JP2692147B2 - Object detection method - Google Patents
Object detection methodInfo
- Publication number
- JP2692147B2 JP2692147B2 JP63161635A JP16163588A JP2692147B2 JP 2692147 B2 JP2692147 B2 JP 2692147B2 JP 63161635 A JP63161635 A JP 63161635A JP 16163588 A JP16163588 A JP 16163588A JP 2692147 B2 JP2692147 B2 JP 2692147B2
- Authority
- JP
- Japan
- Prior art keywords
- shadow
- allowable range
- inspection
- detection position
- detection
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Length Measuring Devices By Optical Means (AREA)
- Geophysics And Detection Of Objects (AREA)
- Supply And Installment Of Electrical Components (AREA)
Description
【発明の詳細な説明】 産業上の利用分野 本発明は製造工程中の検査工程において、検査対象物
である所定の寸法の部品等がある特定の位置に存在する
ことを検査する物体検出方法に関するものである。Description: BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an object detecting method for inspecting that a component having a predetermined size, which is an inspection object, exists at a specific position in an inspection process during a manufacturing process. It is a thing.
従来の技術 所定の寸法の検査対象物がある特定の位置に存在する
事を検査する方法の一つとして、検査対象物の影を用い
る方法が提案されていた。これは、検査対象物の斜め上
方に設置した照明装置により検査対象物を照射したとき
に得られる２値画像から、検査対象物の影部分の像を抽
出し、その形状から重心等の特徴量を計算し、予め登録
されている数値と比較することにより、検査対象物の位
置や有無を検出するものである。2. Description of the Related Art A method using a shadow of an inspection target has been proposed as one of methods for inspecting that an inspection target having a predetermined size exists at a specific position. This is to extract the image of the shadow portion of the inspection object from the binary image obtained when the inspection object is irradiated by the illumination device installed diagonally above the inspection object, and to extract the feature amount such as the center of gravity from the shape. Is calculated and compared with a previously registered numerical value to detect the position and presence / absence of the inspection object.
発明が解決しようとする課題 しかしながら上記に示す従来の方法によると、まず影
部分の特定の形状の画像を得るために、検査対象物の影
とそれ以外の部分とを区別できるようなしきい値と呼ば
れるある一定の値の明るさを境に白と黒に２値化するた
めの濃度値を、設定することが必要で、しきい値の設定
にあたっては、検査対象物の色や背景部分の色の条件等
を考慮して設定しても、常に所定の形状の影の画像が得
られるとは限らなかった。さらに、良品の検査対象物が
存在可能な許容範囲が大きくなる程、影を探索すべき探
索範囲も広くしなければならず、検査対象物の色、背景
部の色、照明の条件等により、得られる影の形状にバラ
ツキを生じたり、影以外の部分の余分な情報（ノイズ）
を検出する可能性が高くなり、位置検出精度が悪くなる
という問題点があった。However, according to the conventional method described above, first, in order to obtain an image of a specific shape of the shadow portion, a threshold value that can distinguish the shadow of the inspection object and the other portions It is necessary to set the density value for binarizing white and black with a certain brightness called a boundary, and when setting the threshold value, the color of the inspection object or the color of the background part is set. Even if the setting is performed in consideration of the conditions of 1), the shadow image of the predetermined shape is not always obtained. Furthermore, the larger the allowable range in which a non-defective inspection object can exist, the wider the search range in which the shadow should be searched, and the color of the inspection object, the color of the background, the lighting conditions, etc. There is variation in the shape of the obtained shadow, and extra information (noise) in the area other than the shadow
There is a problem in that the possibility of detecting the position is increased and the position detection accuracy is deteriorated.
課題を解決するための手段 そこで本発明の物体検出方法では、上記問題点を解決
するために，直方体形状をなす検査対象物の斜め上方
に，該検査対象物の各辺に対して直角方向から照射され
るよう複数個の照明を各々配置し，各照明を順次発光し
て検査対象物の影を各々生じさせる第１工程と，第１工
程で得られた個々の影に対する個々の重心位置を求める
第２工程と，第２工程で求めた個々の重心位置をもと
に，各前記重心位置からの所定の相対位置関係により決
定される暫定検出位置を求める第３工程と，この暫定検
出位置が予め設定された所定の許容範囲外にある場合に
は，不良と判定する第４工程と，第４工程にて前記暫定
検出位置が許容範囲内にある場合には，前記暫定検出位
置をもとに良品物体の存在し得る許容範囲よりも小さい
探索範囲を設定する第５工程と，この第５工程で設定さ
れた前記探索範囲内で検査対象物の外形形状の検出処理
を行う第６工程を有することを特徴とするものである。Therefore, in order to solve the above problems, in the object detection method of the present invention, in order to solve the above-mentioned problems, the inspection object having a rectangular parallelepiped shape is obliquely above the inspection object from a direction perpendicular to each side of the inspection object. The first step of arranging a plurality of illuminations so as to irradiate each of the illuminations and sequentially producing each of the illuminations to produce a shadow of the inspection object and the position of the center of gravity for each shadow obtained in the first step are described. A second step to be obtained, a third step to obtain a provisional detection position determined by a predetermined relative positional relationship from each of the center of gravity positions based on the individual center of gravity positions obtained in the second step, and the provisional detection position Is outside the predetermined allowable range set in advance, the fourth step of determining a defect, and when the temporary detection position is within the allowable range in the fourth step, the temporary detection position is also detected. Is smaller than the allowable range for non-defective objects The present invention is characterized by including a fifth step of setting a good search range and a sixth step of detecting the outer shape of the inspection object within the search range set in the fifth step.
作用 本発明は、上記方法により、許容範囲内にある物体の
影を利用して大まかな存在位置を求め、位置検出処理の
ための探索範囲を小さく限定することにより、余分なノ
イズ情報を排除して位置検出処理における信頼性を向上
させることができ、物体の影そのものの形状から物体の
位置を直接検出する方法に比べて、影の形状のバラツキ
や、余分なノイズ情報の影響を受けにくい安定した検出
が可能となる。Effect The present invention eliminates unnecessary noise information by obtaining a rough existing position by utilizing the shadow of an object within the allowable range by the above method and limiting the search range for the position detection process to a small range. The reliability of the position detection process can be improved, and compared to the method that directly detects the position of the object from the shape of the shadow itself of the object, it is more stable and less susceptible to variations in shadow shape and extra noise information. It is possible to detect the difference.
実施例 以下、本発明の一実施例を図を用いて説明する。第１
図は本実施例の物体検出方法のフローチャート、第２図
は本実施例であるチップ部品装着検査装置（以下、チッ
プ検査装置と略す）の概略構成図である。本実施例のチ
ップ検査装置はプリント基板８上に装着されたチップ部
品９の位置を検査するもので、本発明の物体検出方法を
用いている。検査対象物であるチップ部品９と、照明装
置10〜13、画像を画像認識部15に入力するためのTVカメ
ラ14との位置関係は第２図の通りであり、他の場所のチ
ップ部品を検査するために、照明装置とTVカメラはプリ
ント基板上をロボットにより平行移動する。Embodiment An embodiment of the present invention will be described below with reference to the drawings. First
FIG. 1 is a flowchart of the object detection method of this embodiment, and FIG. 2 is a schematic configuration diagram of a chip component mounting inspection device (hereinafter abbreviated as chip inspection device) of this embodiment. The chip inspection apparatus of this embodiment inspects the position of the chip component 9 mounted on the printed circuit board 8 and uses the object detection method of the present invention. The positional relationship among the chip component 9 that is the inspection object, the illumination devices 10 to 13 and the TV camera 14 for inputting an image to the image recognition unit 15 is as shown in FIG. For inspection, the illuminator and TV camera are translated by a robot on the printed circuit board.
さて実施例のチップ検査装置の動作を第１図に基づき
説明する。前処理としてチップ検査装置としての画像処
理等の処理全体を司どる画像認識部15に各チップ部品の
位置、外形寸法、種類等のデータを入力し、影の重心か
らの相対位置や許容範囲を設定しておく。まず、検査の
ステップ１で照明10を発光し、チップ部品９の影16を生
じさせる。引き続きステップ２にて、ステップ１で得ら
れた影の形状より影の重心位置P1を計算する。同様に照
明11〜13を順次発光し各々の照明に対応する影17〜19を
生じさせ、それらの形状より重心位置P2〜P4を計算す
る。次にステップ３において、予めP1〜P4各々からの相
対位置によって定められている位置Ｐ（この位置を暫定
検出位置と呼ぶ）を求め，ステップ４にて予め教えられ
ている検査対象物の大きさを考慮して所定の許容範囲と
の位置関係をチェックする。部品の欠品等で検査対象物
が許容範囲内に存在しない場合には、影15〜18に相当す
る所定の形状が得られないので、P1〜P4から求めるＰの
位置は正規の場合に比べると大きくずれ、検査対象物の
大きさを考慮すると許容範囲外となる場合が多く、部品
欠品のNGの多くはこのステップにて判別されることにな
る。ステップ４にて許容範囲内にあると判断された場合
には、先に求められた位置Ｐをもとにして、予め登録さ
れた検査対象物の大きさに応じた位置検出処理のための
探索範囲を設定する（ステップ５）。ここで設定される
位置検出処理のための探索範囲の大きさは、良品物体の
存在し得る許容範囲よりも小さい範囲とする。ステップ
５にて設定された探索範囲内において位置検出処理を行
う。ここで位置検出処理とは、指定された範囲内におい
て微妙な明度の差を判別し、その変化点を検出するよう
な非常に検出感度の鋭敏な一連の演算処理群で、本実施
例においては、前記の位置検出処理を検査対象物品の外
形部に適用することにより、検査対象物の外形形状を検
出し、その各頂点の位置座標を計算するものとする（ス
テップ６）。ステップ６において求められた各頂点の位
置座標をもとに、検出対象物に対する詳細な位置や寸法
を求め、予め登録してある条件と比較し、最終的な良否
の判定を行う（ステップ７）。Now, the operation of the chip inspection apparatus of the embodiment will be described with reference to FIG. As the pre-processing, data such as the position of each chip part, the external dimension, and the type is input to the image recognition unit 15 that controls the entire processing such as image processing as the chip inspection device, and the relative position from the gravity center of the shadow and the allowable range are set. Set it. First, in step 1 of the inspection, the illumination 10 is caused to emit light, and a shadow 16 of the chip component 9 is produced. Subsequently, in step 2, the barycentric position P 1 of the shadow is calculated from the shape of the shadow obtained in step 1. Similarly, the lights 11 to 13 are sequentially emitted to generate shadows 17 to 19 corresponding to the respective lights, and the barycentric positions P 2 to P 4 are calculated from their shapes. Next, in step 3, the position P (this position is referred to as a provisional detection position) determined in advance by the relative position from each of P 1 to P 4 is obtained, and in step 4, the inspection object is taught in advance. The positional relationship with a predetermined allowable range is checked in consideration of the size. If the inspection target is not within the allowable range due to missing parts, etc., the predetermined shape corresponding to shadows 15-18 cannot be obtained, so the position of P obtained from P 1 -P 4 is normal. Compared with the above, there is a large deviation, and in many cases it is out of the allowable range in consideration of the size of the inspection object, and most of the NG of missing parts will be determined in this step. If it is determined in step 4 that the position is within the allowable range, a search for a position detection process corresponding to the size of the inspection object registered in advance is performed based on the position P previously obtained. Set the range (step 5). The size of the search range for the position detection processing set here is set to a range smaller than the allowable range in which a non-defective object can exist. Position detection processing is performed within the search range set in step 5. Here, the position detection processing is a series of arithmetic processing groups having a very sensitive detection sensitivity such that a subtle difference in lightness is discriminated within a designated range and a change point thereof is detected. By applying the position detection processing to the outer shape of the inspection target article, the outer shape of the inspection target is detected, and the position coordinates of each vertex are calculated (step 6). Based on the position coordinates of the vertices obtained in step 6, detailed positions and dimensions with respect to the detection target object are obtained and compared with pre-registered conditions to make a final pass / fail judgment (step 7). .
発明の効果 以上のように本発明によれば、検査対象物の影を利用
して大まかな存在位置を求めることにより、通常検出対
象物の許容範囲全域に対して位置検出処理を施すと、余
分なノイズ情報を検出してしまって検出精度が低くなる
ような場合にでも、位置検出処理のための探索範囲を小
さく限定することができるので、従来の方法に比べて、
影の形状のバラツキや余分なノイズ情報の影響を受けに
くい安定した検出が可能となる。さらに、検査対象物の
周囲に基板上のシルク印刷や穴などの存在により、影と
それ以外の部分との判別が困難な箇所においては、予め
その箇所の検査対象物の位置の算出に用いる影のいくつ
かを選択しておくことで、検査対象物の多様化に対応で
き、かつより一層の検査信頼性の向上が可能となる。EFFECTS OF THE INVENTION As described above, according to the present invention, when the position detection processing is performed on the entire allowable range of the normal detection object by obtaining the rough existence position by utilizing the shadow of the inspection object, Even if the detection accuracy is lowered due to detection of various noise information, the search range for the position detection processing can be limited to a small range, so compared to the conventional method,
It is possible to perform stable detection that is unlikely to be affected by variations in shadow shape and extra noise information. Furthermore, in areas where it is difficult to distinguish shadows from other areas due to the presence of silk-screen printing or holes on the substrate around the object to be inspected, the shadow used to calculate the position of the object to be inspected in advance at that location By selecting some of them, it becomes possible to cope with diversification of the inspection object and further improve the inspection reliability.
【図面の簡単な説明】 第１図a,bは本発明の一実施例における物体検出方法の
フローチャート図、第２図は部品装着検査装置の概略構
成図であり、第２図ａは側面図、第２図ｂは平面図であ
る。 ９……検査対象物、10〜13……照明装置、14……TVカメ
ラ、15……画像認識部。BRIEF DESCRIPTION OF THE DRAWINGS FIGS. 1a and 1b are flowcharts of an object detection method in an embodiment of the present invention, FIG. 2 is a schematic configuration diagram of a component mounting inspection device, and FIG. 2a is a side view. 2b is a plan view. 9 ... Object to be inspected, 10 to 13 ... Illumination device, 14 ... TV camera, 15 ... Image recognition unit.
───────────────────────────────────────────────────── フロントページの続き (56)参考文献 特開 昭62−266403（ＪＰ，Ａ) 特開 昭60−24403（ＪＰ，Ａ) 特開 昭63−44104（ＪＰ，Ａ) 特開 昭62−265508（ＪＰ，Ａ) 特開 昭63−29206（ＪＰ，Ａ) ─────────────────────────────────────────────────── ─── Continuation of the front page (56) Reference JP 62-266403 (JP, A) JP 60-24403 (JP, A) JP 63-44104 (JP, A) JP 62- 265508 (JP, A) JP-A-63-29206 (JP, A)
Claims (1)
に，該検査対象物の各辺に対して直角方向から照射され
るよう複数個の照明を各々配置し，各照明を順次発光し
て検査対象物の影を各々生じさせる第１工程と，第１工
程で得られた個々の影に対する個々の重心位置を求める
第２工程と，第２工程で求めた個々の重心位置をもと
に，各前記重心位置からの所定の相対位置関係により決
定される暫定検出位置を求める第３工程と，この暫定検
出位置が予め設定された所定の許容範囲外にある場合に
は，不良と判定する第４工程と，第４工程にて前記暫定
検出位置が許容範囲内にある場合には，前記暫定検出位
置をもとに良品物体の存在し得る許容範囲よりも小さい
探索範囲を設定する第５工程と，この第５工程で設定さ
れた前記探索範囲内で検査対象物の外形形状の検出処理
を行う第６工程を有することを特徴とする物体検出方
法。1. A plurality of illuminations are arranged obliquely above a test object having a rectangular parallelepiped shape so that each side of the test object is irradiated from a direction perpendicular to each side, and the respective lights are sequentially emitted. Based on the first step for respectively producing the shadow of the inspection object, the second step for obtaining the position of the center of gravity for each shadow obtained in the first step, and the position of the center of gravity for the individual obtained in the second step , A third step of obtaining a provisional detection position determined by a predetermined relative positional relationship from each of the barycentric positions, and if the provisional detection position is outside a preset predetermined allowable range, it is determined to be defective. In the fourth step, and in the fourth step, if the temporary detection position is within the allowable range, a search range smaller than the allowable range in which a non-defective object can exist is set based on the temporary detection position. Within the process and the search range set in this 5th process Object detecting method characterized by having a sixth step of performing the process of detecting contour of 査 object.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63161635A JP2692147B2 (en) | 1988-06-29 | 1988-06-29 | Object detection method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP63161635A JP2692147B2 (en) | 1988-06-29 | 1988-06-29 | Object detection method |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH0210204A JPH0210204A (en) | 1990-01-16 |
| JP2692147B2 true JP2692147B2 (en) | 1997-12-17 |
Family
ID=15738935
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63161635A Expired - Fee Related JP2692147B2 (en) | 1988-06-29 | 1988-06-29 | Object detection method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP2692147B2 (en) |
Families Citing this family (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2714277B2 (en) * | 1991-07-25 | 1998-02-16 | 株式会社東芝 | Lead shape measuring device |
| JP6024349B2 (en) * | 2012-09-28 | 2016-11-16 | サクサ株式会社 | Monitoring device and monitoring system |
| DE112016007500T5 (en) * | 2016-12-07 | 2019-10-24 | Yamaha Hatsudoki Kabushiki Kaisha | Surface mount device, component recognition device and component recognition process |
| CN107565375A (en) * | 2017-09-30 | 2018-01-09 | 昂纳信息技术（深圳）有限公司 | A kind of pasting method of chip of laser |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6024403A (en) * | 1983-07-20 | 1985-02-07 | Tokico Ltd | Position detecting device |
| JPS62266403A (en) * | 1986-05-15 | 1987-11-19 | Toshiba Corp | Position recognizing instrument for three-dimensional object |
| JPS6344104A (en) * | 1986-08-12 | 1988-02-25 | Nissan Motor Co Ltd | Method for confirming position and posture of work |
-
1988
- 1988-06-29 JP JP63161635A patent/JP2692147B2/en not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0210204A (en) | 1990-01-16 |
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