CN203896592U - Circuit board laying apparatus - Google Patents
Circuit board laying apparatus Download PDFInfo
- Publication number
- CN203896592U CN203896592U CN201420238218.6U CN201420238218U CN203896592U CN 203896592 U CN203896592 U CN 203896592U CN 201420238218 U CN201420238218 U CN 201420238218U CN 203896592 U CN203896592 U CN 203896592U
- Authority
- CN
- China
- Prior art keywords
- circuit board
- placing device
- board placing
- placement plate
- accepting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000463 material Substances 0.000 claims abstract description 10
- 238000007639 printing Methods 0.000 abstract description 2
- 238000004519 manufacturing process Methods 0.000 description 5
- 230000007306 turnover Effects 0.000 description 4
- 238000002360 preparation method Methods 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 238000006243 chemical reaction Methods 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 238000000151 deposition Methods 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 230000003252 repetitive effect Effects 0.000 description 1
Abstract
The utility model provides a circuit board laying apparatus made of high temperature resistance materials. The circuit board laying apparatus comprises a first laying plate and a second laying plate, which are fixed with an included angle. The first laying plate comprises a plurality of first accepting grooves arranged at an interval. The second laying plate comprises a plurality of second accepting grooves arranged at an interval. The plurality of second accepting grooves are corresponding to the plurality of first accepting grooves. Extension direction of each two of the second accepting groove and the first accepting groove which are opposite is mutually perpendicular. According to the circuit board laying apparatus provided by the utility model, the circuit board after being repaired is embedded and accommodated through the first accepting grooves and the second accepting grooves, which are corresponding one to one. A long side and a short side are blocked in the first accepting grooves and the second accepting grooves of the circuit board laying apparatus. Stability is high and the plate is prevented from reversing. No bump between the adjacent two circuit boards is present. The circuit board with double surfaces repaired is laid, and a plate surface is not scratched or printing ink is not scraped.
Description
Technical field
The utility model relates to a kind of placing device, especially, relates to a kind of circuit board placing device.
Background technology
When circuit board production board is checked, some character printings are unclear or have the production board that reveals copper to need to pick out repairing.At present, common way is that the production board after repairing is well positioned on pig cage or thousand layers of frame and waits to bake, but, if be placed in pig cage, deposit, production board is because gong has removed technique edges, extremely easily bump against edges of boards scratch circuit and be not easy to pick and place plank, if keep flat on thousand layers of frame, plate body is fixing easily wipes the ink that flower repairing is got on, and can only repair one side baking sheet, repetitive operation by one side, efficiency is low, in addition, after repairing, depositing in production board on pig cage or thousand layers of frame needs again to retrieve and puts into baking box baking sheet, complex operation.
Utility model content
For solving the problems of the technologies described above, the utility model provides a kind of circuit board placing device of insertion slot type, can place the circuit board of two-sided repairing, can scratch circuit or scratch ink, and can put into baking box baking sheet together with circuit board, and reduce and to get plate and put plate operation, increase work efficiency.
The circuit board placing device that the utility model provides, the material of described circuit board placing device is high temperature resistant material, it comprises and is mutually angle fixing the first placement plate and the second placement plate, described the first placement plate comprises a plurality of spaced the first accepting grooves, described the second placement plate comprises a plurality of spaced the second accepting grooves, a plurality of described the second accepting grooves are corresponding one by one with a plurality of described the first accepting grooves, and every two relative the second accepting grooves are mutually vertical with the first accepting groove bearing of trend.
In a kind of preferred embodiment of the circuit board placing device providing at the utility model, described circuit board placing device also comprises handle, and described handle is located at the two ends of described the first placement plate.
In a kind of preferred embodiment of the circuit board placing device providing at the utility model, described the first placement plate and described the second placement plate are rectangular-shaped, and the two vertical setting mutually.
In a kind of preferred embodiment of the circuit board placing device providing at the utility model, described circuit board placing device also comprises buffer structure, and described buffer structure is located at the inner surface of described the first accepting groove and the second accepting groove.
In a kind of preferred embodiment of the circuit board placing device providing at the utility model, a plurality of described the first accepting grooves are arranged parallel to each other each other.
In a kind of preferred embodiment of the circuit board placing device providing at the utility model, a plurality of described the first accepting grooves spacing is each other identical.
In a kind of preferred embodiment of the circuit board placing device providing at the utility model, the spacing between adjacent two described the first accepting grooves is 10mm.
In a kind of preferred embodiment of the circuit board placing device providing at the utility model, the degree of depth of described the first accepting groove is 10mm, and width is 5mm.
In a kind of preferred embodiment of the circuit board placing device providing at the utility model, described circuit board placing device also comprises two side plates, and described two side plates are symmetricly set in respectively the two ends of described the first placement plate.
In a kind of preferred embodiment of the circuit board placing device providing at the utility model, the material of described circuit board placing device is high temperature resistant material.
Compared to prior art, the circuit board placing device that the utility model provides is by the first accepting groove and the second accepting groove are embedded the circuit board holding after repairing one to one, its long limit and minor face are all fastened in first accepting groove and the second accepting groove of described circuit board placing device, steadiness is high, can avoid turnover panel, between adjacent two circuit boards, can not bump, can place the circuit board of two-sided repairing, can scratch plate face or scratch ink, and, described circuit board placing device adopts high temperature resistant material preparation, until described circuit board placing device, pile after circuit board, can directly described circuit board placing device be put into baking box baking sheet together with circuit board, reduced and got plate and put plate operation, efficiency is high.
Accompanying drawing explanation
In order to be illustrated more clearly in the technical scheme in the utility model embodiment, below the accompanying drawing of required use during embodiment is described is briefly described, apparently, accompanying drawing in the following describes is only embodiment more of the present utility model, for those of ordinary skills, do not paying under the prerequisite of creative work, can also according to these accompanying drawings, obtain other accompanying drawing, wherein:
Fig. 1 is the structural representation of a kind of embodiment of circuit board placing device of providing of the utility model;
Fig. 2 is the structural representation of the another kind of embodiment of the circuit board placing device that provides of the utility model.
Embodiment
Below in conjunction with the accompanying drawing in the utility model embodiment, the technical scheme in the utility model embodiment is clearly and completely described, obviously, described embodiment is only a part of embodiment of the present utility model, rather than whole embodiment.Embodiment based in the utility model, those of ordinary skills are not making all other embodiment that obtain under creative work prerequisite, all belong to the scope of the utility model protection.
Referring to Fig. 1, is the structural representation of a kind of embodiment of circuit board placing device of providing of the utility model.Described circuit board placing device 100 is roughly L-type, comprises and is mutually angle fixing the first placement plate 1 and the second placement plate 2, buffer structure (not shown) and handle 3.Described the first placement plate 1 and described the second placement plate 2 can be integrated part, can be also the two parts that separate.Described the first placement plate 1 and described the second placement plate 2 are rectangular-shaped, and the two vertical setting mutually.Described the first placement plate 1 and described the second placement plate 2 all adopt high temperature resistant material preparation.
Described the first placement plate 1 comprises a plurality of spaced the first accepting grooves 11.Described the first accepting groove 11 is located on a wherein plate face of described the first placement plate.A plurality of described the first accepting grooves 11 are arranged parallel to each other each other.The quantity of described the first accepting groove 11 has determined the accommodating amount of circuit board placing device, has how many described the first accepting grooves 11, and described circuit board placing device 100 just can hold how many circuit boards.
Preferably, a plurality of described the first accepting grooves 11 spacing is each other identical.
Preferably, the spacing between adjacent two described the first accepting grooves 11 is 10mm.
The degree of depth of described the first accepting groove 11 does not make its turnover panel be advisable with engaging circuit board, and the thickness of width and circuit board is suitable.Preferably, the degree of depth of described the first accepting groove 11 is 10mm, and width is 5mm.
Described the second placement plate 2 is perpendicular to the edge setting of described the first placement plate 1.Described the second placement plate 2 comprises a plurality of spaced the second accepting grooves 21.Described the second accepting groove 21 is located on the plate face of described second placement plate 2 contiguous described the first placement plate 1.A plurality of described the second accepting grooves 21 are corresponding one by one with the first accepting groove 11 of described the first placement plate 1.Every two relative the second accepting grooves 21 are mutually vertical with the first accepting groove 11 bearing of trends.A plurality of described the second accepting grooves 21 on described the second placement plate 2 plate faces arrange with a plurality of described the first accepting grooves 11 on described the first placement plate 1 plate face arrange identical.The degree of depth of described the second accepting groove 21 and width are also consistent with described the first accepting groove 11.
Described buffer structure is located at the inner surface of described the first accepting groove 11 and described the second accepting groove 21.Described buffer structure can slow down the friction of circuit board 200 and described the first accepting groove 11 and described the second accepting groove 21 inner surfaces, avoids described in scratch circuit board 200 plate faces or scratches ink.
Described handle 3 is located at the two ends of described the first placement plate 1.Described handle 3 and described the first accepting groove 11 are positioned at the same surface of described the first placement plate 1.Described handle 3 handled easily personnel grasp by hand, are convenient to carry circuit board placing device 100 described in taking and placing.
As the further improvement of above-mentioned execution mode, described circuit board placing device 100 also comprises two side plates 4, as shown in Figure 2.Described two side plates 4 are symmetricly set in respectively the two ends of described the first placement plate 1.Described two side plates 4 are vertical mutually with the plate face of described the second placement plate 2 with described the first placement plate 1.The both ends of described the first placement plate 1 connect with described two side plates 4 respectively, simultaneously, the both ends of described the second placement plate 2 also connect with described two side plates 4, be that described two side plates 4, described the first placement plate 1 and described the second placement plate 2 surround a receiving space jointly, described circuit board 200 is contained in described receiving space.Described two side plates 4 can improve the steadiness of described circuit board placing device 100, avoid described circuit board placing device 100 turnover panels.In above-described embodiment, described handle 3 is located at the two ends of described the first placement plate 1, and in the present embodiment, has additional described two side plates 4, and described handle 3 can be located at the outer surface of described two side plates 4.
The circuit board placing device 100 that the utility model provides is by described the first accepting groove 11 and described the second accepting groove 21 are embedded containment circuit board 200 one to one, be specially, circuit board 200 cards after repairing are established in first accepting groove 11 and the second accepting groove 21 of described circuit board placing device 100, with described the first placement plate 1, provide support, and provide balance with perpendicular the second placement plate 2 of described the first placement plate 1, the long limit of described circuit board 200 and minor face are all fastened in first accepting groove 11 and the second accepting groove 21 of described circuit board placing device 100, steadiness is high, can avoid turnover panel, between adjacent two circuit boards 200, can not bump, can place the circuit board 200 of two-sided repairing, can scratch plate face or scratch ink, and, described circuit board placing device 100 adopts high temperature resistant material preparation, until described circuit board placing device 100, pile after circuit board 200, can directly described circuit board placing device 100 be put into baking box baking sheet together with described circuit board 200, reduced and got plate and put plate operation, efficiency is high.
The foregoing is only embodiment of the present utility model; not thereby limit the scope of the claims of the present utility model; every equivalent structure or conversion of equivalent flow process that utilizes the utility model specification and accompanying drawing content to do; or be directly or indirectly used in other relevant technical field, be all in like manner included in scope of patent protection of the present utility model.
Claims (9)
1. a circuit board placing device, it is characterized in that, the material of described circuit board placing device is high temperature resistant material, it comprises and is mutually angle fixing the first placement plate and the second placement plate, described the first placement plate comprises a plurality of spaced the first accepting grooves, described the second placement plate comprises a plurality of spaced the second accepting grooves, and a plurality of described the second accepting grooves are corresponding one by one with a plurality of described the first accepting grooves, and every two relative the second accepting grooves are mutually vertical with the first accepting groove bearing of trend.
2. circuit board placing device according to claim 1, is characterized in that, described circuit board placing device also comprises handle, and described handle is located at the two ends of described the first placement plate.
3. circuit board placing device according to claim 1, is characterized in that, described the first placement plate and described the second placement plate are rectangular-shaped, and the two vertical setting mutually.
4. circuit board placing device according to claim 1, is characterized in that, described circuit board placing device also comprises buffer structure, and described buffer structure is located at the inner surface of described the first accepting groove and the second accepting groove.
5. circuit board placing device according to claim 1, is characterized in that, a plurality of described the first accepting grooves are arranged parallel to each other each other.
6. circuit board placing device according to claim 5, is characterized in that, a plurality of described the first accepting grooves spacing is each other identical.
7. circuit board placing device according to claim 6, is characterized in that, the spacing between adjacent two described the first accepting grooves is 10mm.
8. circuit board placing device according to claim 1, is characterized in that, the degree of depth of described the first accepting groove is 10mm, and width is 5mm.
9. circuit board placing device according to claim 1, is characterized in that, described circuit board placing device also comprises two side plates, and described two side plates are symmetricly set in respectively the two ends of described the first placement plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420238218.6U CN203896592U (en) | 2014-05-09 | 2014-05-09 | Circuit board laying apparatus |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201420238218.6U CN203896592U (en) | 2014-05-09 | 2014-05-09 | Circuit board laying apparatus |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN203896592U true CN203896592U (en) | 2014-10-22 |
Family
ID=51722938
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201420238218.6U Expired - Lifetime CN203896592U (en) | 2014-05-09 | 2014-05-09 | Circuit board laying apparatus |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN203896592U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107116515A (en) * | 2016-02-24 | 2017-09-01 | 张生兰 | A kind of board plug device of pcb board |
| CN110255178A (en) * | 2019-05-23 | 2019-09-20 | 上海飞为智能系统股份有限公司 | One kind is for thick and porose PCB retraction plate machine equipment |
-
2014
- 2014-05-09 CN CN201420238218.6U patent/CN203896592U/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107116515A (en) * | 2016-02-24 | 2017-09-01 | 张生兰 | A kind of board plug device of pcb board |
| CN110255178A (en) * | 2019-05-23 | 2019-09-20 | 上海飞为智能系统股份有限公司 | One kind is for thick and porose PCB retraction plate machine equipment |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN203921580U (en) | A kind of pcb board rack | |
| CN107067988A (en) | LED display modules and its design method, LED display | |
| CN203896592U (en) | Circuit board laying apparatus | |
| CN102674007A (en) | Method for carrying liquid crystal display panel and carrying device | |
| CN202805169U (en) | Toughened glass placement rack | |
| CN104907972A (en) | Pre-assembly tool | |
| CN202687141U (en) | Width-adjustable sheet placing jig | |
| CN205162379U (en) | Stretchable bookshelf | |
| CN202414613U (en) | Sheet placing frame | |
| CN105563383A (en) | Preassembling tool | |
| CN204873112U (en) | Panel alignment device | |
| CN204346887U (en) | A kind of hundred lattice sheets | |
| CN206427721U (en) | A kind of glass transfer support | |
| CN203697630U (en) | Two-plate input type bias attaching machine | |
| CN105563382A (en) | Air conditioner cabinet panel preassembling tool | |
| CN207077224U (en) | A kind of high-precision thin-plate processing device | |
| CN202147945U (en) | Hanging device for PCBs (Printed Circuit Board) | |
| CN206537963U (en) | A kind of material collecting device of optical cement | |
| CN105563386A (en) | Preassembling tool for panel of air conditioner cabinet | |
| CN202912116U (en) | Printing template placement frame | |
| CN206123590U (en) | PCB board picture peg frame with adjustable | |
| CN103558940A (en) | Device and method for binding touch screen with FPCs (flexible circuit boards) | |
| CN211222715U (en) | Storage device for engineering management bidding documents and contracts | |
| CN202346194U (en) | Novel flashboard frame | |
| CN207930624U (en) | A kind of wood composite pallet assembly bench |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant |