JPS60135805A - Pattern detecting method and apparatus therefor - Google Patents

Pattern detecting method and apparatus therefor

Info

Publication number
JPS60135805A
JPS60135805A JP24384783A JP24384783A JPS60135805A JP S60135805 A JPS60135805 A JP S60135805A JP 24384783 A JP24384783 A JP 24384783A JP 24384783 A JP24384783 A JP 24384783A JP S60135805 A JPS60135805 A JP S60135805A
Authority
JP
Japan
Prior art keywords
light
fluorescence
printed circuit
circuit board
base material
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP24384783A
Other languages
Japanese (ja)
Other versions
JPH0476042B2 (en
Inventor
Hirotani Saitou
斎藤 啓谷
Koichi Tsukazaki
柄崎 晃一
Yasuhiko Hara
靖彦 原
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP24384783A priority Critical patent/JPS60135805A/en
Publication of JPS60135805A publication Critical patent/JPS60135805A/en
Publication of JPH0476042B2 publication Critical patent/JPH0476042B2/ja
Granted legal-status Critical Current

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  • Length Measuring Devices By Optical Means (AREA)
  • Investigating Materials By The Use Of Optical Means Adapted For Particular Applications (AREA)

Abstract

PURPOSE:To make it possible to detect the wiring pattern formed on a substrate in a good S/N ratio, by generating fluorescence from the phosphor placed on the back side of the substrate by light transmitted through the base material of the substrate and adding fluorescence generated from the base material to the generated fluorescence before detecting the combined fluorescence by a detector. CONSTITUTION:Light 21 from a light source 5 is allowed to irradiate the wiring surface 2 of a printed circuit board 1 through a first filter 7, a translucent mirror 8 and the wiring surface 2 of the printed circuit board 1 and reflected light is generated from the wiring surface 2 while fluorescence is generated from a base material 3. Further, light 23 transmitted through the base material 3 is incident on the phosphor 12 positioned at the under side of a printed circuit board 1 to generate fluorescence 33. The fluorescence 33 transmits the base material 3 of the printed circuit board 1 again to be directed upwardly. This fluorescence 33 is combined with the fluorescence generated from the base material 3 of the printed circuit board 1 to form fluorescence 34 which is, in turn, passed through the translucent mirror 8 and detected by a detector 11 through a second filter 9. Therefore, fluorescence to be detected increases and the S/N ratio of a detection signal can be improved.

Description

【発明の詳細な説明】 〔発明の利用分野〕 本発明は配線パターンを検出するパターン検出装置に係
り、特にプリント基板の基材から発生する螢光をとらえ
ることによって配線パターンを検出するパターン検出方
法及びその装置に関するものである。
[Detailed Description of the Invention] [Field of Application of the Invention] The present invention relates to a pattern detection device for detecting wiring patterns, and particularly to a pattern detection method for detecting wiring patterns by capturing fluorescence generated from the base material of a printed circuit board. and its apparatus.

〔発明の背景〕[Background of the invention]

従来のパターン検出装置は、プリント基板の配線パター
ンからの反射光像を検出器で検出するものである。しか
しながら、この検出装置では本来配線パターンに欠陥の
ないもの(例えばよごれ、浅い傷)才で欠陥とみなして
しすう欠点を有した。
A conventional pattern detection device uses a detector to detect a reflected light image from a wiring pattern on a printed circuit board. However, this detection device has a drawback in that it treats wiring patterns that do not originally have defects (for example, dirt, shallow scratches) as defects.

〔発明の目的〕[Purpose of the invention]

本発明の目的は、上記従来技術の欠点をなくし、S/N
の良い螢光パターンを検出できるようにし、基板上に形
成された配線パターンを認識Tるパターン検出方法及び
その装置を提供するにある。
The purpose of the present invention is to eliminate the drawbacks of the above-mentioned prior art, and to
An object of the present invention is to provide a pattern detection method and apparatus for detecting a fluorescent pattern with good quality and recognizing a wiring pattern formed on a substrate.

〔発明の概要〕[Summary of the invention]

本発明は、上記目的を達成するために、プリント基板の
下側に螢光を発生する螢光体を位置し、プリント基板の
基材を透過してきた光によって前記螢光体から螢光を発
生させ、基材を透過して戻ってくる螢光を、基材から発
生した螢光に加えて検出器で検出することによって検出
すべき基板上に形成された配線パターンを検出゛するこ
とを特徴とするものである。
In order to achieve the above object, the present invention places a phosphor that generates fluorescent light on the underside of a printed circuit board, and generates fluorescent light from the phosphor by light that has passed through the base material of the printed circuit board. The wiring pattern formed on the substrate to be detected is detected by detecting the fluorescent light transmitted through the base material and returned by a detector in addition to the fluorescent light generated from the base material. That is.

〔発明の実施例〕[Embodiments of the invention]

以下本発明の一実施例を第1図及び第2図により説明す
る。
An embodiment of the present invention will be described below with reference to FIGS. 1 and 2.

第1図に示すプリント基板lの配線面2に限定した波長
の光22を照射し基材3から発生する螢光31を検出器
11で検出する方式であり、プリント基板10基材3か
ら発生する螢光が小さいため、第1のフィルタ7あるい
は第2のフィルタ90分光透過率特性の良いものを選ぶ
必要があったり、出力の大きい光源5を使う必要があっ
た。
This is a method in which the wiring surface 2 of the printed circuit board 1 shown in FIG. Since the emitted fluorescence is small, it is necessary to select the first filter 7 or the second filter 90 with good spectral transmittance characteristics, or it is necessary to use a light source 5 with a large output.

そこで次のように構成した。第2図においてプリント基
板1、光源5、コンデンサレンズ6第1のフィルタ7、
半透鏡8、第2のフィルタ9、結像レンズ10、検出器
11は、第1図に示した従来のパターン検出装置の同一
符号のものと同じ構成であるが新たに螢光体12が追加
されている。光源5から発した光21は第1のフィルタ
7でプリント基板10基′#3から螢光が発生しやすい
波長の光22に変わり、半透鏡8によって光路が変更さ
れ、プリント基板1の配線面2に照射される。プリント
基板1の配線内2では反射光が発生し、基材3では螢光
が発生する。東に、前記基材3を透過した光23は、プ
リント基板1の下側に位置する螢光体12に照射され、
螢光33を発生させる。螢光33は再びプリント基板1
の基材3を透過して上方へ向かう。然らば光34は配線
面2での反射光と基材3で発生した螢光と螢光体12で
発生し基材3を透過して来た螢光の合わさった光である
。光34は半透鏡8を通過して第2のフィルタ9に入射
する。第2のフィルタ9では反射光がカットされ螢光3
5のみ透過され、結像レンズ10で検出器11の結像面
に結像される。
Therefore, it was constructed as follows. In FIG. 2, a printed circuit board 1, a light source 5, a condenser lens 6, a first filter 7,
The semi-transparent mirror 8, second filter 9, imaging lens 10, and detector 11 have the same configuration as those with the same numbers in the conventional pattern detection device shown in FIG. 1, but a phosphor 12 is newly added. has been done. The light 21 emitted from the light source 5 is changed by the first filter 7 into light 22 having a wavelength that easily generates fluorescence from the printed circuit board 10'#3, and the optical path is changed by the semi-transparent mirror 8, and the light 21 is directed to the wiring surface of the printed circuit board 1. 2. Reflected light is generated in the wiring 2 of the printed circuit board 1, and fluorescent light is generated in the base material 3. To the east, the light 23 transmitted through the base material 3 is irradiated onto the phosphor 12 located under the printed circuit board 1,
Fluorescence 33 is generated. The fluorescent light 33 is again printed on the printed circuit board 1.
The light passes through the base material 3 and heads upward. Therefore, the light 34 is a combination of the reflected light from the wiring surface 2, the fluorescent light generated from the base material 3, and the fluorescent light generated from the phosphor 12 and transmitted through the base material 3. The light 34 passes through the semi-transparent mirror 8 and enters the second filter 9. The second filter 9 cuts off the reflected light and the fluorescent light 3
5 is transmitted, and is imaged by the imaging lens 10 on the imaging plane of the detector 11.

本実施例によれば、プリント基板10基材3から発生す
る螢光に加えて、螢光体12から発生し基材3そ通過し
てくる螢光も検出されるので検出すべき螢光が増大し、
検出信号のS/Nを改善できるという効果がある。
According to this embodiment, in addition to the fluorescent light generated from the printed circuit board 10 and the base material 3, the fluorescent light generated from the fluorescent body 12 and passing through the base material 3 is also detected, so that the fluorescent light to be detected is increase,
This has the effect of improving the S/N of the detection signal.

第3図は、スルーホール13を有するプリント基板1に
適用した実施例を示す。スルーホール13を通過した光
24によって螢光体12から螢光33が発生し、かつス
ルーホール13を通過して戻り、第2図における光34
に合わさった光36になる。
FIG. 3 shows an embodiment applied to a printed circuit board 1 having a through hole 13. Fluorescent light 33 is generated from the phosphor 12 by the light 24 passing through the through hole 13, and returns through the through hole 13 to become the light 34 in FIG.
The combined light becomes 36.

第4図はスルーホール13を有するプリント基板1の検
出器11で検出されたパターン像を示す6スルーホール
13がバッド14のパターン像の中に検出される。
FIG. 4 shows a pattern image detected by the detector 11 of the printed circuit board 1 having through holes 13. Six through holes 13 are detected in the pattern image of the pad 14. FIG.

上記説明した実施例によれは、プリント基板1がスルー
ホール13を有する場合、スルーホール13を通過した
光24によって螢光体12から螢光33が発生し、かつ
スルーホール13を通過して戻ってくる螢光33を検出
することになるので、スルーホール13をパターン像と
して検出することができるため、パッド14とスルーホ
ール13の位置ずれあるいはスルーホール13の径の測
定可能である。
According to the embodiment described above, when the printed circuit board 1 has the through hole 13, the fluorescent light 33 is generated from the fluorescent body 12 by the light 24 that has passed through the through hole 13, and the fluorescent light 33 is generated after passing through the through hole 13 and returned. Since the incoming fluorescent light 33 is detected, the through hole 13 can be detected as a pattern image, and the positional deviation between the pad 14 and the through hole 13 or the diameter of the through hole 13 can be measured.

〔発明の効果〕〔Effect of the invention〕

以上説明したように本発明によれば、プリント基板1の
基材3から発生する螢光に加えて、螢光体12から発生
し、基材3を通過してくる螢光も検出されるので検出す
べき螢光が増大できるので検出信号のS/Nを改善でき
る効果がある。
As explained above, according to the present invention, in addition to the fluorescent light generated from the base material 3 of the printed circuit board 1, the fluorescent light generated from the phosphor 12 and passing through the base material 3 is also detected. Since the amount of fluorescent light to be detected can be increased, the S/N ratio of the detection signal can be improved.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は本発明に係る螢光検出方式のパターン検出装置
を示す側面図、第2図及び第3図は本発明の一実施例の
パターン検出装置を示す側面図、第4図はパターン像を
示す図である。 1・・・プリント基板 2・・・配線面3・・・基材 
4・・・配線パターン 5・・・光源 6・・・コンデンサレンズ7・・・第1
のフィルタ 8・・・半透鏡9・・・第2のフィルタ 
10・・・結1象レンズ11・・・検出器 12・・・
螢光体 13・・・スルーホール 14・・・ノ々ツド21.2
2,23.24・・・照明光 31 、34 、36・・・螢光と反射光の合わさった
光32.33.35・・・螢光 第1図 第2し
FIG. 1 is a side view showing a pattern detection device using a fluorescence detection method according to the present invention, FIGS. 2 and 3 are side views showing a pattern detection device according to an embodiment of the present invention, and FIG. 4 is a pattern image. FIG. 1... Printed circuit board 2... Wiring surface 3... Base material
4... Wiring pattern 5... Light source 6... Condenser lens 7... First
Filter 8...Semi-transparent mirror 9...Second filter
10...Illustrated lens 11...Detector 12...
Fluorescent body 13... Through hole 14... Notch 21.2
2, 23, 24... Illumination light 31, 34, 36... Combined light of fluorescent light and reflected light 32.33.35... Fluorescent light Figure 1, Figure 2

Claims (1)

【特許請求の範囲】 1、基板の裏側に螢光を発生する螢光体を置き、基板の
基材から発生する螢光に、上記螢光体から発生する螢光
を基材を透過させて加え、検出器で検出し基板上に形成
された配線パターンを認識することを特徴とするパター
ン検出方法。 2、上記螢光体として、上記基板の基材そ用いることを
特徴とする特許請求の範囲第1項記載のパターン検出方
法。 3、 プリント基板の配線パターンに光を照射する光源
と、螢光を検出するための検出器と、前記光源からの光
を螢光か発生しやすい波長に限定するための第1のフィ
ルタと、前記プリント基板の配線パターンからの反射光
をカットし、螢光を透過する第2のフィルタと、前記検
出器に配線パターン像を結像するための結像レンズと、
光源からの光をプリント基板の配線面に向け、該配線面
からの反射光および螢光を前記結像レンズおよび検出器
側へ導く半透鏡と、ツーリント基板の裏側に位置し、プ
リント基板の基材を透過する光により螢光を発生する螢
光体とを備え付けたことを特徴とするパターン検出装置
[Claims] 1. A phosphor that generates fluorescent light is placed on the back side of the substrate, and the fluorescent light generated from the phosphor is transmitted through the base material. In addition, a pattern detection method characterized by detecting with a detector and recognizing a wiring pattern formed on a board. 2. The pattern detection method according to claim 1, wherein the base material of the substrate is used as the phosphor. 3. A light source that irradiates light onto the wiring pattern of the printed circuit board, a detector that detects fluorescent light, and a first filter that limits the light from the light source to a wavelength that is likely to generate fluorescent light; a second filter that cuts reflected light from the wiring pattern of the printed circuit board and transmits fluorescent light; an imaging lens that forms a wiring pattern image on the detector;
A semi-transparent mirror that directs the light from the light source to the wiring surface of the printed circuit board and guides the reflected light and fluorescent light from the wiring surface to the imaging lens and detector side, and a semi-transparent mirror located on the back side of the tooling board that A pattern detection device characterized in that it is equipped with a phosphor that generates fluorescence by light transmitted through a material.
JP24384783A 1983-12-26 1983-12-26 Pattern detecting method and apparatus therefor Granted JPS60135805A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP24384783A JPS60135805A (en) 1983-12-26 1983-12-26 Pattern detecting method and apparatus therefor

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP24384783A JPS60135805A (en) 1983-12-26 1983-12-26 Pattern detecting method and apparatus therefor

Related Child Applications (1)

Application Number Title Priority Date Filing Date
JP15473092A Division JPH0676884B2 (en) 1992-06-15 1992-06-15 Pattern detection method

Publications (2)

Publication Number Publication Date
JPS60135805A true JPS60135805A (en) 1985-07-19
JPH0476042B2 JPH0476042B2 (en) 1992-12-02

Family

ID=17109832

Family Applications (1)

Application Number Title Priority Date Filing Date
JP24384783A Granted JPS60135805A (en) 1983-12-26 1983-12-26 Pattern detecting method and apparatus therefor

Country Status (1)

Country Link
JP (1) JPS60135805A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62207904A (en) * 1986-03-07 1987-09-12 Mitsubishi Monsanto Chem Co Measuring instrument for light emission wavelength and area of wafer
US6187417B1 (en) 1998-02-18 2001-02-13 International Business Machines Corporation Substrate having high optical contrast and method of making same

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52114483A (en) * 1976-03-18 1977-09-26 Agfa Gevaert Nv Improvement for radioactiveeray conversion screens
JPS5447579A (en) * 1977-09-22 1979-04-14 Hitachi Ltd Develping condiction inspecting method in photoetching

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS52114483A (en) * 1976-03-18 1977-09-26 Agfa Gevaert Nv Improvement for radioactiveeray conversion screens
JPS5447579A (en) * 1977-09-22 1979-04-14 Hitachi Ltd Develping condiction inspecting method in photoetching

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62207904A (en) * 1986-03-07 1987-09-12 Mitsubishi Monsanto Chem Co Measuring instrument for light emission wavelength and area of wafer
US6187417B1 (en) 1998-02-18 2001-02-13 International Business Machines Corporation Substrate having high optical contrast and method of making same

Also Published As

Publication number Publication date
JPH0476042B2 (en) 1992-12-02

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