JPH0436335B2 - - Google Patents
Info
- Publication number
- JPH0436335B2 JPH0436335B2 JP58092304A JP9230483A JPH0436335B2 JP H0436335 B2 JPH0436335 B2 JP H0436335B2 JP 58092304 A JP58092304 A JP 58092304A JP 9230483 A JP9230483 A JP 9230483A JP H0436335 B2 JPH0436335 B2 JP H0436335B2
- Authority
- JP
- Japan
- Prior art keywords
- light
- irradiation means
- printed circuit
- circuit board
- filter
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000001514 detection method Methods 0.000 claims description 37
- 239000000463 material Substances 0.000 claims description 30
- 238000003384 imaging method Methods 0.000 claims description 9
- 239000000758 substrate Substances 0.000 claims description 5
- 239000011368 organic material Substances 0.000 claims description 4
- 230000001678 irradiating effect Effects 0.000 claims description 3
- 238000007689 inspection Methods 0.000 claims 3
- 238000010586 diagram Methods 0.000 description 6
- 238000006243 chemical reaction Methods 0.000 description 4
- 230000000694 effects Effects 0.000 description 4
- 230000005284 excitation Effects 0.000 description 3
- 230000007547 defect Effects 0.000 description 2
- 239000011521 glass Substances 0.000 description 2
- 230000003287 optical effect Effects 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004593 Epoxy Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 239000000919 ceramic Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 150000002739 metals Chemical class 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229920002120 photoresistant polymer Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 239000004332 silver Substances 0.000 description 1
- WFKWXMTUELFFGS-UHFFFAOYSA-N tungsten Chemical compound [W] WFKWXMTUELFFGS-UHFFFAOYSA-N 0.000 description 1
- 229910052721 tungsten Inorganic materials 0.000 description 1
- 239000010937 tungsten Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N21/00—Investigating or analysing materials by the use of optical means, i.e. using sub-millimetre waves, infrared, visible or ultraviolet light
- G01N21/62—Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light
- G01N21/63—Systems in which the material investigated is excited whereby it emits light or causes a change in wavelength of the incident light optically excited
- G01N21/64—Fluorescence; Phosphorescence
Description
【発明の詳細な説明】
〔発明の利用分野〕
本発明は配線パターンを検出するパターン検出
装置に係り、特にプリント基板の光沢のある半田
パターンの配線パターンの欠陥を検出するための
検出部として好適なパターン検出装置に関するも
のである。[Detailed Description of the Invention] [Field of Application of the Invention] The present invention relates to a pattern detection device for detecting wiring patterns, and is particularly suitable as a detection unit for detecting defects in wiring patterns of glossy solder patterns on printed circuit boards. This invention relates to a pattern detection device.
プリント基板の基材にはガラスエポキシ、ガラ
スポリイミドなどの有機材料が用いられている。
これらの材料に光を照射すると、照射した光の波
長よりも長い波長の蛍光が放出されることが知ら
れている。また、フオトレジストやPIQのような
有機材料からも同様に蛍光が発生する。一方、配
線材料として用いられる金属（例えば、銅、半
田、アルミニウム、タングステン、銀、金）から
は、このような蛍光は発生しない。
Organic materials such as glass epoxy and glass polyimide are used as base materials for printed circuit boards.
It is known that when these materials are irradiated with light, they emit fluorescence with a wavelength longer than the wavelength of the irradiated light. Fluorescence is also generated from organic materials such as photoresist and PIQ. On the other hand, such fluorescence is not generated from metals used as wiring materials (for example, copper, solder, aluminum, tungsten, silver, and gold).
上記したような蛍光を発生する材料と蛍光を発
生しない材料とからなるプリント基板の配線パタ
ーンの欠陥を検出する場合において、従来のパタ
ーン検出装置は、第３図に示すごとく、光３１を
発する高輝度光源１１と、コンデンサレンズ２１
と、光源からの光３１を、蛍光が発生しやすい波
長に限定するためのフイルタ２２と、ハーフミラ
ー２３と、配線面２からの反射光をカツトし、基
材４から発生する蛍光のみを透過するフイルタ２
４と、該フイルタ２４を透過した光４２を検出す
るための検出器１３と、該検出器１３に配線パタ
ーン像を結像するための結像レンズ２５から構成
され、プリント基板１の基材４から発生する蛍光
を検出することによつて、配線パターンのネガパ
ターンを検出するものであるが、基材４から発生
する蛍光の光量が非常に小さいため、第１図のＡ
−Ａ線上の検出結果を示す第４図に示すように基
材４のレベルを示す電圧V2と配線パターン３の
レベルを示す電圧V1との間に差がなく、即ち
Ｓ／Ｎが悪く、両者を区別するためのシユレツヨ
ルドレベルVTの設定できる範囲が非常に狭いか、
あるいは設定できないという問題があつた。 When detecting defects in wiring patterns of printed circuit boards made of materials that emit fluorescence and materials that do not emit fluorescence as described above, the conventional pattern detection device uses a high-temperature sensor that emits light 31 as shown in FIG. Brightness light source 11 and condenser lens 21
, a filter 22 for limiting the light 31 from the light source to wavelengths where fluorescence is likely to occur, a half mirror 23, and a filter that cuts reflected light from the wiring surface 2 and transmits only the fluorescence generated from the base material 4. filter 2
4, a detector 13 for detecting the light 42 transmitted through the filter 24, and an imaging lens 25 for forming a wiring pattern image on the detector 13. The negative pattern of the wiring pattern is detected by detecting the fluorescence emitted from the base material 4, but since the amount of fluorescence emitted from the base material 4 is very small,
- As shown in FIG. 4 showing the detection results on line A, there is no difference between the voltage V 2 indicating the level of the base material 4 and the voltage V 1 indicating the level of the wiring pattern 3, that is, the S/N is poor. , the range in which the Schretzjord level V T can be set to distinguish between the two is very narrow, or
Or there was a problem that it could not be configured.
本発明の目的は、上記従来技術の問題点に鑑
み、基材から発生する蛍光の光量を増量し、Ｓ／
Ｎの改善された検出信号を得ることができるパタ
ーン検出装置を提供することにある。
In view of the problems of the prior art described above, an object of the present invention is to increase the amount of fluorescent light generated from the base material, and to increase the amount of fluorescence generated from the base material.
An object of the present invention is to provide a pattern detection device capable of obtaining N improved detection signals.
本発明は、上記目的を達成するために、基板の
表側から光を照射するだけでなく裏側からも光を
照射して、基材から発生する蛍光の量を増加させ
ることにより、検出信号のＳ／Ｎ比を改善した。
In order to achieve the above object, the present invention not only irradiates light from the front side of the substrate but also irradiates light from the back side to increase the amount of fluorescence generated from the substrate. /N ratio was improved.
以下、本発明の一実施例を第５図を用いて詳細
に説明する。
Hereinafter, one embodiment of the present invention will be described in detail using FIG. 5.
第５図において、プリント基板１，高輝度光源
１１，コンデンサレンズ２１，フイルタ２２，ハ
ーフミラー２３，フイルタ２４，結像レンズ２
５，検出器１３の構成は第３図に示した従来のパ
ターン検出装置と同じであるが、新たに第２の高
輝度光源１１′，コンデンサレンズ２１′，フイル
タ２２′，ミラー２６が設けてある。第５図にお
いて、高輝度光源１１から発した光３１はコンデ
ンサレンズ２１を通り、フイルタ２２へ入り、一
方第２の高輝度光源１１′から発した光３１′はコ
ンデンサレンズ２１′を通り、フイルタ２２′へ入
る。フイルタ２２，２２′はプリント基板１の基
材から蛍光が発生しやすいように高輝度光源１１
から発した光３１の波長を限定するためのフイル
タで、例えば波長300nmから460nmまでの波長の
みを透過させる一般にブルーフイルタと呼称され
ているものである。フイルタ２２を通過した光３
２はハーフミラー２３で光路を90度変更されてプ
リント基板１の配線面２を照射し、またフイルタ
２２′を通過した光３２′はミラー２６で光路を90
度変更されてプリント基板１の配線面２の裏面に
相当する配線面２′を照射し、両者とも基材４か
ら蛍光を発生させるための励起光として働らく。
基材４から発生した蛍光と、配線面２で反射した
反射光と、基材４を透過した透過光と、スルーホ
ール８を通過した通過光の合わさつた光４３は再
びハーフミラー２３を通つてフイルタ２４へ入
る。フイルタ２４はプリント基板１の基材４から
発生した蛍光と、その他の反射光，透過光，通過
光とを分離するためのもので、前記励起光３２の
限定された波長域以外の光を透過させるもので例
えば波長500nm以下の光を反射し、波長500nm以
上の光を透過させる、一般にイエローフイルタと
呼称されているものである。フイルタ２４で配線
面２からの反射光，配線面２′に照射した光３
２′が基材４を透過した透過光，スルーホール８
を通過した通過光と分離された蛍光４４は、結像
レンズ２５で検出器１３の光電変換面に結像され
るためプリント基板１の配線パターンのネガパタ
ーンが得られる。従がつて、第５図における本発
明の一実施例ではプリント基板やセラミツク基板
の基材４が、配線面２を照射する光３２と配線面
２の裏面に相当する配線面２′を照射する光３
２′の両方の光で励起されるため、発生する蛍光
が増量し、検出器１３で検出される検出信号の
Ｓ／Ｎが改善される。従来のパターン検出装置の
検出結果を示す第４図と比較して、本発明の一実
施例であるパターン検出装置の検出結果を示す第
６図を用いて詳細に説明する。第６図は第４図と
同様、横軸は位置を示し、縦軸は検出器１３で光
電変換された電圧を示す。配線パターン３のレベ
ルを示す電圧V1は第６図，第４図とも同じであ
るが、基材４のレベルを示す第６図における電圧
V3は第４図における電圧V2に比べかなり高い電
圧レベルを示し、シユレツシヨルドレベルを示す
電圧VTの設定可能範囲は第６図の方が第４図よ
りも広く、即ちＳ／Ｎが改善される。 In FIG. 5, a printed circuit board 1, a high-intensity light source 11, a condenser lens 21, a filter 22, a half mirror 23, a filter 24, and an imaging lens 2 are shown.
5. The configuration of the detector 13 is the same as that of the conventional pattern detection device shown in FIG. be. In FIG. 5, light 31 emitted from the high brightness light source 11 passes through the condenser lens 21 and enters the filter 22, while light 31' emitted from the second high brightness light source 11' passes through the condenser lens 21' and enters the filter 22. Enter 22'. The filters 22 and 22' are connected to the high-intensity light source 11 so that fluorescence is easily generated from the base material of the printed circuit board 1.
This is a filter for limiting the wavelength of the light 31 emitted from, for example, a filter that only transmits wavelengths from 300 nm to 460 nm and is generally called a blue filter. Light 3 that passed through the filter 22
2, the optical path is changed by 90 degrees by a half mirror 23 to illuminate the wiring surface 2 of the printed circuit board 1, and the light 32' that has passed through the filter 22' is changed by a mirror 26 to change the optical path by 90 degrees.
The intensity is changed and the wiring surface 2' corresponding to the back surface of the wiring surface 2 of the printed circuit board 1 is irradiated, and both of them serve as excitation light for generating fluorescence from the base material 4.
Light 43, which is a combination of the fluorescence generated from the base material 4, the reflected light reflected from the wiring surface 2, the transmitted light transmitted through the base material 4, and the transmitted light transmitted through the through hole 8, passes through the half mirror 23 again. Enters filter 24. The filter 24 is for separating the fluorescence generated from the base material 4 of the printed circuit board 1 from other reflected light, transmitted light, and passing light, and transmits light other than the limited wavelength range of the excitation light 32. For example, it is generally called a yellow filter, which reflects light with a wavelength of 500 nm or less and transmits light with a wavelength of 500 nm or more. The filter 24 filters the light reflected from the wiring surface 2 and the light 3 irradiated onto the wiring surface 2'.
2' is the transmitted light transmitted through the base material 4, through hole 8
The fluorescent light 44 separated from the transmitted light is imaged by the imaging lens 25 on the photoelectric conversion surface of the detector 13, so that a negative pattern of the wiring pattern of the printed circuit board 1 is obtained. Accordingly, in one embodiment of the present invention shown in FIG. 5, the base material 4 of a printed circuit board or a ceramic substrate irradiates the wiring surface 2' corresponding to the back surface of the wiring surface 2 with the light 32 that illuminates the wiring surface 2. light 3
2', the amount of fluorescence generated increases, and the S/N ratio of the detection signal detected by the detector 13 is improved. This will be explained in detail using FIG. 6, which shows the detection results of a pattern detection device according to an embodiment of the present invention, in comparison with FIG. 4, which shows the detection results of a conventional pattern detection device. In FIG. 6, like FIG. 4, the horizontal axis shows the position, and the vertical axis shows the voltage photoelectrically converted by the detector 13. In FIG. The voltage V 1 indicating the level of the wiring pattern 3 is the same in FIGS. 6 and 4, but the voltage in FIG. 6 indicating the level of the base material 4
V 3 shows a considerably higher voltage level than the voltage V 2 in FIG. 4, and the settable range of the voltage V T indicating the threshold level is wider in FIG. 6 than in FIG. 4, that is, the S/N is improved.
第７図は本発明の他の実施例を示す図で、プリ
ント基板１，高輝度光源１１，１１′，コンデン
サレンズ２１，２１′、フイルタ２２，２２′，ハ
ーフミラー２３，フイルタ２４，結像レンズ２
５，検出器１３の構成は第５図に示した実施例と
同じであるが、配線面２′に対して斜め方向から
光３２′を照射するため、第５図におけるミラー
２６に代わりミラー２６′と凹面鏡あるいは平面
鏡２７′が新しく設けてある点が異なり、その動
作は第３図と同じであるため省略する。光３２′
を配線面２′に対して斜め方向から照射する理由
は、配線面２′の配線パターンの影の影響を受け
ないように配慮したことによる。 FIG. 7 is a diagram showing another embodiment of the present invention, in which a printed circuit board 1, high-intensity light sources 11 and 11', condenser lenses 21 and 21', filters 22 and 22', a half mirror 23, a filter 24, and an image forming lens 2
5. The structure of the detector 13 is the same as the embodiment shown in FIG. 5, but in order to irradiate the wiring surface 2' with light 32' from an oblique direction, a mirror 26 is used instead of the mirror 26 in FIG. The difference is that a concave mirror or a plane mirror 27' is newly provided, and the operation thereof is the same as that in FIG. 3, so a description thereof will be omitted. light 32'
The reason for irradiating the wiring surface 2' from an oblique direction is to avoid being affected by the shadow of the wiring pattern on the wiring surface 2'.
次に第８図において本発明の他の実施例を示
す。第８図において、プリント基板１，高輝度光
源１１，１１′，コンデンサレンズ２１，２１′，
フイルタ２２，２２′，ミラー２６′，凹面鏡ある
いは平面鏡２７′，フイルタ２４，結像レンズ２
５，検出器１３の構成は第７図に示した実施例と
同じであるが、第７図におけるハーフミラー２３
の代わりにミラー２６，凹面鏡あるいは平面鏡２
７を新しく設け、更に配線面２′の配線パターン
を検出するためフイルタ２４′，結像レンズ２
５′，検出器１３′が追加された構成となつてい
る。第８図において、検出器１３の光電変換面に
プリント基板１の配線面２の配線パターンのネガ
パターンが結像されるまでの動作は第５図と同じ
であるため説明は省略する。また検出器１３′の
光電変換面にプリント基板１の配線面２の裏面に
相当する配線面２′の配線パターンのネガパター
ンが結像されるまでの動作は、検出器１３の光電
変換面にプリント基板１の配線面２の配線パター
ンのネガパターンが結像されるまでの動作説明に
おいて、ダツシユを付した構成は、ダツシユを付
さない構成に、ダツシユを付さない構成は、ダツ
シユを付した構成に代わるのみで、類似している
ため説明は省略する。本発明の実施例によれば、
配線面２の配線パターンのネガパターンを検出器
１３で、かつ、配線面２′の配線パターンのネガ
パターンを検出器１３′で一度に検出することが
できるため、配線パターンの検出に要する時間を
大巾に短縮することができる。更にプリント基板
１の基材４は、配線面２を照射する光３２と、配
線面２の裏面に相当する配線面２′を照射する光
３２′の両方の光で励起されるため、発生する蛍
光の光量は第５図と同様増量し、検出器１３およ
び１３′で検出される検出信号のＳ／Ｎは改善さ
れたものであることはもち論である。第９図は第
８図に示した本発明の実施例であるパターン検出
装置で検出した第１図のＡ−Ａ線上の検出結果を
示すもので、ａは配線面２における検出結果を示
し、ｂは配線面２の裏面に相当する配線面２′の
検出結果を示す。第９図ａは当然のことながら第
６図と同じ結果を示す。 Next, FIG. 8 shows another embodiment of the present invention. In FIG. 8, a printed circuit board 1, high-intensity light sources 11, 11', condenser lenses 21, 21',
Filters 22, 22', mirror 26', concave mirror or plane mirror 27', filter 24, imaging lens 2
5. The configuration of the detector 13 is the same as the embodiment shown in FIG. 7, but the half mirror 23 in FIG.
Mirror 26, concave mirror or plane mirror 2 instead of
In addition, a filter 24' and an imaging lens 2 are installed to detect the wiring pattern on the wiring surface 2'.
5' and a detector 13' are added. In FIG. 8, the operation until the negative pattern of the wiring pattern on the wiring surface 2 of the printed circuit board 1 is imaged on the photoelectric conversion surface of the detector 13 is the same as that in FIG. 5, and therefore a description thereof will be omitted. In addition, the operation until the negative pattern of the wiring pattern on the wiring surface 2' corresponding to the back side of the wiring surface 2 of the printed circuit board 1 is imaged on the photoelectric conversion surface of the detector 13' is performed on the photoelectric conversion surface of the detector 13'. In the explanation of the operation until the negative pattern of the wiring pattern on the wiring surface 2 of the printed circuit board 1 is imaged, the configuration with the dots is compared to the configuration without the dots, and the configuration without the dots is compared to the configuration with the dots. This configuration is only a replacement for the previous configuration, and the explanation will be omitted since it is similar. According to an embodiment of the invention:
Since the negative pattern of the wiring pattern on the wiring surface 2 can be detected by the detector 13 and the negative pattern of the wiring pattern on the wiring surface 2' can be detected by the detector 13' at the same time, the time required to detect the wiring pattern can be reduced. It can be shortened to a large width. Furthermore, since the base material 4 of the printed circuit board 1 is excited by both the light 32 that irradiates the wiring surface 2 and the light 32' that irradiates the wiring surface 2' corresponding to the back surface of the wiring surface 2, It goes without saying that the amount of fluorescence increases as in FIG. 5, and the S/N of the detection signals detected by the detectors 13 and 13' is improved. FIG. 9 shows the detection results on the line A-A in FIG. 1 detected by the pattern detection device according to the embodiment of the present invention shown in FIG. 8, where a indicates the detection result on the wiring surface 2; b shows the detection result of the wiring surface 2' corresponding to the back surface of the wiring surface 2. FIG. 9a naturally shows the same results as FIG. 6.
以上の説明はもつぱら配線基板の基材から発す
る蛍光を検出する場合を例示したが、本発明は、
例えば蛍光を発しない基材のうえに蛍光を発する
材料で描いた回路パターンの例えば、エツチング
用レジストパターンに対しても有効であることは
言うまでもない。具体的例としては印刷回路板用
レジストパターン，半導体回路用レジストパター
ンの検査に適用できる。 Although the above explanation mainly exemplified the case of detecting fluorescence emitted from the base material of a wiring board, the present invention
It goes without saying that this method is also effective for etching resist patterns, such as circuit patterns drawn using fluorescent materials on non-fluorescent substrates. As a specific example, it can be applied to inspecting resist patterns for printed circuit boards and resist patterns for semiconductor circuits.
以上説明したように本発明によれば、以下に述
べるごとき効果を得ることができる。
As explained above, according to the present invention, the following effects can be obtained.
１ 本発明の第１および第２の実施例によれば、
プリント基板の表裏線面を同時に照射するよう
にしたため、基材から発生する蛍光の光量が増
量できるので、検出信号のＳ／Ｎを改善できる
効果がある。更に、本発明の第２の実施例によ
れば、配線パターンの斜め方向から光を照射す
る構成としたので、配線パターンの影の影響を
除去でき、一層改善された検出信号のＳ／Ｎ比
を得ることができる。1 According to the first and second embodiments of the present invention:
Since the front and back surfaces of the printed circuit board are irradiated simultaneously, the amount of fluorescent light generated from the base material can be increased, which has the effect of improving the S/N of the detection signal. Furthermore, according to the second embodiment of the present invention, since the wiring pattern is irradiated with light from an oblique direction, the influence of the shadow of the wiring pattern can be removed, and the S/N ratio of the detection signal is further improved. can be obtained.
２ 本発明の第３の実施例によれば、上記した１
で述べた本発明の第２の実施例と同様に、配線
パターンの斜め方向から光を照射する構成とし
たので、配線パターンの影の影響を除去でき、
一層改善された検出信号のＳ／Ｎ比を得られる
効果があるとともに、プリント基板の表裏配線
面の配線パターンを別々に設けた検出器で検出
するようにしたため表裏配線面の配線パターン
を一度に検出することができるので、配線パタ
ーンの検出に要する時間を大巾に短縮すること
のできるパターン検出装置を得ることのできる
効果がある。2 According to the third embodiment of the present invention, the above-mentioned 1
Similar to the second embodiment of the present invention described in , since the configuration is such that light is irradiated from the diagonal direction of the wiring pattern, the influence of the shadow of the wiring pattern can be removed.
In addition to the effect of obtaining a further improved S/N ratio of the detection signal, the wiring patterns on the front and back wiring surfaces of the printed circuit board are detected by separate detectors, so the wiring patterns on the front and back wiring surfaces can be detected at the same time. Since the wiring pattern can be detected, it is possible to obtain a pattern detection device that can greatly shorten the time required to detect the wiring pattern.
第１図はプリント基板の平面図、第２図は第１
図のＡ−Ａ線断面図、第３図は従来のパターン検
出装置を示す側面図、第４図は従来のパターン検
出装置による第１図のＡ−Ａ線上の検出結果を示
す図、第５図は本発明の一実施例のパターン検出
装置を示す側面図、第６図は本発明の一実施例の
パターン検出装置による第１図のＡ−Ａ線上の検
出結果を示す図、第７図は本発明の他の一実施例
のパターン検出装置を示す側面図、第８図は本発
明の他の一実施例のパターン検出装置を示す側面
図、第９図は本発明の他の一実施例のパターン検
出装置による第１図Ａ−Ａ線上の検出結果を示す
図でａは配線面２における検出結果を示す図でｂ
は配線面２の裏面である配線面２′における検出
結果を示す図。
１…プリント基板、２，２′…配線面、３，
３′…配線パターン、４…基材、１１，１１′…高
輝度光源、１３，１３′…検出器、２１，２１′…
コンデンサレンズ、２２，２２′…フイルタ、２
３…ハーフミラー、２４，２４′…フイルタ、２
５，２５′…結像レンズ、２６，２６′…ミラー、
２７，２７′…凹面鏡あるいは平面鏡、３１，３
１′…光源の光、３２，３２′…励起光、４２，４
４，４６，４６′…蛍光。
Figure 1 is a top view of the printed circuit board, Figure 2 is the top view of the printed circuit board.
3 is a side view showing a conventional pattern detection device, FIG. 4 is a diagram showing detection results on line AA in FIG. 1 by the conventional pattern detection device, and FIG. FIG. 6 is a side view showing a pattern detection device according to an embodiment of the present invention, FIG. 6 is a diagram showing detection results on line A-A in FIG. 1 by the pattern detection device according to an embodiment of the present invention, and FIG. 8 is a side view showing a pattern detecting device according to another embodiment of the present invention, FIG. 9 is a side view showing a pattern detecting device according to another embodiment of the present invention, and FIG. 9 is a side view showing a pattern detecting device according to another embodiment of the present invention. A diagram showing the detection results on line A-A in FIG. 1 by the example pattern detection device, a is a diagram showing the detection results on the wiring surface 2,
2 is a diagram showing detection results on a wiring surface 2' which is the back surface of the wiring surface 2. FIG. 1...Printed circuit board, 2, 2'...wiring surface, 3,
3'... Wiring pattern, 4... Base material, 11, 11'... High brightness light source, 13, 13'... Detector, 21, 21'...
Condenser lens, 22, 22'...filter, 2
3... Half mirror, 24, 24'... Filter, 2
5, 25'...imaging lens, 26, 26'...mirror,
27, 27'...concave mirror or plane mirror, 31, 3
1'... Light of light source, 32, 32'... Excitation light, 42, 4
4,46,46'...Fluorescence.
Claims (1)
形成したプリント基板の表側と裏側とに光を照射
する照射手段と、該照射手段の光を蛍光が発生し
やすい波長に限定するための第１のフイルタと、
前記プリント基板の前記表側の面からの反射光お
よびスルーホールからの通過光をカツトして前記
基材から発生する蛍光のみを透過する第２のフイ
ルタと、該第２のフイルタを透過した蛍光を検出
するための検出器と、該検出器に前記表側の配線
パターン像を結像するための結像レンズとを備え
付けたことを特徴とするパターン検出装置。 ２ 上記照射手段は、プリント基板の表側の面に
光を照射する第１の照射手段と、裏側の面に光を
照射する第２の照射手段によつて構成したことを
特徴とする特許請求の範囲第１項記載のパターン
検出装置。 ３ 上記第２の照射手段は、プリント基板の裏側
の面に斜め方向から光を照射することを特徴とす
る特許請求の範囲第２項記載のパターン検出装
置。 ４ 上記第１のフイルタは、上記第１の照射手段
と上記第２の照射手段とに対応させて複数のフイ
ルタによつて構成したことを特徴とする特許請求
の範囲第２項記載のパターン検出装置。 ５ 有機材料を含む基材の両側に配線パターンを
形成したプリント基板の表側と裏側とに光を照射
する照射手段と、該照射手段の光を蛍光が発生し
やすい波長に限定するための第１のフイルタと、
前記プリント基板の表側の面からの反射光および
スルーホールからの通過光をカツトして前記基材
から発生する蛍光のみを透過する第２のフイルタ
と、該第２のフイルタを透過した蛍光を検出する
ための第１の検出器と、該第１の検出器に前記プ
リント基板の表側の配線パターンの像を結像する
ための第１の結像レンズと、更に前記プリント基
板の裏側の面からの反射光およびスルーホールか
らの通過光をカツトし、前記基材から発生する蛍
光のみを透過する第３のフイルタと、該第３のフ
イルタを透過した蛍光を検出するための第２の検
出器と、該第２の検出器に前記プリント基板の裏
側の配線パターンの像を結合させるための第２の
結像レンズとを備えたことを特徴とするパターン
検出装置。 ６ 上記照射手段は、プリント基板の表側の面に
照射する第１の照射手段と、裏側の面に光を照射
する第２の照射手段とによつて構成したことを特
徴とする特許請求の範囲第５項記載のパターン検
査装置。 ７ 上記第１の照射手段と上記第２の照射手段と
は、それぞれ基板に斜め方向から光を照射するこ
とを特徴とする特許請求の範囲第５項記載のパタ
ーン検査装置。 ８ 上記第１のフイルターは、第１の照射手段と
第２の照射手段とに対応させて複数のフイルタに
よつて構成したことを特徴とする特許請求の範囲
第６項記載のパターン検査装置。[Scope of Claims] 1. Irradiation means for irradiating light onto the front and back sides of a printed circuit board in which a wiring pattern is formed on both sides of a base material containing an organic material, and the light from the irradiation means is set to a wavelength that facilitates the generation of fluorescence. a first filter for limiting;
a second filter that cuts out reflected light from the front surface of the printed circuit board and transmitted light from the through hole and transmits only fluorescence generated from the base material; and a second filter that transmits only the fluorescence generated from the base material; A pattern detection device comprising: a detector for detection; and an imaging lens for forming an image of the wiring pattern on the front side on the detector. 2. The above-mentioned irradiation means is constituted by a first irradiation means that irradiates light onto the front surface of the printed circuit board, and a second irradiation means that irradiates light onto the back surface of the printed circuit board. The pattern detection device according to scope 1. 3. The pattern detection device according to claim 2, wherein the second irradiation means irradiates the back surface of the printed circuit board with light from an oblique direction. 4. Pattern detection according to claim 2, wherein the first filter is constituted by a plurality of filters corresponding to the first irradiation means and the second irradiation means. Device. 5. An irradiation means for irradiating light onto the front and back sides of a printed circuit board on which wiring patterns are formed on both sides of a base material containing an organic material, and a first irradiation means for limiting the light of the irradiation means to a wavelength at which fluorescence is likely to occur. and a filter of
a second filter that cuts out the light reflected from the front surface of the printed circuit board and the light that passes through the through hole and transmits only the fluorescence generated from the base material, and detects the fluorescence that has passed through the second filter. a first detector for forming an image of the wiring pattern on the front side of the printed circuit board on the first detector; and a first imaging lens for forming an image of the wiring pattern on the front side of the printed circuit board on the first detector; a third filter that cuts out the reflected light and the light that passes through the through hole and transmits only the fluorescence generated from the base material; and a second detector for detecting the fluorescence that has passed through the third filter. and a second imaging lens for combining an image of the wiring pattern on the back side of the printed circuit board with the second detector. 6. Claims characterized in that the irradiation means is constituted by a first irradiation means that irradiates the front surface of the printed circuit board, and a second irradiation means that irradiates light to the back surface of the printed circuit board. The pattern inspection device according to item 5. 7. The pattern inspection apparatus according to claim 5, wherein the first irradiation means and the second irradiation means each irradiate the substrate with light from an oblique direction. 8. The pattern inspection apparatus according to claim 6, wherein the first filter is constituted by a plurality of filters corresponding to the first irradiation means and the second irradiation means.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58092304A JPS59218937A (en) | 1983-05-27 | 1983-05-27 | Pattern detector |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58092304A JPS59218937A (en) | 1983-05-27 | 1983-05-27 | Pattern detector |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59218937A JPS59218937A (en) | 1984-12-10 |
| JPH0436335B2 true JPH0436335B2 (en) | 1992-06-15 |
Family
ID=14050667
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58092304A Granted JPS59218937A (en) | 1983-05-27 | 1983-05-27 | Pattern detector |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59218937A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4679938A (en) * | 1985-06-03 | 1987-07-14 | International Business Machines Corporation | Defect detection in films on ceramic substrates |
| KR100880858B1 (en) | 2007-08-09 | 2009-01-30 | 한기수 | Light source sturcture for pcb light exposition apparatus |
-
1983
- 1983-05-27 JP JP58092304A patent/JPS59218937A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59218937A (en) | 1984-12-10 |
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