JPH0499950A - Soldering inspection apparatus - Google Patents
Soldering inspection apparatusInfo
- Publication number
- JPH0499950A JPH0499950A JP21751690A JP21751690A JPH0499950A JP H0499950 A JPH0499950 A JP H0499950A JP 21751690 A JP21751690 A JP 21751690A JP 21751690 A JP21751690 A JP 21751690A JP H0499950 A JPH0499950 A JP H0499950A
- Authority
- JP
- Japan
- Prior art keywords
- solder
- brightness
- lead
- distance
- soldering
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 title claims abstract description 39
- 238000007689 inspection Methods 0.000 title claims abstract description 15
- 229910000679 solder Inorganic materials 0.000 claims abstract description 99
- 238000001514 detection method Methods 0.000 claims description 18
- 229920006395 saturated elastomer Polymers 0.000 claims description 9
- 230000001678 irradiating effect Effects 0.000 claims description 5
- 238000003384 imaging method Methods 0.000 description 10
- 238000005286 illumination Methods 0.000 description 8
- 238000010438 heat treatment Methods 0.000 description 6
- 230000007547 defect Effects 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 230000004927 fusion Effects 0.000 description 3
- 238000002844 melting Methods 0.000 description 3
- 230000008018 melting Effects 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000003287 optical effect Effects 0.000 description 2
- 241001122767 Theaceae Species 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
- 238000011179 visual inspection Methods 0.000 description 1
Landscapes
- Length Measuring Devices By Optical Means (AREA)
- Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Abstract
Description
プリント基板に表面実装された部品のリード先端の半田
付状態を検査する半田付検査装置に関し、半田部に照射
する光の強度や半田の反射率等に影響されずに、半田付
良否をより正確に判定することを目的とし、
プリント基板に表面実装された部品のリード先端の半田
部に光を照射して該半田部の明るさを検出する明るさ検
出手段と、該リードの先端部及び該半田のリード長手方
向側先端部に相当する該明るさのピーク位置を検出する
ピーク位置検出手段と、該ピーク位置間の距離Ｗを測定
する半田部測定手段と、基準値設定手段と、該距離Ｗと
該基準値との差に応じて半田付良否を判定する半田付良
否判定手段と、を備えて構成する。Regarding soldering inspection equipment that inspects the soldering condition of the lead tips of components surface-mounted on printed circuit boards, it is possible to more accurately determine the quality of soldering without being affected by the intensity of light irradiating the soldering area or the reflectance of the solder. A brightness detection means detects the brightness of the solder part by irradiating light onto the solder part at the tip of the lead of a component surface mounted on a printed circuit board, and a brightness detection means detects the brightness of the solder part, and A peak position detection means for detecting the peak position of the brightness corresponding to the longitudinal end of the solder lead, a solder part measuring means for measuring the distance W between the peak positions, a reference value setting means, and the distance. Soldering quality determining means for determining soldering quality according to the difference between W and the reference value.
本発明は、プリント基板に表面実装された部品のリード
先端の半田付状態を検査する半田付検査装置に関する。The present invention relates to a soldering inspection device for inspecting the soldering condition of the lead tips of components surface-mounted on a printed circuit board.
第８Ａ図は半田付検査状態を示す。第８Ｂ図は半田付近
の平面図である。
表面実装型部品のリードのプリント基板上での半田付は
、プリント基板１０上のフットプリント１２に半田を予
約塗り付けておき、表面実装型部品１４のリード１６の
先端部をフットプリント１２上に配置し、半田１８を加
熱溶融することにより行われる。この半田付状態の検査
は、例えば、半田１８に照明光２０を投射した状態で、
撮像装置２２により半田１８を含む領域を撮像し、撮像
装置２２から出力された輝度データを２値化し、第８Ｃ
図に示すようなリード先端像１６ａの近（の半田像１８
ａの面積を測定して、半田付良否を判定していた。FIG. 8A shows the soldering inspection state. FIG. 8B is a plan view of the vicinity of the solder. To solder the leads of the surface mount type component on the printed circuit board, apply solder in advance to the footprint 12 on the printed circuit board 10, and then place the tip of the lead 16 of the surface mount type component 14 onto the footprint 12. This is done by placing the solder 18 in place and heating and melting the solder 18. This soldering state inspection may be performed, for example, by projecting illumination light 20 onto the solder 18.
The area including the solder 18 is imaged by the imaging device 22, and the brightness data output from the imaging device 22 is binarized.
The solder image 18 near the lead tip image 16a as shown in the figure
The area of a is measured to judge whether the soldering is good or bad.
【発明が解決しようとする課題］
ところが、検査対象が同一であっても、照明光２０の強
度が大き過ぎたり、２値化閾値が低すぎたり、半田１８
の反射率が通常より大きかったりすると、半田１８の像
面積は第８Ｄ図に示す如く、第８Ｃ図の場合よりも広く
なる。逆に、照明光２０の強度が小さ過ぎたり、２値化
閾値が高すぎたり、酸化膜により半田１８の反射率が通
常より小さかったりすると、半田１８の像面積は第８Ｅ
図に示す如く、８０図の場合よりも狭くなる。
このた約半田１８の面積を正確に測定することができず
、半田付良否を誤判定することがあった。
本発明の目的は、このような問題点に鑑み、半田部に照
射する照明光の強度や半田の反射率等に影響されずに、
半田付良否をより正確に判定することができる半田付検
査装置を提供することにある。
【課題を解決するた約の手段及びその作用】第１図は本
発明に係る半田付検査装置の原理構成を示す。
図中、１は明るさ検出手段であり、プリント基板に表面
実装された部品のり−ド２の先端の半田部３に光を照射
して半田部の明るさ（輝度またはこれに相当するもの）
を検出する。
４はピーク位置検出手段であり、リード２の先端部及び
半田３のリード長手方向側先端部に相当リーる明るさの
ピーク位置を検出する。
５は半田部測定手段であり、ピーク位置間の距離Ｗを測
定する。
６は基準値設定手段である。
７は半田付良否判定手段であり、距離Ｗとこの基準値と
の差に応じて半田伺良否を判定する。
上記構成において、明るさのピーク位置は、入反射角の
関係で定り、明るさには依存しない。また、半田部Ｗは
、半田付良否に依存する。例えば、半田の加熱溶融温度
が低すぎたりリードが浮き上がったりして、第５Ａ図に
示す如く、半田１８Ａがリード１６の端面に付いていな
い場合にも、入反射角の関係により、第５Ｂ図に示す如
く、リード１６の先端部と半田１８Ａの先端部に対応し
た２つのピークが現れる。しかし、第５Ａ図２点鎖線で
示す如く、半田溶融時に半田の表面張力で半田１８Ｂが
リード１６の端面に付いた場合よりも明らかに半田部Ｗ
が長くなる。また、半田が存在しない場合にはピークが
１つしか現れないので、Ｗ−０となる。半田が存在して
も半田量が少な過ぎる場合には、半田部Ｗは通常値より
も小さくなる。
したがって、半田部Ｗが基準値以」二であるかどうかに
より、半田伺良否を判定することにより、半田部に照射
する光の強度や半田の反射率等に影響されずに、半田付
良否をより正確に判定することができる
明るさ検出手段１は、例えば、リード２の幅方向に沿っ
た明るさの平均値を、リード２の長手方向に沿った線上
の点における明るさとする。
この構成によれば、リード２の先端部及び半田３のリー
ド長手方向側先端部に相当する明るさのピーク位置をよ
り正確に検出することができ、したがって、半田良否の
判定をより正確に行うことができる。
上記基準値は、半田量、リードの厚さや幅又は半田融着
時の加熱温度（半田の表面張力）等により異なるので、
これらのパラメータを考慮して基準値を設定する必要が
ある。
しかし、同種複数本のリード２について測定された距離
Ｗの平均値を基準値とすれば、このようなパラメータを
考慮することなく適当な基準値を自動設定することがで
きるので、操作性が向」二する。
明るさのピーク位置は、入反射角の関係で定り、明るさ
には依存しないので、たとえ明るさ検出手段１の出力が
ピーク部で飽和していても、飽和部分の中点をピーク位
置とすれば、半田部Ｗを正確に測定することができる。[Problems to be Solved by the Invention] However, even if the inspection object is the same, the intensity of the illumination light 20 is too high, the binarization threshold is too low, or the solder 18
If the reflectance of the solder 18 is larger than normal, the image area of the solder 18 becomes wider as shown in FIG. 8D than in the case of FIG. 8C. Conversely, if the intensity of the illumination light 20 is too small, the binarization threshold is too high, or the reflectance of the solder 18 is smaller than normal due to the oxide film, the image area of the solder 18 will be
As shown in the figure, it is narrower than in the case of Figure 80. As a result, the area of the solder 18 cannot be accurately measured, and the quality of the soldering may be erroneously determined. In view of these problems, an object of the present invention is to provide a method that is not affected by the intensity of the illumination light applied to the solder part or the reflectance of the solder, etc.
It is an object of the present invention to provide a soldering inspection device that can more accurately determine the quality of soldering. [Means for Solving the Problems and Their Effects] FIG. 1 shows the basic structure of a soldering inspection device according to the present invention. In the figure, 1 is a brightness detection means, which measures the brightness (luminance or equivalent) of the solder part by irradiating light onto the solder part 3 at the tip of the component glue 2 surface-mounted on the printed circuit board.
Detect. Reference numeral 4 denotes a peak position detection means, which detects the peak position of the brightness corresponding to the tip of the lead 2 and the tip of the solder 3 on the longitudinal side of the lead. 5 is a solder portion measuring means, which measures the distance W between peak positions. 6 is a reference value setting means. Reference numeral 7 denotes soldering quality determining means, which determines the quality of soldering according to the difference between the distance W and this reference value. In the above configuration, the brightness peak position is determined by the angle of incidence and reflection, and does not depend on the brightness. Further, the solder portion W depends on the quality of soldering. For example, even if the solder 18A is not attached to the end face of the lead 16 as shown in FIG. 5A because the heating melting temperature of the solder is too low or the lead is lifted, the solder 18A may not be attached to the end face of the lead 16 as shown in FIG. 5B due to the angle of incidence and reflection. As shown in FIG. 2, two peaks appear corresponding to the tip of the lead 16 and the tip of the solder 18A. However, as shown by the two-dot chain line in FIG. 5A, the solder portion W is more clearly than when the solder 18B is attached to the end surface of the lead 16 due to the surface tension of the solder when the solder is melted.
becomes longer. Furthermore, if there is no solder, only one peak appears, resulting in W-0. Even if solder is present, if the amount of solder is too small, the solder portion W will be smaller than the normal value. Therefore, by determining the quality of soldering based on whether the solder area W is equal to or less than the standard value, the quality of the soldering can be determined without being affected by the intensity of the light irradiating the solder area, the reflectance of the solder, etc. The brightness detecting means 1, which can make a more accurate determination, takes, for example, the average value of the brightness along the width direction of the lead 2 as the brightness at a point on a line along the longitudinal direction of the lead 2. According to this configuration, the brightness peak positions corresponding to the tip of the lead 2 and the tip of the solder 3 on the longitudinal side of the lead can be detected more accurately, and therefore the quality of the solder can be determined more accurately. be able to. The above reference values vary depending on the amount of solder, the thickness and width of the lead, the heating temperature during solder fusion (solder surface tension), etc.
It is necessary to set reference values in consideration of these parameters. However, if the average value of the distance W measured for multiple leads 2 of the same type is used as the reference value, an appropriate reference value can be automatically set without considering such parameters, improving operability. ” Second. The peak position of brightness is determined by the angle of incidence and reflection and does not depend on the brightness. Therefore, even if the output of the brightness detection means 1 is saturated at the peak, the midpoint of the saturated part is determined as the peak position. If so, the solder portion W can be measured accurately.
以下、図面に基づいて本発明の一実施例を説明する。
第２図及び第３Ａ図は第８Ａ図及び第８Ｂ図に対応して
おり、同一構成要素には同一符号を伺してその説明を省
略する。
撮像装置２２は、半田１８の明るさ画像を得るためのも
のであって、エリアセンサ又はラインセンサを備えた電
子カメラ、或は、半田１８に投射した光スポットの明る
さを光位置検出器（ＰＳＤ）で検出し、光スポットをプ
リント基板１０上で走査して半田１８の画像を得る構成
であってもよい。プリント基板１０に対する照明平行光
２０Ａの入射角と撮像装置２２の光軸とは、半田１８の
リード長手方向側両端部以外からの正反射光が撮像装置
２２へ殆ど入らない関係になっている。
撮像装置２２から出力された輝度信号は、Ａ／Ｄ変換器
２４でデジタル化されて半田付不良検出装置２６の画像
記憶部２６ａに読み込まれ、画像処理により半田付状態
が検査される。
半田付不良検出装置２６はマイクロコンピュータを用い
て構成されており、第２図はその構成を機能ブロック２
６ａ〜２６ｈで示す。
ウィンド記憶部２６ｂには、設計データに基づいて、第
３Ａ図に示すようなウィンド２８の設定位置、方向及び
サイズが格納されている。このウィンド２８は矩形で、
リード１６の先端の両側を含みかつリード１６の中央線
に沿っている。
輝度曲線作成部２６ｃは、画像記憶部２６ａに書き込ま
れた画像データに対し、前記設定位置にウィンド２８を
設定し、このウィンド２８内の輝度データから第３Ｂ図
実線に示すような輝度曲線を次のようにして作成する。
すなわち、第３Ａ図に示す如く、ウィンド２８の長手方
向にＸ軸を設定し、これに直交する方向にＹ軸を設定し
、ウィンド２８内の位置座標（ｉ、ｊ）の輝度をＢｌｊ
、ウィンド２８のサイズをｍ ｘ ｎ画素としたときに
Ｂ１−ΣＢＩＪを１−１〜ｎについて求狛る。
ｊ＝１
第３Ｂ図において、リード１６の先端部と半田１８のＸ
軸方向先端部の位置にピークが存在するのは、入反射角
の関係でこの部分に多くの正反射光が撮像装置２２に入
射するためである。したがって、照明平行光２ＯＡの強
度を大きくすると、−点鎖線で示す如く変化し、照明平
行光２ＯＡの強度を小さくすると、点線で示す如く変化
するが、２つのピーク位置自体は変化しない。
ピーク位置検出部２６ｄは輝度Ｂ＋ （ｉ＝１〜ｎ）
からこれら２つのピーク位置を検出する。半田部測定部
２６ｅは、ピーク間距離Ｗを半田部として測定する。な
お、第４図に示す如く、撮像装置２２の出力がピーク位
置で飽和した場合には、飽和部分の中点、例えばピーク
の立上がり位置と立下がり位置の中点をピーク位置とし
て、半田部Ｗを測定する。
ここで、半田が存在しない場合にはピークが１つしか現
れないので、Ｗ−０とする。半田が存在しても半田量が
少な過ぎる場合には、半田部Ｗは通常値よりも小さくな
る。半田の加熱溶融温度が低すぎたりリードが浮き上が
ったりして、第５Ａ図に示す如く、半田１８Ａがリード
１６の端面に付いていない場合にも、入反射角の関係に
より、第５Ｂ図に示す如く、リード１６の先端部と半田
１８Ａの先端部に対応した２つのピークが現れる３しか
し、第５Ａ図２点鎖線で示す如く、半田溶融時に半田の
表面張力で半田１８Ｂがリード１６の端面に付いた場合
よりも明らかに半田部Ｗが長くなる。したがって、この
半田部Ｗが基準値以上であるかどうかにより半田付良否
を判定することができる。
しかし、この基準値は、フットプリント１２への最初の
半田付着量、リード１６の厚さや幅又は半田融着時の加
熱温度（表面張力）等により異なるので、これらのパラ
メータを考慮して基準値を設定する必要があるので煩雑
である。そこで、本実施例では次のようにしてこの基準
値を自動設定している。
すなわち、例えば第６図に示す如く、表面実装型部品１
４の片側から突出したリード１６１〜１６Ｎの先端部の
半田１８１〜１８Ｎの各半田部Ｗ、（ｉ＝１〜Ｎ）を測
定し、これら測定値を第２図の半田部記憶部２６ｆに一
時記憶させておく３そして、その平均値Ｗを基準値検出
部２６ｇで演算してこれを基準値とする。第６図中、１
８１〜１８Ｎはウィンドである。
半田付良否判定部２６ｈは、半田部Ｗ１とＷとの差に基
づいて半田付良否を判定し、半田付不良位置を出力する
。
次に、第７図に基づいて上記半田付不良検出手順の詳細
を説明する。
（５０）ＩＪ−ド１６１を識別する１を１に初期設定し
、半田部Ｗ１の合計値Ｓを０に初期設定する。
（５２） Ｊ１記の如くして、リード１６ｉの長手方向
に沿った輝度分布曲線の２つのピーク位置を検出する。
（５４）次に、２つのピーク間の距離Ｗ、を測定する。
（５６）Ｓに半田部ＷＩを加えた値を新たなＳとする。
（５８）ｉとＮとを比較し、
（６０）ｉ≠Ｎであれば、１をインクリメントし、上記
ステップ５２へ戻る。
（６２）ｉ＝Ｎとなれば、基準値として半田部Ｗ１の平
均値Ｗ＝Ｓ／Ｎを算出し、また、１を１に初期設定する
。
なお、半田部Ｗ１の標準偏差Ｓも算出し、ばらつきの大
きいＷ−ｋｓ（ｋは定数）以下又はＷ＋ｋｓ以上のＷ、
を除いて再度平均値を算出し、これを基準値としてもよ
い。
（６４）ＩＷＩ−ＷｌとＤとを比較し、（６６）ＩＷ、
−ｗｌ≧Ｄであれば、半田付不良と判定してその位置を
出力する。
（６８）ｉとＮとを比較し、
（７０）ｉ≠Ｎであれば、１をインクリメントし、上記
ステップ６４へ戻る。Hereinafter, one embodiment of the present invention will be described based on the drawings. FIG. 2 and FIG. 3A correspond to FIG. 8A and FIG. 8B, and the same components are denoted by the same reference numerals and the explanation thereof will be omitted. The imaging device 22 is for obtaining a brightness image of the solder 18, and is an electronic camera equipped with an area sensor or a line sensor, or an optical position detector (which measures the brightness of a light spot projected onto the solder 18). PSD), and a light spot may be scanned on the printed circuit board 10 to obtain an image of the solder 18. The angle of incidence of the parallel illumination light 20A on the printed circuit board 10 and the optical axis of the imaging device 22 are such that almost no specularly reflected light from other than both ends of the solder 18 leads in the longitudinal direction enters the imaging device 22. The brightness signal output from the imaging device 22 is digitized by the A/D converter 24 and read into the image storage section 26a of the soldering defect detection device 26, and the soldering state is inspected by image processing. The soldering defect detection device 26 is configured using a microcomputer, and FIG. 2 shows its configuration as a functional block 2.
6a to 26h. The window storage unit 26b stores the set position, direction, and size of the window 28 as shown in FIG. 3A based on the design data. This window 28 is rectangular,
It includes both sides of the tip of the lead 16 and is along the center line of the lead 16. The brightness curve creation unit 26c sets a window 28 at the set position for the image data written in the image storage unit 26a, and creates a brightness curve as shown by the solid line in FIG. 3B from the brightness data in the window 28. Create it like this. That is, as shown in FIG. 3A, the X-axis is set in the longitudinal direction of the window 28, the Y-axis is set in the direction perpendicular to this, and the brightness at the position coordinates (i, j) within the window 28 is determined by Blj
, when the size of the window 28 is m x n pixels, B1-ΣBIJ is determined for 1-1 to n. j=1 In FIG. 3B, the tip of the lead 16 and the X of the solder 18
The reason why the peak exists at the position of the tip in the axial direction is that a large amount of specularly reflected light enters the imaging device 22 at this portion due to the angle of incidence and reflection. Therefore, when the intensity of the parallel illumination light 2OA is increased, it changes as shown by the dashed line, and when the intensity of the parallel illumination light 2OA is decreased, it changes as shown by the dotted line, but the two peak positions themselves do not change. The peak position detection unit 26d has brightness B+ (i=1 to n)
Detect these two peak positions from . The solder portion measurement unit 26e measures the inter-peak distance W as a solder portion. As shown in FIG. 4, when the output of the imaging device 22 is saturated at the peak position, the midpoint of the saturated portion, for example, the midpoint between the rising and falling positions of the peak, is set as the peak position, and the solder portion W is Measure. Here, if there is no solder, only one peak appears, so it is set as W-0. Even if solder is present, if the amount of solder is too small, the solder portion W will be smaller than the normal value. Even if the solder 18A is not attached to the end face of the lead 16 as shown in Fig. 5A because the heating melting temperature of the solder is too low or the lead is lifted, the solder 18A may not be attached to the end face of the lead 16 as shown in Fig. 5B due to the relationship of the angle of incidence and reflection. As shown in FIG. 5A, two peaks corresponding to the tip of the lead 16 and the tip of the solder 18A appear.3 However, as shown by the two-dot chain line in FIG. The solder portion W is obviously longer than if it were attached. Therefore, the quality of soldering can be determined based on whether the solder portion W is equal to or greater than the reference value. However, this standard value varies depending on the initial amount of solder attached to the footprint 12, the thickness and width of the lead 16, the heating temperature (surface tension) during solder fusion, etc., so the standard value is determined by taking these parameters into account. It is complicated because it is necessary to set the Therefore, in this embodiment, this reference value is automatically set as follows. That is, for example, as shown in FIG.
Each solder part W, (i=1 to N) of the solder 181 to 18N at the tip of the lead 161 to 16N protruding from one side of the lead 4 is measured, and these measured values are temporarily stored in the solder part storage section 26f in FIG. Then, the average value W is calculated by the reference value detection section 26g and used as the reference value. In Figure 6, 1
81 to 18N are windows. The soldering quality determination unit 26h determines the quality of the soldering based on the difference between the solder portions W1 and W, and outputs the position of the soldering failure. Next, the details of the soldering defect detection procedure will be explained based on FIG. 7. (50) Initialize 1, which identifies the IJ-domain 161, to 1, and initialize the total value S of the solder portion W1 to 0. (52) Two peak positions of the brightness distribution curve along the longitudinal direction of the lead 16i are detected as described in J1. (54) Next, measure the distance W between the two peaks. (56) The value obtained by adding the solder portion WI to S is set as a new S. (58) Compare i and N. (60) If i≠N, increment by 1 and return to step 52 above. (62) If i=N, calculate the average value W=S/N of the solder portion W1 as a reference value, and initialize 1 to 1. In addition, the standard deviation S of the solder part W1 is also calculated, and W is less than or equal to W-ks (k is a constant) or more than W+ks, which has a large variation.
It is also possible to calculate the average value again by excluding , and use this as the reference value. (64) Compare IWI-Wl and D, (66) IW,
If -wl≧D, it is determined that the soldering is defective and its position is output. (68) Compare i and N. (70) If i≠N, increment by 1 and return to step 64 above.
以上説明した如く、本発明に係る半田付検査装置によれ
ば、半田部に照射する光の強度や半田の反射率等に影響
されずに、半田付良否をより正確に判定することができ
るという優れた効果を奏し、外観検査の質の向上に寄与
するところが大きい。
また、明るさ検出手段を、リードの幅方向に沿った明る
さの平均値をリードの長手方向に沿った線上の点におけ
る明るさとする構成にすれば、リードの先端部及び半田
のリード長手方向側先端部に相当する明るさのピーク位
置をより正確に検出することができるので、半田良否の
判定をより正確に行うことができるという効果を奏する
。
また、同種複数本のリードについて測定された距離Ｗの
平均値を基準値とすれば、半田量、リードの厚さや幅又
は半田融着時の加熱温度等のパラメータを考慮すること
なく適当な基準値を自動設置３
定することができるという効果を奏する。
さらに、明るさのピーク位置は、大反射角の関係で定り
、明るさには依存しないので、たｙえ明るさ検出手段の
出力がピーク部で飽和していても、飽和部分の中点をピ
ーク位置とすれば、半田部Ｗを正確に測定することがで
きるという効果を奏する。As explained above, according to the soldering inspection device according to the present invention, it is possible to more accurately determine whether the soldering is good or not, without being affected by the intensity of the light irradiated to the solder part, the reflectance of the solder, etc. It has excellent effects and greatly contributes to improving the quality of visual inspection. Furthermore, if the brightness detection means is configured to take the average value of the brightness along the width direction of the lead as the brightness at a point on a line along the longitudinal direction of the lead, it is possible to Since the brightness peak position corresponding to the side tip portion can be detected more accurately, it is possible to more accurately determine whether the solder is good or bad. Furthermore, if the average value of the distance W measured for multiple leads of the same type is used as the standard value, an appropriate standard can be set without considering parameters such as the amount of solder, the thickness and width of the leads, or the heating temperature during solder fusion. This has the effect that the value can be automatically set. Furthermore, since the brightness peak position is determined by the relationship between the large reflection angle and does not depend on the brightness, even if the output of the brightness detection means is saturated at the peak, the midpoint of the saturated portion By setting this as the peak position, it is possible to accurately measure the solder portion W.
第１図は本発明に係る半田付検査装置の原理構成を示す
ブロック図である。
第２図乃至第７図は本発明の一実施例に係り、第２図は
半田付検査装置構成図、
第３Ａ図は半田付近の平面図、
第３Ｂ図は半田付近の輝度分布を示す線図、第４図は撮
像装置の出力がピーク部で飽和した場合の輝度分布を示
す線図、
第５Ａ図は半田茶温れ状態を示す側面図、第５Ｂ図は第
５Ａ図に対応した半田付近の輝度分布を示す線図、
第６図は表面実装型部品のリードの半田付状態を示す平
面図、
第７図は半田伺不良検出手順を示すフローチャトである
。
第８Ａ図乃至第８Ｅ図は従来例に係り、第８Ａ図は半田
付検査装置を示す側面図、第８Ｂ図は半田付近の平面図
、
第８Ｃ図乃至第８Ｅ図はリード先端部及び半田部の２値
画像図である。
図中、
１０はプリント基板
１２はフットプリント
１４は表面実装型部品
１６．１６１〜１６Ｎはリード
１８．１８Ａ、１８Ｂは半田
２ＯＡは照明平行光
２２は撮像装置
２４はＡ／Ｄ変換器FIG. 1 is a block diagram showing the principle configuration of a soldering inspection device according to the present invention. Figures 2 to 7 relate to an embodiment of the present invention, in which Figure 2 is a configuration diagram of a soldering inspection device, Figure 3A is a plan view of the vicinity of the solder, and Figure 3B is a line showing the brightness distribution in the vicinity of the solder. Figure 4 is a diagram showing the brightness distribution when the output of the imaging device is saturated at its peak, Figure 5A is a side view showing the temperature of the solder tea, and Figure 5B is the solder corresponding to Figure 5A. FIG. 6 is a diagram showing the brightness distribution in the vicinity, FIG. 6 is a plan view showing the soldering state of the leads of the surface mount type component, and FIG. 7 is a flowchart showing the solder contact defect detection procedure. 8A to 8E relate to the conventional example, FIG. 8A is a side view showing the soldering inspection device, FIG. 8B is a plan view of the vicinity of the solder, and FIGS. 8C to 8E are the lead tip and solder portion. It is a binary image figure of. In the figure, 10 is a printed circuit board 12, a footprint 14 is a surface mount type component 16, 161 to 16N are leads 18, 18A, 18B is solder 2OA is illumination parallel light 22 is an imaging device 24 is an A/D converter
Claims (1)
田部の明るさを検出する明るさ検出手段（１）と、 該リードの先端部及び該半田のリード長手方向側先端部
に相当する該明るさのピーク位置を検出するピーク位置
検出手段（４）と、 該ピーク位置間の距離Ｗを測定する半田長測定手段（５
）と、 基準値設定手段（６）と、 該距離Ｗと該基準値との差に応じて半田付良否を判定す
る半田付良否判定手段（７）と、 を有することを特徴とする半田付検査装置。 ２）．前記明るさ検出手段（１）は、前記 リードの幅方向に沿った明るさの平均値を、該リードの
長手方向に沿った線上の点における明るさとすることを
特徴とする請求項１記載の装置。 ３）．前記基準値は、同種複数本の前記リ ードについて測定された前記距離Ｗの平均値であること
を特徴とする請求項１又は２記載の装置。 ４）．前記ピーク位置は、前記明るさ検出 手段（１）の出力が該ピーク部で飽和している場合には
、飽和部分の中点をピーク位置とすることを特徴とする
請求項１及至３のいずれかに記載の装置。[Claims] 1). a brightness detection means (1) for detecting the brightness of the solder part by irradiating light onto the solder part (3) at the tip of the lead (2) of a component surface mounted on a printed circuit board; peak position detection means (4) for detecting the peak position of the brightness corresponding to the tip of the solder lead in the longitudinal direction; and solder length measuring means (5) for measuring the distance W between the peak positions.
), a reference value setting means (6), and a soldering quality determination means (7) for determining soldering quality according to the difference between the distance W and the reference value. Inspection equipment. 2). 2. The brightness detection means (1) determines the average value of the brightness along the width direction of the lead as the brightness at a point on a line along the longitudinal direction of the lead. Device. 3). 3. The apparatus according to claim 1, wherein the reference value is an average value of the distance W measured for a plurality of the leads of the same type. 4). 4. The peak position is set at a midpoint of the saturated portion when the output of the brightness detection means (1) is saturated at the peak portion. The device described in Crab.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21751690A JPH0499950A (en) | 1990-08-17 | 1990-08-17 | Soldering inspection apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21751690A JPH0499950A (en) | 1990-08-17 | 1990-08-17 | Soldering inspection apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0499950A true JPH0499950A (en) | 1992-03-31 |
Family
ID=16705461
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21751690A Pending JPH0499950A (en) | 1990-08-17 | 1990-08-17 | Soldering inspection apparatus |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0499950A (en) |
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