CN102548226A - Process for treating crease phenomenon during flexible printed circuit machining - Google Patents
Process for treating crease phenomenon during flexible printed circuit machining Download PDFInfo
- Publication number
- CN102548226A CN102548226A CN2012100350114A CN201210035011A CN102548226A CN 102548226 A CN102548226 A CN 102548226A CN 2012100350114 A CN2012100350114 A CN 2012100350114A CN 201210035011 A CN201210035011 A CN 201210035011A CN 102548226 A CN102548226 A CN 102548226A
- Authority
- CN
- China
- Prior art keywords
- product
- temperature
- wrinkle
- treatment process
- wrinkle phenomenon
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Landscapes
- Processing And Handling Of Plastics And Other Materials For Molding In General (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention discloses a process for treating a crease phenomenon during flexible printed circuit machining. The process comprises the following steps of: (1) putting products having the crease phenomenon into a tank containing a 55 to 65 percent sodium hydroxide solution, and soaking the products at the temperature of between 40 and 45 DEG C for 60 to 90 minutes; (2) cleaning and drying the soaked products, and performing hot pressing in 30 minutes at the setting temperature of between 130 and 140 DEG C under the pressure of 8 to 10MPa for 100 to 120 minutes; and (3) putting the products into the prepared anti-oxygen buffering agent, soaking the products at the temperature of between 30 and 35 DEG C for 15 to 20 seconds, and cleaning and drying the products to ensure that the original material property of the products is recovered. According to the process, flexible printed circuit boards having the crease phenomenon are subjected to smooth recovery treatment, and the treating effect is good.
Description
Technical field
The present invention relates to a kind of flexible circuitry processed technology, refer in particular to the treatment process of wrinkle phenomenon in a kind of flexible circuitry processing.
Background technology
Its characteristics of FPC (FPC) are: removable, crooked, reverse and can not damage lead, can bear millions of times dynamic bendings, can be applicable to well continuous motion or motion regularly in link in the system.Because its installation accuracy is high, so its planarization is had very high requirement, the wrinkle phenomenon must not be arranged, to guarantee the reliable of its function, become the part of product function, to guarantee the normal operation of product.
Yet in production practices, because the manufacturing procedure of FPC is long, its process route comprises: blanking → subsides light-sensitive surface → exposure → development → etching → paste positive and negative facial mask → pressing → surface treatment → plating → performance test → die-cut → check → packing.The inter process conveyance can be frequent, inevitably in each manufacturing procedure, all might produce the product wrinkle.Even very little wrinkle also can influence the installation accuracy of FPC, influence the function of product, this part bad accounting for is produced about 3% of product population, causes a large amount of wastes to enterprise.
Each producer does one's utmost in processing procedure control this is bad in the prior art, but can't stop the wrinkle phenomenon fully, and can't handle the product that causes the wrinkle phenomenon.
In view of this, the inventor provides a kind of has the smooth treatment process of efficient recovery to the FPC that produces the wrinkle phenomenon, and this case produces thus.
Summary of the invention
The object of the present invention is to provide and a kind of the FPC that produces the wrinkle phenomenon is effectively handled, make it reach the treatment process of wrinkle phenomenon in the flexible circuitry processing consistent with normal smooth product requirement.
For reaching above-mentioned purpose, solution of the present invention is:
The treatment process of wrinkle phenomenon in a kind of flexible circuitry processing; May further comprise the steps: the product that 1. will produce the wrinkle phenomenon is put into the alkaline solution groove; Under temperature 40-45 ℃ condition; Soaked 60-90 minute, the alkaline solution in this alkaline solution groove is that volumetric concentration is the sodium hydroxide solution of 55%-65%; 2. the product after soaking is behind the water cleaning, drying; In 30 minutes, utilize the pressing machine to carry out the heat seal compacting; The process conditions of its heat seal compacting are: temperature 130-140 ℃, pressure 8-10Mpa, time 100-120 minute, treat that the product temperature after the heat seal compacting is reduced to room temperature, and product is taken out; 3. the product that takes out is put into anti-oxygen buffer, under temperature 30-35 ℃ condition, soak 15-20 second; Behind the water cleaning, drying, make product recover original material property, wherein, anti-oxygen buffer is prepared in proportion: in the 1000ml aqueous solution; Add solid-state potassium bichromate 100g; Stirring is dissolved it fully, adds mass concentration again and be 98% sulfuric acid 30-35ml, stirs evenly to get final product.
Further, step 1. in, earlier product is placed in the screen frame of separate layer, it is that 20-25 opens that the per minute interlayer is placed product, the alkaline solution groove is put into whole screen frame product again in the gap of reservation 5-10mm between layer and layer.
Further, step 1. in, the product that produces the wrinkle phenomenon is to unify to collect through the wrinkle product that each operation before the performance test is produced to obtain.
Further, step 3. after, according to one group of every folded 10 product, layering is placed on temperature and is set to carry out stability processing in 120-130 ℃ the baking oven with the product after the treated completion, the processing time is 120-125 minute.
Further, step 2. in, will be one by one product separate with corrosion resistant plate, after stacking again, on the pressing machine, carry out the heat seal compacting.
Further, step 3. in, with the product that takes out again one by one layering separate, put into the screen frame of separate layer then, whole screen frame product is put into the anti-oxygen buffer for preparing.
After adopting such scheme; It is that the sodium hydroxide solution of 55%-65% makes the wrinkle of FPC softening that the present invention adopts concentration, and it is consistent with normal smooth product with anti-oxygen buffer wrinkle to be returned to then, thereby makes the wrinkle product be able to the recovery use; Its recovery rate can reach 93 ﹪, economizes on resources.
Secondly, step 1. in, earlier product is placed in the screen frame of separate layer; It is that 20-25 opens that the per minute interlayer is placed product, between layer and layer, keeps the gap of 5-10mm, more whole screen frame product is put into the alkaline solution groove; Therefore; In the treatment process of the present invention, can many products of single treatment, improve treatment effeciency.
Once more, step 3. after, with the product after the treated completion according to one group of every folded 10 product; Layering is placed on temperature and is set in 120-130 ℃ the baking oven; Carry out stability and handle, the processing time is 120-125 minute, therefore; Reliability of products and long-time stability can be effectively improved, in follow-up use, any problem can be do not produced.
Embodiment
Below in conjunction with specific embodiment the present invention is done detailed description.
Embodiment one:
The treatment process of wrinkle phenomenon in a kind of flexible circuitry processing, it may further comprise the steps:
Wrinkle product unification to each operation before the performance test produces is collected;
Product after collecting is placed in the screen frame of separate layer; It is 20 that the per minute interlayer is placed product; Between layer and layer, keep the gap of 5mm, the purpose of this step is: improve the efficient of the treatment process of wrinkle phenomenon in the flexible circuitry processing, promptly once can handle many products;
Whole screen frame product is put into the alkaline solution groove, under the condition of 40 ℃ of temperature, soaked 60 minutes, the alkaline solution in this alkaline solution groove is that volumetric concentration is 55% sodium hydroxide solution;
Product after soaking is behind the water cleaning, drying; Product is separated with corrosion resistant plate one by one; After stacking, in 30 minutes, utilize the pressing machine to carry out the heat seal compacting, the process conditions of its heat seal compacting are: 130 ℃ of temperature, pressure 8Mpa, 100 minutes time again; Treat that the product temperature after the heat seal compacting reduces to room temperature, product is taken out;
With the product that takes out again one by one layering separate, put into the screen frame of separate layer then, whole screen frame product is put into the anti-oxygen buffer for preparing; Under the condition of 30 ℃ of temperature, soaked 15 seconds, behind the water cleaning, drying, make product recover its original material property; Wherein, anti-oxygen buffer is prepared in proportion: in the 1000ml aqueous solution, add solid-state potassium bichromate 100g; Stirring is dissolved it fully, adds mass concentration again and be 98% sulfuric acid 30ml, stirs evenly to get final product;
According to one group of every folded 10 product, layering is placed on temperature and is set to carry out stability processing in 120 ℃ the baking oven with the product after the treated completion, and the processing time is 120 minutes, changes the normal next procedure of FPC after the processing over to.This stability is handled and is meant: because of product after soda acid and baking, the molecular structure of material is in fluctuation status, through the heat treatment of this step, its molecular state is in no longer includes big variation, thereby effectively improve reliability of products and long-time stability.
Embodiment two:
The treatment process of wrinkle phenomenon in a kind of flexible circuitry processing, it may further comprise the steps:
Wrinkle product unification to each operation before the performance test produces is collected;
Product after collecting is placed in the screen frame of separate layer; It is 25 that the per minute interlayer is placed product; Between layer and layer, keep the gap of 10mm, the purpose of this step is: improve the efficient of the treatment process of wrinkle phenomenon in the flexible circuitry processing, promptly once can handle many products;
Whole screen frame product is put into the alkaline solution groove, under the condition of 45 ℃ of temperature, soaked 90 minutes, the alkaline solution in this alkaline solution groove is that volumetric concentration is 65% sodium hydroxide solution;
Product after soaking is behind the water cleaning, drying; Product is separated with corrosion resistant plate one by one; After stacking, in 30 minutes, utilize the pressing machine to carry out the heat seal compacting, the process conditions of its heat seal compacting are: 140 ℃ of temperature, pressure 10Mpa, 120 minutes time again; Treat that the product temperature after the heat seal compacting reduces to room temperature, product is taken out;
With the product that takes out again one by one layering separate, put into the screen frame of separate layer then, whole screen frame product is put into the anti-oxygen buffer for preparing; Under the condition of 35 ℃ of temperature, soaked 20 seconds, behind the water cleaning, drying, make product recover its original material property; Wherein, anti-oxygen buffer is prepared in proportion: in the 1000ml aqueous solution, add solid-state potassium bichromate 100g; Stirring is dissolved it fully, adds mass concentration again and be 98% sulfuric acid 35ml, stirs evenly to get final product;
According to one group of every folded 10 product, layering is placed on temperature and is set to carry out stability processing in 130 ℃ the baking oven with the product after the treated completion, and the processing time is 125 minutes, changes the normal next procedure of FPC after the processing over to.Equally; This stability is handled and is meant: because of product after soda acid and baking, the molecular structure of material is in fluctuation status, through the heat treatment of this step; Its molecular state is in no longer includes big variation, thereby effectively improve reliability of products and long-time stability.
It is consistent with normal smooth product that the present invention can make wrinkle return to, thereby make the wrinkle product be able to recover to use, and can not produce excessive glue, and concrete effect sees the following form:
The treatment process test data of wrinkle phenomenon and evaluation result table
Can be known that by last table when the volumetric concentration of sodium hydroxide solution is got 55%-65%, temperature is 40-45 ℃, product soaked 60-90 minute; Soak the back in 30 minutes, under temperature 130-140 ℃, pressure 8-10Mpa, time 100-120 minute, on the pressing machine, carry out the heat seal compacting; Then, in temperature 30-35 ℃ anti-oxygen buffer, soak time is that 15-20 is during second; Effect is best, and promptly in process conditions scope of the present invention, the effect that the wrinkle product recovers is best; Slip amesdial evenness test bias value 0.05 by in the table can be known; This test value is littler than the test value of other process conditions, and therefore, it is better than using other process conditions to use process conditions of the present invention to make the smooth degree of wrinkle product recovery.
In addition, the present invention is following to the requirement of technology point:
1, the product after alkaline solution soaks must carry out hot pressing in 30 minutes, and the time is short more good more, surpasses 30 minutes and carries out hot pressing, and it is smooth that wrinkle are difficult to recover.
2, the concentration of the solution that disposes is wanted accurately, and the temperature of technological requirement, time are wanted strict management and control.
The above is merely embodiments of the invention, is not the restriction to this case, and all equivalent variations of doing according to the key of this case all fall into the protection range of this case.
Claims (6)
1. the treatment process of wrinkle phenomenon during a flexible circuitry is processed; It is characterized in that: may further comprise the steps: the product that 1. will produce the wrinkle phenomenon is put into the alkaline solution groove; Under temperature 40-45 ℃ condition; Soaked 60-90 minute, the alkaline solution in this alkaline solution groove is that volumetric concentration is the sodium hydroxide solution of 55%-65%; 2. the product after soaking is behind the water cleaning, drying; In 30 minutes, utilize the pressing machine to carry out the heat seal compacting; The process conditions of its heat seal compacting are: temperature 130-140 ℃, pressure 8-10Mpa, time 100-120 minute, treat that the product temperature after the heat seal compacting is reduced to room temperature, and product is taken out; 3. the product that takes out is put into anti-oxygen buffer, under temperature 30-35 ℃ condition, soak 15-20 second; Behind the water cleaning, drying, make product recover original material property, wherein, anti-oxygen buffer is prepared in proportion: in the 1000ml aqueous solution; Add solid-state potassium bichromate 100g; Stirring is dissolved it fully, adds mass concentration again and be 98% sulfuric acid 30-35ml, stirs evenly to get final product.
2. the treatment process of wrinkle phenomenon in a kind of flexible circuitry processing as claimed in claim 1; It is characterized in that: step 1. in; Earlier product is placed in the screen frame of separate layer; It is that 20-25 opens that the per minute interlayer is placed product, between layer and layer, keeps the gap of 5-10mm, more whole screen frame product is put into the alkaline solution groove.
3. the treatment process of wrinkle phenomenon in a kind of flexible circuitry processing as claimed in claim 1 is characterized in that: step 1. in, the product that produces the wrinkle phenomenon is to unify to collect through the wrinkle product that each operation before the performance test is produced to obtain.
4. the treatment process of wrinkle phenomenon in a kind of flexible circuitry processing as claimed in claim 1; It is characterized in that: step 3. after; With the product after the treated completion according to one group of every folded 10 product; Layering is placed on temperature and is set in 120-130 ℃ the baking oven, carries out stability and handles, and the processing time is 120-125 minute.
5. the treatment process of wrinkle phenomenon in a kind of flexible circuitry processing as claimed in claim 1 is characterized in that: step 2. in, product is separated with corrosion resistant plate one by one, after stacking, on the pressing machine, carries out the heat seal compacting again.
6. the treatment process of wrinkle phenomenon in a kind of flexible circuitry processing as claimed in claim 1; It is characterized in that: step 3. in; With the product that takes out again one by one layering separate, put into the screen frame of separate layer then, whole screen frame product is put into the anti-oxygen buffer for preparing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210035011.4A CN102548226B (en) | 2012-02-16 | 2012-02-16 | Process for treating crease phenomenon during flexible printed circuit machining |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201210035011.4A CN102548226B (en) | 2012-02-16 | 2012-02-16 | Process for treating crease phenomenon during flexible printed circuit machining |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN102548226A true CN102548226A (en) | 2012-07-04 |
| CN102548226B CN102548226B (en) | 2014-08-06 |
Family
ID=46353845
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201210035011.4A Active CN102548226B (en) | 2012-02-16 | 2012-02-16 | Process for treating crease phenomenon during flexible printed circuit machining |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN102548226B (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104244600A (en) * | 2014-07-25 | 2014-12-24 | 昆山圆裕电子科技有限公司 | Board surface flattening technology of flexible printed circuit board for notebook computer |
| CN106535465A (en) * | 2016-11-15 | 2017-03-22 | 智恩电子(大亚湾)有限公司 | Shock-resistant printed circuit board |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5744759A (en) * | 1996-05-29 | 1998-04-28 | International Business Machines Corporation | Circuit boards that can accept a pluggable tab module that can be attached or removed without solder |
| CN1330509A (en) * | 2000-04-28 | 2002-01-09 | 福田金属箔粉工业株式会社 | Copper foil for printed circuit board and its surface treatment method |
| JP2011179078A (en) * | 2010-03-02 | 2011-09-15 | Fukuda Metal Foil & Powder Co Ltd | Treated copper foil |
-
2012
- 2012-02-16 CN CN201210035011.4A patent/CN102548226B/en active Active
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5744759A (en) * | 1996-05-29 | 1998-04-28 | International Business Machines Corporation | Circuit boards that can accept a pluggable tab module that can be attached or removed without solder |
| CN1330509A (en) * | 2000-04-28 | 2002-01-09 | 福田金属箔粉工业株式会社 | Copper foil for printed circuit board and its surface treatment method |
| JP2011179078A (en) * | 2010-03-02 | 2011-09-15 | Fukuda Metal Foil & Powder Co Ltd | Treated copper foil |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104244600A (en) * | 2014-07-25 | 2014-12-24 | 昆山圆裕电子科技有限公司 | Board surface flattening technology of flexible printed circuit board for notebook computer |
| CN104244600B (en) * | 2014-07-25 | 2018-01-23 | 昆山圆裕电子科技有限公司 | A kind of notebook computer FPC plate face flatness technique |
| CN106535465A (en) * | 2016-11-15 | 2017-03-22 | 智恩电子(大亚湾)有限公司 | Shock-resistant printed circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| CN102548226B (en) | 2014-08-06 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN100556249C (en) | Jack process of printed circuit board | |
| CN102958282B (en) | A kind of wiring board adopts the circuit manufacturing method of wet film+dry film | |
| CN106028655B (en) | A kind of quick nog plate method for adhering film of outer-layer circuit plate | |
| CN103215592B (en) | Etching cream, applications of etching cream, and method for etching nano silver conductive material by utilizing etching cream | |
| CN102548226B (en) | Process for treating crease phenomenon during flexible printed circuit machining | |
| CN103096631A (en) | Processing method of printed circuit board (PCB) and PCB | |
| CN107592742A (en) | A kind of circuit forming method of pcb board | |
| CN106028663A (en) | Manufacturing process for radar built-in circuit board | |
| CN103606595A (en) | Reutilization method and grating line recovery method of defective monocrystalline silicon battery sheet after sintering | |
| CN103068174A (en) | Manufacturing method for metallization slotted hole circuit board | |
| CN104320926A (en) | Surface processing method of circuit board | |
| CN106328880A (en) | Surface processing method of tab easily plated with tin | |
| CN103677409B (en) | A kind of processing technology of the touch module of the two-sided conducting membrane structure of GF2 | |
| CN105449036A (en) | Reworking treatment method for poor screen printing sheet | |
| CN106245048A (en) | Pyrite tube core acid washing method | |
| CN111403838A (en) | Recycling method of retired power lithium battery diaphragm paper | |
| CN101626661B (en) | Method for manufacturing double-side hollowed-out plates | |
| CN206293270U (en) | Two-side film membrane inductor | |
| CN108203819A (en) | A kind of silver-plated teaching test method of glass fibre | |
| CN102921665A (en) | Cleaning solution and cleaning method for silicon nitride film on surface of silicon chip | |
| CN105198227A (en) | Frosted glass production process | |
| CN208208730U (en) | A kind of semiconductor packaging system | |
| CN103337563A (en) | Method for reworking defective printing piece of crystalline silicon solar cell | |
| CN104267851A (en) | Manufacturing technology for improved touch module with GF2 double-surface conductive film structure | |
| CN110176522A (en) | A kind of alkaline etching technique of SE solar battery |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C06 | Publication | ||
| PB01 | Publication | ||
| C10 | Entry into substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |