CN108696985A - A kind of printed circuit board preparation method improving the oily welding resistance loci of identification lid - Google Patents
A kind of printed circuit board preparation method improving the oily welding resistance loci of identification lid Download PDFInfo
- Publication number
- CN108696985A CN108696985A CN201810536695.3A CN201810536695A CN108696985A CN 108696985 A CN108696985 A CN 108696985A CN 201810536695 A CN201810536695 A CN 201810536695A CN 108696985 A CN108696985 A CN 108696985A
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- China
- Prior art keywords
- welding resistance
- resistance loci
- circuit board
- printed circuit
- loci
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
- H05K1/0269—Marks, test patterns or identification means for visual or optical inspection
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0008—Apparatus or processes for manufacturing printed circuits for aligning or positioning of tools relative to the circuit board
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/28—Applying non-metallic protective coatings
- H05K3/285—Permanent coating compositions
- H05K3/287—Photosensitive compositions
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
The invention discloses a kind of printed circuit board preparation methods improving the oily welding resistance loci of identification lid, and steps are as follows:Process portion before single-sided aluminum-base plate is carried out;Then copper is drawn in development etching around welding resistance loci, and welding resistance loci includes aligning ring and the middle circle PAD in the middle part of contraposition ring, aligns and equally draws copper between ring and middle circle PAD;Again welding resistance pre-treatment, by circuit surface ink thickness requirement coating/spraying;Continuous tunnel furnace is pre-baked;Plate is received to wait aligning;In the corresponding Position Design windowing circle of line film welding resistance loci on the welding resistance film, windowing diameter of a circle is smaller than the diameter of middle circle PAD;Identify that contraposition production, CCD exposure machines identify welding resistance film windowing circle and welding resistance loci simultaneously using CCD exposure machines.The advantage of the invention is that:Design 8mm*8mm draws copper region, draws that copper region is big than traditional 3mm*3mm, and 8mm*8mm draws the high low head of white oil on copper region and welding resistance loci middle circle and become apparent from, and contraposition ring outer diameter has slight false dew copper, strengthens the effect of CCD identifications.
Description
Technical field
The present invention relates to identified in a kind of printed circuit board manufacture technology field more particularly to printed circuit board manufacturing process
The technology of the oily welding resistance loci of lid.
Background technology
Solder mask is the coat of printed circuit board, can be played short caused by moisture, chemicals etc. between preventing conductor
The effects that road is become attached to and is resisted various adverse circumstances, ensures printed board function.Use liquid welding resistance oil in industry substantially at present
Ink, coating method tradition be silk-screen printing, with the production capacity of each producer be continuously increased and industry 4.0 development, welding resistance coating
Automation is imported, common is pressure reel roller coating and electrostatic/low pressure spray.The welding resistance loci of technique edges can be with edge sealing when silk-screen prints
Processing so that loci facilitates manual alignment or automatic aligning to concentrate on work at selected units without ink;But for being coated with and spraying in current industry
There is no effective scheme to carry out edge sealing to technique edges and reserves welding resistance loci, so entire plate face is ink after coating and spraying,
Welding resistance loci is also capped.Green oil itself has a transparency, and green oil covers loci without influence, can normally identify contraposition, but with
The importing of white oil coating/spraying, white oil, which covers welding resistance loci, can cause contraposition identification difficult, can not manual alignment circuit
PAD.Ameliorative way at present:1. as shown in Figure 1, replacing circuit PAD to align using hole 1, but it is coated with and sprays slight ink and enter hole,
Aperture changes, and it is poor using the contraposition of PIN nails and identifying hole aligning accuracy to cause;2. as shown in Fig. 2, the areas Tao Tong of circuit PAD
Domain 21 is 3mm*3mm, 22 diameter 1.5mm of middle circle PAD, and periphery 23 and middle circle 22 are copper sheets, and it is to be situated between that residue, which draws copper region 21,
Matter layer goes to grab circuit PAD using special light sources, and effect improved unobvious, therefore, the recognition methods that white oil covers loci are industry
Interior improved special project.
Invention content
For the present invention in order to solve in the prior art, white oil, which covers welding resistance loci, can cause contraposition identification difficult problem, carry
For a kind of printed circuit board preparation method improving the oily welding resistance loci of identification lid.
The invention is realized by the following technical scheme:
A kind of printed circuit board preparation method improving the oily welding resistance loci of identification lid, printed circuit board making step is such as
Under:
(1) single-sided aluminum-base plate is carried out pre-treatment, coating, baking sheet;
(2) the corresponding Position Design welding resistance loci in each angle of technique edges and fool proof in line film, by line film
Reach desired figure using development etching after contraposition, exposure, makes to draw copper around welding resistance loci, drawing copper area size is
8mm*8mm, welding resistance loci include aligning ring and the middle circle PAD in the middle part of contraposition ring, are aligned between ring and middle circle PAD
Equally draw copper;
(3) carry out AOI according to step again, printed circuit board makes welding resistance pre-treatment, be coated with by circuit surface ink thickness requirement/
Spraying;
(4) continuous tunnel furnace is pre-baked;
(5) plate is received to wait aligning;
(6) the welding resistance film designs:In the corresponding Position Design windowing circle of line film welding resistance loci, open a window diameter of a circle
It is smaller than the diameter of middle circle PAD;
(7) the identification contraposition production of CCD exposure machines, CCD exposure machines is used to identify film windowing circle and welding resistance loci simultaneously.
Further, the outer diameter of the contraposition ring is 2.5mm, and internal diameter is 1.9mm, middle circle PAD diameters 1.5mm.
Further, the windowing circular diameter of the welding resistance film is 1.0mm.
Further, the pre-baked temperature of the continuous tunnel furnace from temperature of the starting to outlet be 100 DEG C successively, 105 DEG C, 110
DEG C, 100 DEG C, conveying speed 3.5m/min.
Further, CCD exposure machines parameter setting:The a diameter of 2.5mm of welding resistance loci for grabbing printed circuit board, grabs welding resistance
The a diameter of 1.0mm of welding resistance loci of the film;Black-White/gray scale setting 80~100, brightness settings 10~20 make diameter 2.5mm
The edge of welding resistance loci shows clear rule circle, facilitates CCD judgement identifications.
It should be noted that middle circle PAD is pad, AOI is automatic optics inspection, is scanned to the line pattern after etching
The defects of comparing engineering data, scanning notch, open circuit, short circuit.
Advantageous effect of the present invention:Design 8mm*8mm draws copper region, big, equal amount of drawing copper region than traditional 3mm*3mm
White oil is covered in when drawing on copper region, and 8mm*8mm draws the white oil thickness ratio 3mm*3mm in copper region, and to draw copper region thin, so
8mm*8mm draws the high low head of white oil on copper region and welding resistance loci middle circle and becomes apparent from, and white oil thickness is different, reflective effect
Fruit is different, while equipped with contraposition ring, and outer diameter has slight false dew copper, strengthens the effect of CCD identifications.
Description of the drawings
Fig. 1 is the structural schematic diagram of location hole in the prior art;
Fig. 2 is circuit PAD aligning structures schematic diagram in the prior art;
Fig. 3 is circuit PAD aligning structure schematic diagrames of the present invention.
Specific embodiment
A kind of printed circuit board preparation method improving the oily welding resistance loci of identification lid, steps are as follows:
(1) single-sided aluminum-base plate is carried out pre-treatment, coating, baking sheet;
(2) the corresponding Position Design welding resistance loci in each angle of technique edges and fool proof in line film, according to every profession and trade
Different Cu thickness etching parameter carries out adequate compensation, will reach desired figure using development etching after line film contraposition, exposure
Shape, as shown in figure 3, making to draw copper around welding resistance loci, it is 8mm*8mm to draw 31 size of copper region, and the welding resistance loci includes
Ring 32 and the middle circle PAD 33 positioned at 32 middle part of contraposition ring are aligned, the outer diameter of the contraposition ring is 2.5mm, and internal diameter is
1.9mm, middle circle PAD diameters 1.5mm.Copper is equally drawn between contraposition ring and middle circle PAD;
(3) carry out AOI according to step again, printed circuit board makes welding resistance pre-treatment, be coated with by circuit surface ink thickness requirement/
Spraying;
(4) continuous tunnel furnace is pre-baked, pre-baked temperature from temperature of the starting to outlet be 100 DEG C successively, 105 DEG C, 110 DEG C, 100
DEG C, conveying speed 3.5m/min;So that circuit surface ink and base material ink is cured rapidly, reduces ink eminence toward lower stream, protect
It is poor to demonstrate,prove level of ink.
(5) plate is received to wait aligning;
(6) the welding resistance film designs:In the corresponding Position Design windowing circle of line film welding resistance loci, windowing circular diameter is
1.0mm;
(7) the identification contraposition production of CCD exposure machines, CCD exposure machines is used to identify film windowing circle and welding resistance loci simultaneously;
CCD exposure machine parameter settings:The welding resistance contraposition spot diameter for grabbing printed circuit board is (straight after printed circuit board etching
Diameter) it is 2.5mm, grab a diameter of 1.0mm of welding resistance loci of the welding resistance film;Black-White/gray scale setting 80~100, brightness settings
10~20 (white oil has reflective) make the edge of diameter 2.5mm welding resistance locis show clear rule circle, CCD are facilitated to sentence
Fixed identification.
The welding resistance film is located at the top of printed circuit board, and CCD aligns the welding resistance loci and printing electricity of the welding resistance film simultaneously
The welding resistance loci of road plate, it is different with the white oil thickness in middle circle because drawing copper region, white oil reflecting effect can be caused different, and
And the design of ring is aligned, outer diameter has slight false dew copper, increases the effect of CCD identification welding resistance locis.
The advantage of the invention is that:
1. white oil lid oil welding resistance aligns the recognizable contrapositions of PAD, aligning accuracy satisfaction ± 2mil;
2. using the recognizable contraposition of common CCD;
3. without increasing flow and cost.
The technical solution provided above inventive embodiments is described in detail, specific case pair used herein
The principle and embodiment of the embodiment of the present invention are expounded, and the explanation of above example is only applicable to help to understand this hair
The principle of bright embodiment;Meanwhile for those of ordinary skill in the art, embodiment according to the present invention, in specific implementation mode
And there will be changes in application range, in conclusion the content of the present specification should not be construed as the limitation to invention.
Claims (5)
1. a kind of printed circuit board preparation method improving the oily welding resistance loci of identification lid, it is characterised in that:Printed circuit board system
Steps are as follows for work:
(1) single-sided aluminum-base plate is carried out pre-treatment, coating, baking sheet;
(2) the corresponding Position Design welding resistance loci in each angle of technique edges and fool proof in line film, line film is aligned,
Reach desired figure using development etching after exposure, makes to draw copper around welding resistance loci, it is 8mm* to draw copper area size
8mm, welding resistance loci include aligning ring and the middle circle PAD in the middle part of contraposition ring, are aligned same between ring and middle circle PAD
Draw copper;
(3) AOI is carried out according to step, printed circuit board makes welding resistance pre-treatment, by circuit surface ink thickness requirement coating/spray again
It applies;
(4) continuous tunnel furnace is pre-baked;
(5) plate is received to wait aligning;
(6) the welding resistance film designs:In the corresponding Position Design windowing circle of line film welding resistance loci, the diameter of a circle ratio that opens a window
Between circle PAD diameter it is small;
(7) the identification contraposition production of CCD exposure machines, CCD exposure machines is used to identify film windowing circle and welding resistance loci simultaneously.
2. a kind of printed circuit board preparation method improving the oily welding resistance loci of identification lid according to claim 1, special
Sign is:The outer diameter of the contraposition ring is 2.5mm, and internal diameter is 1.9mm, middle circle PAD diameters 1.5mm.
3. a kind of printed circuit board preparation method improving the oily welding resistance loci of identification lid according to claim 2, special
Sign is:The windowing circular diameter of the welding resistance film is 1.0mm.
4. a kind of printed circuit board preparation method improving the oily welding resistance loci of identification lid according to claim 1, special
Sign is:Temperature of the pre-baked temperature of the continuous tunnel furnace from starting to outlet is 100 DEG C, 105 DEG C, 110 DEG C, 100 DEG C successively, defeated
Send speed 3.5m/min.
5. a kind of printed circuit board preparation method improving the oily welding resistance loci of identification lid according to claim 1, special
Sign is:CCD exposure machine parameter settings:The a diameter of 2.5mm of welding resistance loci for grabbing printed circuit board, grabs the welding resistance of the welding resistance film
The a diameter of 1.0mm of loci;Black-White/gray scale setting 80~100, brightness settings 10~20 make diameter 2.5mm welding resistance locis
Edge show clear rule circle, facilitate CCD judgement identifications.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810536695.3A CN108696985B (en) | 2018-05-30 | 2018-05-30 | Printed circuit board manufacturing method for improving oil resistance welding contraposition of recognition cover |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201810536695.3A CN108696985B (en) | 2018-05-30 | 2018-05-30 | Printed circuit board manufacturing method for improving oil resistance welding contraposition of recognition cover |
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| Publication Number | Publication Date |
|---|---|
| CN108696985A true CN108696985A (en) | 2018-10-23 |
| CN108696985B CN108696985B (en) | 2021-06-04 |
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|---|---|---|---|
| CN201810536695.3A Active CN108696985B (en) | 2018-05-30 | 2018-05-30 | Printed circuit board manufacturing method for improving oil resistance welding contraposition of recognition cover |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109862693A (en) * | 2019-02-01 | 2019-06-07 | 奥士康精密电路（惠州）有限公司 | A kind of annular pad and its management-control method |
| CN110099507A (en) * | 2019-05-29 | 2019-08-06 | 广东依顿电子科技股份有限公司 | Thick copper circuit board and its manufacturing method |
| CN112867281A (en) * | 2021-01-04 | 2021-05-28 | 深圳市景旺电子股份有限公司 | Flexible circuit board and manufacturing method thereof |
| CN114245575A (en) * | 2021-11-16 | 2022-03-25 | 龙南骏亚电子科技有限公司 | Design method of PCB resistance welding zigzag circuit board |
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| JPS608705A (en) * | 1983-06-29 | 1985-01-17 | Hitachi Ltd | Pattern detector |
| US20050022379A1 (en) * | 2001-06-25 | 2005-02-03 | Rumsey Brad D. | Method of making a semiconductor device having an opening in a solder mask |
| CN1980522A (en) * | 2005-11-29 | 2007-06-13 | 比亚迪股份有限公司 | Optical identifying welding plate for printed circuit board and mfg. method |
| CN103025064A (en) * | 2012-12-05 | 2013-04-03 | 深圳市兴达线路板有限公司 | Circuit board contraposition method |
| CN105307412A (en) * | 2015-10-23 | 2016-02-03 | 深圳市强达电路有限公司 | Thick copper foil PCB printing processing method |
| KR20160070592A (en) * | 2014-12-10 | 2016-06-20 | 삼성전기주식회사 | Method for recognizing of alignment mark and board having alignment mark |
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Patent Citations (6)
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| JPS608705A (en) * | 1983-06-29 | 1985-01-17 | Hitachi Ltd | Pattern detector |
| US20050022379A1 (en) * | 2001-06-25 | 2005-02-03 | Rumsey Brad D. | Method of making a semiconductor device having an opening in a solder mask |
| CN1980522A (en) * | 2005-11-29 | 2007-06-13 | 比亚迪股份有限公司 | Optical identifying welding plate for printed circuit board and mfg. method |
| CN103025064A (en) * | 2012-12-05 | 2013-04-03 | 深圳市兴达线路板有限公司 | Circuit board contraposition method |
| KR20160070592A (en) * | 2014-12-10 | 2016-06-20 | 삼성전기주식회사 | Method for recognizing of alignment mark and board having alignment mark |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109862693A (en) * | 2019-02-01 | 2019-06-07 | 奥士康精密电路（惠州）有限公司 | A kind of annular pad and its management-control method |
| CN110099507A (en) * | 2019-05-29 | 2019-08-06 | 广东依顿电子科技股份有限公司 | Thick copper circuit board and its manufacturing method |
| CN112867281A (en) * | 2021-01-04 | 2021-05-28 | 深圳市景旺电子股份有限公司 | Flexible circuit board and manufacturing method thereof |
| CN114245575A (en) * | 2021-11-16 | 2022-03-25 | 龙南骏亚电子科技有限公司 | Design method of PCB resistance welding zigzag circuit board |
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| Publication number | Publication date |
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| CN108696985B (en) | 2021-06-04 |
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