JP2801657B2 - Package inspection equipment with pins - Google Patents

Description

Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a pinned package inspection apparatus for inspecting pins of a pinned package such as a printed wiring board.

[Prior Art] Conventionally, in order to inspect pins of a package with pins for defects, the package is visually inspected from the x direction and the y direction, and if the pins are not arranged in a line, it is determined as a defect. In addition, a jig with a hole for pin insertion was created at the position where the pin was attached, and the package was gently placed on this jig, and it was judged whether it was normal or not by checking whether it fits in the jig. .

[Problems to be Solved by the Invention] In the conventional packaged inspection apparatus with pins as described above, there is a large possibility that a failure is overlooked, and it takes time.
There has been a problem that the pin bending can be determined but the pin missing cannot be determined, and the pin is scratched in the inspection using a jig or the like.

The present invention has been made to solve such a problem, and an object of the present invention is to provide an accurate and efficient package inspection apparatus with pins.

[Means for Solving the Problems] A package inspection apparatus with pins according to the present invention includes a translucent optical substrate on which a package with pins to be inspected is mounted, and a mounting position of the package with pins on the optical substrate. A plurality of scattered light white light sources provided so as to surround the optical substrate, an optical detector installed below the optical substrate and detecting an image of a pin reflected on the optical substrate, and an optical detector from the optical detector. And an image processing device for processing an image signal.

[Operation] In the present invention, an image of a pin reflected on an optical ground glass is captured by an optical detector, and the captured image is processed by an image processing device to determine a non-defective or defective pin.

Embodiment FIG. 1 is a diagram showing the appearance of a packaged inspection apparatus with pins according to an embodiment of the present invention. In the figure, (1)
Is an optical ground glass, and (2) is a scattered light white light source, which is provided on the optical ground glass (1) at equal intervals in four directions. (3) is a package with pins to be inspected, which is located at the center of each scattered white light source (2).
(4) is a video camera, which images a pin image of the package (3) with pins. (5) is an opaque plate (made of metal)
In order to improve the accuracy of the video camera (4) installed below the optical ground glass (1), the video camera (4) covers the optical ground glass (1).

FIG. 2 is a diagram showing an image captured from a video camera.

Next, the operation will be described. When white light is applied in the direction of the arrow from four scattered light white light sources (2) to a package (3) with pins placed in the center on the frosted optical glass (1),
An image of a pin as shown in FIG. 2 is taken into a video camera (4) through an optical frosted glass (1) and image-processed by an image processing device (6) to determine whether the pin is good or defective. In FIG. 2, the position having the lowest luminance (gray level) among the images of the pins corresponds to the pin point. The image of the pin is an image in which the tip of the pin is displaced due to the bending of the pin, and the pin is determined to be defective. The image of the pin is an image of the missing pin, and the pin tip cannot be detected.

Also, the difference in the pin type (the pin length is different) can be determined by detecting this because the brightness of a specific pin destination is completely different from the other pins around the pin.

If the scattered white light source (2) in the above embodiment is changed to a white fluorescent lamp (2 ') as shown in FIG. 3, the luminous intensity with respect to the pinned package to be inspected becomes constant and is reflected on a translucent plate. The image of the pin is made more uniform, and the detection power of the pin tip is improved.

When the video camera (4) in the other embodiment shown in FIG. 3 is replaced with a mask pattern (7) and an optical sensor (4 '), the mask pattern (7) is an opaque plate, and only the pin tip portion is used. Has a cut-out structure,
When there is a defect of the pin, light leakage is detected by the optical sensor (4 '), and a defective pin can be found, thereby easily distinguishing a non-defective product from a defective product.

[Effects of the Invention] As described above, the present invention provides a semi-transparent optical substrate on which a package with pins to be inspected is mounted, and is provided so as to surround the mounting position of the package with pins on the optical substrate. A plurality of scattered light white light sources, an optical detector installed below the optical substrate for detecting an image of a pin reflected on the optical substrate, and an image processor for processing an image signal from the optical detector By using a plurality of scattered light white light sources, the image of the pin is uniformly reflected on the translucent plate, so that the image captured by the video camera becomes two colors of white and black, and the image processing algorithm is simplified. Has an effect. In addition, a pin dropout, a pin bending, a difference in pin type, and the like can be found only by an image captured by a video camera, so that the inspection time can be shortened. In addition, since there is no need to create a special jig, there is an effect that the versatility is very high.

[Brief description of the drawings]

FIG. 1 is an external view of a package inspection apparatus with pins according to an embodiment of the present invention, FIG. 2 is an image view taken from a video camera, and FIGS. 3 and 4 are diagrams with pins according to another embodiment of the present invention. It is an outline view of a pattern inspection device. In the figure, (1) ... frosted glass for optical use, (2) ...
Scattered light white light source, (2 ') fluorescent light, (3) package with pins, (4) video camera, (4')
... optical sensor (6) ... image processing device. The same reference numerals in the drawings indicate the same or corresponding parts.

──────────────────────────────────────────────────続 き Continued on the front page (58) Field surveyed (Int.Cl. ⁶ , DB name) G01N 21/84-21/91 G01B 11/00-11/30 102 H05K 13/08

Claims (1)

(57) [Claims] 1. A translucent optical substrate on which a package with pins to be inspected is mounted, and a plurality of scattered light white light sources provided so as to surround the mounting position of the package with pins on the optical substrate as a center. And an optical detector installed below the optical substrate, for detecting an image of a pin reflected on the optical substrate, and an image processing device for processing an image signal from the optical detector. Package inspection equipment with pins.