CN104244600A - Board surface flattening technology of flexible printed circuit board for notebook computer - Google Patents
Board surface flattening technology of flexible printed circuit board for notebook computer Download PDFInfo
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- CN104244600A CN104244600A CN201410359569.7A CN201410359569A CN104244600A CN 104244600 A CN104244600 A CN 104244600A CN 201410359569 A CN201410359569 A CN 201410359569A CN 104244600 A CN104244600 A CN 104244600A
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- circuit board
- baking
- printed circuit
- flexible printed
- notebook computer
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Abstract
The invention discloses a board surface flattening technology of a flexible printed circuit board for a notebook computer. The technology comprises the following steps that first, preparation work is carried out, wherein the flexible printed circuit board to be flattened is prepared, whether a drying oven meets the secure use regulations or not is checked, and a plurality of sheets of white paper for flame retardance and two silicone iron pads are prepared; second, pre-baking is carried out, wherein the flexible printed circuit board to be baked is vertically placed in shelves of the drying oven; third, secondary baking is carried out, wherein secondary baking is carried out on the baked flexible printed circuit board; fourth, inspection is carried out after baking, wherein the flexible printed circuit board processed in the procedures is inspected so that whether the flatness of the flexible printed circuit board meets the technological requirement or not can be checked. According to the board surface flattening technology of the flexible printed circuit board for the notebook computer, through two times of baking carried out on the flexible printed circuit board, the flexible printed circuit board is tightly clamped by the silicone iron pads through the gravity of the silicone iron pads, and due to the high-temperature baking effect of the drying oven, the purposes that the board surface flatness of the flexible printed circuit board is high, and the final board warp is smaller than 6 mm are achieved.
Description
[technical field]
The invention belongs to flexible circuit board manufacture technology field, more particularly, relate to notebook computer flexible circuit board plate surface evenness technique.
[background technology]
Along with keyboard Luminescence Uniformity requires more and more higher, require also more and more higher to flexible PCB plate surface evenness.Make processing procedure from flexible PCB, the processing procedure affecting flexible circuit plate flatness is the baking of white photosensitive-ink.During the baking of white photosensitive-ink, the stress produced due to ink solidification can cause flexible PCB plate to stick up.Alternate manner is for substitute white photosensitive-ink with white covering film, but because white covering film cost is higher and processing procedure tolerance (± 0.1mm) is larger than white photosensitive-ink processing procedure tolerance (± 0.03mm), affect the yields of product, generally do not use.
Therefore, be necessary to provide a kind of novel process to solve the problems referred to above.
[summary of the invention]
Technical problem to be solved by this invention is, provides a kind of notebook computer flexible circuit board screen board surface evenness technique, solves flexible PCB plate in existing moulding process and stick up too high problem.
For solving the problems of the technologies described above, the present invention adopts following technical scheme, comprises the following steps.
(1) preparation: get out smooth flexible PCB, check whether baking oven meets safe handling rule, some blank sheet of paper (fire-retardant), two pieces of burning pair iron plates;
(2) prebake conditions: flexible PCB to be baked is erect and is put in baking oven layer frame;
(3) secondary baking: secondary baking is carried out to the flexible PCB completing prebake conditions;
(4) check after baking: check the flexible PCB completing above flow process, whether its evenness reaches technological requirement.
Further, in described step (2), blank sheet of paper has flame-retardant nature.
Further, in described step (2), bake out temperature is 100 DEG C, and the time is 30min.
Further, in described step (3), each block flexible PCB is clipped in the middle of two blank sheet of paper.
Further, in described step (3), be topmost mixed in blank sheet of paper bottom to burn and pay in the middle of iron plate and flexible PCB.
Further, in described step (3), all the other blank sheet of paper are mixed in the middle of two flexible PCBs.
Further, in described step (3), two pieces are burnt the outermost end of paying iron plate and laying respectively at interlayer.
Further, in described step (3), bake out temperature is 150 DEG C, and the time is 50min.
The invention has the beneficial effects as follows: by twice baking to flexible PCB, utilize to burn and pay the gravity of iron plate and step up flexible PCB, by the effect of baking oven high-temperature baking, reach flexible PCB plate surface evenness high, most soleplate sticks up the object being all less than 6mm.
[accompanying drawing explanation]
Fig. 1 is sandwich schematic diagram of the present invention.
In figure: 1, flexible PCB; 2, blank sheet of paper; 3, a pair iron plate is burnt.
[embodiment]
Below in conjunction with specific embodiment the present invention done and be described further.
Refer to Fig. 1, notebook computer flexible circuit board plate surface evenness process of the present invention, comprise baking oven (not marking), comprise the steps: (1) preparation: get out smooth flexible PCB 1, check whether baking oven meets safe handling rule, some blank sheet of paper 2 (fire-retardant), two pieces of burning pair iron plates 3; (2) prebake conditions: flexible PCB 1 to be baked is erect and is put in baking oven layer frame, open baking oven power supply, arranging bake out temperature is 100 DEG C, and the time is 30min.After having toasted, flexible PCB 1 is pulled out baking box; (3) secondary baking: secondary baking is carried out to the flexible PCB 1 completing prebake conditions.As shown in Figure 1, during secondary baking, each block flexible PCB 1 is clipped in the middle of two blank sheet of paper 2, topmost being mixed in blank sheet of paper 2 bottom to burn pays in the middle of iron plate 3 and flexible PCB 1, all the other blank sheet of paper 2 are mixed in the middle of two flexible PCBs 1, two pieces are burnt the outermost end of paying iron plate 3 and laying respectively at interlayer, burn the gravity paying iron plate 3 and are compressed by the flexible PCB 1 be mingled with therebetween, guarantee the plate surface evenness of flexible PCB 1.Ready interlayer 100 level be put in baking oven layer frame, open baking oven power supply, arranging bake out temperature is 150 DEG C, and the time is 50min; (4) check after baking: check the flexible PCB 1 completing above flow process, whether its evenness reaches technological requirement (plate sticks up < 6mm).
In one embodiment, 100 kinds, described interlayer accompanies 5 pieces of flexible PCBs 1, is not limited in this in other embodiments to the quantity of flexible PCB 1.
The present invention is by twice baking to flexible PCB 1, and utilize the gravity burning pair iron plate 3 to step up flexible PCB 1, by the effect of baking oven high-temperature baking, reach flexible PCB 1 plate surface evenness high, plate sticks up low object.
Be different from the flexible circuit plate flatness technique of prior art, stuck up by flexible PCB 1 plate of this processes and all control at below 6mm, compare and use old technology (plate sticks up and is more than 8mm) to make much progress.
Schematically above be described the present invention and execution mode thereof, this description does not have restricted, and also just one of the embodiments of the present invention shown in accompanying drawing, actual structure is not limited thereto.So, if those of ordinary skill in the art enlightens by it, when not departing from the invention aim, designing the frame mode similar to this technical scheme and embodiment without creationary, all should protection scope of the present invention be belonged to.
Claims (6)
1. a notebook computer flexible circuit board plate surface evenness technique, comprises baking oven, it is characterized in that, include following steps:
(1) preparation: get out smooth flexible PCB, some blank sheet of paper, two pieces of burning pair iron plates;
(2) prebake conditions: flexible PCB to be baked is erect and is put in baking oven layer frame, in described prebake conditions, bake out temperature is 100 DEG C, and the time is 30min.
(3) secondary baking: carry out secondary baking to the flexible PCB completing prebake conditions, in described secondary baking, bake out temperature is 150 DEG C, and the time is 50min.
(4) check after baking: check the flexible PCB completing above flow process, whether its evenness reaches technological requirement.
2. the flexible circuit board plate surface evenness technique of the notebook computer as described in right 1, is characterized in that: described paper has flame-retardant nature.
3. the flexible circuit board plate surface evenness technique of the notebook computer as described in right 1, it is characterized in that: in described secondary baking, each block flexible PCB is clipped in the middle of two blank sheet of paper.
4. the flexible circuit board plate surface evenness technique of the notebook computer as described in right 1, is characterized in that: in described secondary baking, is topmost mixed in blank sheet of paper bottom to burn and pays in the middle of iron plate and flexible PCB.
5. the flexible circuit board plate surface evenness technique of the notebook computer as described in right 1, is characterized in that: in described secondary baking, and residue blank sheet of paper is mixed in the middle of two flexible PCBs.
6. the flexible circuit board plate surface evenness technique of the notebook computer as described in right 1, is characterized in that: in described secondary baking, and two pieces are burnt the outermost end of paying iron plate and laying respectively at interlayer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410359569.7A CN104244600B (en) | 2014-07-25 | 2014-07-25 | A kind of notebook computer FPC plate face flatness technique |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410359569.7A CN104244600B (en) | 2014-07-25 | 2014-07-25 | A kind of notebook computer FPC plate face flatness technique |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104244600A true CN104244600A (en) | 2014-12-24 |
| CN104244600B CN104244600B (en) | 2018-01-23 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201410359569.7A Active CN104244600B (en) | 2014-07-25 | 2014-07-25 | A kind of notebook computer FPC plate face flatness technique |
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| CN (1) | CN104244600B (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105307426A (en) * | 2015-09-16 | 2016-02-03 | 深圳市景旺电子股份有限公司 | Curing method used for preventing swelling of glue-free stratified area of multi-layer soft board |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07307548A (en) * | 1994-05-10 | 1995-11-21 | Sumitomo Electric Ind Ltd | Method of processing flexible printed wiring board |
| CN101022702A (en) * | 2006-05-18 | 2007-08-22 | 黄文平 | Flexible circuit board crimp device and quick crimp machine using the same device |
| CN101730389A (en) * | 2008-10-15 | 2010-06-09 | 比亚迪股份有限公司 | Method for manufacturing single-side hollow out flexible circuit board |
| CN101801156A (en) * | 2009-02-06 | 2010-08-11 | 周伯如 | Method for manufacturing flexible printed circuit board and structure thereof |
| CN102548226A (en) * | 2012-02-16 | 2012-07-04 | 厦门华天华电子有限公司 | Process for treating crease phenomenon during flexible printed circuit machining |
-
2014
- 2014-07-25 CN CN201410359569.7A patent/CN104244600B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07307548A (en) * | 1994-05-10 | 1995-11-21 | Sumitomo Electric Ind Ltd | Method of processing flexible printed wiring board |
| CN101022702A (en) * | 2006-05-18 | 2007-08-22 | 黄文平 | Flexible circuit board crimp device and quick crimp machine using the same device |
| CN101730389A (en) * | 2008-10-15 | 2010-06-09 | 比亚迪股份有限公司 | Method for manufacturing single-side hollow out flexible circuit board |
| CN101801156A (en) * | 2009-02-06 | 2010-08-11 | 周伯如 | Method for manufacturing flexible printed circuit board and structure thereof |
| CN102548226A (en) * | 2012-02-16 | 2012-07-04 | 厦门华天华电子有限公司 | Process for treating crease phenomenon during flexible printed circuit machining |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105307426A (en) * | 2015-09-16 | 2016-02-03 | 深圳市景旺电子股份有限公司 | Curing method used for preventing swelling of glue-free stratified area of multi-layer soft board |
| CN105307426B (en) * | 2015-09-16 | 2018-10-23 | 深圳市景旺电子股份有限公司 | A kind of curing for avoiding multilayer soft board from being heaved without glue demixing zone |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104244600B (en) | 2018-01-23 |
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