JP2001343214A - Method and apparatus for inspecting position of mounted part, and method and apparatus for mounting part - Google Patents

Abstract

PROBLEM TO BE SOLVED: To enable correctly detecting a state in which parts are adjacently mounted and promptly coping with a problematic state if generated when parts are adjacently mounted. SOLUTION: A plurality of the parts are mounted on an object where the parts are to be mounted, and an adjacency distance between adjacent parts is detected for the plurality of the mounted parts. It is judged that a mount position of the adjacent parts is not good when the detected adjacency distance is lower than a reference value. A mounting operation for the parts is changed when the position is judged not to be good.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method and an apparatus for inspecting the position of a mounted component, and a method and an apparatus for mounting a component by using the method. For example, an electronic component is mounted on a circuit board in a mounted state or a temporary mounted state. It is used as it is or by reflow processing to manufacture an electronic circuit board.

[0002]

2. Description of the Related Art A component mounting apparatus for mounting electronic components will be described with reference to FIG. 11 showing an embodiment of the present invention.
Approximately component supply means 1, mounting object handling means 4 which repeats positioning of circuit board 2 and mounting of electronic components 3, and electronic component 3 to be supplied picked up and positioned on circuit board 2 positioned And a component handling means 5 for repeating carrying and mounting at a predetermined position.

The position of the electronic component 3 mounted on the circuit board 2 is controlled, for example, with respect to the electronic component 3 before mounting picked up by the component handling means 5 in a fixed positional relationship with the positioned circuit board 2. The position on the circuit board 2 recognized by the recognition camera 6 and the position on the circuit board 2 recognized by the recognition camera 8 on the circuit board 2 for the position recognition mark 7 attached to the positioned circuit board 2 , Based on.

In the handling of components, the pick-up position of the electronic component 3 and the recognition camera 8, and thus the pickup position of the electronic component 3 and the recognition position of the recognition position mark 7 recognized by the recognition camera 8, have a unique relationship. The two types of position recognition are based on the pick-up position of the electronic component 3 on the component handling means 5 and the position of the circuit board 2, that is, the position where each electronic component 3 is to be mounted on the circuit board 2, on the component handling means 5. Therefore, the electronic component 3 can be carried to a predetermined position on the circuit board 2 and mounted with high positional accuracy by the position control.

[0005]

On the other hand, with the recent miniaturization of electronic devices, the miniaturization of the electronic components 3, the miniaturization of the circuit board 2, and the increase in the density of mounting electronic components have progressed. The adjacent distance of No. 3 has been narrowed to 0.1 to 0.3 mm, and even a slight displacement has become unacceptable. The shift of the mounting position of the electronic component 3 allowed on the circuit board 2 is determined by the relationship between the mounting position of the electronic component 3 on the circuit board 2, the mounting direction, the shape, and the like.
In places where the strictest is required, accuracy exceeding the general equipment specifications of the component mounting apparatus is required.

[0006] Under such circumstances, even if components are mounted by performing the above-described conventional position control, an unacceptable positional shift sometimes occurs. However, the conventional component mounting apparatus does not have a function to cope with such a displacement. For this reason, whenever a position shift that is not permissible in the past occurs, a person operates the component mounting device, corrects the resulting mounting position shift by human judgment, updates the operation program in the mounting device, The equipment must be adjusted manually, which is troublesome and requires skill, and cannot be properly dealt with due to human intervention or indirect measurement of adjacent distance for correction. There are many. In addition, the misalignment is left until a person notices it and takes action, thereby causing many defects in the manufactured electronic circuit board.

[0007] On the other hand, there is a device that automatically adjusts a component mounting device by using a time lapse or a temperature change as a trigger.
Since the measurement is not performed on the actual component mounting apparatus, it is impossible to cope with the above-mentioned positional deviation, and the quality of the final electronic circuit board cannot be guaranteed.

According to the present invention, there is provided a position inspection method and apparatus capable of accurately judging an adjacent state between mounted components on a mounting object, and an immediate use when a problematic adjacent state occurs by using these methods. It is an object of the present invention to provide a component mounting method and device.

[0009]

In order to achieve the above object, a method for inspecting the position of a mounted component according to the present invention comprises the steps of: determining a distance between adjacent components for a plurality of components mounted on a mounting object; The main feature is that when the detected adjacent distance is smaller than the reference value, it is determined that the mounting positions of the adjacent components are defective.

In such a configuration, information on the actual adjacent distance detected from adjacent ones of a plurality of components mounted on the mounting object is obtained, and the quality of the mounting position is determined based on whether or not this is less than a reference value. Therefore, the mounting position can be accurately inspected when the recent adjacent distance is a problem, and the occurrence of the defective adjacent distance can be accurately and promptly detected. Accordingly, the amount of defective products can be reduced quickly without waste.

[0011] The mounted component position detecting apparatus of the present invention which implements such a method includes a detecting means for detecting an adjacent distance between adjacent components mounted on the mounting object, and a detecting means for detecting the adjacent distance. Determination means for determining that the mounting position of the adjacent components is defective when the value is below the reference value, and the position inspection of the mounted components is automatically and accurately and stably performed by the characteristic method. It can be carried out.

Here, the detection of the adjacent distance can be performed based on the contours of the components obtained by capturing the images of the adjacent components and obtaining the captured images.
Imaging means for imaging adjacent ones of a plurality of components mounted on a mounting target; capturing an image of the captured component; calculating an adjacent distance between the components based on a contour of the component obtained from the captured image; And a calculating means, and the adjacent distance can be automatically and accurately detected by image recognition.

Further, the detection of the adjacent distance can be performed by taking in images of adjacent components, and based on the mounting positions of those components obtained from the captured images and the shape data defined for these components. For this purpose, an image pickup means for picking up images of adjacent ones of a plurality of components mounted on a mounting target, a storage means for storing shape data defined for each mounted component, and an image of a picked-up component Calculating means for calculating an adjacent distance based on the mounting positions of those parts obtained from the captured image and the shape data of these parts, and the adjacent distance may be used for image recognition and known data. Automatically and at a high speed.

In the component mounting method of the present invention using the above-described inspection method and apparatus, a plurality of components are mounted on a mounting object, and for each of the plurality of mounted components, adjacent components are placed adjacent to each other. The main feature is that the distance is detected, and when the detected adjacent distance is smaller than the reference value, the mounting positions of the adjacent components are determined to be defective, and when the determination is defective, the mounting operation of the components is changed.

In such a configuration, when a plurality of components are mounted on the mounting target, information on an actual adjacent distance detected from adjacent components of the mounted components is obtained, and this information is used as a reference value. Of the mounting position is determined based on whether the distance is less than the specified value, so that the mounting position can be accurately inspected when the adjacent distance is a problem in recent years, and the occurrence of an adjacent distance defect can be detected quickly and accurately, and the adjacent distance defect is detected. When this is done, the mounting operation is changed and the response is taken, so that the response can be quickly and reliably performed without waste, and the amount of defective products generated can be further reduced.

The component mounting apparatus of the present invention that achieves such a method includes a component supply unit, a mounting target handling unit that repeats positioning of the mounting target and providing the mounting of the component, and a supplied component. A component handling means that repeats picking up and carrying on a mounted mounting object and mounting at a predetermined position, and a detecting means for detecting an adjacent distance between adjacent ones of a plurality of components mounted on the mounting object, When the detected adjacent distance is less than the reference value, a determination unit that determines that the mounting position of those adjacent components is defective, and a control unit that changes the mounting operation when the determination is defective are sufficient. It is possible to automatically and stably achieve the above component mounting method at a high speed.

The change of the mounting operation may be performed by adding an external notification operation. With this, it is possible to notify immediately after the occurrence of the mounting position defect due to the adjacent distance defect and to take an early action. . This includes, as a mounting device,
What is necessary is just to provide the notification means which can perform a visual or audible notification operation.

Further, the change of the mounting operation may be performed by reducing the operation speed of a part or the whole of the mounting operation, whereby the inertia affects various types of positioning at each point in time or delays the positioning control. Thus, it is possible to eliminate the possibility that the mounting position defect is likely to occur due to the occurrence of the mounting position defect, and to reduce the occurrence of the mounting position defect immediately after the detection of the mounting defect. For this purpose, a control device for reducing the mounting operation speed may be provided as the mounting device.

In addition, when the mounting operation is changed, the mounting operation position can be automatically corrected.
The mounting position is corrected immediately after the mounting position defect due to the adjacent distance defect occurs, and the mounting defect does not occur without lowering the operation speed and reducing the productivity. For this purpose, means for correcting the mounting position may be provided so that the adjacent distance smaller than the reference value is equal to or greater than the reference value.

The correction is preferably performed based on the result of automatically measuring the positional accuracy of the mounting operation.

Further objects and features of the present invention will become apparent from the following detailed description and drawings. Each feature of the present invention can be used alone or in various combinations in combination as far as possible.

[0022]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS A method and an apparatus for inspecting a component mounting position according to an embodiment of the present invention and a method and an apparatus for mounting a component using the same will be described below with reference to FIGS. For an understanding of the invention.

In this embodiment, an electronic circuit board is manufactured by mounting electronic components such as a semiconductor element and a connector on a printed circuit board or the like in a mounted state or in a provisionally mounted state, or as it is or by reflow processing. This is an example of the case where the present invention is applied. However, the present invention is not limited to this, and is generally applicable to a case where various components are mounted on various mounting objects regardless of a plate member, a non-plate member, an electronic component or a non-electronic component. And both cases belong to the category of the present invention.

FIGS. 3 and 4 show a method for inspecting the position of a mounted component according to the present embodiment for an electronic component 3 on which a plurality of circuit boards 2 as mounting objects are mounted as shown in FIGS. In this manner, the adjacent distance ΔR between the adjacent electronic components 3 is detected, and when the detected adjacent distance ΔR is smaller than the reference adjacent distance R as a reference value, it is determined that the mounting position of the adjacent electronic components 3 is defective. Thereby, the circuit board 2
Information on the actual adjacent distance ΔR detected from adjacent ones of the plurality of electronic components 3 mounted thereon is obtained, and as shown in FIG. 6, whether or not the adjacent distance ΔR is smaller than the reference adjacent distance R is determined. Since the pass / fail is determined, it is possible to accurately inspect the mounting position, for example, in the case of manufacturing an electronic circuit board, in which the recent adjacent distance is a problem, and to quickly and accurately detect occurrence of the adjacent distance defect. Accordingly, the amount of defective products can be reduced quickly without waste.

Here, the adjacent distance ΔR is detected by capturing an image of an adjacent electronic component 3 by a recognition camera or the like and capturing the captured image, as shown in FIGS. 3 and 4 of the electronic component 3 obtained from the captured image. This can be performed based on the contour 3a by image recognition.

In the detection example shown in FIG. 3, setting the scanning line L1 in the direction in which the electronic components 3 are narrowest and adjacent to each other, and measuring the interval between the electronic components 3 on this scanning line L1 is called the scanning line L1. The position of L1 is repeated in the whole area of the electronic component 3 while shifting in the Y direction, for example, which intersects it, and optimally shifting by a fine constant pitch ΔY. As a result, the scanning line L2 that minimizes the distance between the electronic components 3 is searched, and the length of the searched scanning line L2 between the electronic components 3 is detected as the adjacent distance ΔR.

In the example shown in FIG. 4, the central electronic component 3
And a tangent L3 circumscribing the contour 3a of the extracted electronic component 3 and an outward perpendicular L4 to the tangent L3 are set, and the contour of the electronic component 3 centered at the intersection of the tangent L3 and the perpendicular L4. The entire area 3a is scanned, and the distance between the electronic component 3 at the center and the electronic components 3 around it is measured. As a result, a perpendicular L5 in which the interval between the electronic components 3 is the smallest on the perpendicular L4 is searched,
The length between the electronic components 3 at the retrieved perpendicular L5 is set as the adjacent distance ΔR.

Separately, the detection of the adjacent distance ΔR is performed by detecting the mounting positions of the electronic components 3 obtained from the captured images of the adjacent electronic components 3 as shown in FIGS. Table 1 below defined for parts
This can be performed based on planar shape data as shown in FIG.

[0029]

[Table 1]

In this method, the position of the center P of the mounted electronic component 3 and the inclination angle θ on the position detection coordinates on the screen or the like are not used directly as the captured image of the electronic component 3. Based on this, the virtual outer diameter of the mounted electronic component 3 is defined as the outline of the electronic component 3 based on the shape data of the electronic component 3 defined in Table 1 above. The adjacent distance ΔR is detected. Note that the shape data in Table 1 is obtained when there is no inclination on the position detection coordinates.

The component mounting method according to the present embodiment using the above-described method for inspecting the mounting position of the electronic component 3 includes mounting a plurality of electronic components 3 on the circuit board 2, and mounting the plurality of mounted electronic components 3. With respect to the electronic component 3, an adjacent distance ΔR between the adjacent electronic components 3 is detected, and when the detected adjacent distance ΔR is smaller than a reference adjacent distance R which is a reference value, as shown in FIG. It is determined that the mounting position is defective, and if the determination is defective, the mounting operation of the electronic component 3 is changed as shown in FIGS. 7 and 8, for example.

As described above, a plurality of electronic components 3 are mounted on the circuit board 2. Information on the actual adjacent distance ΔR detected from adjacent ones of the mounted electronic components 3 is obtained, and this information is used as a reference adjacent component. Since the quality of the mounting position is determined based on whether the distance is less than the distance R, the mounting position can be accurately inspected when the recent adjacent distance ΔR is a problem, and the occurrence of the adjacent distance defect can be detected quickly and accurately. When a defect is detected, the mounting operation is changed and the response is taken, so that the response can be made earlier without waste and the amount of defective products generated can be further reduced.

In the example shown in FIG. 7, when it is determined that the mounting position is defective due to an adjacent distance defect, an external notification is made. Specifically, this is a warning display, and by this notification, it is possible to promptly notify the worker of the occurrence of the adjacent distance defect and take action. In the notification, the warning display is a visual notification, but an audible notification can also be made.

In the example shown in FIG. 8, when it is determined that the mounting position is defective due to the adjacent distance defect, the operation speed is reduced, and the inertia affects various types of positioning at each point in time or the position control is performed. The problem that the mounting position defect is likely to occur due to the delay in the distance can be eliminated, and the adjacent distance defect can be made less likely to occur, and the same after the detection of the mounting position defect due to the adjacent distance defect The occurrence of defects can be prevented.

The basic configuration of the component mounting apparatus according to the present embodiment which achieves such a component mounting method includes a component supply means 1, a mounting object handling means 4 as shown in FIG. In order to achieve the mounting method as described above, in particular, the adjacent distance Δ between adjacent ones of the plurality of electronic components 3 mounted on the circuit board 2 is provided.
R detecting means 11 for detecting an adjacent electronic component 3 when the detected adjacent distance ΔR is smaller than the reference adjacent distance R.
Determining means 12 for determining that the mounting position P is defective;
Control means 13 for changing the mounting operation when the determination is bad. This makes it possible to automatically and stably achieve the above-described characteristic component mounting method at a high speed.

More specifically, the component supply means 1 has a plurality of component supply mechanisms 1a for supplying a plurality of types of electronic components 3 in the X direction, and moves in the X direction to supply the electronic components 3 required at each time. The electronic components 3 are supplied to a predetermined position or the necessary electronic components 3 are carried by the movement of the component handling means 5 in the X direction. The speed can be increased by using both movements. The mounting object handling means 4 is a circuit board 2
For example, the electronic circuit board on which the necessary electronic components 3 are mounted after handling the circuit board 2 in the X direction, positioning the circuit board 2 loaded through the loading section 4a by the positioning section 4b, and providing the electronic components 3 thereon. Is carried out through the carrying-out section 4c.

The component handling means 5 has a mounting head 16 which moves in the X and Y directions orthogonal to each other by an axis 14 in the X direction and an axis 15 in the Y direction perpendicular thereto.
A suction nozzle 17 as a component handling tool for holding, carrying and mounting the electronic component 3 is supported so as to be able to move up and down. The shaft 14 is driven by an X-axis motor 18 and the shaft 15 is driven by a Y-axis.
The mounting head 16 is driven to rotate by a shaft motor 19 to a required position at each time. The mounting head 16 is provided with a motor 21 for rotating the suction nozzle 17 so that the direction and rotation angle of the electronic component 3 held by the suction nozzle 17 can be corrected or set.

Component supply means 1 and mounting object handling means 4
The recognition camera 6 is provided between the
Nozzle 1 in which the mounting head 16 has moved downward
7, the electronic component 3 is held, picked up, and carried on the circuit board 2 positioned by the positioning portion 4b.
When the electronic component 3 passes through the field of view of the recognition camera 6, the holding position and the orientation of the electronic component 3 on the mounting head 16 and thus on the component handling means 5 are image-recognized. . Further, the recognition camera 8 is provided on the mounting head 16, and before the mounting head 16 mounts the electronic component 3 held by the suction nozzle 17 on the circuit board 2, the recognition camera 8 The position recognition mark 7 is image-recognized.

The image recognition data from the recognition cameras 6 and 8 is input to a microcomputer 22 for controlling the above-mentioned operations, and the microcomputer 22 controls the position based on the recognition data according to a preset program, and performs electronic control. The mounting operation of the component 3 is performed. At this time, the suction nozzle 17
When the position and the angle of the electronic component 3 held by the above are misaligned, the electronic component 3 is corrected and mounted at a predetermined position on the circuit board 2.

On the other hand, the detecting means 11, the judging means 12 and the control means 13 for changing function as an internal function of the microcomputer 22 or as an external device, and the detecting means 11 is an electronic device mounted on the circuit board 2. An adjacent distance ΔR between adjacent parts of the component 3 is detected,
If the detected adjacent distance ΔR is smaller than the reference adjacent distance R, it is determined that the mounting position is defective. If the judgment is bad, control means 1
3 works to change the mounting operation, and automatically responds to a mounting position defect.

As shown in FIG. 12, the detecting means 11 includes, as shown in FIG. 12, the recognition camera 8 serving as an image pickup means for picking up images of adjacent electronic components 3 mounted on the circuit board 2, and Calculating means 24 for taking in an image of the electronic component 3 which has been taken and calculating the adjacent distance ΔR of the electronic component 3 by the method shown in FIG. 3 or 4 based on the outline of the electronic component 3 obtained from the taken-in image. I have. The calculating means 24 may use the internal function of the microcomputer 22 or may be an external device.

As shown in FIG. 13, the detecting means 11 further includes a recognition camera 8 for picking up images of adjacent electronic components 3 mounted on the circuit board 2, and a definition for each mounted electronic component 3. A storage means 25 for storing the shape data as shown in Table 1 and a captured image of the electronic component 3, and based on the mounting positions of the components obtained from the captured image and the shape data of these components. And a calculating means 26 for calculating the adjacent distance. The storage unit 25 and the calculation unit 26 can also use the internal functions of the microcomputer 22 or may be external devices.

When the determination means 12 determines that a defect has occurred, the control means 13 for change changes the buzzer 28 of the operation panel 27.
The monitor 29 is notified as notification means to the outside as described above. Sound may be used for sound announcement. In addition to or instead of this notice, for example, the mounting head 1 which is a part of the device as described above
The change control of the operation is performed by switching the moving speed 6 or the speed of the entire apparatus to a low speed. The mounting position by the program and the setting position on the apparatus are corrected so that the adjacent distance ΔR is equal to or longer than the reference adjacent distance R.

FIG. 9 shows an operation example in the case of performing correction. It is determined whether there is an adjacent electronic component 3 in question on the plus side in the X direction of the electronic component 3 to be mounted, and if so, the position of the mounted X coordinate is corrected in the negative direction. It is determined whether there is an adjacent electronic component 3 on the minus side of the electronic component 3 in the X direction, and if so, the position of the mounted X coordinate is corrected in the plus direction. It is determined whether there is a problematic adjacent electronic component 3 on the plus side in the Y direction of the electronic component 3 to be mounted, and if so, the position of the mounted Y coordinate is corrected in the negative direction. It is determined whether there is an adjacent electronic component 3 in question on the minus side of the electronic component 3 in the Y direction, and if so, the position of the mounted Y coordinate is corrected in the plus direction. By the above, the adjacent distance Δ
R can be prevented from approaching until the distance falls below the reference adjacent distance ΔR.

The determination as to whether or not there is an adjacent electronic component 3 that causes a problem is made, for example, by a mounting program in which the mounting position of the electronic component 3 is registered as shown in Table 2 below.

[0046]

[Table 2]

There is a method of registering the data of the adjacent direction and the reference adjacent distance R, and using this.

FIG. 10 shows another example of control for performing position correction. When there is a defective mounting position, the suction nozzle 17 is moved to the center position of the imaging field of view of the recognition camera 6, and the center position of the suction nozzle 17 and the image pickup are performed. If there is a deviation from the center position of the field of view, it causes a mounting failure. Therefore, the positional deviation amount in the XY directions is calculated. Next, an offset value is added to the mounting XY coordinate values of the mounting program to correct the operating position. Thereafter, the mounting position defect due to the displacement of the suction nozzle 17 does not occur.

[0049]

According to the method and apparatus for inspecting the position of a mounted component according to the present invention, information on an actual adjacent distance detected from adjacent components mounted on a mounting object is obtained as a reference value. , The mounting position is determined based on whether the distance is less than the above, so that the mounting position can be accurately inspected when the recent adjacent distance is a problem, and the occurrence of the adjacent distance defect can be detected accurately and quickly. Accordingly, the amount of defective products can be reduced quickly without waste. In particular, according to the apparatus, it is possible to automatically and stably perform the position inspection of the mounted component by the characteristic method described above.

According to the component mounting method and apparatus of the present invention, when a plurality of components are mounted on the mounting target, the actual adjacent distance detected from adjacent components of the mounted components is determined. Information is obtained, and whether the mounting position is good or bad is determined based on whether it is below the reference value. Therefore, when the adjacent distance is a problem recently, the mounting position is properly inspected, and the occurrence of the adjacent distance defect is found accurately and quickly. When the adjacent distance defect is detected, the mounting operation is changed and the response is taken, so that the response can be quickly and reliably performed without waste, and the amount of defective products can be further reduced. In particular, the apparatus can automatically and stably achieve the component mounting method having the above characteristics at a high speed.

The detection of the adjacent distance can be performed based on the contours of those components obtained from the captured images by capturing the images of the adjacent components. Can be detected.

Further, the detection of the adjacent distance can be performed by taking in images of adjacent components, and based on the mounting positions of those components obtained from the captured images and the shape data defined for these components. This can be automatically detected with high accuracy and high speed by the detection means using the image recognition and the stored known data.

The change of the mounting operation may be performed by adding an external notification operation. This immediately or visually and audibly notifies the driver immediately after the occurrence of the mounting position defect due to the adjacent distance defect, thereby taking an early response. Can be achieved with simple control.

The change of the mounting operation may be performed by lowering a part or the entire operation speed of the mounting operation, whereby the inertia affects various types of positioning at each time point or delays the positioning control. This eliminates the possibility that mounting position defects are likely to occur due to the occurrence of mounting defects, and makes it difficult for mounting position defects to occur immediately after the detection of mounting defects, and is achieved with simple control .

Further, when the mounting operation is changed, the mounting operation position can be automatically corrected.
The mounting position is corrected immediately after the mounting position defect due to the adjacent distance defect occurs, and the mounting defect does not occur without lowering the operation speed and reducing the productivity. This can also be achieved with relatively simple control.

The correction is preferably performed based on the result of automatically measuring the positional accuracy of the mounting operation.

[Brief description of the drawings]

FIG. 1 is a plan view showing an example in which a plurality of electronic components are mounted adjacent to each other on a circuit board according to an embodiment of the present invention.

FIG. 2 is a plan view showing another example in which a plurality of electronic components are mounted adjacent to each other on the circuit board according to the embodiment of the present invention.

3 is an explanatory diagram showing one example of a method of detecting an adjacent distance by taking the electronic components shown in FIG. 1 as an example.

FIG. 4 is an explanatory diagram showing another example of a method of detecting an adjacent distance using the electronic components shown in FIG. 2 as an example.

FIG. 5 is an explanatory diagram showing another example of a method of detecting an adjacent distance between adjacent electronic components.

FIG. 6 is a flowchart illustrating an operation example of determining whether the mounting position is good or bad according to the adjacent distance.

FIG. 7 is a flowchart illustrating an example of changing an operation according to the quality of the determination in FIG. 6;

FIG. 8 is a flowchart showing another example of changing the operation according to the quality of the determination in FIG.

FIG. 9 is a flowchart illustrating an example of correcting a mounting position depending on whether there is an adjacent electronic component in question.

FIG. 10 is a flowchart illustrating an example of measuring the center position of the suction nozzle when the mounting position is determined to be defective, and correcting the mounting position by correcting the positional deviation amount.

FIG. 11 is a plan view showing a schematic configuration of a component mounting apparatus according to an embodiment of the present invention.

FIG. 12 is a block diagram showing one specific example of the detection means of FIG. 11;

FIG. 13 is a block diagram showing another specific example of the detecting means of FIG. 11;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Component supply means 2 Circuit board 3 Electronic component 3a Outline 4 Mounting object handling means 5 Component handling means 6, 8 Recognition camera 11 Detecting means 12 Judging means 13 Control means 16 Mounting head 17 Suction nozzle 22 Microcomputer 24, 26 Calculation means 25 storage means 27 operation panel 28 buzzer 29 monitor

 ──────────────────────────────────────────────────続 き Continuing from the front page (72) Inventor Hiroaki Imagawa 1006 Kazuma Kadoma, Osaka Prefecture Matsushita Electric Industrial Co., Ltd. (72) Inventor Junichi Hata 1006 Okadoma Kadoma Kadoma City, Osaka Matsushita Electric Industrial F Term (reference) 2F065 AA03 AA22 AA51 CC28 FF04 QQ31 RR05 UU05 5E313 CC03 EE02 EE03 EE24 FF21 FF28 FG06

Claims (20)

[Claims] 1. An adjacent distance between adjacent components is detected for a plurality of components mounted on an object to be mounted, and when the detected adjacent distance is smaller than a reference value, it is determined that the mounting position of the adjacent components is defective. A position inspection method for a mounted component. 2. The method for inspecting the position of a mounted component according to claim 1, wherein images of adjacent components are fetched, and an adjacent distance is detected based on contours of those components obtained from the fetched image. 3. The image capturing apparatus according to claim 1, wherein an image of adjacent parts is captured, and an adjacent distance is detected based on a mounting position of the parts obtained from the captured image and shape data defined for these parts. Position inspection method for mounted components. 4. A detecting means for detecting an adjacent distance between adjacent ones of a plurality of components mounted on an object to be mounted, and when the detected adjacent distance is smaller than a reference value, the mounting positions of the adjacent components are defective. And a determination unit for determining the position of the mounted component. 5. A detecting means, comprising: an image pick-up means for picking up an image of adjacent ones of a plurality of components mounted on a mounting target; a pick-up image of the picked-up component; 5. The apparatus for inspecting a position of a mounted component according to claim 4, further comprising: a calculating means for calculating an adjacent distance between the components. 6. A detecting means, comprising: an imaging means for imaging adjacent ones of a plurality of components mounted on a mounting target; a storage means for storing shape data defined for each mounted component; And a calculating means for calculating an adjacent distance based on a mounting position of the component obtained from the captured image and the shape data of the component. Position inspection device. 7. A plurality of components are mounted on an object to be mounted, an adjacent distance between adjacent components is detected for the plurality of mounted components, and when the detected adjacent distance is smaller than a reference value, the adjacent components are adjacent to each other. A component mounting method comprising: determining that a component mounting position is defective; and changing the component mounting operation if the determination is bad. 8. The component mounting method according to claim 7, wherein the change of the mounting operation adds an external notification operation. 9. The mounting operation according to claim 7, wherein changing the mounting operation lowers a part or the entire operation speed of the mounting operation.
The mounting method of the parts described in the section. 10. The component mounting method according to claim 7, wherein the change of the mounting operation automatically corrects the mounting operation position. 11. The component mounting method according to claim 10, wherein the correction is performed based on a result of automatically measuring the positional accuracy of the mounting operation. 12. The image capturing apparatus according to claim 7, wherein an image of a component adjacent to the mounting operation position is captured, and an adjacent distance is detected based on a contour of the component obtained from the captured image.
The mounting method of the parts described in the section. 13. The image capturing apparatus according to claim 7, wherein an image of adjacent parts is captured, and an adjacent distance is detected based on a mounting position of the parts obtained from the captured image and shape data defined for these parts. A method for mounting the component according to any one of the preceding claims. 14. A component supply means, a mounting object handling means for repeating positioning of the mounting object and providing the mounting of the component, a picked-up component to be carried on the positioned mounting object, A component handling unit that repeats mounting at a position, a detecting unit that detects an adjacent distance between adjacent components of a plurality of components mounted on the mounting target, and an adjacent component when the detected adjacent distance is smaller than a reference value. A component mounting apparatus, comprising: a determination unit that determines that the mounting position of the component is defective; and a control unit that changes a component mounting operation based on the determination that the component is defective. 15. The component mounting apparatus according to claim 14, further comprising an external notifying unit, wherein the control unit operates the notifying unit based on the determination that the component is defective. 16. The control device according to claim 1, wherein a part or the whole operation speed of the mounting operation is reduced based on the determination of the defect.
16. The component mounting apparatus according to any one of items 4 and 15. 17. The component mounting apparatus according to claim 14, wherein the control means automatically corrects the mounting operation position based on the defect determination. 18. The component mounting apparatus according to claim 17, further comprising measuring means for measuring positional accuracy of the mounting operation position, wherein the control means performs correction based on a result of measurement by the measuring means based on the determination of the defect. 19. A detecting means, comprising: an imaging means for imaging adjacent ones of a plurality of components mounted on a mounting target;
19. A calculating means for capturing an image of a captured component and calculating an adjacent distance between the components based on the outline of the component obtained from the captured image. Equipment for mounting components. 20. An imaging means for imaging adjacent ones of a plurality of components mounted on a mounting target,
A storage unit for storing shape data defined for each component to be mounted, an image of a captured component captured, and an adjacent distance based on the mounting position of the component obtained from the captured image and the shape data of the component; The component mounting apparatus according to any one of claims 14 to 18, further comprising a calculation unit configured to calculate the component.