JPH0469511A - Visual inspection device for soldering part and packaging component - Google Patents

Abstract

PURPOSE:To attain not only the visual inspection of the soldering part, but also the check of the packaging component by using an X-ray system and an optical system in combination. CONSTITUTION:A body 10 to be inspected on an XY table 12 is irradiated with X rays from an X-ray tube 14, the X rays transmitted through the body 10 are converted optically by a fluorescent screen 16, and a reflected fluorescent image obtained by a 1st mirror 18 is detected by an X-ray camera 20 to carry- out the visual inspection of soldering. At the same time, an optical image obtained by a 2nd mirror 24 is photographed by an optical camera 26. Those X-ray system and optical system are both used in combination to carry-out the visual inspection of the soldering part and packaging component accurately and speedily on a single inspection stage.

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Field of Application] The present invention relates to an X-ray type soldering appearance inspection apparatus having a function of inspecting the appearance of mounted components. More specifically, the present invention relates to an apparatus that uses a common inspection stage and combines an X-ray soldering appearance inspection function and an optical mounted component inspection function.

This device is used, for example, to inspect electronic equipment in which electronic components are mounted on printed wiring boards.

[Prior Art] There is an X-ray type soldering appearance inspection device as a device for inspecting defects etc. in soldered portions of electronic components.

This consists of an inspection stage that moves the object to be inspected (printed wiring board, etc.), an X-ray tube located directly above it that irradiates the object to be inspected, and an X-ray tube located directly below that irradiates the object to be inspected.
It is equipped with a fluorescent screen that converts rays into light and an XvA camera that detects the fluorescent image, and is configured to inspect the state of the soldered part using the fluorescent image generated by the X-rays that have passed through the object to be inspected.

The XklA method has become increasingly useful in recent years because it can inspect items such as J-lead and pin grid type ICs, where the leads are hidden below the component body and cannot be inspected optically.

[Problems to be Solved by the Invention] However, in an X-ray visual inspection device, it takes time to handle the object to be inspected and carry it into and out of the device in order to prevent X-ray leakage. In addition, there is a drawback that the inspection only involves inspection of soldered parts and cannot check mounted components, which is often insufficient.

Optical methods are also available as visual inspection devices. Although it is possible to check mounted components using an optical appearance inspection device, the accuracy of inspecting soldered parts is poor, and inspection is not possible when the leads are hidden as described above.

Therefore, if it is desired to also inspect the state of the mounted components, it is necessary to provide a separate inspection device for the mounted components in addition to the X-ray type soldering appearance inspection device.

SUMMARY OF THE INVENTION An object of the present invention is to provide an inspection apparatus that is capable of not only inspecting the appearance of soldered parts but also checking mounted components, taking into consideration the actual state of the prior art as described above.

[Means for Solving the Problems] The present invention is an apparatus that uses a common inspection stage and combines an X-ray soldering appearance inspection function and an optical mounted component inspection function. Even though it is an X-ray type soldering visual inspection device, its basic configuration is very similar to that of an optical type. The difference is whether the image is captured using an X-ray method or an optical method. However, in terms of measures against X-ray leakage, etc., conventional
Even if line-type and optical-type visual inspection devices are put together, a system that can achieve the desired purpose cannot be constructed.

The present invention includes an inspection stage that moves an object to be inspected, an XFI tube that irradiates the object with X-rays, a fluorescent screen that converts the X-rays that have passed through the object into light, and an X-ray that detects the fluorescent image. This is an X-ray type soldering appearance inspection device equipped with a camera. This equipment is further equipped with an illumination lamp that irradiates the object to be inspected from the same side as the X-rays, and a mirror that reflects the optical image of the object is placed between the X-ray tube and the inspection stage. It is provided on the irradiation axis, and an optical power camera is installed in the reflection optical path of the mirror.

In practice, it is preferable that the X-ray tube is provided directly above the inspection stage, the fluorescent screen is provided directly below the inspection stage, and the illumination lamp is provided above the inspection stage.

[Function] The X-ray soldering visual inspection device inspects the soldered parts of the inspected object. Because it uses the X-ray method, accurate inspection is possible without any problems even when the leads are hidden behind the component body. will be held. In addition, the object to be inspected is irradiated with a lighting lamp,
The reflected optical image is reflected by a mirror near the X-ray tube and sent to an optical power camera, where the mounted components are inspected.

Since the optical path of the reflected optical image is bent by the mirror, the optical power camera can be installed in a location that is not affected by X-ray irradiation.
It is possible to combine both functions.

Furthermore, since the mirror is located on the X-ray irradiation axis, soldered parts and mounted components can be inspected with minimal loss time.

[Embodiment] FIG. 1 is an explanatory diagram showing an embodiment of the visual inspection apparatus according to the present invention. An inspection stage (an XY child table 12 and an X-ray tube 1 located directly above the inspection stage 12 that irradiates X-rays to the inspection object 10) on which the inspection object 10 is placed and moved
4, a fluorescent screen 16 that is located directly below the inspection stage 12 and converts the X-rays transmitted through the inspection object 10 into light, and a first mirror 18 that reflects the fluorescent image and bends the optical path approximately at right angles. It is equipped with an X-ray camera (high sensitivity camera) 20 that detects the reflected fluorescent image. Here, the object to be inspected 10 is, for example, a printed wiring board on which mounted components are mounted. Further, as the fluorescent screen 16, one having a structure that does not transmit light is used.

In the present invention, an illumination lamp 2 is further provided above the inspection stage 12 and irradiates the object to be inspected lO from the same side as the X-rays.
2, and place the second mirror 24 that reflects the optical image of the object 10 directly under the X-ray tube 14 (X-ray tube 1
4 and the inspection stage 12), and an optical power camera 26 is installed in the reflection optical path of the second mirror 24. The second mirror 24 functions to reflect the optical image in a substantially perpendicular direction and allows the optical power camera 26 to be installed at a location not affected by X-rays.

Soldering appearance inspection is performed as follows. X-rays emitted from the X-ray tube 14 pass through the object 10 and are converted into light by the fluorescent screen 16.

The amount of X-rays that have passed through the soldered area is reduced, so the image is dark, and the rest of the image has a bright contrast. The optical path of the fluorescent image is bent approximately at right angles by the first mirror 18 below, and then enters the X-ray camera 20. Image information detected by the X-ray camera 20 is sent to an image processing device (not shown).

The reason why the X-ray camera 20 is not installed directly below the X-ray tube 14 is to prevent the camera's electronic circuit and the like from being directly affected by the X-rays. Note that the second mirror 24 located directly below the X-ray tube 14 may be an extremely common glass reflecting mirror, and has almost no effect on X-ray irradiation. lighting lamp 2
If the amount of light 2 is large, the light may leak onto the fluorescent screen 16, so it is better to lower the amount of light when capturing an X-ray image.

Inspection of mounted components is performed as follows. The object to be inspected 10 is irradiated with the illumination lamp 22, and the optical image thereof is transferred to the second mirror 2.
Reflect at 4. The optical path is bent approximately at right angles, and the reflected optical image is incident on the optical power camera 26. The image information detected by the optical force camera 26 is also sent to the image processing device, and the mounted components are checked.

Since the fluorescent screen 16 has a structure that does not allow light to pass through,
It is possible to use X-rays and simultaneously capture an optical image of the illuminated part.

Furthermore, in the present invention, since the second mirror 24 is provided on the X-ray irradiation axis, the focus position of the X-ray inspection system and the focus position of the optical inspection system can be set at the same location. As a result, the soldered appearance inspection using the X-ray method and the mounted component inspection using the optical method can be performed simultaneously without moving the object 10 to be inspected, and the soldered portion and the mounted component can be inspected with minimum loss time.

Furthermore, since there is basically no difference in image processing devices between the X-ray method and the optical method, both can be used in common, and the system can be configured at low cost. In such a configuration, the inspection is serial processing and takes time, but if high-speed processing is required, the processing device may be configured in parallel.

[Effects of the Invention] As described above, the present invention is an apparatus that combines the soldering appearance inspection function of the X-ray method and the mounted component inspection function of the optical method. Visual inspection of both mounted components can be performed accurately and quickly, improving inspection performance.

The present invention does not require a costly inspection stage section, image processing,
Since inspection processors and the like can be shared, the cost of the entire system can be reduced and the installation space of the system can be reduced.

[Brief explanation of the drawing]

FIG. 1 is an explanatory diagram showing an embodiment of the appearance inspection apparatus according to the present invention. 10... Inspection object, 12... Inspection stage, 14.
・・X-ray tube, 16・・fluorescent screen, 18・
...First mirror 20...X-ray camera, 22...
Illumination lamp, 24... second mirror, 26... optical power camera. Patent applicant Iwaki Electronics Co., Ltd.

Claims (2)

[Claims] 1. An inspection stage that moves the inspected object, an X-ray tube that irradiates the inspected object with X-rays, and an X-ray tube that irradiates the inspected object with X-rays.
In an X-ray type soldering appearance inspection apparatus equipped with a fluorescent screen that converts rays into light and an X-ray camera that detects the fluorescent image, an illumination lamp that irradiates the object to be inspected from the same side as the X-rays. A mirror is installed on the X-ray irradiation axis between the X-ray tube and the inspection stage, and an optical power camera is installed in the reflection optical path of the mirror. Appearance inspection device for soldering parts and mounted parts. 2. 2. The apparatus according to claim 1, wherein the X-ray tube is located directly above the examination stage, the fluorescent screen is located directly below the examination stage, and the illumination lamp is installed above the examination stage.