JP3700486B2 - Contact type image sensor IC mounting position inspection method and contact type image sensor IC mounting position inspection apparatus - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention and the sensor substrate of the contact type image sensor is a sensor device of the image scanner, an inspection method for inspecting a mounting position state to the sensor substrate of the image sensor IC (Integrated Circuit), and an inspection device.
[0002]
[Prior art]
With the recent increase in demand for personal computers, the demand for image scanners, which are one of the peripheral devices, has increased. The performance required for an image scanner is the reproducibility of a wide-size and high-definition read image quality. For this purpose, the size of the scanner itself and the high integration of mounted elements are increasing.
[0003]
FIG. 11 is a schematic diagram of a contact image sensor. 1 is a sensor substrate that receives a read image, 2 is an LED unit that projects light onto a target image, 3 is a lens that focuses LED light emitted from 2 and forms an image on an image sensor IC mounted on 1 The unit 4 is a glass plate, and 5 is a package for assembling the components of the sensor 1 to the glass plate 4.
[0004]
FIG. 12 is a schematic view of the sensor substrate 1. Reference numerals 6A ₁ to 6A _{n denote} image sensor ICs which are sensor devices serving as the heart of the image scanner, and are mounted on the sensor substrate 1 in-line as shown in the figure. FIG. 13 is an enlarged view of the image sensor IC 6. Reference numerals 7A ₁ to 7An _denote light receiving units that receive the read images.
[0005]
The image quality of the image scanner is determined by the mounting accuracy of the image sensor IC 6 on the sensor substrate 1 as well as the assembly accuracy of the sensor substrate 1, the LED unit 2, and the lens unit 3 with respect to the package 5.
[0006]
The assembly accuracy of the LED unit 2, the lens unit 3, and the sensor substrate 1 in the package can be compensated by automation of the assembly process. However, as described above, the integration of the image sensor IC 6 on the sensor substrate 1 is highly integrated. However, since the mounting accuracy of the IC mounting machine (die bonder) alone cannot be satisfied, a visual inspection is separately performed by using a microscope.
[0007]
[Problems to be solved by the invention]
By the way, the actual read image quality often becomes a problem at the time of acceptance evaluation performed at the customer who shipped after assembly into the package, which causes defective outflow and complaints. In particular, the influence of the image sensor IC mounting state on the image quality occupies the majority, which means finding defects after the assembly of the package, and there is a problem that it is difficult to rework the sensor substrate at this stage.
[0008]
The present invention has been made in order to solve the above-described problems, and in order to control the image quality of an image scanner, a contact image sensor IC capable of inspecting the mounting state of the image sensor IC on the sensor substrate before assembly of the package. The object is to obtain a mounting position inspection method and apparatus .
[0011]
[Means for Solving the Problems]
The contact image sensor IC mounting position inspection method according to the present invention is an image of a sensor substrate provided with two target marks for calculating a reference line for inspecting the mounting position of an image sensor IC mounted in-line. In the method of inspecting the mounting position of the sensor IC, a step of connecting two target marks and calculating a reference line, and from a midpoint between two light receiving portions at both ends of the light receiving portion row provided in the image sensor IC In addition to the step of inspecting the mounting position of the image sensor IC on the sensor substrate by measuring the distance to the reference line, the surface on which the image sensor IC is mounted on the sensor substrate is defined as the XY plane, and the adjacent image sensor IC Two adjacent image centers are calculated from the X-direction center distance and the Y-direction center distance between two adjacent light receiving units. In which further comprises the step of measuring the relative positional relationship of the IC.
[0012]
Or, the step of capturing an image of good image sensor IC, an image of good image sensor IC with the master image, obtains a difference between the image of the image sensor IC of the inspection target with the master image, the image area the difference value is not 0 If there is a defect in the appearance of the image sensor IC to be inspected , and the luminance of the corner of the image sensor IC to be inspected is the same as the luminance of the adhesive, the defect is regarded as adhesive leakage, same time as the luminance brightness of the substrate of the image sensor IC corner of the test object is further contains a step of distinguishing the chipping of the defect.
[0013]
Further, as a target mark is to utilize the mounting holes for mounting the sensor substrate to the package.
[0014]
Further, according to the present invention the contact image sensor IC mounting position inspection device includes an image capturing means for capturing an image of Lee Mejisensa IC, a drivable XY stage to change the image capturing position is mounted an image sensor IC reference from the midpoint between the two light receiving portion from image captured by the image capturing means to calculate a reference line bear target mark of two locations, also at both ends of the light receiving portion array provided on the image sensor IC The mounting position of the image sensor IC on the substrate is inspected by measuring the distance to the line, and the surface of the sensor substrate on which the image sensor IC is mounted is defined as an XY plane, and the adjacent image sensor ICs are adjacent to each other. The relative positional relationship between the two adjacent image sensor ICs from the X-direction center distance and the Y-direction center distance between the two light receiving portions. Is obtained by an arithmetic processing unit that measures.
Alternatively, an image capturing unit that captures an image of the image sensor IC, an XY stage that is mounted with the image sensor IC and can be driven to change the image capturing position, and two targets from the image captured by the image capturing unit The sensor substrate of the image sensor IC is calculated by connecting a mark, calculating a reference line, and measuring the distance from the midpoint between the two light receiving parts at both ends of the light receiving part row provided in the image sensor IC to the reference line. The mounting position of the image sensor IC is inspected, the image of the non-defective image sensor IC is captured, the image of the non-defective image sensor IC is used as a master image, and the difference between the master image and the image of the image sensor IC to be inspected is obtained. If there is an image area where the difference value is not 0, it is determined that the appearance of the image sensor IC to be inspected is defective, and further the inspection object When the luminance of the corner of the image sensor IC is the same as the luminance of the adhesive, the defect is leaked as adhesive, and when the luminance of the corner of the image sensor IC to be inspected is the same as the luminance of the substrate, the defect is defective. And an arithmetic processing device for distinction.
[0015]
Further , an image capturing means for capturing an image of an attachment hole having a larger visual field size than an image capturing means for capturing an image of the image sensor IC, an image capturing means for capturing an image of the image sensor IC, and an image of the mounting hole. Position correction means for correcting the positional relationship of each of the image capturing means to be captured .
[0016]
DETAILED DESCRIPTION OF THE INVENTION
Embodiment 1 FIG.
FIG. 1 is an explanatory view for explaining a method for inspecting a contact image sensor IC mounting position according to Embodiment 1 of the present invention.
[0017]
In FIG. 1, reference numerals 6A1 to 6An denote image sensor ICs which are sensor devices which are the heart part of the image scanner, and are mounted inline on the sensor substrate 1 as shown in the figure. Reference numerals 7A1 to 7An denote light receiving units that receive the read image. Reference numeral 8 is a target mark provided in at least two places on the sensor substrate 1, and 9 is a reference line made of a straight line connecting the two target mark positions, which is a mounting position reference for the image sensor IC6. Here, it is assumed that N image sensor ICs 6 are mounted on the sensor substrate 1.
[0018]
FIG. 1A is an enlarged view showing the measurement principle of the mounting position of the image sensor IC 6. 10 out of the light receiving portion 7 on the image sensor IC6, a midpoint of the light receiving unit 7A _1, 7A _n respective central positions of both ends two locations, to define the middle point and the light receiving portion center position 10 of the image sensor IC6 . Here, when the reference line 9 is ax + by + c = 0 on the XY plane and the light receiving unit center position 10 of the image sensor IC 6 is (X _p , Y _p ), the distance A from the reference line 9 of the image sensor IC 6 is an image. The mounting position with respect to the reference line of the sensor IC 6 is defined.
[0019]
A = | aX _p + bY _p + c | / √ (a ² + b ² ) (1)
[0020]
FIG. 2 is an explanatory diagram showing a measurement order on the sensor substrate 1 when the mounting position of the image sensor IC 6 with respect to the reference line 9 is measured by the above procedure. The measurement order starts from the right target mark 8B toward the drawing, and after measuring the left target mark 8A, the first left end of the image sensor IC 6 → the first right end and the second left end → the second right end and the third left end →. → (N-1) th right end and Nth left end → Nth right end. Here, when measuring the image sensor IC 6, the measurement is performed for every two adjacent image sensor ICs in consideration of the measurement accuracy, the measurement area size, and the measurement time. When measuring an image sensor IC with a longitudinal direction of about 10 mm for measurements that require several μm in measurement accuracy, an input means such as a camera of about 5000 × 5000 bits is required to measure one image sensor IC. It becomes. For this reason, in order to measure with an input means such as a camera of about 500 × 500 bits, which is inexpensive and easily available, measurement is performed with a visual field size of about 1 × 1 mm, so two adjacent image sensors as described above. It is efficient to measure each IC.
[0021]
FIG. 3 is a flowchart showing the mounting position measurement / inspection operation with respect to the reference line 9 of the image sensor IC 6 in the above-described procedure. In steps 11 to 13, two target marks 8 are measured, and a reference line 9 connecting them is calculated. Next, at step 14, the position of the leftmost light receiving portion of the image sensor IC 6 is measured. Next, in steps 15 to 21, when 0 <i <N, the positions of the light receiving portions at the i-th right end and the (i + 1) -th left end of the image sensor IC 6 are calculated, the center position is calculated, and the mounting position from the reference line 9 (the above figure). After repeating the calculation / inspection of the distance A) in 1 (a), in steps 22 to 25, the measurement of the position of the light receiving part at the right end of N, the calculation of the center position, and the calculation / inspection of the mounting position from the reference line 9 I do.
[0022]
FIG. 4 is a block diagram showing an apparatus for measuring and inspecting the mounting position of the contact image sensor IC shown in the first embodiment. Reference numeral 34 denotes a camera as image capturing means, 35 denotes an image processing unit that analyzes image data captured by the camera 34, 36 denotes an inspection table on which the sensor substrate 1 to be inspected is mounted, and 37 denotes an XY stage on which the inspection table 36 is mounted. , 38 is a Z stage that performs focusing of the camera 34, 39 is a monitor that displays the inspection status performed by the image processing unit 35, and 40 is an overall control unit that controls the entire system.
[0023]
As shown in FIGS. 1 to 3, each image is captured by the camera 34 while the inspection table 36 is driven by the XY stage 37 according to the measurement item, and each detected position is obtained by analyzing the captured image by the image processing unit 35. . The overall control unit 40 performs the calculation of the reference line 9 from the two target mark positions and the calculation / inspection of the mounting position of the image sensor IC. As described above, this inspection system can be realized with a simple unit without requiring special mechanisms and parts.
[0024]
Embodiment 2. FIG.
In the first embodiment, in the measurement of the position of the light receiving unit of the image sensor IC 6, in order to perform efficient measurement from the measurement accuracy, the measurement region size, and the measurement time, measurement is performed for every two adjacent ICs. As described above, in the measurement process, it is possible to calculate and inspect the relative mounting positional relationship between two adjacent image sensor ICs by only adding a partial calculation process without changing the measurement sequence.
[0025]
FIG. 5 is a flowchart showing the measurement / inspection operation of the relative mounting position of two adjacent image sensor ICs. In the flowchart of FIG. 3 showing the mounting position measurement / inspection operation with respect to the reference line 9, between the step 19 and the step 20, the calculation / inspection of the relative positions of the i-th and (i + 1) -th ICs in the steps 26 and 27 is performed. It is possible to calculate and inspect two adjacent relative mounting positions simply by adding a calculation process. As shown in FIG. 1 (b), each of the center positions of the relative positional relationship between B of the left receiving portion 7B ₁ of the other side IC and the right end receiving portion 7A _n of one IC, it will be determined from the calculation of C. By the relative mounting position inspection of the two adjacent image sensor ICs, it is possible to determine, for example, the rotational deviation of each IC that cannot be determined only by the mounting position inspection with respect to the reference line 9.
[0026]
Embodiment 3 FIG.
In the first and second embodiments, in the measurement process, the image sensor IC 6 such as an application leakage state of an adhesive for adhering the ICs from adjacent portions of the image sensor ICs and breakage of IC corners or the like are damaged. It is also possible to detect defects in appearance.
[0027]
FIG. 6 is a schematic view showing an application leakage state of an adhesive for adhering the image sensor IC 6 to the substrate, and chipping at the corners of the IC. Reference numeral 28 denotes a state in which the adhesive creeps up to the upper surface of the IC and leaks. Reference numeral 29 denotes a state where the corner portion of the IC is missing. FIG. 7 is a flowchart showing an application leakage state of these adhesives and an inspection operation for IC corner chipping. In the flowchart of FIG. 3 representing the mounting position measurement / inspection operation with respect to the reference line 9, or the flowchart of FIG. 5 representing the relative mounting position measurement / inspection operation of two adjacent image sensor ICs, step 16 and step 17 are performed. In the meantime, each processing of the inspection of the application state of the adhesive material of the i-th IC and the (i + 1) -th IC in step 30 and the inspection of the chip state of the right-corner portion of the i-th IC and the left corner of the (i + 1) -th IC in step 31 If this is added, it is possible to divert the image data for detecting the position of the light receiving portion of the image sensor IC and perform these inspections.
[0028]
The following methods are conceivable as specific methods for inspecting the adhesive application leakage state and IC corner chipping in steps 30 and 31. First, an image of a non-defective image sensor IC 6 having no appearance defect is taken in as a master image and stored in advance in a memory mounted on the image processing unit 35. Then, in the actual inspection stage, the difference between the image of the image sensor IC 6 to be inspected and the master image is taken, and if there is an image region whose difference value is not 0 particularly near the IC corner, the image sensor IC 6 to be inspected It can be seen that there is an appearance defect.
[0029]
However, at this stage, it is not known whether the cause of defects in appearance is leakage of adhesive or due to chipping at the corners of the IC. When the distinction is necessary, it can be determined by checking the luminance (brightness) of the image near the IC corner. In the case of leakage of the adhesive, the surface of the adhesive is uneven, so that the illumination used at the time of image capturing is irregularly reflected, so that the IC corners are hidden and appear whitish. In the case of chipping, the luminance at the corners of the IC looks the same as that of the lower substrate. In this way, it is possible to distinguish from the difference in appearance.
[0030]
Embodiment 4 FIG.
FIG. 8 is an explanatory diagram for explaining the use of attachment holes provided for attaching the sensor substrate 1 to the package 5 as two target marks for obtaining the reference line 9. Reference numeral 32 denotes an attachment pin of the sensor substrate 1 provided on the package side, and 33 denotes an attachment hole for fitting to the package by fitting with the pin 32. If this mounting hole 33 is used for the target mark 8, the absolute reference line of the package reference can be obtained as it is without creating a separate target mark, so that the mounting position of the image sensor IC is measured and inspected with high accuracy. It becomes possible.
[0031]
Embodiment 5 FIG.
In the fourth embodiment, when the package attachment holes 33 are used as the two target marks 6 for obtaining the reference line 9, the package attachment holes 33 have the dimensions of the light receiving portion 7 for obtaining the IC mounting position. If the camera 34 is much larger than the field of view of the camera 34 having the optimum field size for light receiving unit recognition, it is necessary to provide a camera with a larger field size for package mounting hole recognition (that is, target mark recognition).
[0032]
FIG. 9 is a configuration diagram in which a camera 41 having a different visual field size is further added to the contact image sensor IC mounting position inspection apparatus shown in FIG. As described above, when the package mounting hole 33 assumed to be a target mark with respect to the light receiving unit 7 is considerably large, the position of the package mounting hole 33 (that is, the target mark 6) using the camera 41 and the camera 34 are used. The position of the light receiving unit 7 is obtained.
[0033]
By the way, in the above case, the package mounting hole 33 (that is, the target mark 6) and the light receiving unit 7 are recognized by the two cameras 34 and 41 having different visual field sizes, and the positions thereof are obtained. It affects the mounting position accuracy.
[0034]
FIG. 10 is an explanatory diagram showing position correction means for correcting the positions of the two cameras. Reference numeral 42 denotes a position correction board having the same size as that of the sensor board 1, and two circle marks having different diameters and widths are arranged concentrically at the center position. Reference numeral 43 denotes a circle mark having a large diameter and width. Cameras 41 and 44 having a large field size are circle marks having a small diameter and width, and are circular marks for position correction of the camera 34 having a small field size. Periodically, the position correction substrate 42 is mounted on the inspection table 36 instead of the sensor substrate 1 so that the cameras 41 and 34 recognize the center positions of the circle marks 43 and 44, and the position coordinates of the inspection table 36 at that time. If the positional relationship between the two cameras is managed, fluctuations in the positional relationship between the two cameras 34 and 41 that may be caused by a disturbance such as heat can be corrected.
[0035]
Embodiment 6 FIG.
In the contact image sensor IC mounting position inspection apparatus shown in the first embodiment, pixel data in the X direction and the Y direction of an image captured from the camera 34 is regarded as coordinates, and pixel coordinates arbitrarily designated on the image By combining the position and the movement amount obtained from the pulse amount of the encoder attached to the driving motor of the inspection table 36 that can be driven by the XY stage 37, the camera 34 at an arbitrary position on the XY stage 37 can be manually operated. By specifying two arbitrary positions in the image, it is possible to measure the distance between these two points.
[0038]
【The invention's effect】
As described above, in the method of inspecting the mounting position of the image sensor IC on the sensor board provided with two target marks for calculating the reference line for inspecting the mounting position of the image sensor IC mounted in-line, An image by connecting two target marks and calculating a reference line, and measuring the distance from the midpoint between two light receiving parts at both ends of the light receiving part row provided in the image sensor IC to the reference line In addition to the step of inspecting the mounting position of the sensor IC on the sensor substrate, the surface on which the image sensor IC is mounted on the sensor substrate is the XY plane, and the X direction center between two adjacent light receiving portions in the adjacent image sensor IC The method further includes the step of measuring the relative positional relationship between two adjacent image sensor ICs from the distance and the center distance in the Y direction. Since, in addition to the mounting state of the sensor substrate of the image sensor IC before assembling the package, the effect of the relative positional relationship between the two image sensor IC adjacent readily inspected is obtained.
[0039]
Or, the step of capturing an image of good image sensor IC, an image of good image sensor IC with the master image, obtains a difference between the image of the image sensor IC of the inspection target with the master image, the image area the difference value is not 0 If there is a defect in the appearance of the image sensor IC to be inspected , and the luminance of the corner of the image sensor IC to be inspected is the same as the luminance of the adhesive, the defect is regarded as adhesive leakage, since the same time as the luminance brightness of the substrate of the image sensor IC corners inspected further comprises a step of distinguishing and chipping the defect, the effect capable of inspecting defects in appearance of the image sensor IC can be obtained.
[0040]
Further, as te target mark, Se because capacitors utilizing the mounting holes for attaching the substrate to the package separately without the need to prepare such target marks for image sensor IC mounting position measurement, it is possible to obtain an absolute reference line package reference Therefore, it is possible to obtain an effect of measuring and inspecting the mounting position of the image sensor IC with high accuracy .
[0041]
Also, Lee and image capturing means for Mejisensa capturing an image of the IC, and the XY stage can be driven to change the image capturing position is mounted an image sensor IC, the image captured by the image capturing means of two places targets calculating a reference line bear marks, also in the image sensor IC by measuring the distance from the midpoint between the two light receiving sections at both ends of the light receiving portion array provided on the image sensor IC to the reference line sensor substrate And the surface of the sensor board on which the image sensor IC is mounted is defined as an XY plane, and the distance between the X-direction centers of the two adjacent light receiving portions in the adjacent image sensor IC, and Y and a direction center-to-center distance, since a processing unit for measuring a relative positional relationship between the two image sensor IC for the adjacent package assembly Only in addition to the mounting state of the sensor substrate of the image sensor IC before, the effect of the relative positional relationship between the two image sensor IC adjacent readily inspected is obtained.
Alternatively, an image capturing unit that captures an image of the image sensor IC, an XY stage that is mounted with the image sensor IC and can be driven to change the image capturing position, and two targets from the image captured by the image capturing unit The sensor substrate of the image sensor IC is calculated by connecting a mark, calculating a reference line, and measuring the distance from the midpoint between the two light receiving parts at both ends of the light receiving part row provided in the image sensor IC to the reference line. The mounting position of the image sensor IC is inspected, the image of the non-defective image sensor IC is captured, the image of the non-defective image sensor IC is used as a master image, and the difference between the master image and the image of the image sensor IC to be inspected is obtained. If there is an image area where the difference value is not 0, it is determined that the appearance of the image sensor IC to be inspected is defective, and further the inspection object When the luminance of the corner of the image sensor IC is the same as the luminance of the adhesive, the defect is leaked as adhesive, and when the luminance of the corner of the image sensor IC to be inspected is the same as the luminance of the substrate, the defect is defective. In addition to the mounting state of the image sensor IC on the sensor board before assembly of the package, an effect of easily inspecting the appearance defect of the image sensor IC can be obtained.
[0042]
Further, the image capturing means for capturing the image of the mounting hole having a larger field size than the image capturing means for capturing the image of the image sensor IC, the image capturing means for capturing the image of the image sensor IC, and the image of the mounting hole are captured. Since the position correction means for correcting the positional relationship of each of the image capture means is provided, the two image capture means can be used even when the mounting hole for attaching the sensor substrate to the package is used as the target mark as described above. The mounting position of the image sensor IC on the sensor substrate can be inspected with high accuracy regardless of the positional change caused by disturbance such as heat.
[Brief description of the drawings]
FIG. 1 is an explanatory diagram for explaining an image sensor mounting position inspection method according to Embodiment 1 of the present invention;
FIG. 2 is an explanatory diagram for explaining a measurement order on an image sensor substrate according to Embodiment 1 of the present invention.
FIG. 3 is a flowchart showing an image sensor mounting position inspection method according to Embodiment 1 of the present invention;
FIG. 4 is a configuration diagram showing an image sensor mounting position inspection apparatus according to Embodiment 1 of the present invention;
FIG. 5 is a flowchart showing an image sensor mounting position inspection method according to Embodiment 2 of the present invention;
FIG. 6 is an explanatory diagram for explaining an image sensor mounting position inspection method according to Embodiment 3 of the present invention;
FIG. 7 is a flowchart showing an image sensor mounting position inspection method according to Embodiment 3 of the present invention.
FIG. 8 is an explanatory diagram for explaining an image sensor mounting position inspection method according to Embodiment 4 of the present invention;
FIG. 9 is a block diagram showing an image sensor mounting position inspection apparatus according to Embodiment 5 of the present invention.
FIG. 10 is an explanatory diagram showing position correction means for correcting two camera positions according to Embodiment 5 of the present invention;
FIG. 11 is a schematic view of a conventional image sensor.
FIG. 12 is a schematic view of a conventional image sensor substrate.
FIG. 13 is an enlarged view of a conventional image sensor.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Sensor substrate, 6 Image sensor IC, 7 Light-receiving part, 8 Target mark, 9 Reference line, 10 Light-receiving part center position, 29 Package mounting hole, 34 Camera, 35 Image processing unit, 36 Inspection stand, 40 Overall control unit, 41 Camera, 42 Position correction means

Claims (6)

A step of calculating a reference line for inspecting the mounting position of the image sensor IC mounted in-line on the sensor substrate by connecting target marks provided at two locations on the sensor substrate; step from the midpoint between two of the light receiving portions at both ends of the provided light-receiving portion array seek distance to the reference line to inspect the mounting position of the image sensor IC, and the said image sensor IC of the sensor substrate There was implemented face the XY plane, X-direction distance between the centers of two of the light receiving portion adjacent in the image sensor IC adjacent, and a Y-direction distance between the centers of the two image sensor IC to the adjacent relative tight adhesion type image sensor IC mounting location check how to comprising the step of measuring the positional relationship. A step of calculating a reference line for inspecting the mounting position of the image sensor IC mounted in-line on the sensor substrate by connecting target marks provided at two locations on the sensor substrate; The step of determining the mounting position of the image sensor IC by obtaining the distance from the midpoint between the two light receiving portions at both ends to the reference line in the provided light receiving portion row, and the image of the non-defective image sensor IC capturing process, and the image of the non-defective image sensor IC with the master image, obtains a difference between the image of the image sensor IC of the inspection target with the master image, the inspected if the image area the difference value is not 0 It determines that there is a defect in the appearance of the image sensor IC, further the defect based on the luminance of an image sensor IC corner of the test-sample Tight adhesion type image sensor IC mounting location check how to comprising the step of distinguishing whether it is wearing agent leakage chipping. As a target mark, contact image sensor IC mounting position inspection method according to claim 1 or 2, characterized by the use of mounting holes for mounting the sensor substrate to the package. An image capturing means for capturing an image of Lee Mejisensa IC, a drivable XY stage to change the mounted image capture position sensor substrate for mounting the image sensor IC, images captured by the image capturing means from calculating the baseline bear target mark of two locations, also to measure the distance from the midpoint between two of the light receiving portions at both ends of the light receiving portion array provided in the image sensor IC to the reference line Thus, the mounting position of the image sensor IC on the sensor substrate is inspected , and the surface of the sensor substrate on which the image sensor IC is mounted is an XY plane, and the two adjacent light receiving units in the adjacent image sensor ICs X-direction distance between the centers of, and from the Y-direction distance between the centers, operation of measuring the relative positional relationship between the two image sensor IC to the adjacent Contact image sensor IC mounting position inspection apparatus characterized by comprising a management device. Image capturing means for capturing an image of the image sensor IC, an XY stage that can be driven to change the image capturing position by mounting the image sensor IC, and two targets from the image captured by the image capturing means The reference line is calculated by connecting the marks, and by measuring the distance from the midpoint between the two light receiving parts at both ends of the light receiving part row provided in the image sensor IC to the reference line. The mounting position on the sensor board is inspected, the image of the non-defective image sensor IC is captured, and the image of the non-defective image sensor IC is used as a master image. If there is an image area whose difference value is not 0, it is determined that the appearance of the image sensor IC to be inspected is defective, and further, A contact-type image sensor IC mounting position inspection apparatus comprising: an arithmetic processing unit that distinguishes whether the defect is an adhesive leak or a chip based on the brightness of an image sensor IC corner to be inspected . An image capturing means for capturing an image of a mounting hole for mounting a sensor substrate to a package having a larger field size than an image capturing means for capturing an image of the image sensor IC; an image capturing means for capturing an image of the image sensor IC; 6. The contact image sensor IC mounting position inspection apparatus according to claim 4, further comprising position correction means for correcting the positional relationship of each of the image capturing means for capturing the image of the mounting hole .

Images