JPS603507A - Wiring pattern detecting device - Google Patents

Wiring pattern detecting device

Info

Publication number
JPS603507A
JPS603507A JP11141483A JP11141483A JPS603507A JP S603507 A JPS603507 A JP S603507A JP 11141483 A JP11141483 A JP 11141483A JP 11141483 A JP11141483 A JP 11141483A JP S603507 A JPS603507 A JP S603507A
Authority
JP
Japan
Prior art keywords
light
wiring
wiring pattern
base material
filter
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP11141483A
Other languages
Japanese (ja)
Inventor
Koichi Tsukazaki
柄崎 晃一
Noriaki Ujiie
氏家 典明
Yasuhiko Hara
靖彦 原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP11141483A priority Critical patent/JPS603507A/en
Priority to DE19843422395 priority patent/DE3422395A1/en
Publication of JPS603507A publication Critical patent/JPS603507A/en
Priority to US06/832,692 priority patent/US4816686A/en
Pending legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/302Contactless testing
    • G01R31/308Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation
    • G01R31/309Contactless testing using non-ionising electromagnetic radiation, e.g. optical radiation of printed or hybrid circuits or circuit substrates
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01RMEASURING ELECTRIC VARIABLES; MEASURING MAGNETIC VARIABLES
    • G01R31/00Arrangements for testing electric properties; Arrangements for locating electric faults; Arrangements for electrical testing characterised by what is being tested not provided for elsewhere
    • G01R31/28Testing of electronic circuits, e.g. by signal tracer
    • G01R31/2801Testing of printed circuits, backplanes, motherboards, hybrid circuits or carriers for multichip packages [MCP]
    • G01R31/2806Apparatus therefor, e.g. test stations, drivers, analysers, conveyors
    • GPHYSICS
    • G01MEASURING; TESTING
    • G01NINVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
    • G01N21/00Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
    • G01N21/84Systems specially adapted for particular applications
    • G01N21/88Investigating the presence of flaws or contamination
    • G01N21/95Investigating the presence of flaws or contamination characterised by the material or shape of the object to be examined
    • G01N21/956Inspecting patterns on the surface of objects
    • G01N2021/95638Inspecting patterns on the surface of objects for PCB's

Abstract

PURPOSE:To detect with high accuracy a wiring pattern without being affected by oxidation, ruggedness, flaws, etc. of a wiring pattern surface by irradiating light to a printed board, converting photoelectrically fluorescence emitted from a specified wiring surface, and generating fluorescence by exciting a base material. CONSTITUTION:Light 32 which has passed through a filter 22 is the excitation light for generating fluorescence to a base material 4 of a printed board 1, and it is reflected by a half mirror 23, and made incident to a wiring surface 2 of the printed board 1 from a roughly vertical direction. The composite light of reflected light of the excitation light and fluorescence generated by the base material 4 is emitted from the wiring surface 2, but this composite light transmits through the half mirror 23, is made incident to a filter 24, and light 42 which has transmitted through the filter 24 forms an image on a photodetector 13 by a lens 25. The light 42 is only the fluorescence generated by the base material 4 and does not contain the excitation light. That is to say, the fluorescence generated by the base material 4 is emitted from the wiring surface 2 by using a wiring pattern 3 on the wiring surface as a mask, and made incident to the photodetector 13. Accordingly, a negative pattern of the wiring pattern forms an image on the photodetector 13, and a negative pattern signal is obtained as its photoelectric converting output.

Description

【発明の詳細な説明】 〔発明の利用分野〕 本発明はプリント基板の配線パターンを検出する配線パ
ターン検出装置に係り、特にプリント基板の配線パター
ンの欠陥を検出するための検査装置の検出部として好適
な配線パターン検出装置に関する。
DETAILED DESCRIPTION OF THE INVENTION [Field of Application of the Invention] The present invention relates to a wiring pattern detection device for detecting a wiring pattern of a printed circuit board, and particularly as a detection unit of an inspection device for detecting defects in the wiring pattern of a printed circuit board. The present invention relates to a suitable wiring pattern detection device.

〔発明の背景〕[Background of the invention]

プリント基板の配線パターンを照明し、その配線面から
の反射光を光電変換することによって、配線パターンの
ポジパターン(陽画)信号を得る配線パターン検出装置
がある。しかし、との装置は配線パターンの表面とプリ
ント基板の基材の表面との反射率の違いを利用する関係
上、配線パターン面の酸化、凹凸、キズ等の影響を受け
やすく、高密度プリント基板の微細な配線パターンの検
出に利用すると検出エラーを起こしやすいという問題が
あった。
There is a wiring pattern detection device that obtains a positive pattern (positive image) signal of the wiring pattern by illuminating the wiring pattern of a printed circuit board and photoelectrically converting the reflected light from the wiring surface. However, because this device utilizes the difference in reflectance between the surface of the wiring pattern and the surface of the base material of the printed circuit board, it is easily affected by oxidation, unevenness, scratches, etc. on the surface of the wiring pattern. When used to detect minute wiring patterns, there is a problem in that detection errors are likely to occur.

また、検出対象の配線面と反対側の面を照明し、配線面
側に透過した光を光電変換することにより、配線パター
ンのネガパターン(陰画)信号を得る構成の配線パター
ン検出装置もある。この装置は前者の装置のような配線
パターン面の酸化等の影響は受けに(いが、両面配線の
プリント基板の場合、検出対象の配線面と反対側の配線
面にある配線パターンの影響を受けるため、その影響を
除去するための信号処理を必要とするという問題がある
There is also a wiring pattern detection device configured to obtain a negative pattern (negative image) signal of the wiring pattern by illuminating the surface opposite to the wiring surface to be detected and photoelectrically converting the light transmitted to the wiring surface side. This device is not susceptible to the effects of oxidation on the wiring pattern surface like the former device (however, in the case of a printed circuit board with double-sided wiring, it is sensitive to the effects of the wiring pattern on the opposite side of the wiring surface to be detected). Therefore, there is a problem in that signal processing is required to remove the influence.

〔発明の目的〕[Purpose of the invention]

本発明の目的は、前述したような問題点のない配線パタ
ーン検出装置を提供することにある。
An object of the present invention is to provide a wiring pattern detection device that does not have the above-mentioned problems.

〔発明の概要〕[Summary of the invention]

本発明は、プリント基板に光を照射することによってプ
リント基板の基材を励起して螢光を発生させ、特定の配
線面から出る螢光な光電変換することにより配線パター
ンのネガパターン信号を得ることを特徴とするものであ
る。
The present invention excites the base material of the printed circuit board by irradiating the printed circuit board with light to generate fluorescent light, and obtains a negative pattern signal of the wiring pattern by photoelectrically converting the fluorescent light emitted from a specific wiring surface. It is characterized by this.

〔発明の実施例〕[Embodiments of the invention]

第1図は本発明の一実施例を示す概略側面図である。こ
の図において、11は高輝度光源であり、ここから発す
る光31はレンズ21を経てフィルタ22に入射する。
FIG. 1 is a schematic side view showing one embodiment of the present invention. In this figure, 11 is a high-intensity light source, and light 31 emitted from this source passes through a lens 21 and enters a filter 22.

このフィルタnを通過した光32は、プリント基板1の
基材4に螢光を発生させるための励起光であり、これは
ハーフミラ−nで反射され、プリント基板1の配線面2
に略々垂直方向より入射する。本実施例ではフィルタn
は所謂ブルーフィルタと呼ばれるもので、たとえばB 
、−:370プルーフイルターを使うと、励起光320
波長は約300 nmから約460 nmの範囲に限定
される。
The light 32 that has passed through this filter n is excitation light for generating fluorescence in the base material 4 of the printed circuit board 1, and is reflected by the half mirror n, and is reflected on the wiring surface 2 of the printed circuit board 1.
is incident from a direction approximately perpendicular to the direction. In this embodiment, filter n
is a so-called blue filter, for example B
, -: When using a 370 proof filter, the excitation light is 320
The wavelength is limited to a range of about 300 nm to about 460 nm.

配線面2からは、励起光の反射光と、基材4が発生する
螢光の合成光が出るが、この合成光はハーフミラ−るを
透過してフィルタ冴に入射し、このフィルタ冴を透過し
た光42はレンズ5によって光検出器13に結像される
。フィルタ冴は所謂イエローフィルタと呼ばれるもので
、たとえばY−50シヤープカツト・フィルターを使う
と、約500nm以上の波長を持つ光のみを透過させる
。したがって、フィルタ冴を透過した光42は、基材4
で発生した螢光のみであり励起光を含まない。即ち、基
材4で発生した螢光が配線面2上の配線パターン3をマ
スクとして配線面2より出て、光検出器13に入射する
ことになる。したがって、配線バターy、v*−n−p
<p−y−b、□7.3□。わ、ヶ。 入光電変換出力
としてネガパターン信号が得られる。
A composite light of the reflected excitation light and the fluorescent light generated by the base material 4 is emitted from the wiring surface 2, but this composite light passes through the half mirror, enters the filter, and is transmitted through the filter. The emitted light 42 is focused on the photodetector 13 by the lens 5. The filter is what is called a yellow filter. For example, when a Y-50 sharp cut filter is used, only light having a wavelength of about 500 nm or more is transmitted. Therefore, the light 42 transmitted through the filter is transmitted to the base material 4.
This includes only the fluorescent light generated by the light and does not include excitation light. That is, the fluorescent light generated in the base material 4 comes out from the wiring surface 2 using the wiring pattern 3 on the wiring surface 2 as a mask, and enters the photodetector 13. Therefore, the wiring butter y, v*-n-p
<p-y-b, □7.3□. Wow. A negative pattern signal is obtained as the input photoelectric conversion output.

−例として、プリント基板1の配線面2に第2図に示す
ような配線パターンが形成されており、A−A線のネガ
パターンが光検出器13に結像されたとする。なお、第
3図は第2図のA−A断面図である。この場合、光検出
器13からは第4図に示すようなネガパターン信号が得
られる。この図から明らかなように、適当なスレッショ
ルドレベルvTでネガパターン信号を2値化すれば、配
線パターン部分(レベルがvT未満の部分)と、それ以
外の部分(レベルが71以上の部分)とを識別できる。
- As an example, assume that a wiring pattern as shown in FIG. 2 is formed on the wiring surface 2 of the printed circuit board 1, and a negative pattern of the line A-A is imaged on the photodetector 13. Note that FIG. 3 is a sectional view taken along line AA in FIG. 2. In this case, a negative pattern signal as shown in FIG. 4 is obtained from the photodetector 13. As is clear from this figure, if the negative pattern signal is binarized at an appropriate threshold level vT, the wiring pattern portion (the portion where the level is less than vT) and the other portion (the portion where the level is 71 or higher) are separated. can be identified.

このように、本発明は基材4から発生し配線面2より出
る螢光を利用するから、配線面からの反射光を利用する
従来装置や透過光を利用する従来装置における問題点を
完全に解消できる。
As described above, since the present invention utilizes the fluorescent light generated from the base material 4 and emitted from the wiring surface 2, it completely eliminates the problems in conventional devices that utilize reflected light from the wiring surface and conventional devices that utilize transmitted light. It can be resolved.

第5図は本発明の他の実施例を示す概略側面図である。FIG. 5 is a schematic side view showing another embodiment of the present invention.

この実施例は、プリント基板1の配線面2と反対側の面
2′からも励起光を照射して螢光量を増すことにより、
ネガパターン信号のシN改善をはかったものであり、第
1図と同等部分は同符号にて示されている。
In this embodiment, the amount of fluorescent light is increased by emitting excitation light from the surface 2' of the printed circuit board 1 opposite to the wiring surface 2.
This is an attempt to improve the signal N of a negative pattern signal, and parts equivalent to those in FIG. 1 are indicated by the same reference numerals.

第5図において、51は高輝度光源であり、ことから発
する光はレンズ52を通過した後、2組の平面鏡オと凹
面鏡Mで反射されて面2′に照射される。
In FIG. 5, 51 is a high-intensity light source, and the light emitted from it passes through a lens 52, is reflected by two sets of plane mirror O and concave mirror M, and is irradiated onto surface 2'.

基板4は配線面2と反対側面2′の両方から照射される
光によって励起されるため、前記実施例よりも多量の螢
光を発生する。したがって、光検出器13に入射する螢
光量が増加するため、前記実施例よりも振幅が大きくシ
への良いネガパターン信号が得られる。
Since the substrate 4 is excited by the light irradiated from both the wiring surface 2 and the opposite side surface 2', it generates a larger amount of fluorescent light than in the previous embodiment. Therefore, since the amount of fluorescent light incident on the photodetector 13 increases, a negative pattern signal with a larger amplitude and better contrast than in the previous embodiment can be obtained.

第6図は第2図のA−A線に対して得られるネガパター
ン信号を示す。この図と第4図を比較すれば、本実施例
の方がネガパターン信号の振幅が増大し、その分だl 
S/Nが改善されることは明らかである。また、スレッ
ショルドレベルv、rの設定可能範囲が拡大し、同レベ
ルvTの設定が容易になることも理解できよう。
FIG. 6 shows the negative pattern signal obtained for line A--A in FIG. Comparing this figure with Fig. 4, it can be seen that the amplitude of the negative pattern signal increases in this embodiment, and
It is clear that the S/N ratio is improved. It will also be understood that the range in which the threshold levels v and r can be set is expanded, making it easier to set the same level vT.

なお、本実施例では、面2′に対し斜め方向より励起光
を照射している。これは、面2に配線パターンが存在し
ていても、励起光をその配線パターンによってさえぎら
れることなく、基材4内に−様に透過させるよう耐磁し
たものである。したがって、面2′に配線パターンがな
い場合は、面2に対しても配線面2と同様に略々垂直方
向より励起光を照射してもよい。
In this embodiment, the excitation light is irradiated obliquely to the surface 2'. This is anti-magnetic so that even if there is a wiring pattern on the surface 2, the excitation light is not blocked by the wiring pattern and is transmitted through the base material 4 in a negative direction. Therefore, if there is no wiring pattern on the surface 2', the excitation light may be irradiated onto the surface 2 from a substantially perpendicular direction similarly to the wiring surface 2.

〔発明の効果〕〔Effect of the invention〕

以上に詳述した如く、本発明は基材を励起して螢光を発
生させ、その螢光を利用して配線パターンを検出するも
のであるから、配線パターン面の酸化、凹凸、キズ等の
影響を受けることな(配線パターンを高い精度で検出す
ることができ、また、両面配線のプリント基板の配線パ
ターン検出も、格別の信号処理を必要とすることなく可
能であるなど、多(の効果を得られるものである。
As detailed above, the present invention excites the base material to generate fluorescent light and detects the wiring pattern using the fluorescent light. Therefore, it is possible to prevent oxidation, unevenness, scratches, etc. It has many advantages, such as being able to detect wiring patterns with high accuracy without being affected by signal processing, and also being able to detect wiring patterns on printed circuit boards with double-sided wiring without the need for special signal processing. It is something that can be obtained.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明の一実施例を示す概略側面図、第2図は
プリント基板の平面図、第3図は第2図のA−A線断面
図、第4図は同上実施例において第2図のA−A線に対
し得られるネガパターン信号の波形図、第5図および第
6図はそれぞれ本発明の他の実施例を示す概略側面図お
よび第2図のA−A線に対するネガパターン信号を示す
波形図である。 1・・・プリント基板、2・・・配線面、計・・配線パ
ターン、 4・・・基材、 11 、51・・・高輝度
光源、13・・・光検出器、 21 、25 、52・
・・レンズ、 n、24・・・フィルタ、 羽・・・ハ
ーフミラ−153パ・平面鏡、 54・・・凹面鏡。 /″1 代理人弁理士 鈴 木 誠1..1 、+〕 第1図 第4図 □イl 第2図 2′ 第3図 4/1 −36− 醐置
FIG. 1 is a schematic side view showing one embodiment of the present invention, FIG. 2 is a plan view of a printed circuit board, FIG. 3 is a sectional view taken along line A-A in FIG. 2, and FIG. 2, and FIGS. 5 and 6 are schematic side views showing other embodiments of the present invention, and negative pattern signals obtained for line A-A in FIG. 2, respectively. FIG. 3 is a waveform diagram showing a pattern signal. DESCRIPTION OF SYMBOLS 1... Printed circuit board, 2... Wiring surface, Total... Wiring pattern, 4... Base material, 11, 51... High brightness light source, 13... Photodetector, 21, 25, 52・
...Lens, n, 24...Filter, Wings...Half mirror-153 plane mirror, 54...Concave mirror. /″1 Representative Patent Attorney Makoto Suzuki 1..1 , +] Figure 1 Figure 4 □ I Figure 2 2' Figure 3 4/1 -36- Goki

Claims (2)

【特許請求の範囲】[Claims] (1) プリント基板の基材を励起して螢光を発生させ
るための光を該プリント基板に照射する手段と、光電変
換手段と、該プリント基板の特定の配線面から出る光の
うち実質的に該螢光のみを選択して該光電変換手段に入
射させる手段とを有し、該光電変換手段の光電変換出力
として該配線面の配線パターンに対応する電気信号を得
るようにして成る配線バター検出装置。
(1) Means for irradiating the printed circuit board with light for exciting the base material of the printed circuit board to generate fluorescence, photoelectric conversion means, and substantially all of the light emitted from a specific wiring surface of the printed circuit board. and means for selecting only the fluorescent light and making it enter the photoelectric conversion means, and obtaining an electrical signal corresponding to the wiring pattern on the wiring surface as a photoelectric conversion output of the photoelectric conversion means. Detection device.
(2)前記の光を照射する手段は、前記プリント基板の
前記配線面およびその反対側面に光を照射することを特
徴とする特許請求の範囲第1項記載の配線パターン検出
装置。
(2) The wiring pattern detection device according to claim 1, wherein the light irradiation means irradiates the wiring surface and the opposite side of the printed circuit board with light.
JP11141483A 1983-06-16 1983-06-21 Wiring pattern detecting device Pending JPS603507A (en)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP11141483A JPS603507A (en) 1983-06-21 1983-06-21 Wiring pattern detecting device
DE19843422395 DE3422395A1 (en) 1983-06-16 1984-06-15 METHOD AND DEVICE FOR DETERMINING WIRING PATTERNS
US06/832,692 US4816686A (en) 1983-06-16 1986-02-25 Method and apparatus for detecting wiring patterns

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP11141483A JPS603507A (en) 1983-06-21 1983-06-21 Wiring pattern detecting device

Publications (1)

Publication Number Publication Date
JPS603507A true JPS603507A (en) 1985-01-09

Family

ID=14560560

Family Applications (1)

Application Number Title Priority Date Filing Date
JP11141483A Pending JPS603507A (en) 1983-06-16 1983-06-21 Wiring pattern detecting device

Country Status (1)

Country Link
JP (1) JPS603507A (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61296204A (en) * 1985-06-25 1986-12-27 Oki Electric Ind Co Ltd Apparatus for measuring dimension of pattern
US8278351B2 (en) 2001-07-27 2012-10-02 Neptune Technologies & Bioressources, Inc. Natural marine source phospholipids comprising polyunsaturated fatty acids and their applications
US8586567B2 (en) 2009-10-29 2013-11-19 Acasti Pharma, Inc. Concentrated therapeutic phospholipid compositions

Cited By (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61296204A (en) * 1985-06-25 1986-12-27 Oki Electric Ind Co Ltd Apparatus for measuring dimension of pattern
US8278351B2 (en) 2001-07-27 2012-10-02 Neptune Technologies & Bioressources, Inc. Natural marine source phospholipids comprising polyunsaturated fatty acids and their applications
US8383675B2 (en) 2001-07-27 2013-02-26 Neptune Technologies & Bioressources, Inc. Natural marine source phospholipids comprising polyunsaturated fatty acids and their applications
US8586567B2 (en) 2009-10-29 2013-11-19 Acasti Pharma, Inc. Concentrated therapeutic phospholipid compositions
US9475830B2 (en) 2009-10-29 2016-10-25 Acasti Pharma Inc. Concentrated therapeutic phospholipid compositions
US10130644B2 (en) 2009-10-29 2018-11-20 Acasti Pharma Inc. Concentrated therapeutic phospholipid compositions

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