JPH11274794A - Method of inspecting component-mounting condition of mounting apparatus and tool for inspecting component-mounting condition - Google Patents

Abstract

PROBLEM TO BE SOLVED: To contrive so that the work of inspecting mounting conditions can be done easily by tentatively mounting before operating the mounting apparatus, and the inspection thereof and adjustment based thereon can be accurately effected. SOLUTION: A dummy substrate 30 having a pattern 32 for indicating components-mounting positions and dummy components 40 formed into shapes corresponding to the shapes of components such as glass plates are used. With the dummy substrate 30 mounted on a substrate mounting position on the mounting apparatus, the dummy components 40 chucked by a head unit are mounted on the dummy substrate 30, and in this mounting condition the positional slippage of the dummy components 40 from the pattern 32 of the dummy substrate 30 is checked to inspect the components mounting condition. Scale is marked at the periphery of the pattern 32 of the dummy substrate 30, and the periphery of the dummy components 40, and the positional slippage of the dummy components 40 can be measured in the inspection.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a component mounting state inspection method for checking a component mounting state for calibration or the like in a mounting machine for mounting a component sucked by a head unit having a nozzle member on a printed circuit board. The present invention relates to a component mounting state inspection tool used in the method.

[0002]

2. Description of the Related Art Conventionally, a head unit having a nozzle member sucks an electronic component such as an IC from a component supply unit, transfers it onto a printed circuit board positioned and mounts the electronic part on a predetermined position of the printed circuit board. 2. Description of the Related Art A mounting machine is generally known. Recently, in this type of mounting machine, a camera for recognizing a printed circuit board is mounted on a head unit, and the fiducial mark attached to the printed circuit board is recognized by the camera, so that the head unit and the printed circuit board can be accurately aligned. A component recognition camera is installed on the device that detects the positional relationship to ensure mounting accuracy, and a component recognition camera is mounted on the mounting machine body, and the component after suction is recognized by this camera, taking into account the misalignment of the component with the nozzle member. There is proposed an apparatus which performs mounting.

In such a mounting machine, various parameters relating to component mounting accuracy, such as a movement reference position of a head unit and a positional relationship between a camera for component recognition and a nozzle member, are set precisely, and these initial values are set. Proper adjustment (calibration) is indispensable for improving mounting accuracy. For this reason, before the operation of the mounting machine, etc., the components are mounted on the printed circuit board on a test basis, the mounting state (position shift etc.) is inspected, and based on that, the calibration data is created and corrected as necessary. Adjustment of the various parameters as described above has been conventionally performed.

[0004]

In the conventional method as described above, when components are mounted on an actual printed circuit board on a test basis, the proper component mounting position on the printed circuit board and the displacement of the components relative thereto are visually observed. It is not easy to check, and the inspection of the mounted state requires skill. Also, for example, when a leaded component is used as a component to be mounted on a test, the mounting position may be shifted due to bending of the lead, and when the actual component is used, the mounting position may be shifted due to factors specific to the component, As a result, the accuracy of the inspection for setting the parameters of the mounting machine itself and the initial adjustment based on the inspection are reduced.

[0005] In addition, if the test mounting causes damage to the components (lead breakage, etc.), there is another problem that the components are wasted.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problem, and it is possible to easily carry out a test mounting operation before the operation of the mounting machine and the like to inspect the mounting state. It is an object of the present invention to provide a component mounting state inspection method and a component mounting state inspection tool of a mounting machine capable of performing the inspection and adjustment based on the inspection with high accuracy.

[0007]

According to a first aspect of the present invention, there is provided a method for inspecting a component mounting state of a mounting machine, comprising a head unit having a nozzle member for picking up a component, wherein the head unit sucks a component from a component supply side. In a mounting machine configured to mount components on a printed board installed at a board installation position of a mounting machine main body, the dummy board having a pattern for displaying a component mounting position on a dummy board configuration plate is attached to the above-described substrate. After the dummy component formed in a shape corresponding to the shape of the component is sucked by the head unit in a state where the dummy component is installed at the installation position, the dummy component is moved to a position corresponding to the component mounting position display pattern on the dummy substrate. The dummy unit is mounted on the dummy substrate by driving the head unit as described above, and in this mounted state, the dummy portion corresponding to the pattern for displaying the component mounting position is displayed. By examining the positional deviation of those which is adapted to inspect the component mounting state.

According to this method, after the dummy component is mounted on the dummy substrate, the displacement of the dummy substrate with respect to the pattern for displaying the component mounting position of the dummy substrate is checked, so that the component mounting state can be easily inspected. Done. Moreover, unlike the case where an actual component is used, the bending of the lead does not lower the accuracy, and the component is not damaged at the time of mounting or the like and is not wasted.

A component mounting state inspection tool according to a second aspect is used for the component mounting state inspection method according to the first aspect, wherein a pattern for displaying a component mounting position is attached to a dummy substrate configuration plate. And a dummy component formed by a transparent plate into a shape corresponding to the shape of the component. A dummy portion is provided around the pattern for displaying the component mounting position of the dummy substrate and the periphery of the dummy component. A scale for measuring the displacement of the dummy component when the dummy component is mounted on the substrate is provided.

By using this component mounting state inspection tool, the above-described component mounting state inspection method is effectively performed, and the displacement of the dummy component when the dummy component is mounted on the dummy substrate can be easily determined by the scale. Measured.

In this tool, one of the scale at the periphery of the pattern for displaying the component mounting position and the scale at the periphery of the dummy component is a full scale scale, and the other is a vernier scale. ), It is possible to measure the displacement with high accuracy.

Further, if a cross-shaped mark indicating the center position is attached to each of the center of the pattern for displaying the component mounting position and the center of the dummy component on the dummy substrate (claim 4), this corresponds. By examining the displacement of the cross mark, the displacement of the dummy component can be inspected.

In a case where the tool is applied to a mounting machine provided with a component recognizing means for correcting a mounting position by taking an image of a component adsorbed on the head unit by an image taking means and recognizing the component, the dummy component is used. Is a relatively large first
The dummy component has an outer shape corresponding to the type of component, and a pattern that simulates the type 1 component is attached to the periphery of the dummy component, and the inside of the dummy component is smaller than the type 1 component. Second
It is preferable that a pattern that simulates the kind of part is attached (claim 5).

In this way, during the inspection, the suction and recognition of the dummy component by the head unit and the mounting on the dummy substrate are sequentially performed. In the recognition, when the viewing angle of the image pickup means is wide, the first is used. Imaging and recognition of a pattern that simulates a type component is performed. On the other hand, when the viewing angle of the imaging unit is narrow, imaging and recognition of a pattern that simulates a second type component is performed. That is, it is possible to selectively use the above two types according to the specifications of the imaging unit.

When the above-mentioned tool is used in a mounting machine in which a head unit is provided with an imaging means for board recognition,
It is preferable that a mark is provided on the fourth even portion of the dummy component so as to enable the image pickup by the board recognizing image pickup device and the automatic inspection of the component mounting state based thereon (claim 6).
With this configuration, after the mounting of the dummy component on the dummy substrate, each of the marks is sequentially imaged by the board recognizing imaging unit, and based on the image, operations such as the mounting state of the dummy component and creation of calibration data based thereon are automatically performed. Done

In the above-mentioned tool, when a pattern for displaying a component mounting position is provided at each of a plurality of locations on the dummy substrate (claim 7), a plurality of dummy components can be mounted on the dummy substrate. The mounting angle of the component is changed and the component is mounted on the dummy substrate, and the mounting state of the dummy component at various mounting angles can be inspected.

Further, if the dummy substrate is composed of an edge frame having a positioning portion for the mounting machine main body and a dummy substrate main body detachably attached to the edge frame (claim 8), the dummy substrate main body is provided. It is convenient for exchanging.

[0018]

DESCRIPTION OF THE PREFERRED EMBODIMENTS An example of a mounting machine to which the present invention is applied will be described with reference to FIGS.

FIGS. 1 and 2 show the structure of the entire mounting machine. As shown in the figure, on the base 1 of the mounting machine main body,
A conveyor 2 for transporting a printed board is arranged, and the printed board 3 is transported on the conveyor 2 and stopped at a predetermined board installation position. A component supply unit 4 is arranged on the side of the conveyor 2. The component supply unit 4 includes a component supply feeder, for example, a multi-row tape feeder 4a.

Above the base 1, a head unit 5 for mounting components is provided. The head unit 5 is movable across the component supply unit 4 and the component mounting unit where the printed circuit board 3 is located.
It can move in the axial direction (the direction of the conveyor 2) and the Y-axis direction (the direction orthogonal to the X-axis on a horizontal plane).

That is, a fixed rail 7 in the Y-axis direction and a ball screw shaft 8 rotated and driven by a Y-axis servomotor 9 are disposed on the base 1, and a head unit is mounted on the fixed rail 7. A support member 11 is provided, and a nut portion 12 provided on the support member 11 is screwed to the ball screw shaft 8. The support member 11 has X
An axial guide member 13 and a ball screw shaft 14 driven by an X-axis servo motor 15 are provided, and the head unit 5 is movably held by the guide member 13,
A nut portion (not shown) provided on the head unit 5 is screwed to the ball screw shaft 14. And
By the operation of the Y-axis servo motor 9, the support member 11
The head unit 5 is moved in the X-axis direction with respect to the support member 11 by the operation of the X-axis servo motor 15 while moving in the axial direction.

The Y-axis servo motor 9 and the X-axis servo motor 15 have a rotary encoder 1 respectively.
0 and 16 are provided so that the movement position of the head unit 5 can be detected.

As shown in FIG. 3, the head unit 5 is provided with a nozzle member for sucking components. In the illustrated example, two nozzle members 21 and 22 are provided, each of which is capable of moving in the Z-axis direction (vertical direction) and rotating around the R-axis (nozzle center axis) with respect to the frame of the head unit 5. The servomotors 17 and 18 and the R-axis servomotors 19 and 20 are operated. These servo motors 17 to 20 are provided with encoders 23 to 26, respectively, which detect the operating positions of the nozzle members 21 and 22. Each of the nozzle members 21 and 22 is connected to a negative pressure supply unit (not shown) via a valve or the like, so that a negative pressure for component suction is supplied to the nozzle members 21 and 22 when necessary.

Further, a board recognizing camera 27 (board recognizing image pickup means) is attached to the front side of the head unit 5. The board recognition camera 27 takes an image of a fiducial mark attached to the surface of the printed board 3 at the time of mounting, and also takes an image of a mark attached to a dummy component to obtain calibration data as described later. ing. A luminous body 28 composed of a large number of LEDs is fixed to the lower end of the board recognition camera 27. At the time of imaging, the luminous body 28 emits light and an image is printed on the substrate via a detection hole 28a provided in the luminous body 28. The image is captured by the recognition camera 27.

The base 1 has a head unit 5
A component recognition camera 29 (component recognition imaging means) for recognizing the suction state of the component sucked by the component recognition camera 29 is provided, and the head unit 5 is moved above the component recognition camera 29 after the component is sucked. At 29, the suction component is imaged.

For such a mounting machine, a dummy substrate 3 as shown in FIGS.
0 and a dummy component 40 are prepared, and an inspection of a component mounting state as described later is performed using these components.

As shown in FIGS. 4 and 5, the dummy substrate 30 includes a dummy substrate main body 31 and an edge frame 35, and is substantially the same size as a printed board. As shown in FIG. 6, the dummy substrate main body 31 is made of a hard plate formed in a substantially rectangular shape, and in this embodiment is made of a transparent glass plate. On the surface of the dummy substrate main body 31, a pattern 32 for displaying a component mounting position is provided. The patterns 32 are provided at a plurality of positions, desirably at four or more positions on the dummy substrate main body 31. In the illustrated example, the patterns 32 are provided at eight positions in two rows of four positions.

As shown in FIG. 7, the pattern 32 is composed of scales 32a provided on the four sides of a square portion corresponding to the outer shape of the dummy part 40, and the scales 32a are rod-shaped at regular intervals. Mark. A cross mark 33 indicating the center position is provided at the center of the pattern 32 for displaying the component mounting position.

Further, dot marks 34 corresponding to fiducial marks are provided at required positions on the dummy substrate main body 31.

The pattern 32, the cross mark 33 and the mark 34 are formed of a chromium film or the like adhered to the surface of the transparent glass plate and are opaque.

The edge frame 35 of the dummy substrate 30 is formed of a hard material such as metal into a frame shape surrounding a space for accommodating the dummy substrate body 31. Then, the dummy substrate main body 31 is detachably mounted in the edge frame 35,
It is fixed with the fixing tool 36. The fixing member 36 is formed in a disk shape or the like, is fixed to the edge frame 35 by bolts or the like, and presses and fixes the dummy substrate main body 31.

Further, engaging holes 3 as positioning portions with respect to the mounting machine main body are provided at two places before and after each side of the edge frame 35.
8 are formed. In a state where the dummy substrate 30 is installed at the board installation position of the mounting machine main body, a movable locking pin (not shown) provided on the mounting machine main body is engaged with the engagement hole 38.
, The positioning of the dummy substrate with respect to the mounting machine body is performed.

On the other hand, as shown in FIGS. 8 and 9, the dummy component 40 is made of a transparent plate such as a transparent glass plate, has an outer shape corresponding to a specific type of component, and has, for example, a relatively large lead. A component 41 is formed to have an outer shape corresponding to the component (QFP), and a pattern 41 that simulates the large-sized leaded component (first-type component) is attached to the periphery thereof, and the large-sized component is provided inside the component. A pattern 42 that simulates a small-sized leaded component (a second-type component) smaller than a shaped-leaded component is provided.

More specifically, a scale 41a serving as a pattern imitating the lead of a component having a large lead is attached to the periphery of the dummy component 40 (see FIGS. 8 and 10). And the rectangular frame-shaped portion 41b is an opaque chrome surface, thereby forming a pattern 41 representing the periphery of the large-sized leaded component simulated by them, and inside the rectangular frame-shaped portion 41b, Pattern 42a imitating the lead of a small leaded component and its inner part 42b
(Except for a circular transparent portion described later) is an opaque chrome surface, and a pattern 42 representing the peripheral portion of the small leaded component is formed by simulation.

The scale 32a on the periphery of the pattern 32 for displaying the component mounting position on the dummy substrate 30 and the scale 41a on the periphery of the pattern 41 on the dummy component 40 correspond to the dummy component 40 mounted on the dummy substrate 30. Sometimes arranged to overlap. Since the pitch between the scale 32a on the dummy substrate 30 side and the scale 41a on the dummy component 40 side is slightly different, one is a full scale scale and the other is a vernier scale.
a is a main scale, and a scale 41a on the dummy component 40 side is a vernier scale.

In the dummy component 40, a circular transparent portion 43 exists inside a pattern 42 that simulates a small leaded component, and a cross-shaped mark 44 indicating the center position of the dummy component 40 is provided at the center thereof. Is attached. further,
The four corners of the dummy component 40 are provided with dot-like marks 45 that enable the board recognition camera 27 to take an image and automatically inspect the component mounting state based on the image. Reference numeral 46 denotes a tapered portion provided on one side of the dummy component 40, which handles the dummy component 40 (for example, the dummy substrate 3).
0 after the mounting of dummy components).

Next, a component mounting state inspection method using the dummy substrate 30 and the dummy component 40 will be described.

This inspection is performed, for example, at the initial setting stage of the mounting machine, or is performed periodically as needed. At the time of this inspection, first, the dummy substrate 30 is installed at a predetermined substrate installation position on the conveyor 2 of the mounting machine main body, and a detection pin (not shown) is engaged with the engagement hole 38 by, for example, the dummy substrate 30. Position. On the other hand, the dummy component 40 is set on the component supply unit side.

In this state, the dummy unit 40 is experimentally mounted on the dummy substrate 30 by driving the head unit 5 and the like as in the mounting. That is, by controlling the various driving means in accordance with the mounting, after the dummy component 30 is sucked by the nozzle member of the head unit 5, the head unit 5 is displayed on the component recognition camera 29.
Moves, the picked-up component is imaged by the component recognition camera 29, and component recognition is performed by an arithmetic and control unit (not shown) that receives the image data, that is, the component center position and the nozzle based on the scanning of the component image and the like. The inclination of the component in the rotation direction (θ direction) is obtained. Then, as the mounting position correction data, a correction amount in the X and Y directions according to the shift of the component center position with respect to the nozzle center and a correction amount in the θ direction according to the inclination are obtained.

After this component recognition, the head unit 5 is moved onto the dummy substrate 30, and a specific position on the dummy substrate 30 where the pattern 32 for displaying the component mounting position is set as a target position. The dummy component 40 is mounted on the target position in consideration of the correction by the above.

Thus, the dummy component 40 is placed on the dummy substrate 30.
After the mounting, the inspection of the mounting state such as the displacement can be easily performed visually.

That is, in an initial stage where calibration of parameters such as the movement reference position of the head unit 5 and the positional relationship between the camera for component recognition and the nozzle member is not performed accurately, the mounting position of the dummy component 40 is not determined. In this case, since the dummy substrate 30 is provided with the pattern 32 for displaying the component mounting position, the displacement of the dummy component 40 with respect to the pattern 32 may be visually checked. Since the scales 32a and 41a are provided on the peripheral portion of the pattern 32 and the peripheral portion of the dummy component 40, it is possible to easily measure the positional deviation amount by visual observation. In particular, by using these scales 32a and 41a as the main scale and the vernier scale, it is possible to measure the displacement with high accuracy on the same principle as the caliper.

Since the cross marks 33 and 44 are provided at the center of the pattern 32 and the center of the dummy component 40 on the dummy substrate 30, respectively,
The displacement of the dummy component 40 can also be visually recognized by examining the mutual displacement of the dummy components 3 and 44.

Further, since patterns 32 for displaying component mounting positions are provided at a plurality of locations on the dummy substrate 30, a plurality of dummy components 40 can be mounted at different mounting angles.
0 can also be mounted. For example, the first dummy part is not rotated after recognition (mounting angle 0 °), and
The third dummy part is rotated by 90 ° after recognition, the third dummy part is rotated by 180 ° after recognition, and the fourth dummy part is rotated by 270 ° after recognition. Each dummy substrate 3
It can also be mounted at the four positions of the pattern 32 of 0, and the mounting state of each can be inspected.

Further, since the dummy pattern 40 is provided with an outer pattern 41 simulating a large leaded component and an inner pattern 42 simulating a small leaded component,
These patterns 41 and 42 can be properly used at the time of recognition according to the specifications of the component recognition camera 29. That is, when a component having a large viewing angle is used as the component recognition camera 29, the outer pattern 41 that simulates a large leaded component is recognized, but the component recognition camera 29 has a small viewing angle. If a pattern is used and the pattern 41 does not fit in the viewing angle, the inner pattern 42 that simulates a small leaded component may be recognized. Even when the inner pattern 42 is recognized, during the inspection after the dummy component 40 is mounted on the dummy substrate 30, the position is shifted using the scale 41 a around the outer pattern 41 and the scale 32 a on the dummy substrate 30 side. Should be measured.

In this manner, the mounting state can be visually inspected, and the displacement can be measured. In this case, since the glass dummy component 40 and the dummy substrate 30 that are not deformed are used, the mounting position may have an error due to a component specific to the component such as a bent lead as in the case of using a component such as an actual QFP. This prevents the accuracy of the inspection for calibration of the mounting machine from deteriorating, and prevents the components from being wasted due to damage to the components such as broken leads during mounting. Then, based on the measurement of the displacement in this inspection, if necessary, adjust the assembling of each part of the mounting machine, obtain calibration data of parameters related to mounting accuracy, and input the calibration data to the arithmetic and control unit, This can be reflected in the control during subsequent mounting.

In this embodiment, the dummy component 4
Since the dot mark 45 is attached to the fourth even part of the “0”, after the dummy component 40 is mounted on the dummy substrate 30, the calibration data is obtained by using the substrate recognition camera 27 mounted on the head unit 5. Can be automatically obtained.

That is, the board recognizing camera 27 is originally intended to capture the fiducial mark of the printed board, and since the viewing angle is small, the board recognition camera 27 captures the entirety of the dummy component 40 mounted on the dummy board 30. However, it is possible to image the dot mark 45 and detect its position. Accordingly, the board recognition camera 27 sequentially captures the marks 45 of the even part of the dummy component 40 to detect the position of each mark 45, and based on that,
For example, the center position of the dummy component 40 is obtained by finding the intersection of two diagonal lines connecting two marks, and the deviation from the target position is checked, and the inclination of the line connecting the marks is found. You can check the slope.

Therefore, the calculation control means which receives the information from the board recognition camera 27 can automatically calculate the calibration data according to the shift and the inclination of the center position of the dummy component 40.

The structures of the dummy substrate 30, the dummy components 40, and the like are not limited to the above-described embodiment, but can be variously changed.

For example, the material of the dummy component 40 may be a transparent hard plastic or the like, but a transparent glass plate is preferable in order to avoid deformation due to heat and to improve accuracy.

Further, the dummy substrate main body 31 is not necessarily required to be a transparent glass plate.
If it is possible to discriminate 34 from the ground color, calibration may be performed using an opaque ceramic plate or metal plate. The dummy substrate 30 may be one in which the main body 31 and the edge frame 32 are integrated.

[0053]

As described above, the method for inspecting a component mounting state of a mounting machine according to the present invention is performed in a state where a dummy substrate having a pattern for displaying a component mounting position is attached to a dummy substrate configuration plate at a substrate mounting position. The dummy component sucked by the head unit is mounted on the dummy substrate, and in this mounted state, the position of the dummy component with respect to the pattern for displaying the component mounting position of the dummy substrate is checked to check the component mounting state. Therefore, the component mounting state can be easily and clearly inspected visually. In addition, since the inspection is performed using the dummy substrate and the dummy component, the accuracy of the inspection is reduced due to the bending of the component or the component is damaged and wasted as in the case of using the actual component. Inspection can be performed effectively.

The component mounting state inspection tool used in the above method includes a dummy substrate provided with a pattern for displaying a component mounting position, and a dummy component formed by a transparent plate into a shape corresponding to the shape of the component. In addition, a scale for measuring a displacement of the dummy component when the dummy component is mounted on the dummy substrate is provided at a peripheral portion of the pattern for displaying the component mounting position and a peripheral portion of the dummy component. Therefore, the displacement amount of the mounting position of the dummy component can be easily measured.

[Brief description of the drawings]

FIG. 1 is a plan view showing a mounting machine to which the present invention is applied.

FIG. 2 is a front view showing the mounting machine.

FIG. 3 is a front view showing a head unit.

FIG. 4 is a schematic plan view showing a dummy substrate and a dummy component.

FIG. 5 is a sectional view of the dummy substrate taken along line VV in FIG. 4;

FIG. 6 is a schematic plan view of a dummy substrate main body.

7 is an enlarged plan view of a portion A in FIG.

FIG. 8 is a plan view of a dummy component.

FIG. 9 is a side view of the dummy component.

FIG. 10 is an enlarged plan view of a portion B in FIG.

[Explanation of symbols]

 3 Printed Board 5 Head Unit 21 Nozzle Member 27 Board Recognition Camera 29 Component Recognition Camera 30 Dummy Board 31 Dummy Board Main Body 32 Pattern for Component Mounting Position Display 32a Scale 33 Cross Mark 35 Edge Frame 40 Dummy Parts 41, 42 Pattern 41a Scale 44 Cross mark 45 mark

Claims (8)

[Claims] 1. A head unit having a nozzle member for picking up a component is provided. The head unit sucks a component from a component supply side and mounts the component on a printed board installed at a board installation position of a mounting machine body. In the mounting machine configured as described above, in a state where the dummy substrate having the pattern for displaying the component mounting position on the dummy substrate configuration plate is installed at the substrate installation position, the dummy substrate is formed into a shape corresponding to the shape of the component. After the dummy component is sucked by the head unit, the head unit is driven to move the dummy component to a position corresponding to the component mounting position display pattern on the dummy substrate, and the dummy component is mounted on the dummy substrate. In the mounting state, the component mounting state is inspected by checking the displacement of the dummy component with respect to the pattern for displaying the component mounting position. A component mounting state inspection method, characterized in that: 2. A component mounting state inspection tool used in the component mounting state inspection method according to claim 1, wherein: a dummy substrate having a pattern for displaying a component mounting position on a dummy substrate configuration plate; Dummy parts formed in a shape corresponding to the shape of the parts by the board, and the dummy parts are mounted on the dummy substrate at the peripheral part of the pattern for displaying the component mounting position of the dummy substrate and the peripheral part of the dummy part A tool for inspecting a component mounting state, which is provided with a scale for measuring a displacement of a dummy component when the component mounting is performed. 3. A scale for peripheral parts of a pattern for displaying a component mounting position and a scale for peripheral parts of a dummy part, wherein one of the scale is a main scale and the other is a vernier scale. 2. The component mounting state inspection tool according to 2. 4. A cross-shaped mark indicating a center position is attached to a center of a pattern for displaying a component mounting position on a dummy substrate and a center of a dummy component, respectively. The component mounting status inspection tool described. 5. A tool used for a mounting machine provided with a component recognizing unit that corrects a mounting position by imaging a component adsorbed on a head unit by an imaging unit and performing component recognition. The dummy component has an outer shape corresponding to a relatively large first-type component, and a pattern representing the first-type component is imitated around the dummy component, and the inside of the dummy component has a pattern. 5. The component mounting state inspection tool according to claim 2, wherein a pattern representing a second type component smaller than the first type component is imitated. 6. A tool used for a mounting machine in which a head unit is provided with a board recognizing image pickup means, wherein the board recognizing image pickup means picks up an image of a dummy component at four even portions and mounts the component based on the image. 3. A mark is provided to enable automatic inspection of the condition.
6. The component mounting state inspection tool according to any one of claims 5 to 5. 7. The component mounting state inspection tool according to claim 2, wherein a pattern for displaying a component mounting position is attached to each of a plurality of locations on the dummy substrate. 8. The dummy substrate according to claim 2, wherein the dummy substrate includes an edge frame having a positioning portion for the mounting machine main body, and a dummy substrate main body detachably attached to the edge frame. The component mounting status inspection tool described.