insulating layer 60 is not corroded, the brightness of the surface of the insulating layer is not deteriorated, the definition of the two-dimensional code is guaranteed, and the normal scanning and recognition of the two-dimensional code pattern are guaranteed.
In the second and third embodiments, the laser etching ink layer 50 is disposed on one side of the routing layer 70. As shown in fig. 4 to 9, the routing layer 70 of the surface layer 10 covered by the solder resist ink layer 40, the laser etching ink layer 50 and the solder resist ink layer 40 are arranged on the same layer, and the laser etching ink layer 50 is arranged on the right side of the solder resist ink layer 40, so that the area division is reasonable, the mutual interference during separate printing is avoided, and the area of the pad of the solder resist ink layer 40 is not affected by the laser etching ink layer 50. The routing layer 70 and the laser etching ink layer 50 of this embodiment have the same thickness, so as to ensure the flatness of the printed circuit board 100.
In the second and third embodiments, the laser etching ink layer 50 is a black ink layer; the solder resist ink layer 40 is a green ink layer or a black ink layer. Specifically, if the solder resist ink layer 40 and the laser etching ink layer 50 have different colors, for example, in a general case, the solder resist ink layer 40 is a green ink layer, and the laser etching ink layer 50 is a black ink layer, as shown in fig. 4 and 7, the solder resist ink layer 40 is formed by printing a green ink, and then the laser etching ink layer 50 is formed by printing a black ink. If solder mask ink layer 40 with when radium carving printing ink layer 50 colour is unanimous, for example, solder mask ink layer 40 with radium carving printing ink layer 50 is black printing ink layer, as shown in fig. 5 and fig. 8, then can with solder mask ink layer 40 with radium carving printing ink layer 50 adopts black printing ink one printing to form, need not make radium carving printing ink layer 50 alone again, further shortens the process, has saved manufacturing cost and time, improves production efficiency, guarantees radium carving effect simultaneously.
In the printed circuit board 100 and the manufacturing method thereof provided by the invention, the copper sheet 11 of the surface layer 10 can be used, or the white or almost white substrate 20 can be used, and the white or almost white insulating layer 60 can be used as the bottom layer of the two-dimensional code, so that two layers of printing ink are not required to be manufactured, the board manufacturing process is reduced, the production time is shortened, the production efficiency is improved, the risk that the printing ink is polluted by dust is avoided, the problems of bulging and inaccurate alignment between the two printing ink layers are prevented, the product yield is high, and the reliability of product recording and tracking is effectively improved. Moreover, when the white or nearly white insulating substrate 20 and the white or nearly white insulating layer 60 are used, even in a high-temperature and high-humidity environment, the substrate 20 is not corroded, the surface brightness is not deteriorated, the definition of the two-dimensional code is ensured, and the normal scanning and identification of the two-dimensional code pattern are further ensured. The invention can be applied to various common printed circuit boards 100 such as FR-4, ceramics, metal substrates 20 and the like, has wide application range, saves manpower and material resources, reduces the production cost of products, improves the yield of the products and increases the profit of the products.
The above description is only a preferred embodiment of the present invention, and not intended to limit the scope of the present invention, and all modifications and equivalents of the present invention, which are made by the contents of the present specification and the accompanying drawings, or directly/indirectly applied to other related technical fields, are included in the scope of the present invention.
Claims (10)
1. A printed circuit board is characterized in that the printed circuit board comprises a surface layer, a substrate and a bottom layer which are sequentially stacked, wherein a solder resist ink layer and a laser etching ink layer are covered on the surface layer, the solder resist ink layer and the laser etching ink layer are arranged on the same layer and are mutually avoided,
the area, corresponding to the laser etching ink layer, of the surface layer is provided with a copper sheet, and hollowed points are formed in the laser etching ink layer in a laser etching mode, so that the copper sheet leaks out of the hollowed points to form a two-dimensional code pattern.
2. The printed circuit board of claim 1, wherein the laser-engraved ink layer is disposed on one side of the solder resist ink layer.
3. The printed circuit board of claim 2, wherein the solder resist ink layer and the laser etch ink layer are the same thickness.
4. The printed circuit board of claim 1, wherein the laser-engraved ink layer is a black ink layer; the resistance welding ink layer is a green ink layer, or the resistance welding ink layer is a black ink layer and is integrally arranged with the laser etching ink layer.
5. The manufacturing method of the printed circuit board is characterized in that the printed circuit board comprises a surface layer, a substrate and a bottom layer which are sequentially stacked, and the manufacturing method of the printed circuit board comprises the following steps:
etching a copper sheet on the surface layer, and separating the copper sheet from other circuits on the surface layer;
printing ink on the surface layer in an area which avoids the copper sheet to form a solder mask ink layer covering the surface layer except the copper sheet; printing ink on the surface layer in an area corresponding to the copper sheet to form a laser etching ink layer covering the copper sheet;
and carrying out laser etching on the laser etching ink layer to form hollowed-out points, so that the copper sheet leaks out of the hollowed-out points to form a two-dimensional code pattern.
6. The printed circuit board is characterized by comprising a surface layer, a substrate and a bottom layer which are sequentially stacked;
the surface layer comprises a routing layer and a laser etching ink layer, the routing layer and the laser etching ink layer are arranged on the same layer, and a solder resist ink layer covers the routing layer;
the substrate is an insulating substrate and is white, and hollowed-out points are laser-carved in the laser-carved ink layer, so that the substrate leaks out of the hollowed-out points to form a two-dimensional code pattern;
or the substrate is a conductive substrate, an insulating layer is arranged between the surface layer and the substrate, the insulating layer is white, and hollowed points are laser-etched in the laser-etched ink area, so that the insulating layer leaks out of the hollowed points to form a two-dimensional code pattern.
7. The printed circuit board of claim 6, wherein the laser-etched ink layer is disposed on one side of the routing layer.
8. The printed circuit board of claim 7, wherein the routing layer and the laser engraved ink layer are the same thickness.
9. The printed circuit board of claim 6, wherein the laser-engraved ink layer is a black ink layer; the solder resist ink layer is a green ink layer or a black ink layer.
10. A method for manufacturing a printed circuit board is characterized in that,
the printed circuit board comprises a surface layer, a substrate and a bottom layer which are sequentially stacked, wherein the substrate is an insulating substrate and is white, and the manufacturing method of the printed circuit board comprises the following steps:
etching a copper sheet on the surface layer to form a routing layer and a blank area except the routing layer on the surface layer;
printing ink on the wiring layer to form a solder mask ink layer covering the wiring layer; printing ink on the blank area on the surface layer to form a laser etching ink layer;
performing laser etching on the laser etching ink layer to form hollowed-out points, so that the substrate is exposed out of the hollowed-out points to form a two-dimensional code pattern;
alternatively, the first and second electrodes may be,
the printed circuit board comprises a surface layer, a substrate and a bottom layer which are sequentially stacked, wherein the substrate is a conductive substrate, an insulating layer is arranged between the surface layer and the substrate, the insulating layer is white, and the manufacturing method of the printed circuit board comprises the following steps:
etching a copper sheet on the surface layer to form a routing layer and a blank area except the routing layer on the surface layer;
printing ink on the wiring layer to form a solder mask ink layer covering the wiring layer; printing ink on the blank area on the surface layer to form a laser etching ink layer;
and carrying out laser etching on the laser etching ink layer to form hollowed-out points, so that the insulating layer is leaked from the hollowed-out points to form a two-dimensional code pattern.
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| CN113260161B (en) * | 2021-06-29 | 2021-09-21 | 惠州市大亚湾科翔科技电路板有限公司 | Traceable circuit board manufacturing method |
| CN113543490B (en) * | 2021-07-08 | 2023-01-10 | 江西晶弘新材料科技有限责任公司 | Method for increasing adhesion of printing ink on ceramic substrate |
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