CN208208730U - A kind of semiconductor packaging system - Google Patents
A kind of semiconductor packaging system Download PDFInfo
- Publication number
- CN208208730U CN208208730U CN201820928118.4U CN201820928118U CN208208730U CN 208208730 U CN208208730 U CN 208208730U CN 201820928118 U CN201820928118 U CN 201820928118U CN 208208730 U CN208208730 U CN 208208730U
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- China
- Prior art keywords
- semiconductor
- packaging system
- semiconductor packaging
- board
- machine
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Abstract
The utility model belongs to semiconductor packaging device field, and it discloses a kind of semiconductor packaging systems, including sequentially connected first semiconductor board, the first temporary storage machine, the first curing apparatus, the second semiconductor board, caching machine, the second curing apparatus；First semiconductor board is more and more the first semiconductor boards are imported in the first temporary storage machine by deflecting conveyer.The purpose of this utility model is to provide a kind of compact layout, semiconductor packaging system high in machining efficiency.
Description
Technical field
The utility model relates to field of semiconductor processing, specially a kind of semiconductor packaging system.
Background technique
Existing LED semiconductor machining system usually by bonder, AOI detection device, the equipment that is heating and curing, dispensing or
Molding equipment, curing apparatus composition, but equipment above-mentioned in existing system be all it is single, for making full use of plus
Work space is unfavorable.
Utility model content
The purpose of this utility model is to provide a kind of compact layout, semiconductor packaging system high in machining efficiency.
To achieve the above object, the utility model provides the following technical solutions: a kind of semiconductor packaging system, including successively
First semiconductor board of connection, the first temporary storage machine, the first curing apparatus, the second semiconductor board, caching machine, the second solidification are set
It is standby；First semiconductor board is more and more the first semiconductor boards import first by deflecting conveyer and keep in
In machine.
In above-mentioned semiconductor packaging system, first is equipped between the deflecting conveyer and the first temporary storage machine
AOI detection device.
In above-mentioned semiconductor packaging system, it is equipped between first curing apparatus and the second semiconductor board
CT-AOI detection device.
In above-mentioned semiconductor packaging system, it is equipped between the CT-AOI detection device and the second semiconductor board
Second temporary storage machine.
In above-mentioned semiconductor packaging system, set between the caching machine and the second curing apparatus equipped with Photoelectric Detection
It is standby.
In above-mentioned semiconductor packaging system, third is equipped between the optoelectronic detecting device and the second curing apparatus
Temporary storage machine.
In above-mentioned semiconductor packaging system, second curing apparatus includes preheating section and bringing-up section, described
Preheating section is connect with caching machine, and the bringing-up section is connect with preheating section.
In above-mentioned semiconductor packaging system, first semiconductor board is bonder, and described the second half lead
Body board is dispenser or molding equipment.
The beneficial effect of this programme is:
It is heating and curing equipment by many-to-one bonder-, may be implemented to reach maximization layout in a limited space
Purpose, effectively utilize space, improve production efficiency.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of the embodiments of the present invention 1.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without making creative work
Every other embodiment obtained, fall within the protection scope of the utility model.
Embodiment 1
Referring to Fig. 1, a kind of semiconductor packaging system, including sequentially connected first semiconductor board 1, the first temporary storage machine
2, the first curing apparatus 3, the second semiconductor board 4, caching machine 5, the second curing apparatus 6；First semiconductor board 1 is
More and more the first semiconductor boards 1 are imported in the first temporary storage machine 2 by deflecting conveyer 7.Wherein, described the first half
Conductor board 1 is bonder, and second semiconductor board 4 is dispenser or molding equipment.
In the present embodiment, process is that will then be heating and curing after LED semiconductor die bond, then reheat solidification,
Then dispensing, finally heated solidification are carried out again.It is solid using many-to-one bonder-the first since die bond process is slow
Processing efficiency can effectively be provided by changing equipment 3.
In the present embodiment, the first AOI detection device is equipped between the deflecting conveyer 7 and the first temporary storage machine 2
8, CT-AOI detection device 9, the CT-AOI inspection are equipped between first curing apparatus 3 and the second semiconductor board 4
The second temporary storage machine 10 is equipped between measurement equipment 9 and the second semiconductor board 4, between the caching machine 5 and the second curing apparatus 6
Equipped with optoelectronic detecting device 11, third temporary storage machine 12 is equipped between the optoelectronic detecting device 11 and the second curing apparatus 6.
First AOI detection device 8 mainly die bond effect is detected, CT-AOI detection device 9 mainly to die bond after
Solidification effect is detected, and optoelectronic detecting device 11 mainly detects dispensing effect.
The effect of temporary storage machine in the present embodiment is mainly that NG keeps in the straight-through function of OK, will when there is rejected product
Rejected product is temporary, and qualified product is straight-through.
The main function of caching machine 5 in the present embodiment is first in first out, and the LED semiconductor after dispensing is cached.
In the present embodiment, second curing apparatus 6 includes preheating section 61 and bringing-up section 62, the preheating section 61
It is connect with caching machine 5, the bringing-up section 62 is connect with preheating section 61.It, can be using turning in this way when workshop space is inadequate
Connector connection bringing-up section 62 and preheating section 61.
It is obvious to a person skilled in the art that the present invention is not limited to the details of the above exemplary embodiments, and
And without departing substantially from the spirit or essential attributes of the utility model, it can realize that this is practical new in other specific forms
Type.Therefore, in all respects, the present embodiments are to be considered as illustrative and not restrictive, this is practical new
The range of type is indicated by the appended claims rather than the foregoing description, it is intended that containing for the equivalent requirements of the claims will be fallen in
All changes in justice and range are embraced therein.It should not treat any reference in the claims as limiting
Related claim.
Claims (8)
1. a kind of semiconductor packaging system, including sequentially connected first semiconductor board, the first temporary storage machine, the first solidification are set
Standby, the second semiconductor board, caching machine, the second curing apparatus；It is characterized in that, first semiconductor board be more and
More the first semiconductor boards are imported in the first temporary storage machine by deflecting conveyer.
2. semiconductor packaging system according to claim 1, which is characterized in that the deflecting conveyer and first is temporarily
It deposits and is equipped with the first AOI detection device between machine.
3. semiconductor packaging system according to claim 1, which is characterized in that first curing apparatus and the second half
CT-AOI detection device is equipped between conductor board.
4. semiconductor packaging system according to claim 3, which is characterized in that the CT-AOI detection device and second
The second temporary storage machine is equipped between semiconductor board.
5. semiconductor packaging system according to claim 4, which is characterized in that the caching machine and the second curing apparatus
Between be equipped with optoelectronic detecting device.
6. semiconductor packaging system according to claim 5, which is characterized in that the optoelectronic detecting device and second is consolidated
Change and is equipped with third temporary storage machine between equipment.
7. semiconductor packaging system according to claim 1, which is characterized in that second curing apparatus includes preheating
Section and bringing-up section, the preheating section are connect with caching machine, and the bringing-up section is connect with preheating section.
8. -7 any semiconductor packaging system according to claim 1, which is characterized in that first semiconductor board
For bonder, second semiconductor board is dispenser or molding equipment.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820928118.4U CN208208730U (en) | 2018-06-15 | 2018-06-15 | A kind of semiconductor packaging system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820928118.4U CN208208730U (en) | 2018-06-15 | 2018-06-15 | A kind of semiconductor packaging system |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208208730U true CN208208730U (en) | 2018-12-07 |
Family
ID=64496910
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820928118.4U Expired - Fee Related CN208208730U (en) | 2018-06-15 | 2018-06-15 | A kind of semiconductor packaging system |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208208730U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108807642A (en) * | 2018-06-15 | 2018-11-13 | 佛山宝芯智能科技有限公司 | A kind of semiconductor module package system and packaging method |
-
2018
- 2018-06-15 CN CN201820928118.4U patent/CN208208730U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN108807642A (en) * | 2018-06-15 | 2018-11-13 | 佛山宝芯智能科技有限公司 | A kind of semiconductor module package system and packaging method |
| CN108807642B (en) * | 2018-06-15 | 2024-03-29 | 佛山宝芯智能科技有限公司 | Semiconductor modularized packaging system and packaging method |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20181207 Termination date: 20200615 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |