JP2010232540A - Mounting state inspection method for electronic component, mounting state inspection device, and substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a mounting state inspection method for an electronic component, the method inspecting the mounting state of an electronic component by specifying the mounting position of the electronic component even when it is difficult to recognize the mounting position of the electronic component through conventional pattern matching; and to provide a mounting state inspection device and a substrate. <P>SOLUTION: The mounting state inspection method for the electronic component 2 mounted on the substrate 1 includes: giving an identification mark Mr by coloring to the electronic component 2 to be mounted or having been mounted on the substrate 1; imaging a mounting surface 1a of the substrate 1; recognizing the position of the identification mark Mr given to the electronic component 2 by the color based upon the picked-up image; specifying the recognized position of the identification mark Mr as the mounting position of the electronic component 2; and determining that the mounting state of the electronic component 2 is defective when the distance between the specified mounting position of the electronic component 2 and another object position of comparison exceeds a preset criterion threshold. <P>COPYRIGHT: (C)2011,JPO&INPIT

Description

  The present invention relates to an electronic component mounting state inspection method, a mounting state inspection device, and a substrate.

  A method for inspecting the mounting state of electronic components mounted on a board includes an appearance inspection method that determines whether or not the mounting state is defective based on the appearance of the mounting surface of the board. In order to perform the mounting state of the electronic component, the mounting surface of the board is imaged by a camera (imaging means) provided above, and the captured image is subjected to image processing to determine whether the mounting state is defective. An inspection device is used.

  In such a conventional electronic component mounting state inspection apparatus, image data obtained by capturing an electronic component alone and mounting position data when the electronic component is in a good mounting state are stored in advance in a memory (storage unit). The electronic image to be inspected by comparing the image obtained by imaging the electronic component to be inspected and the stored image data by using pattern matching (for example, a method of calculating the degree of coincidence by comparing both images in units of pixels). The mounting position of the component is specified, and it is determined whether or not the mounting state of the component to be inspected is defective based on the specified mounting position and the stored non-defective mounting position data (for example, see Patent Document 1). .

Japanese Patent Laid-Open No. 2002-42112

  By the way, the electronic components mounted on the board include (1) those that have been mounted with a transparent coating agent such as transparent resin to improve the environmental resistance, and (2) electronic component leads, etc. Discrete parts that are fixed in a state where the electronic parts stand up by inserting the mounting legs into the lands of the board and soldering on the back side, or (3) Place and heat the electronic parts on the board coated with paste-like solder There is a surface mount component that is fixed by melting solder.

  In the conventional electronic component mounting state inspection apparatus using the above pattern matching, the positional deviation is limited to the plane direction of the mounting surface of the substrate, and the change in the shape of the electronic component viewed from the camera is extremely small (3) It is effective for inspection of surface mount parts.

  However, in the electronic parts coated with the transparent coating agent described in (1) above, it is easy to apply force to the parts in the coating process, and the electronic parts viewed from the camera due to light reflection, refraction and gloss change due to the transparent coating agent. The apparent shape of the component changes greatly, and in the discrete component of (2) above, the shape of the electronic component seen from the camera changes greatly when the component is tilted. The above-mentioned degree of coincidence in the case is significantly reduced, so that the conventional electronic component mounting state inspection apparatus using pattern matching cannot recognize the electronic component.

  The present invention has been made paying attention to such a problem, and even if it is difficult to recognize the mounting position of an electronic component using conventional pattern matching, the mounting position can be specified, It is an object of the present invention to provide an electronic component mounting state inspection method, a mounting state inspection device, and a substrate capable of inspecting the electronic component mounting state.

  In order to achieve this object, the present invention takes the following measures.

  That is, the electronic component mounting state inspection method of the present invention is an inspection method for inspecting the mounting state of an electronic component mounted on a substrate, and is based on an imaging step of imaging the mounting surface of the substrate and the captured image. If the distance between the position specifying step for specifying the mounting position of the electronic component and the distance between the mounting position of the specified electronic component and another comparison target position exceeds a preset determination reference threshold value, A determination step of determining that the mounting state is defective, and further comprising a mark adding step of attaching an identification mark by coloring the electronic component before or after being mounted on the substrate, In the position specifying step, the position of the identification mark attached to the electronic component is recognized by color, and the recognized position of the identification mark is specified as the mounting position of the electronic component.

  According to such a structure, the mounting position of an electronic component can be specified by using the identification mark attached by coloring. In particular, the mounting position of an electronic component can be recognized using conventional pattern matching, such as the mounting component being tilted to change the apparent shape, or the mounting position is difficult to recognize due to the gloss of the transparent resin applied to the electronic component. Even when it is difficult, it is effective that the mounting position of the electronic component can be specified by performing effective coloring.

  In order to detect a mounting failure due to a positional deviation from a reference position where the electronic component is to be mounted, the comparison target position is set in advance with respect to the mounting position of the electronic component specified by the position specifying step. The mounting position of the electronic component in a good mounting state, and the determination step is based on a positional deviation threshold in which a distance between the mounting position of the identified electronic component and the comparison target position is a predetermined determination reference threshold value. In the case where the electronic component is larger, it is desirable to include a positional deviation determination step for determining that the electronic component has a mounting defect due to positional deviation.

  In order to detect a mounting failure due to an interval between adjacent electronic components, the comparison target position is relative to the mounting position of one electronic component among the mounting positions of the plurality of electronic components specified by the position specifying step. Mounting position of an electronic component adjacent to the electronic component, and the determination step is performed when both distances between the mounting positions of both electronic components are smaller or larger than an interval threshold value which is a predetermined determination reference threshold value. It is desirable to include an interval determination step for determining that the electronic component has a mounting failure due to the interval.

  In the conventional pattern matching, it is difficult to specify the mounting position of the electronic component. In order to determine the mounting state of the electronic component mounted in an upright state via mounting legs such as leads, the mark adding step includes the substrate It is effective to attach the identification mark to the end of the electronic component on the side opposite to the board before or after being mounted on the board.

  In order to apply the inspection method of the present invention to various electronic components by flexibly changing the determination criteria of the defective determination of the mounting state of the electronic component, in association with the determination step or the determination step, It is preferable to further include a determination criterion changing step for changing the determination criterion threshold.

  In order to identify the electronic component to be dealt with and smoothly proceed to the next step, the electronic device further includes a display step for displaying the position of the electronic component when it is determined that there is a mounting defect in the determination step. preferable.

  In order to effectively carry out the above-described electronic component mounting state inspection method, it is preferable to use an electronic component mounting state inspection apparatus by visual inspection described below.

  That is, the electronic component mounting state inspection apparatus according to the present invention is an inspection device for inspecting the mounting state of an electronic component mounted on a substrate, and an identification mark is attached to the electronic component mounted on the substrate by coloring. A mark adding means for imaging, an imaging means for imaging the mounting surface of the substrate, and a position of the identification mark attached to the electronic component based on the captured image, by color, and the position of the recognized identification mark When the distance between the specified electronic component mounting position and the other comparison target position exceeds a predetermined determination reference threshold, the electronic component is determined to be the mounting position of the electronic component. And a determination unit that determines that the mounting state is defective.

  According to such a configuration, the mounting position of the electronic component can be efficiently and appropriately specified through the imaging unit, the position specifying unit, and the determining unit using the identification mark colored by the mark adding unit. In particular, the mounting position of an electronic component can be recognized using conventional pattern matching, such as the mounting component being tilted to change the apparent shape, or the mounting position is difficult to recognize due to the gloss of the transparent resin applied to the electronic component. Even if it is difficult, it is possible to specify the mounting position of the electronic component by performing effective coloring.

  In addition, whether or not to automatically add an identification mark, in order to accurately determine a mounting failure that leads to a determination omission, the electronic component mounting state inspection apparatus according to the present invention is mounted on a board. An inspection apparatus for inspecting a mounted state of the electronic component, wherein an imaging means for imaging the mounting surface of the substrate and a position of an identification mark attached to the electronic component by coloring based on the captured image The distance between the position identifying means that recognizes by color and identifies that the position of the recognized identification mark is the mounting position of the electronic component and the mounting position of the identified electronic component and another comparison target position is set in advance. And a determination unit that determines that the mounting state of the electronic component is defective when the determination reference threshold is exceeded. The determination unit specifies the comparison target position by the position specifying unit. Electronic components A mounting position in a favorable mounting state of the electronic component set in advance with respect to the mounting position, and a distance between the mounting position of the identified electronic component and the comparison target position is a predetermined criterion threshold A positional deviation determination unit that determines that the electronic component has a mounting defect due to a positional deviation when the electronic component is larger than a certain positional deviation threshold; and a plurality of electronic components that are identified by the position identification unit as the comparison target position Among the positions, with respect to the mounting position of one electronic component, the mounting position of the electronic component adjacent to the electronic component is set, and the distance between the mounting positions of both electronic components is larger than the interval threshold value which is a predetermined criterion threshold A configuration including an interval determination unit that determines that there is a mounting failure due to an interval between the two electronic components when the size is small or large is given.

  Furthermore, in order to apply the inspection method of the present invention to various electronic components by flexibly changing the determination criteria of the electronic component mounting state failure determination, the electronic component mounting state inspection device includes the above-described determination. It is preferable to further include a determination reference changing means for changing the reference threshold.

  In order to reliably specify the mounting position of the electronic component, it is effective that the substrate is provided with a position identification mark by coloring on the top of the mounted electronic component.

  In the conventional pattern matching, it was difficult to specify the mounting position of the electronic component. In the case of a substrate in which the electronic component is mounted upright on the substrate via mounting legs such as leads, it is placed on the top of the mounted electronic component. It is effective that a position identification mark is attached by coloring.

  In conventional pattern matching, it was difficult to specify the mounting position of the electronic component due to the gloss of the transparent coating applied to the electronic component. It is effective that a mark for position identification is attached to the top of the electronic component by coloring.

  Since the present invention has the configuration described above, the mounting position can be specified and the mounting state of the electronic component can be inspected even when it is difficult to recognize the mounting position of the electronic component by conventional pattern matching.

The front view and side view which show the electronic component mounted in the board | substrate which concerns on one Embodiment of this invention. The flowchart which shows the setting process which is a part of the mounting state inspection method of an electronic component. The flowchart which shows the test | inspection process which is a part of the mounting state test | inspection method of an electronic component. FIG. 2 is an explanatory diagram regarding an image obtained by capturing the electronic component shown in FIG. 1 and an algorithm for determining a mounting state based on the image. The schematic block diagram showing the mounting state inspection apparatus of the electronic component which test | inspects the mounting state of the electronic component shown in FIG. The functional block diagram which shows the mounting state inspection apparatus shown in FIG. The flowchart which shows the setting process routine performed with the control means of the mounting state inspection apparatus shown in FIG. 6 is a flowchart showing an inspection processing routine executed by control means of the mounting state inspection apparatus shown in FIG. 6 is a flowchart showing an inspection processing routine executed by control means of the mounting state inspection apparatus shown in FIG. The functional block diagram which shows the mounting state inspection apparatus of the electronic component which concerns on another embodiment of this invention.

  Hereinafter, the board | substrate 1 with which the electronic component 2 which concerns on one Embodiment of this invention was mounted is demonstrated.

  As shown in the front view of FIG. 1, the substrate 1 has a plurality of electronic components 2 mounted on its mounting surface 1a. The electronic component 2 has a horizontal axial component in which leads 2b are provided on both sides of the component body 2a. One lead 2b is bent so that the tip of the lead 2b faces the mounting surface 1a together with the other lead 2b. It is a vertical radial part. The electronic component 2 is fixed (mounted) to the substrate 1 by soldering from the back surface by inserting leads 2b into lands (holes) (not shown) provided on the substrate 1. As described above, the electronic component 2 is mounted on the board 1 in an upright state via the two leads 2b serving as mounting legs and terminals in order to reduce the occupied mounting area. The electronic component 2 is a discrete component such as a resistor.

  A chromatic color paint Cc such as red is applied to the end 2c (top 2c) of the electronic component 2 on the side opposite to the substrate using a paint coloring means Br such as a brush, brush, marker pen, or roller. The mark Mr is attached. The identification mark Mr is a mark that can be identified, and specifically, a hue different from the hue of the substrate 1 and the electronic component 2, that is, different from the color of the substrate 1 and the electronic component 2. Coloring effective for identification is performed by using the color paint Cc. In this sense, the identification mark Mr is different from the color code or the like that is given to the resistor and indicates the resistance value, and the “color” does not represent the function of the electronic component 2. Therefore, in this embodiment, even if the same color is given to all the electronic components 2 mounted on the substrate 1, the intended purpose can be achieved.

  In this way, by attaching the identification mark Mr to the end 2c (top 2c) of the electronic component 2 on the side opposite to the board, as shown in the side view of FIG. Based on the distance (hereinafter also referred to as a positional deviation Dz) of the electronic component 2 to be inspected to the inspection target mounting position Pobj, it is determined whether or not there is a mounting defect due to the positional deviation in the electronic component 2 to be inspected. Both electronic components 2 based on the distance (hereinafter also referred to as component interval Db) between the inspection target mounting position Pobj of the electronic component 2 to be inspected and the adjacent mounting position P1 of the adjacent electronic component 2. It is possible to determine whether or not there is a mounting failure due to the interval.

  The part to which the identification mark Mr is attached is the end 2c (top 2c) of the electronic component 2 on the side opposite to the substrate, even after the electronic component 2 is mounted on the substrate 1 easily. In the electronic component 2 mounted on the substrate 1 in a standing state, the electronic component 2 is inclined (falls) in a direction intersecting with a line connecting the two leads 2b. This is because the deviation from the mounting position Pok becomes large, and it becomes possible to detect the inclination of the electronic component 2 that is difficult to detect from the upper camera (imaging means).

  Note that the timing of attaching the identification mark Mr may be before the electronic component 2 is mounted on the substrate 1 or after the electronic component 2 is mounted on the substrate 1. In addition, when an electronic component mounted on a substrate is coated with a transparent coating material such as a transparent resin, the identification mark Mr is similarly applied, but after the coating with the transparent coating material, the identification mark Mr is applied. Alternatively, an identification mark Mr may be attached before coating with the transparent coating agent.

  Next, an electronic component mounting state inspection method for inspecting the mounting state of the electronic component 2 mounted on the substrate 1 according to an embodiment of the present invention will be described with reference to FIGS. This electronic component mounting state inspection method is carried out mainly by an inspection operator, and a part of the process is automatically performed using the electronic component mounting state inspection apparatus 10 shown in FIG. There is a setting process and an inspection process. The electronic component mounting state inspection apparatus 10 shown in FIG. 5 will be described later.

  The setting step is a step of setting the determination criterion for the mounting state inspection apparatus 10 shown in FIG. 5 when determining the mounting state of the electronic component 2 to be inspected. Specifically, as shown in FIG. 2, first, the paint Cc is manually applied to the electronic component 2 mounted in a good mounting state on the substrate 1 using the paint coloring means Br shown in FIG. It is colored and an identification mark Mr is added (A1). Next, the board | substrate 1 is mounted (set) in the fixed location of the mounting base 15 of the mounting state inspection apparatus 10 (A2). Next, a setting processing routine shown in FIG. 7 to be described later is executed by the mounting state inspection apparatus 10, and a determination criterion is set in the mounting state inspection apparatus 10 via the operation unit 16 (A3).

  The inspection step is a step of determining whether or not the mounting state of the electronic component to be inspected is defective using the determination criteria set for the mounting state inspection apparatus 10 in the above setting step. Specifically, as shown in FIG. 3, first, the inspection operator colors the paint Cc using the paint coloring means Br and adds an identification mark Mr to the electronic component 2 to be inspected (B1: mark). Additional process). Next, the board | substrate 1 is mounted (set) on the mounting base 15 of the mounting state inspection apparatus 10 (B2). Next, an inspection processing routine, which will be described later, is executed by the mounting state inspection apparatus 10, and the determination result displayed on the display means 13 is confirmed (B3). As described above, the identification mark Mr is manually colored (added) to the electronic component 2 in both the setting process and the inspection process, but the paint 2 is applied to the end 2c (top 2c) of the electronic component 2 on the side opposite to the substrate. Since the identification mark Mr is attached by attaching Cc, the influence on the recognition of the identification mark Mr can be extremely reduced even if it is performed manually.

  Next, an algorithm used for specifying the mounting position of the electronic component 2 and determining the mounting state of the electronic component 2 based on an image obtained by capturing the electronic component 2 will be described with reference to FIG. The captured image shown in FIG. 4 is an image obtained by capturing the mounting surface 1a of the substrate 1 from above, and shows the component main body 2a, the lead 2b, and the identification mark Mr of the electronic component 2. The mounting position of the electronic component 2 is identified by creating a binarized image in which only the pixels where the identification mark Mr is present among all the pixels in this captured image are 1 and the other pixels are 0, thereby identifying the identification mark. The position of Mr is specified, the center of gravity position Mo of the specified identification mark Mr is calculated, and the center of gravity position Mo is specified as the mounting position of the electronic component 2. In the setting step, the specified mounting position is stored in the storage unit 18 (memory) as the good mounting position Pok, and information related to adjacent components is also set and stored.

  The mounting state of the electronic component 2 is determined by specifying the mounting position described above, and the distance (position shift Dz) between the specified mounting position Pobj and the good mounting position Pok stored in the setting process is a predetermined distance (position shift threshold). If it is greater than Dz0), it is determined that there is a mounting failure due to a positional shift. Further, in the inspection process, if the interval (component interval Db) between the specified mounting position Pobj and the similarly specified adjacent component mounting position P1 is smaller than a predetermined distance (interval threshold value Db0), the mounting failure due to the interval. It is determined that there is.

  Next, an electronic component mounting state inspection apparatus 10 according to an embodiment of the present invention will be described with reference to FIGS. The electronic component mounting state inspection apparatus 10 is mounted on a mounting surface 15 on which a substrate 1 on which an electronic component 2 (not shown in FIG. 5) is mounted is mounted on a mounting surface 1a. The lighting 14 for illuminating the board 1, the imaging means 12 such as a camera that images the mounting surface 1 a of the board 1 provided above the mounting table 15, and the image data captured by the imaging means 12 are input to mount the electronic component. A control means 11 comprising a CPU, a memory, etc. (not shown) for determining whether or not the state is defective, an operation section 16 for inputting an operation to the control means 11, and an external connection electrically connected to the control means 11. And display means 13 for outputting various information (an image display unit 13a such as a display and a print output unit 13b such as a printer).

  As shown in FIG. 6, the control unit 11 includes a position specifying unit 17, a storage unit 18, a determination unit 19, a determination reference change unit 22, and a display control unit 23.

  The position specifying unit 17 specifies the mounting position Pobj of the electronic component 2 based on the captured image shown in FIG. 4 captured by the imaging unit 12, and extracts pixels of a predetermined color from the captured image, and extracts the extracted pixels. To specify the mounting position Pobj.

  The storage unit 18 determines data regarding a good mounting position Pok that is a mounting position in a good mounting state, and a determination reference threshold value that is a determination criterion as to whether or not there is a mounting failure (whether there is a mounting failure due to a positional deviation Dz). Position gap threshold value Dz0 used in the case, interval threshold value Db0 used when determining whether there is a mounting failure due to the component interval Db), processing window Win that is a search range of the electronic component 2 to be inspected, etc. The other determination conditions are stored. These are set through the operation unit 16 in the setting process mainly performed by the inspection worker and stored in the storage unit 18.

  The determination means 19 shown in FIG. 6 includes a position deviation determination means 20 and an interval determination means 21, a mounting position Pobj of the electronic component 2 to be inspected specified by the position specification means 17, and a storage means 18. Whether or not there is a mounting defect in the electronic component 2 to be inspected is determined on the basis of the position deviation Dz and the stored data regarding the component interval Db. Specifically, the positional deviation determination means 20 is based on the mounting position Pobj identified by the position identification means 17, the data regarding the good mounting position Pok in the good mounting state stored in the storage means 18, and the positional deviation threshold Dz <b> 0. Thus, it is determined whether or not there is a mounting defect due to a positional shift. The interval determination unit 21 determines the presence or absence of a mounting defect due to the interval based on the mounting position Pobj of each electronic component 2 specified by the position specifying unit 17 and the interval threshold value Db0 stored in the storage unit 18.

  The display control unit 23 causes the display unit 13 to display the determination result of the determination unit 19. For example, when it is determined that there is no mounting defect, the display control unit 23 displays that fact on the image display unit 13a, and when it is determined that there is a mounting defect due to misalignment, there is a mounting defect. The position of the single electronic component 2 is displayed on the image display unit 13a, and when it is determined that there is a mounting failure due to the interval, the positions of the plurality of electronic components 2 having the mounting failure are displayed in association with each other. Thus, the display mode of the position of the electronic component 2 with poor mounting is changed according to the cause of the mounting failure so that the next process can be smoothly advanced.

  The determination criterion changing unit 22 increases or decreases the determination criterion thresholds such as the positional deviation threshold Dz0 and the interval threshold Db0 used by the determination unit 19 based on the interval between the mounting positions in the good mounting state stored in the storage unit 18. And the determination reference threshold value is changed. It is preferable to appropriately set the determination reference threshold values such as the positional deviation threshold value Dz0 and the interval threshold value Db0 individually according to the interval between the electronic components 2. However, since this setting requires a lot of time, it is necessary for all the components. Even if it is set uniformly, the determination reference threshold value is changed by the determination reference changing means 22 using a correction value at a predetermined stage according to the interval between adjacent parts. The

  Next, the operation of the mounting state inspection apparatus 10 will be described. When the setting start operation is performed by the operation unit 16, the mounting state inspection apparatus 10 executes the setting processing routine illustrated in FIG. 7 by the CPU of the control unit 11.

  When the setting processing routine is executed, first, the control unit 11 images the mounting surface 1a of the substrate 1 placed on the mounting table 15 with the imaging unit 12 (C1). Next, the pixel data of the captured image is converted into an HLS component (C2). The HSL component is obtained by digitizing color information including three components of hue, saturation, and luminance. When the numerical value difference of hue is used, the process for identifying the identification mark Mr by paint coloring according to the present invention is performed. It is used because it is easy to simplify. Next, based on the HSL component, the binarization processing of the image is performed with the pixel having the hue value of the identification mark Mr and the hue value in a predetermined range as 1 and the other pixels as 0 (C3). Next, a labeling process is performed to classify each pixel block that is 1 into a plurality of groups and specify a plurality of electronic components (C4). Next, the center-of-gravity position Mo is specified for each grouped (labeled) group (that is, for each electronic component 2) (C5). Next, the setting data setting is accepted for each electronic component 2 via the operation unit 16 (C6). The setting data includes the part name, the specified center of gravity position, the processing window Win, the positional deviation threshold value Dz0, the adjacent part name, the interval threshold value Db0, and the like.

  Further, when an inspection start operation is performed by the operation unit 16, the mounting state inspection apparatus 10 executes the inspection processing routine shown in FIGS. 8 to 9 by the CPU of the control unit 11.

  When the inspection processing routine is executed, the control unit 11 first images the mounting surface 1a of the substrate 1 placed on the mounting table 15 with the imaging unit 12 (D1). Next, the pixel data of the captured image is converted into an HLS component (D2). Next, based on the HSL component, the binarization processing of the image is performed with the pixel having the hue value of the identification mark Mr and the hue value in a predetermined range as 1 and the other pixels as 0 (D3).

  Next, the setting data of the electronic component 2 stored in the storage unit 18 is read, and the processing of D5 to D7 is repeated for every setting data of all components (D4). That is, first, the center-of-gravity position Mo of the binarized 1 pixel located in the processing window Win is specified and stored (D5). When there is no pixel that is 1 in the processing window Win, it is determined that the mounting is defective due to a positional shift. Next, it is changed to a positional deviation threshold value Dz0 corresponding to the interval between adjacent parts of the setting data (D6). Next, the center of gravity position (good mounting position Pok: comparison target position) in a good mounting state of the setting data is compared with the center of gravity position Mo (inspection target mounting position Pobj) specified in the process of D5. When the distance (positional deviation Dz) is larger than the positional deviation threshold Dz0, it is determined that there is a mounting defect due to positional deviation (D7). Next, it is determined whether or not the determination based on the setting data of all the parts has been performed (D8). When it is determined that the determination has not been performed (D8: NO), the process returns to the execution of the process of D4.

  On the other hand, in the process of D8, when it is determined that the determination based on the setting data of all the parts is performed (D8: YES), the setting data of the electronic parts stored in the storage unit 18 is read again, and FIG. As shown in FIG. 4, the processing of D10 to D12 is repeated for every setting data of all parts (D9). That is, first, using the center-of-gravity position Mo stored in the process of D5, the center-of-gravity position (inspection target mounting position Pobj) of the electronic component 2 corresponding to the setting data and the adjacent mounting position P1 of the part adjacent to the part (comparison target) Position) and the distance (part interval Db) between the positions of both center of gravity are specified (D10). Next, the interval is changed to the interval threshold value Db0 corresponding to the interval between adjacent parts of the setting data (D11). Next, when the distance (part interval Db) between the center of gravity positions specified in D10 is smaller than the interval threshold value Db0, it is determined that there is a mounting defect due to the interval (D12). Next, it is determined whether or not the determination based on the setting data of all the parts has been performed (D13). If it is determined that the determination has not been performed (D13: NO), the process returns to the execution of D9.

  On the other hand, in the process of D13, when it is determined that the determination based on the setting data of all the parts is performed (D13: YES), it is determined whether or not the electronic component 2 determined to be defective is present (D14). ). When it is determined that there is an electronic component 2 determined as a mounting failure (D14: YES), the display unit 13 displays the position of the electronic component 2 determined as a mounting failure (D15). On the other hand, when it is determined that there is no electronic component 2 determined as a mounting failure (D14: NO), the display means 13 displays that there is no electronic component 2 determined as a mounting failure (D16).

  As described above, the mounting state inspection method for the electronic component according to the present embodiment is an inspection method for inspecting the mounting state of the electronic component 2 mounted on the substrate 1, and is an imaging method for imaging the mounting surface 1 a of the substrate 1. Based on the process (step D1), the mounting position of the electronic component 2 (inspection target mounting position Pobj) based on the captured image, and the specified mounting position of the electronic component 2 A determination reference threshold (position deviation threshold Dz0, interval) set in advance by a distance (position deviation Dz, component interval Db) between (inspection target installation position Pobj) and another comparison target position (good implementation position Pok, adjacent installation position P1). And a determination step (steps D7, D10, D12) for determining that the mounting state of the electronic component 2 is defective when the threshold value Db0) is exceeded, and before or after being mounted on the substrate 1. In addition, the electronic component 2 is further provided with a mark adding step (step B1) for attaching the identification mark Mr by coloring, and the position specifying step determines the position of the identification mark Mr attached to the electronic component 2 by color. Recognizing and identifying the position of the recognized identification mark Mr as the mounting position of the electronic component 2.

  According to such a configuration, the mounting position (inspection target mounting position Pobj) of the electronic component 2 can be specified by using the identification mark Mr attached by coloring. In particular, even when it is difficult to recognize the mounting position of the electronic component 2 using conventional pattern matching, for example, it is difficult to recognize the mounting position due to the gloss of the transparent resin applied to the electronic component 2. It is effective that the mounting position of the electronic component 2 can be specified by applying.

  The comparison target position is a mounting position (good mounting position) in a good mounting state of the electronic component 2 set in advance with respect to the mounting position (inspection target mounting position Pobj) of the electronic component 2 specified by the position specifying process. Pok), and in the determination step, the distance (position deviation Dz) between the mounting position (inspection target mounting position Pobj) of the identified electronic component 2 and the comparison target position (good mounting position Pok) is a predetermined determination criterion. If the positional deviation determination step (step D7) for determining that the electronic component 2 has a mounting defect due to positional deviation is included when the positional deviation threshold value Dz0, which is a threshold value, is larger, a reference for mounting the electronic component 2 It is possible to detect a mounting failure due to a positional deviation from the position (good mounting position Pok).

  The comparison target position is adjacent to the electronic component 2 with respect to the mounting position (inspection target mounting position Pobj) of one electronic component 2 among the mounting positions of the plurality of electronic components 2 specified by the position specifying step. The mounting position of the electronic component 2 (adjacent mounting position P1), and in the determination step, the distance between the mounting positions of both the electronic components 2 (component interval Db) is smaller than the interval threshold value Db0 that is a predetermined determination reference threshold value or In the case where it is larger, if an interval determination step (steps 10 and 12) for determining that there is a mounting failure due to the interval between both electronic components 2 is included, it is possible to detect a mounting failure due to the interval between adjacent electronic components.

  In particular, in the electronic component 2 mounted in an upright state via the lead 2b, the electronic component 2 is liable to be displaced due to the inclination of the lead 2b, the interval between the electronic components 2 is easily changed, and the imaging unit 12 is changed. Since the apparent shape as viewed from the front is greatly changed, it is difficult to specify the mounting position of the electronic component 2 by the conventional pattern matching. However, the mark adding step (step B1) is performed before or after the mounting on the substrate 1. Since the identification mark Mr is attached to the non-board-side end 2c of the electronic component 2 after being applied, the mounting position of the electronic component 2 mounted in a standing state can be specified via the lead 2b, and the mounting state is determined. be able to.

  Furthermore, when the determination step further includes a determination reference change step (steps D6 and D11) for changing the determination reference threshold (position shift threshold Dz0, interval threshold Db0) in association with the determination step, the mounting state of the electronic component 2 The inspection method of the present invention can be applied to various electronic parts by flexibly changing the determination criteria of the defect determination.

  Furthermore, when it is determined that there is a mounting defect in the determination step, the electronic component 2 to be dealt with can be specified by further providing a display step (step D15) for displaying the position of the electronic component 2, and the next step can be smoothly performed. Can proceed.

  The electronic component mounting state inspection apparatus 10 according to the present embodiment is an inspection apparatus that inspects the mounting state of the electronic component 2 mounted on the substrate 1, and includes an imaging unit 12 that images the mounting surface 1 a of the substrate 1, Based on the captured image, the position of the identification mark Mr colored by coloring on the electronic component 2 is recognized by color, and the position of the recognized identification mark Mr is the mounting position of the electronic component 2 (inspection target mounting position Pobj). And the distance (positional deviation) between the specified electronic component 2 mounting position (inspection target mounting position Pobj) and another comparison target position (good mounting position Pok, adjacent mounting position P1). Dz, component interval Db) includes a determination unit 19 that determines that the mounting state of the electronic component 2 is defective when a predetermined determination reference threshold value (position shift threshold value Dz0, interval threshold value Db0) is exceeded. Thus, the determination unit 19 sets the comparison target position in a good mounting state of the electronic component 2 set in advance with respect to the mounting position of the electronic component specified by the position specifying unit 17 (inspection target mounting position Pobj). The mounting position (good mounting position Pok) of the specified electronic component mounting position (inspection target mounting position Pobj) and the comparison target position (good mounting position Pok) (position deviation Dz) is determined in advance. When the position deviation threshold value Dz0, which is the reference threshold value, is larger than the position deviation threshold value Dz0, a plurality of position deviation determination means 20 for determining that the electronic component 2 has a mounting defect due to position deviation and a position to be compared are specified by the position specification means 17. Of the mounting positions of the electronic component 2, the mounting position of the electronic component 2 adjacent to the electronic component 2 (adjacent mounting position) with respect to the mounting position of one electronic component 2 (inspection mounting position Pobj). P1), and when the distance between the mounting positions of both electronic components (component interval Db) is smaller or larger than the interval threshold value Db0 which is a predetermined determination reference threshold value, it is determined that both electronic components have a mounting defect due to the interval. Therefore, by configuring the determination unit 19 from the positional deviation determination unit 20 and the interval determination unit 21, for example, an electronic component that is mounted at a good mounting position and that is adjacent to the electronic component Electronic components with only one of both judgment means, such as when the gap is in contact, or when the gap between adjacent electronic components is secured but not mounted in a good mounting position If it is determined whether or not is a mounting failure, it is possible to accurately determine a mounting failure that leads to a determination failure.

  In addition, the electronic component mounting state inspection apparatus 10 further includes the determination reference changing means 22 that changes the determination reference threshold (position shift threshold Dz0, interval threshold Db0), and thus the determination reference for the defective determination of the mounting state of the electronic component 2. The inspection method of the present invention can be applied to various electronic components 2 by flexibly changing.

  Since the substrate 1 according to this embodiment is provided with the position identification mark Mr by coloring on the top portion 2c of the mounted electronic component 2, the mounting position of the electronic component 2 can be reliably specified.

  In particular, in the case of the substrate 1 on which the electronic component 2 is mounted in a standing state via the leads 2b, the electronic components 2 are likely to be displaced due to the inclination of the leads 2b, and the interval between the electronic components 2 is also likely to change. In addition, since the shape viewed from the imaging means 12 changes greatly, it is difficult to specify the mounting position of the electronic component 2 by the conventional pattern matching. However, the position identification mark is colored by coloring the top portion 2c of the mounted electronic component 2. Since Mr is attached, the mounting position of the electronic component 2 can be specified, and the mounting state can be determined.

  Further, in the case of the substrate 1 on which the electronic component 2 coated with the glossy transparent coating agent is mounted, the mounting position of the electronic component 2 is determined by the gloss of the transparent coating agent applied to the electronic component 2 in the conventional pattern matching. Although it was difficult to specify, since the position identifying mark Mr is colored by coloring on the top 2c of the mounted electronic component 2, the mounting position of the electronic component 2 can be specified and the mounting state can be determined.

  As mentioned above, although one Embodiment of this invention was described, the specific structure of each part is not limited only to above-described embodiment.

  For example, the identification mark Mr is manually attached by an inspection operator using the paint coloring means Br. However, as shown in FIG. 10, the paint coloring means Br is automatically associated with the driving means d1. It is preferable to provide the mounting state inspection apparatus 10 as the mark adding means D for adding the identification mark Mr, and to provide the coloring drive control unit 24 for controlling the driving of the paint coloring means Br. If comprised in this way, the mounting position of the electronic component 2 can be specified efficiently and appropriately through the imaging means 12, the position specifying means 17, and the judging means 19 using the identification mark Mr colored by the mark adding means D. . In particular, the mounted electronic component 2 is inclined and the apparent shape changes, or the mounting position is difficult to recognize due to the gloss of the transparent resin applied to the electronic component 2. Even when it is difficult to recognize the mounting position, it is possible to specify the mounting position of the electronic component 2 by performing effective coloring.

  Steps D6 and D11 are useful for enabling general-purpose use, but are not necessarily provided when the purpose and use are consistent from the beginning.

  In addition, the specific configuration of each part is not limited to the above-described embodiment, and various modifications can be made without departing from the spirit of the present invention.

DESCRIPTION OF SYMBOLS 1 ... Board | substrate 2 ... Electronic component 2a ... Component main body 2b ... Mounting leg (lead)
2c: End on the side opposite to the substrate (top)
DESCRIPTION OF SYMBOLS 10 ... Electronic component mounting state inspection apparatus 11 ... Control means 12 ... Imaging means 13 ... Display means 16 ... Operation part 17 ... Position specifying means 18 ... Storage means 19 ... Determination means 20 ... Position deviation determination means 21 ... Interval determination means 22 ... Criteria changing means 23 ... Display control means 24 ... Coloring drive control unit Br ... Paint coloring means Cc ... Paint d1 ... Drive means D ... Mark adding means Mr ... Identification mark

Claims (5)

An inspection method for inspecting a mounting state of an electronic component mounted on a substrate,
An imaging step of imaging the mounting surface of the substrate;
A position identifying step for identifying a mounting position of the electronic component based on the captured image;
A determination step of determining that the mounting state of the electronic component is defective when the distance between the specified mounting position of the electronic component and the other comparison target position exceeds a predetermined determination reference threshold,
A mark addition step of attaching an identification mark by coloring the electronic component before or after being mounted on the substrate;
The position specifying step recognizes the position of an identification mark attached to the electronic component by color, and specifies that the recognized position of the identification mark is a mounting position of the electronic component. Mounting state inspection method. An inspection device for inspecting a mounting state of an electronic component mounted on a substrate,
Mark adding means for attaching an identification mark by coloring the electronic component mounted on the substrate;
Imaging means for imaging the mounting surface of the substrate;
Position identifying means for recognizing the position of the identification mark attached to the electronic component based on the captured image by color, and identifying the recognized position of the identification mark as the mounting position of the electronic component;
Determining means for determining that the mounting state of the electronic component is defective when the distance between the specified mounting position of the electronic component and another comparison target position exceeds a predetermined determination reference threshold value; An electronic component mounting state inspection apparatus characterized by comprising: An inspection device for inspecting a mounting state of an electronic component mounted on a substrate,
Imaging means for imaging the mounting surface of the substrate;
Position identifying means for recognizing the position of the identification mark colored by coloring on the electronic component based on the imaged image and identifying that the recognized position of the identification mark is the mounting position of the electronic component; ,
Determining means for determining that the mounting state of the electronic component is defective when the distance between the specified mounting position of the electronic component and another comparison target position exceeds a predetermined determination reference threshold value; Become
The determination means includes
The comparison target position is a mounting position in a good mounting state of the electronic component set in advance with respect to the mounting position of the electronic component specified by the position specifying means, and the mounting position of the specified electronic component And a positional deviation determination unit that determines that the electronic component has a mounting defect due to a positional deviation when a distance between the electronic component and the comparison target position is larger than a positional deviation threshold that is a predetermined determination reference threshold.
The comparison target position is a mounting position of an electronic component adjacent to the electronic component with respect to the mounting position of one electronic component among the mounting positions of the plurality of electronic components specified by the position specifying means. And an interval determination unit that determines that both electronic components have a mounting defect due to an interval when the distance between the mounting positions of the components is smaller or larger than an interval threshold that is a predetermined determination reference threshold. Electronic component mounting state inspection device.   The electronic component mounting state inspection apparatus according to claim 2, further comprising a determination reference changing unit that changes the determination reference threshold. A board characterized in that a position identification mark is attached to the top of a mounted electronic component by coloring.

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