JPS60256004A - Testing device of soldered condition of chip part - Google Patents

Abstract

PURPOSE:To enble high-precision and reliable inspection of soldered condition of a chip part, by inspecting the soldered condition in a range set according to an image in the neighborhood of a soldered chip part. CONSTITUTION:Images are picked up by 2 industrial TV cameras 5, 6 for soldered conditions by chip part 3. Image signals supplied from the cameras 5, 6 are binarized by binarizing circuts 13, 14 and delivered to arithmetic circuit 15 inside a window for deviation inspection and that 16 inside a window for soldered condition tests respectively. These signals are compared in the arithmetic circuit 15, 16 with a window signal originated from a window generating circuit 20 and areas inside the deviation testing window and soldered condition testing window are calculated. The results are introduced into a processing circuit 19 and deviation and qualities of the soldered condition of the chip part can be judged in the circuit 19.

Description

DETAILED DESCRIPTION OF THE INVENTION Technical Field The present invention relates to a soldering inspection method for inspecting the soldering condition of a printed wiring board on which chip components are mounted, for example.

BACKGROUND ART For example, when automatically soldering a printed wiring board on which electronic circuit elements are mounted, it is necessary to inspect the soldering condition in order to eliminate solder shortages and missing solders. The correct predecessor of the circuit is realized. Therefore, conventionally, visual inspection is performed, but
There are many parts to be mounted on the printed wiring board, and the inspection target is small, so defects may be overlooked, and the inspection standard 1ζ may vary depending on the physical condition of the inspector.

Purpose The present invention solves the above-mentioned technical problems and provides a soldering inspection method for chip components that enables the soldering state of chip components to be independently inspected with high precision. It is.

Example @1 Figure is a sectional view of one embodiment of the present invention.

A chip component 3 such as a circuit element is rotated by a solder 4 on a land 2 of a printed wiring board 1. A lighting device (not shown) is provided directly above and diagonally above the chip component 3 for irradiating vertically incident light and horizontally diffused light, and this lighting device provides uniform light to the surface of the solder 4. The entire surface is irradiated. An industrial television camera 5.6 is placed facing the direction in which vertically incident light is reflected. The reflected light from the chip component 3 and the broken surface 4a is reflected by the half mirror 7.
is incident on the The straight light from the half mirror 7 is incident on the imaging lens 9 of the industrial television camera 5 via the blue transmission filter 8. Further, the orthogonal light from the half mirror 7 is bent by 90 degrees by the reflecting mirror 1o, and is incident on the imaging lens 12 of the industrial television camera 6 via the red transmission filter 11. In this way, the soldered state of the chip component 3 is imaged by the two industrial television cameras 5 and 6.

FIG. 2 is a block diagram of an embodiment of the present invention. The image signals inputted from the industrial television cameras 5 and 6 are binarized in the binarization circuits 13 and 1.4, and then sent to the shift inspection window arithmetic circuit 15. The signals are respectively applied to the in-window arithmetic circuit 16 for soldering inspection. The misalignment inspection window 17 and the soldering inspection window 18 are set by a window generation circuit 20 connected to the processing circuit 19rc. The window signal for misalignment inspection 15 and the soldering inspection window arithmetic circuit 161 are compared with the window signals from the window generation circuit 2o, and the window air for misalignment inspection and the soldering inspection window are The area within 18 is calculated.The result of this calculation is given to a processing circuit 19, where it is determined whether the chip component 3 is misaligned or whether the soldering condition is good or bad.

FIG. 3 is a flowchart illustrating a soldering inspection method for a chip component 3 according to the present invention Cζ. Step n I I
At C, the window generation circuit 20 Ic! Inspection window air and soldering inspection window 1
8 will be established. In step n2, the displacement of the chip component 3 is inspected using the window air for displacement inspection on the screen shown in FIG. 5 (1).

Next, in step n3, the soldering inspection window 18 is corrected in accordance with the displacement of the chip component 3 on the screen shown in FIG. 4 tl+. After that, in step n4,
The soldering state within the soldering inspection window 18 is inspected.

FIG. 4 is a diagram showing a corrected state of the soldering inspection window 18. The imaging area is indicated by a virtual line 21.

Vertical misalignment inspection windows 17a and 17b are arranged across the pair of lands 2 to which the chip component 3 is connected, and lateral misalignment inspection windows 17c, 17d, 17e, and 17f are arranged on both sides of the vertical misalignment inspection windows 17a and 17b. However, in the arrangement direction of the vertical deviation inspection windows 17a and 17b (the fourth
(in the vertical direction of the figure fil). Such a window air for deviation inspection is generated by the window generation circuit 20.
When ICx is installed, the signal is applied to the deviation checking window arithmetic circuit 15. A pair of soldering inspection windows 18 are formed based on the calculation results of the deviation inspection window arithmetic circuit 15.

FIG. 4(2) and @FIG. 4(3) IC modified as shown. The soldering inspection window 18 generated from the window starting circuit 20 is connected to the portion 22 of the land 2 where the chip component 3 overlaps and the chip component 3 .

In this embodiment, the soldering inspection window 18 is the same size and shape as the soldering inspection window 18Vi land 2? have

Referring to FIG. 1 and FIG. 5, the process of inspecting the soldered state of the chip component 3 will be explained. When inspecting the soldering condition at both ends of the pair of lands 2I and chip component 3 on the printed wiring board 1, first, the vicinity of the chip component 3 soldered to the land 2 is imaged by irradiating horizontally diffused light. , the image shown in 5F9i+1? obtain. Next, the displacement inspection window arithmetic circuit 15 calculates the displacement of the chip component 3 across the lands 2 by l. Based on this calculation result, the position of the chip component 3 is measured, and the shape of the chip component 31 is corrected so that the terminal portion does not fit inside the soldering inspection window 18. In order to inspect the soldering condition of the area to be soldered in the soldering inspection window 18 modified in this way, the vicinity of the chip component 3 is irradiated with vertical incident light. The image f′i obtained at this time is shown in FIG. 5 (not shown in 21).
Defective part 25 and missing part 26 in
The 21iii image is.

When an image is taken by the industrial television camera 5 through the blue transmission filter 8, an image as shown in FIG. 5(3) is obtained. In this image, 25 parts lacking solder appear, but 26 parts lacking solder do not appear. On the other hand, when the image is captured by the industrial television camera 6 through the red transmission filter llTh, the image is binarized as shown in Figure (4). With this painting scratch.

Both a solder-deficient portion 25 and a solder-deficient portion 26 appear. In order to distinguish and inspect solder-deficient areas 25 and solder-deficient areas 26, subtract the binarized image in Figure 5 (31) from 2 in Figure 1g5 (4).

The image shown in Figure 5 (5)? obtain. This image makes it possible to detect only the solder missing portion 26.

By making the soldering inspection window 18 modifiable in this way, it is possible to check for misalignment of the chip component 3. [
↓ Terminal part 2 of chip component 3 shown in Figure 5 (4)
This prevents the image No. 7 from being erroneously determined to be a solder-deficient portion.

A soldering inspection method for chip parts according to the present invention is as follows.

The present invention is not limited to printed wiring boards as in the above embodiments.

It can be implemented in connection with the substrates of all electronic circuit elements.

As described above, according to the present invention, n is soldered to the land f1
The vicinity of the fc chip component is imaged, a gap inspection window spanning between lands is set up based on the imaging results, the entire area of the chip component within this gap inspection window is detected, and the area where the chip components of the land overlap and the chip are detected. Parts and parts that should be soldered? Contains soldering inspection window and settings.

Based on the detection results of the eight chip component areas within the misalignment inspection window, all areas to be soldered in the soldering inspection window are set, and the soldering condition of these areas to be soldered is inspected. By doing so, it is possible to prevent erroneous determination of the broken state due to misalignment of the chip components, and to inspect the broken state of the chip components with high precision and reliability.

[Brief explanation of drawings]

Figure 181 is a sectional view of an embodiment of the present invention, Figure 2 is a block diagram of an embodiment of the present invention, '@3 Figure is a flowchart showing the inspection line), Figure 1g4 is a soldered inspection window. FIG. 18 is a diagram showing a correction letter sign plate of No. 18, and a diagram showing a binarized image obtained by horizontally diffused light and vertical incident light +C. 2...Land, 3...Chip parts, 4...Solder, 5゜6...Industrial TV camera, 13.14...
Binarization circuit, 15... In-window arithmetic circuit for misalignment inspection, 16... In-window arithmetic circuit for soldering inspection,
17...Window for misalignment inspection, 18...Window for soldering inspection, 19...Processing circuit, 20...Window generation circuit Agent Patent Attorney Kei Nishi Part 4 Figure 3 Figure 1 21 t ) J Figure 5 Procedural Amendment Written August 21, 1980 To the Commissioner of the Patent Office 1 1. Indication of the case Patent Application 1982-113609 2. Name of the invention Soldering inspection method for chip parts 3. Person making the amendment Relationship to the case Applicant address name (583) Matsushita Electric Works Co., Ltd. Representative 4, agent address 1-13-38 Nishihonmachi, Nishi-ku, Osaka City Newly produced building country equipment EX 0525-5985 INTAPT
J country #i! FAX GIII&Gn (06)53B-
0247 Telephone (06) 538-0263 (Representative) 6, Claims column, Detailed explanation of the invention column, Brief explanation of drawings column of the specification subject to amendment, Drawing 7, Contents of amendment (1) ) The scope of the 4I claims is as shown in the attached sheet. (2) In the 6th line of page 3 of the specification, the phrase ``rotated.'' is corrected to ``fixed.'' (3) In the 3rd page of the specification, lines 12 and 13 of vj, the phrase “chip component 3” is corrected to “terminal 3aJ of the chip component 3.” (4) The 5th line of the 4th page of the specification ``Binarization circuit 13
" has been corrected to "binarization unit 13." (5) Page 4, line 6 to MS line 7 of the specification are corrected as follows. (6) In the 9th line of page 4 of the specification, [Processing circuit 1]
Corrected to "processing unit 19." )Page 4, line 10 of the specification, page 5, plS, line 2, Oji 2
0J is corrected to ``Window generating section 20J.'' (8) Lines 11 to 13 of page 4 of the specification are corrected as follows. 16, the 17th line of page 4 of the WIN (9) specification from the window generation unit 2o is corrected as follows. The first to fourth lines of the page are corrected as shown below. 6 The misregistration checking window 17 is set by the window generation unit 20 and given to the in-window calculation unit 15.The calculation in this window self-performance gh1s Based on the results (11) In the specification, page 6, line 19 to line 20, it says "Arithmetic circuit in window for deviation inspection 15",
Corrected to "window calculation unit 15". (12) 1 chip component 3 in the 3rd line of No. 7 of the specification
,” should be corrected to “Chip component 3.” (13) On page 8, line 7 of the specification, [Nteru J] is corrected to ``Countermeasure.'' (14) In the 1st and 2nd lines of page 9 of the specification, the expression 1 Part J to be soldered is corrected to ``Part to be soldered''. (15) On page 9, lines 13 to 14 of the specification, the phrase "inspection process" is corrected to "inspection process." (16) On page 9, lines 19 to 20 of the specification, [binarization circuit J] is corrected to "binarization unit." (17) In the specification, page 9, line 20 to page 10, line 1, it is stated that “15...window hall calculation circuit for misalignment inspection;
16...Arithmetic circuit in window for soldering inspection," r15,16...Window performance W, part,
” is corrected. (18) Lines 3 and 4 of page 2 of Specification II ( ) are corrected as follows. Window, 19...Processing unit, 2()...Window generating unit (19) Figures 1, 2, and 4 (1) of the drawings are corrected as shown in the attached sheet. What is claimed is a soldering inspection method for chip components for inspecting the state in which both ends of a chip component are soldered to a pair of lands on a printed wiring board, the vicinity of the chip component being soldered to the lands. Based on the imaging results, a misalignment inspection window is set between the lands, the area of the chip component within this misalignment inspection window is detected, and the areas where the chip components of the land overlap and the chip component and solder are detected. setting a soldering inspection window including a portion to be soldered, and setting an area to be soldered in the soldering inspection window based on the inspection result of the area of the chip component in the deviation inspection window; A method for inspecting soldering of chip components, characterized by inspecting the soldering condition of the area to be soldered.

Claims (1)

[Scope of Claims] A soldering inspection method for a chip component for inspecting the soldered state by tracing both ends of the chip component onto a pair of lands on a printed wiring board. Takes an image of the area around the chip component soldered to the land. Based on the imaging results, a window for inspecting deviations between lands is set. First, the area of the chip component within the inspection window is detected. A soldering inspection window is set that includes the portion of the land where the chip components overlap and the chip component and the component to be soldered. An area to be soldered in the soldering inspection window is set based on the inspection result of the area of the chip component in the deviation inspection window. The method is characterized in that the soldering condition of the area to be soldered is inspected. A soldering inspection method for chip parts.