JPS608705A - Pattern detector - Google Patents
Pattern detectorInfo
- Publication number
- JPS608705A JPS608705A JP11582583A JP11582583A JPS608705A JP S608705 A JPS608705 A JP S608705A JP 11582583 A JP11582583 A JP 11582583A JP 11582583 A JP11582583 A JP 11582583A JP S608705 A JPS608705 A JP S608705A
- Authority
- JP
- Japan
- Prior art keywords
- light
- wiring
- pattern
- wiring pattern
- detector
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/84—Systems specially adapted for particular applications
- G01N21/88—Investigating the presence of flaws or contamination
- G01N21/95—Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
- G01N21/956—Inspecting patterns on the surface of objects
Landscapes
- Physics & Mathematics (AREA)
- Health & Medical Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Length Measuring Devices By Optical Means (AREA)
Abstract
Description
【発明の詳細な説明】
〔発明の利用分野〕
本発明は配線パターンの欠陥を検出するパターン検出装
置に係り、特にプリント基板やセラミック基板の配線パ
ターンの欠陥を検出するための検査装置の検出部として
好適なパターン検出装置に関する。[Detailed Description of the Invention] [Field of Application of the Invention] The present invention relates to a pattern detection device for detecting defects in wiring patterns, and particularly to a detection unit of an inspection device for detecting defects in wiring patterns of printed circuit boards and ceramic substrates. The present invention relates to a pattern detection device suitable for use as a pattern detection device.
プリント基板やセラミック基板の配線パターンの欠陥を
検出するパターン検出装置として、従来種々のものが開
発されている。その−例として、第３図に示すごと（、
プリント基板１やセラミック基板の配線面２に光３Ｊを
照射する高輝度光源１１と、コンデンサレンズ２１と、
ハーフミラ−囚と、前記配線面２かもの反射光４１を検
出するための検出器１３と、該検出器１３に配線バクー
ン像を結像するための結像レンズ６から構成された反射
光検出によるパターン検出装置がある。上記パターン検
出装置を用いて、第１図及び第２図に示すプリント基板
１の配線面２の配線パター７３を検出する。Various types of pattern detection devices have been developed to detect defects in wiring patterns of printed circuit boards and ceramic substrates. As an example, as shown in Figure 3 (,
A high-intensity light source 11 that irradiates the wiring surface 2 of the printed circuit board 1 or the ceramic substrate with 3J of light, and a condenser lens 21,
By detecting reflected light, it is composed of a half mirror, a detector 13 for detecting the reflected light 41 from the wiring surface 2, and an imaging lens 6 for forming a wiring Bakun image on the detector 13. There is a pattern detection device. The pattern detection device described above is used to detect the wiring pattern 73 on the wiring surface 2 of the printed circuit board 1 shown in FIGS. 1 and 2.
この場合プリント基板１の配線面２の配線パターン３か
らの反射光４１に比し、基材４の表面からの反射光が無
視できるぐらい小さいため、これを利用して配線パター
ン３を検出するのであるが、第１図及び第２図に示すプ
リント基板１の配線パターン３間に光の反射率の低い残
銅６が存在すると本来ならプリント基板１として欠陥で
あるため配線パターン３と同じように検出されなければ
ならないにもかかわらず検出されないという問題があつ
ｌこ。In this case, the reflected light from the surface of the base material 4 is negligibly small compared to the reflected light 41 from the wiring pattern 3 on the wiring surface 2 of the printed circuit board 1, so the wiring pattern 3 is detected using this. However, if residual copper 6 with low light reflectance exists between the wiring patterns 3 of the printed circuit board 1 shown in FIGS. 1 and 2, it is originally a defect in the printed circuit board 1, so it is There is a problem that something that should be detected is not detected.
このことを第４図を用いて詳細に説明する。第４図（ａ
）は第１図のＡ−Ａ線上の検出結果を、同図（ｂ）は第
１図のＢ−Ｂ線上の検出結果をそれぞれ示す。第４図（
ａ）、（ｂ）の横軸は配線面２の位置を、縦軸は検出器
１３で光電変換された電圧を、さらにＡは欠げ５の位置
を、Ｂは残銅６の位置を示す。電圧Ｖ。はスルーホー／
Ｉ／８０レベルを示し、電圧Ｖ、は基材４のレベルを示
し、電圧■２は配線パターン３０レベルを示し、電圧ｖ
４は残銅６の位置Ｂのレベルを示す。第４図（ｂ）に示
すように、電圧ｖ４はシュレツショルドレベル電圧ＶＴ
よりも低いため、残銅６が存在しないごとく検出される
。This will be explained in detail using FIG. 4. Figure 4 (a
) shows the detection results on line A-A in FIG. 1, and FIG. 1(b) shows the detection results on line B-B in FIG. 1, respectively. Figure 4 (
In a) and (b), the horizontal axis indicates the position of the wiring surface 2, the vertical axis indicates the voltage photoelectrically converted by the detector 13, A indicates the position of the chip 5, and B indicates the position of the remaining copper 6. . Voltage V. is through-ho/
The voltage V indicates the level of the base material 4, the voltage 2 indicates the level of the wiring pattern 30, and the voltage V indicates the level of the wiring pattern 30.
4 indicates the level of the remaining copper 6 at position B. As shown in FIG. 4(b), the voltage v4 is the threshold level voltage VT
Since the residual copper 6 is lower than that, it is detected as if the residual copper 6 does not exist.
また従来の他のパターン検出装置として、第５図に示す
ごとく、プリント板１の配線面〆に光３２を照射する高
輝度光源１１′と、コンデンサレンズ２１’と、ミラー
渓と、前記配線面２′に斜め方向から光３２を照射する
ための凹面鏡あるいは平面鏡２７と、プリント基板１０
基材４およびスルーホ一ル８を透過する透過光４２を検
出するための検出器ｌｉと・該検出器１３′に配線パタ
ーン像を結像するための結像レンズ５′から構成され、
前記透過光を検出して配線パターンのネガパターンを検
出する透過光によるパターン検出装置がある。上記第５
図に示すパターン検出装置を用いて、プリント基板１の
配線パターンを検出すると、第１図及び第２図に示すプ
リント基板１の配線パターン３の上部だけ欠けて断面積
が小さくなった欠け５が存在づ−ると本来ならプリント
基板ｌとしで欠陥であΦため配線バター／３として検出
されてはいけないにもかかわらず正常な配線パターン３
と同じに検出されるという問題があった。As shown in FIG. 5, another conventional pattern detection device includes a high-intensity light source 11' that irradiates light 32 onto the wiring surface of the printed board 1, a condenser lens 21', a mirror beam, and the wiring surface. a concave mirror or a plane mirror 27 for irradiating light 32 from an oblique direction onto the printed circuit board 10;
It is composed of a detector li for detecting transmitted light 42 transmitted through the base material 4 and the through hole 8, and an imaging lens 5' for forming a wiring pattern image on the detector 13',
There is a pattern detection device using transmitted light that detects a negative pattern of a wiring pattern by detecting the transmitted light. 5th above
When the wiring pattern of the printed circuit board 1 is detected using the pattern detection device shown in the figure, it is found that the chip 5 in which only the upper part of the wiring pattern 3 of the printed circuit board 1 shown in FIGS. 1 and 2 is chipped and the cross-sectional area becomes small is detected. If it existed, it would normally be a defective printed circuit board, so it should not be detected as wiring butter/3, but it is a normal wiring pattern 3.
There was a problem that it was detected as the same.
このことを第６図を用いて詳細に説明する。第６図（ａ
）は第１図のＡ−Ａ線上の検出結果を、第６図（ｂ）は
第１図のＢ−Ｂ線上の検出結果を示す。第６図（ａ）、
（ｂ）も第４図（ａ）、（ｂ）と同様横軸ハ配線面２の
位置を、縦軸は検出器１３’で光電変換された電圧を示
し、さらにＡは欠け５の位置を、Ｂは残銅６の位置を示
す。電圧ｖ６は配線パターン３０レベルを示し、電圧Ｖ
６は基材４のレベルを示し、電圧Ｖ７はスルーホール８
０レベルを示す。第６図（ａ）に示すように欠け５の位
置Ａのレベルはｖ５であり、配線パターン３として検出
され、欠け５が存在しないとと（検出される。This will be explained in detail using FIG. 6. Figure 6 (a
) shows the detection results on line A-A in FIG. 1, and FIG. 6(b) shows the detection results on line B-B in FIG. Figure 6(a),
Similarly to FIGS. 4(a) and 4(b), in (b), the horizontal axis C indicates the position of the wiring surface 2, the vertical axis indicates the voltage photoelectrically converted by the detector 13', and A indicates the position of the chip 5. , B indicate the position of the remaining copper 6. The voltage v6 indicates the wiring pattern 30 level, and the voltage V6
6 indicates the level of the base material 4, and voltage V7 indicates the level of the through hole 8.
Indicates 0 level. As shown in FIG. 6(a), the level of the chip 5 at position A is v5, and it is detected as the wiring pattern 3, and it is detected that the chip 5 does not exist.
以上、従来の反射光を検出するパターン検出装置では光
の反射率の低い残銅６を誤検出し、透過光を検出するパ
ターン検出装置では配線パターンの上部だけ欠けている
欠け５を誤検出するという問題があった。As described above, the conventional pattern detection device that detects reflected light incorrectly detects the residual copper 6 with low light reflectance, and the pattern detection device that detects transmitted light incorrectly detects the chip 5 that is missing only the upper part of the wiring pattern. There was a problem.
本発明の目的とするところは、配線パターン間の光の反
射率の低い残銅も、配線パターン上部だゆ欠ゆている欠
けも見逃すことなく検出し、配線パターンの欠陥を正確
に検出することのできるパターン検出装置を提供するこ
とにある。It is an object of the present invention to accurately detect defects in wiring patterns by detecting residual copper with low light reflectance between wiring patterns and chips in the upper part of wiring patterns without overlooking them. The object of the present invention is to provide a pattern detection device that can perform the following functions.
本発明の要点は、反射光を検出して配線パターンの欠陥
を検出するパターン検出装置の技術と、透過光を検出し
て配線パターンの欠陥を検出するパターン検出装置の技
術とを結合し、さらに、前者の反射光を検出して配線パ
ターンの欠陥馨検出する技術に使用する光の波長域と、
後者の透過光を検出して配線パターンの欠陥を検出する
技術に使用する光の波長域とを互いに異なる波長域とす
るフィルタを設げることにより、両者の長所をとり入れ
、欠点を補うようにして配線パターンの欠陥を正確に検
出するパターン検出装置にある。The gist of the present invention is to combine the technology of a pattern detection device that detects defects in wiring patterns by detecting reflected light and the technology of a pattern detection device that detects defects in wiring patterns by detecting transmitted light, and further , the wavelength range of light used in the former technology to detect defects in wiring patterns by detecting reflected light;
By providing a filter that uses a different wavelength range from the wavelength range of the light used in the technology that detects defects in wiring patterns by detecting the transmitted light of the latter, the strengths of both can be incorporated and the weaknesses can be compensated for. The present invention provides a pattern detection device that accurately detects defects in wiring patterns.
以下、本発明の一実施例を第７図を用いて詳細に説明す
る。Hereinafter, one embodiment of the present invention will be described in detail using FIG. 7.
第７図において、プリント基板１１高輝度光源ＩＩ’、
コンデンサレンズ２１′、ミラー２６、凹面鏡あるいは
平面鏡！、結像レンズ５′、検出器」３′の構成は第５
図に示した従来のパターン検出装置と同じであるが、新
たに高輝度光源１１、コンデンサレンズ２１、フィルタ
ｎ１ハーフミラ−ｄ、フィルタ路、フィルタ２９、結像
レンズ５、検出器」３が設けである。In FIG. 7, the printed circuit board 11 high-intensity light source II',
Condenser lens 21', mirror 26, concave mirror or plane mirror! , the imaging lens 5', and the detector 3' are arranged as follows.
Although it is the same as the conventional pattern detection device shown in the figure, it is newly equipped with a high-intensity light source 11, a condenser lens 21, a filter n1 half mirror d, a filter path, a filter 29, an imaging lens 5, and a detector 3. be.
高輝度光源１１から発した光３１はコンデンツ”レンズ
２１を通り、フィルタηへ入り、一方他の高輝度光源１
１′から発した光３２はコンデンサレンズ２１′を通り
、フィルタあへ入る。フィルタ路とフィルタ２２は互い
に波長域が重ならないよ５ｔＣ波長域を限定するための
フィルタで、フィルタ路は例えば波長５００ｎｍ以下の
光を反射し、波長５００ ｎｍ以上の光を透過させる、
一般にイエローフィルタと呼称されるもめであり、フィ
ルタ２２は例えば波長３００ ｎｍから４６０’ｎｍま
での波長のみを透過させる、一般にブルーフィルタと呼
称されるものである。フィルタｎを透過した光３３はハ
ーフミラ−乙で光路を９０度変更されてプリント基板１
の配線面２に照射され、配線パターン３からの反射光と
して上方にかえる。−力、フィルタあを透過した光３４
は、ミラーあ、凹面鏡あるいは平面鏡ｎを介してプリン
ト基板１の配線面／に斜め方向から照射され、基材４あ
るいはスルーホール８を通って透過光となって上方へ達
する。光３４を配線面２′に対して斜め方向から照射す
る理由は、配線面２′の配線パターン３′の影響を受け
ないよ５に配慮したことによる。Light 31 emitted from the high-intensity light source 11 passes through the condensate lens 21 and enters the filter η, while the other high-intensity light source 1
Light 32 emitted from lens 1' passes through condenser lens 21' and enters filter A. The filter path and the filter 22 are filters for limiting the 5tC wavelength range so that the wavelength ranges do not overlap each other, and the filter path reflects light with a wavelength of 500 nm or less and transmits light with a wavelength of 500 nm or more, for example.
The filter 22 is generally called a blue filter and transmits only wavelengths from 300 nm to 460' nm, for example. The light 33 that has passed through the filter n has its optical path changed by 90 degrees by the half mirror B, and then reaches the printed circuit board 1.
The light is irradiated onto the wiring surface 2 and returns upward as reflected light from the wiring pattern 3. -Power, light transmitted through filter 34
The light is irradiated obliquely onto the wiring surface of the printed circuit board 1 via a mirror A, a concave mirror, or a plane mirror N, and passes through the base material 4 or the through hole 8 to reach upward as transmitted light. The reason why the light 34 is irradiated obliquely to the wiring surface 2' is to avoid being influenced by the wiring pattern 3' on the wiring surface 2'.
すなわち、光３４を配線面２′に対して垂直方向から照
射すると裏面の配線パターン３′が表面にネガ像として
浮ぶことになり、表面の配線パターン３のネガ像と混合
するため、表面の配線パターン３を正確に検出でないが
、光３４を斜め方向から照射すると、光量はプリント基
板１０基材４中で拡散するため裏面の配線パターン３′
は表面に浮び出ないので、プリント基板の配線面２には
表面の配線パターン３のネガ像のみが現われる。配線パ
ターン３かもの反射光および基材４の透過光およびスル
ーホール８０通過光が合わさった光４５は再びハーフミ
ラ−おを通ってもうひとつのハーフミラ−Ｚ３’に入る
。ハーフミラ−ｄは光４５の光路を２分するためのもの
で、一方はフィルタ２９、結像レンズ邪を通って検出器
】３に入り、他方はフィルタＵ、結像レンズヨを通って
検出器１イに入る。フィルタ２９は配線パターン３から
の反射光を透過し、基材４の透過光およびスルーホール
８の通過光を反射するためのフィルタで、前記フィルタ
〃と同じ特性を有するものである。フィルタ２９を透過
した光４７は結像レンズ５で検出器１３の光！変換面に
結像されるため、プリント基板１の配線パターンのポジ
パターンが得られる。一方、フィルタ胴は基材４の透過
光およびスルーホール８０通過光を透過し、配線パター
ン３からの反射光を反射するためのフィルタで、前記フ
ィルタあと同じ特性を七するものである。フィルタ列を
透過した光４６は結像レンズ６′宅検出器１３′の光電
変換面に結像されるため、プリント基板１の配線パター
ンのネガパターンが得られる。検出器１３で得られる検
出結果は光量の減少した割合に応じて電圧が小さくなる
が、その信号波形は第４図に示した結果と同じであり、
検出器１３′で得られる検出結果も光量の減少した割合
に応じて電圧が小さくなるが、その信号波形は第６図に
示した結果と同じである。検出器】３の分光感度特性は
波長５００ ｎｍ以下のところにあるものが適当で、検
出器１３′の分光感度特性は波長５００ ｎｍ以上のと
ころにあるものが適当である。That is, when the light 34 is irradiated from the direction perpendicular to the wiring surface 2', the wiring pattern 3' on the back surface appears as a negative image on the front surface, and is mixed with the negative image of the wiring pattern 3 on the front surface, so that the wiring pattern 3' on the front surface is Although the pattern 3 is not detected accurately, when the light 34 is irradiated from an oblique direction, the amount of light is diffused in the printed circuit board 10 base material 4, so it is difficult to detect the wiring pattern 3' on the back side.
does not stand out on the surface, so only a negative image of the wiring pattern 3 on the front surface appears on the wiring surface 2 of the printed circuit board. Light 45, which is a combination of the light reflected from the wiring pattern 3, the light transmitted through the base material 4, and the light passing through the through hole 80, passes through the half mirror again and enters another half mirror Z3'. The half mirror d is for dividing the optical path of the light 45 into two, one of which passes through the filter 29 and the imaging lens and enters the detector 3, and the other passes through the filter U and the imaging lens into the detector 1. Enter i. The filter 29 is a filter for transmitting the reflected light from the wiring pattern 3 and reflecting the transmitted light of the base material 4 and the transmitted light of the through-hole 8, and has the same characteristics as the above-mentioned filter. The light 47 transmitted through the filter 29 is transmitted to the imaging lens 5 and is transmitted to the detector 13! Since the image is formed on the conversion surface, a positive pattern of the wiring pattern of the printed circuit board 1 is obtained. On the other hand, the filter body is a filter for transmitting the light transmitted through the base material 4 and the light passing through the through hole 80, and for reflecting the reflected light from the wiring pattern 3, and has the same characteristics as the filter body. Since the light 46 transmitted through the filter array is imaged on the photoelectric conversion surface of the imaging lens 6' and the detector 13', a negative pattern of the wiring pattern of the printed circuit board 1 is obtained. In the detection result obtained by the detector 13, the voltage decreases according to the rate at which the amount of light decreases, but the signal waveform is the same as the result shown in FIG.
The detection result obtained by the detector 13' also decreases in voltage in accordance with the rate at which the amount of light decreases, but the signal waveform is the same as the result shown in FIG. The spectral sensitivity characteristic of the detector 3 is suitably at a wavelength of 500 nm or less, and the spectral sensitivity characteristic of the detector 13' is suitably at a wavelength of 500 nm or more.
次に第８図の異常検出回路および第９図の信号波形を示
した図を用いて第１図におけるＡ−Ａ線上およびＢ−Ｂ
線上を検出する動作を説明する。Next, using the abnormality detection circuit of FIG. 8 and the diagram showing the signal waveform of FIG. 9,
The operation of detecting a line will be explained.
検出器１３から出力されたビデオ信号６１は第４図に示
した信号に相当し、検出器１３′から出力されたビデオ
信号６２は第６図に示した信号に相当する。これらの信
号はそれぞれの比較器５１および５１’によってシュレ
ツショルドレベルｖ、’ト比ｅすれ、ディジクル信−号
６３．６イ、６４．６イとして出力される。ここでディ
ジタル信号６３．６４は第１図におけるＡ −Ａ線上の
検出結果を示し、第９図（ａ）に示す波形６３．６４が
対応し、ディジタル信号６３’、 ６４’は第１図にお
ゆるＢ−Ｂ線上の検出結果を示し、第９図（ｂ）に示す
波形６３′、６４′が対応する。ディジタル信号６３お
よび６４は次のＯＲ回路５２でその論理和がとられ第９
図（ａ）に示す波形６５がそれに対応するディジクル信
号６５となり、第１図におけるＡ −Ａ線上の配線パタ
ーンの上部のみ欠けた欠け５が検出できたことを示す。The video signal 61 output from the detector 13 corresponds to the signal shown in FIG. 4, and the video signal 62 output from the detector 13' corresponds to the signal shown in FIG. These signals are compared to threshold levels v, 'e and e by respective comparators 51 and 51' and output as digital signals 63.6a and 64.6a. Here, the digital signals 63 and 64 indicate the detection results on the A-A line in FIG. 1, and the waveforms 63 and 64 shown in FIG. The detection results on all lines BB are shown, and correspond to waveforms 63' and 64' shown in FIG. 9(b). The digital signals 63 and 64 are logically summed in the next OR circuit 52 and the ninth
The waveform 65 shown in FIG. 1A becomes the corresponding digital signal 65, indicating that the chip 5 in which only the upper part of the wiring pattern on the line A--A in FIG. 1 was chipped could be detected.
更にディジタル信号６３′および６４’＋ま同様にＯＲ
回路でその論理和がとられ第９図（ｂ）に示す波形６５
′がそれに対応するディジクル信号６５′となり、第１
図におけるＢ−Ｂ線上の配線パターン間に残銅６が検出
されたことを示す。Further, the digital signals 63' and 64'+ are similarly ORed.
The logical sum is taken in the circuit and the waveform 65 shown in FIG. 9(b) is obtained.
' becomes the corresponding digital signal 65', and the first
This shows that residual copper 6 was detected between the wiring patterns on the line B-B in the figure.
上記パターン検出装置は、プリント基板１やセラミック
基板の基材４を透過して（る透過光を検出し、配線パタ
ーン３のネガパターンを検出する機能と、配線面２から
反射する反射光を検出し、配線パターン３のポジパター
ンを検出する機能とを合わせ持っているため、配線パタ
ーン３間の光の反射率の低い残銅６等は配線パターンの
ネガパターンとして検出し、配線パターン３の上部だけ
欠けている欠け５等は配線パターン３のポジパターンと
して検出できることによって配線パターンの欠陥を正確
に検出できる。The pattern detection device has the function of detecting the transmitted light that passes through the base material 4 of the printed circuit board 1 or the ceramic substrate, and detecting the negative pattern of the wiring pattern 3, and the function of detecting the reflected light reflected from the wiring surface 2. However, since it also has the function of detecting the positive pattern of the wiring pattern 3, residual copper 6 etc. with low light reflectance between the wiring patterns 3 is detected as a negative pattern of the wiring pattern, and the upper part of the wiring pattern 3 is detected as a negative pattern of the wiring pattern. Since the chip 5, etc., which is missing only by a certain amount, can be detected as a positive pattern of the wiring pattern 3, defects in the wiring pattern can be detected accurately.
検出する機能と透過光を検出して配線パターンの欠陥を
検出する機能とを合せ持つので、配線ノくターンの欠陥
を従来のものに比較し、極めて正確に検出できるという
優れた効果を有する。Since it has both the detection function and the function of detecting defects in wiring patterns by detecting transmitted light, it has an excellent effect of being able to detect defects in wiring patterns extremely accurately compared to conventional methods.
第１図はプリント基板の平面図、第２図（ａ）は第１図
のＡ−Ａ断面図、第２図（ｂンは第１図のＢ−Ｂ断面図
、第３図は従来のパターン検出装置を示す側面図、第４
図（ａ）は第１図のＡ −Ａ線上の検出結果を示す図、
第４図（ｂ）は第１図のＢ −Ｂ線上の検出結果を示す
図、第５図は従来の他のパターン検出装置を示す側面図
、第６図（ａ）は第１図のＡ−Ａ線上の検出結果を示す
図、第６図（ｂ）は第１図のＢ−Ｂ線上の検出結果を示
す図、第７図は本発明の一実施例のパターン検出装置を
示す側面図、第８図はパターンの異常検出回路の一例の
構成を示すブロック図、第９図は第８図のパターンの異
常検出回路の動作を示すための図で、同図（ａ）は第１
図のＡ−Ａ線上の検出波形を示す図、同図（ｂ）は第１
図のＢ−Ｂ線上の検出波形を示す図である。
１・・・プリント基板、２、／・・・配線図、３．３′
・・・配線パターン、４・・・基材、５・・・欠け、６
・・・残銅、８・・・スルーホール、１１．１１’・・
・＾輝度光源、１３．１３′・・・検出器、２１．２１
’・・コンｆンサレンズ、２２・・・フィルタ、ｚ３・
・・ハーフミラ−１２４・・・フィルタ、２５・・・結
像レンズ、頷・・・ミラー、２７・・・凹面鏡あるいは
平面鏡、公・−・フィルタ、２９・・フ・イルタ、３１
．３２・・・光源の光、３３、Ｕ・・・波長域を限定さ
れた光、４５・・・反射光と透過の合わさった光、４６
．４７・・・波長域を限定された光、５１．５１′・・
比較器、５２・・・０１（回路、６１．６２・・・ビデ
オ信号、６３．６３′、６４．６−１′。
６５・・ディジタル信号。
第２図
″ｉ４図
メ・８図
オ９図Figure 1 is a plan view of the printed circuit board, Figure 2 (a) is a cross-sectional view taken along line A-A in Figure 1, Figure 2 (b is a cross-sectional view taken along line B-B in Figure 1, and Figure 3 is a conventional Side view showing the pattern detection device, 4th
Figure (a) is a diagram showing the detection results on line A-A in Figure 1;
FIG. 4(b) is a diagram showing the detection results on line B-B in FIG. 1, FIG. 5 is a side view showing another conventional pattern detection device, and FIG. 6(a) is A in FIG. 1. - A diagram showing the detection results on line A, FIG. 6(b) is a diagram showing the detection results on line B-B in FIG. 1, and FIG. 7 is a side view showing a pattern detection device according to an embodiment of the present invention. , FIG. 8 is a block diagram showing the configuration of an example of a pattern abnormality detection circuit, and FIG. 9 is a diagram showing the operation of the pattern abnormality detection circuit of FIG.
A diagram showing the detected waveform on line A-A in the figure, (b) is the first
It is a figure which shows the detected waveform on the BB line of a figure. 1... Printed circuit board, 2, /... Wiring diagram, 3.3'
...Wiring pattern, 4...Base material, 5...Chip, 6
...Remaining copper, 8...Through hole, 11.11'...
・^Brightness light source, 13.13'...Detector, 21.21
'...Conserver lens, 22...Filter, z3...
...Half mirror 124...Filter, 25...Imaging lens, Nod...Mirror, 27...Concave mirror or plane mirror, Public...Filter, 29...Filter, 31
．． 32... Light from a light source, 33, U... Light with a limited wavelength range, 45... Light that is a combination of reflected light and transmitted light, 46
．． 47...Light with a limited wavelength range, 51.51'...
Comparator, 52...01 (circuit, 61.62...Video signal, 63.63', 64.6-1'). 65...Digital signal. figure
Claims (1)
る反射光により配線パターンを検出する第１の検出手段
と、前記基板の＃記配線面とは反対面から光を照射し前
記基板の基材を透過する透過光より配線パターンを検出
する第２の検出手段を有し、前記第１の検出手段で用い
る光の波長域と前記第２の検出手段で用いる光の波長域
とを互いに異なる波長域とするフィルタを設け、さらに
前記第１の検出手段で検出された検出出力と前記第２の
検出手段で検出された検出出力とから配線パターンの欠
陥を検出する手段を設けたことを特徴とするパターン検
出装置。(1) A first detection means that irradiates light onto the wiring surface of the board and detects the wiring pattern by reflected light reflected from the wiring surface; It has a second detection means for detecting the wiring pattern from transmitted light transmitted through the base material of the board, and has a wavelength range of light used by the first detection means and a wavelength range of light used by the second detection means. and a filter having different wavelength ranges from each other, further comprising means for detecting a defect in the wiring pattern from the detection output detected by the first detection means and the detection output detected by the second detection means. A pattern detection device characterized by:
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11582583A JPS608705A (en) | 1983-06-29 | 1983-06-29 | Pattern detector |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11582583A JPS608705A (en) | 1983-06-29 | 1983-06-29 | Pattern detector |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS608705A true JPS608705A (en) | 1985-01-17 |
Family
ID=14672041
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11582583A Pending JPS608705A (en) | 1983-06-29 | 1983-06-29 | Pattern detector |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS608705A (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5177559A (en) * | 1991-05-17 | 1993-01-05 | International Business Machines Corporation | Dark field imaging defect inspection system for repetitive pattern integrated circuits |
| US5225891A (en) * | 1990-10-09 | 1993-07-06 | Kabushiki Kaisha Toshiba | Wire bonding external appearance inspecting apparatus |
| US5790251A (en) * | 1995-04-19 | 1998-08-04 | Nikon Corporation | Defect inspecting apparatus |
| CN108696985A (en) * | 2018-05-30 | 2018-10-23 | 景旺电子科技(龙川)有限公司 | A kind of printed circuit board preparation method improving the oily welding resistance loci of identification lid |
-
1983
- 1983-06-29 JP JP11582583A patent/JPS608705A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5225891A (en) * | 1990-10-09 | 1993-07-06 | Kabushiki Kaisha Toshiba | Wire bonding external appearance inspecting apparatus |
| US5177559A (en) * | 1991-05-17 | 1993-01-05 | International Business Machines Corporation | Dark field imaging defect inspection system for repetitive pattern integrated circuits |
| US5790251A (en) * | 1995-04-19 | 1998-08-04 | Nikon Corporation | Defect inspecting apparatus |
| CN108696985A (en) * | 2018-05-30 | 2018-10-23 | 景旺电子科技(龙川)有限公司 | A kind of printed circuit board preparation method improving the oily welding resistance loci of identification lid |
| CN108696985B (en) * | 2018-05-30 | 2021-06-04 | 景旺电子科技(龙川)有限公司 | Printed circuit board manufacturing method for improving oil resistance welding contraposition of recognition cover |
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