CN105307426A - Curing method used for preventing swelling of glue-free stratified area of multi-layer soft board - Google Patents
Curing method used for preventing swelling of glue-free stratified area of multi-layer soft board Download PDFInfo
- Publication number
- CN105307426A CN105307426A CN201510588420.0A CN201510588420A CN105307426A CN 105307426 A CN105307426 A CN 105307426A CN 201510588420 A CN201510588420 A CN 201510588420A CN 105307426 A CN105307426 A CN 105307426A
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- China
- Prior art keywords
- soft board
- multilayer soft
- steel plate
- glue
- board
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
- H05K3/4611—Manufacturing multilayer circuits by laminating two or more circuit boards
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
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- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Laminated Bodies (AREA)
Abstract
The invention discloses a curing method used for preventing swelling of a glue-free stratified area of a multi-layer soft board. The method comprises the steps that the multi-layer soft board is neatly placed; sides, which contact upper and lower steel boards, of the multi-layer soft board are cleaned; the lower steel board is placed on a multi-layer rack, wherein the smooth side of the lower steel board is upward; the multi-layer soft board is placed on the lower steel board, and the upper steel board with the downward smooth side presses the multi-layer soft board; the multi-layer rack is pushed into an oven for baking, wherein the baking temperature is 150 to 170 DEG C and the baking time is 2 to 2.5 hours; the baked multi-layer rack is pushed out; and after upper and lower steel boards and the multi-layer soft board are cooled, the multi-layer soft board is removed. According to the method of provided by the invention, the problem of swelling of the glue-free stratified area of the multi-layer soft board can be effectively improved; the flatness of the board surface is improved; medicinal liquid is prevented from penetrating into the stratified area when electroplating is carried out; film pasting can be smoothly carried out on an outer line; a dry film which cannot be compacted is avoided; the reliability and the stability of a product are improved.
Description
Technical field
The present invention relates to multilayer soft board manufacture technology field, particularly relate to a kind of curing avoiding the glue-free demixing zone of multilayer soft board to heave.
Background technology
As shown in Figures 1 to 4, for the multilayer soft board 100 that there is glue-free demixing zone, adopt common fast pressure mode the air in glue-free demixing zone cannot to be drained completely, a small amount of air heats expansion after long-time hot setting in glue-free demixing zone can cause glue-free demixing zone to heave, heave position after cooling and can produce distortion fold, thus cause the out-of-flatness of plate face, the risk of liquid medicine is entered when serious Hui Jiangyoujiao district strutted heavy copper facing, simultaneously demixing zone to heave when outer-layer circuit makes dry film cannot compacting, have a strong impact on the reliability of making product.
Therefore, prior art has yet to be improved and developed.
Summary of the invention
In view of above-mentioned the deficiencies in the prior art, the object of the present invention is to provide a kind of curing avoiding the glue-free demixing zone of multilayer soft board to heave, be intended to solve the multilayer soft board problem that in demixing zone, expanded by heating can cause glue-free demixing zone to heave after long-time hot setting.
Technical scheme of the present invention is as follows:
The curing avoiding the glue-free demixing zone of multilayer soft board to heave, wherein, comprising:
Step one, first multilayer soft board is put neatly;
Step 2, clean is carried out to the one side contacting upper steel plate and lower steel plate in multilayer soft board;
Step 3, be positioned on thousand layers of frame by lower steel plate, multilayer soft board, then is positioned on lower steel plate upward by the shiny surface of lower steel plate, is pressed in down by the shiny surface of upper steel plate on multilayer soft board;
Step 4, advance baking ovens to toast on thousand layers of frame, baking temperature is 150 ~ 170 DEG C, and baking time is 2 ~ 2.5h;
Step 5, toast rear release thousand layers of frame, after the cooling of upper steel plate, lower steel plate and multilayer soft board, take out multilayer soft board.
The described curing avoiding the glue-free demixing zone of multilayer soft board to heave, wherein, in step one, often folded board for putting number≤30pnl.
The described curing avoiding the glue-free demixing zone of multilayer soft board to heave, wherein, in step 4, baking time is 2.2h.
The described curing avoiding the glue-free demixing zone of multilayer soft board to heave, wherein, in step 4, baking temperature is 160 DEG C.
The described curing avoiding the glue-free demixing zone of multilayer soft board to heave, wherein, in step 5, is cooled to room temperature and takes out multilayer soft board.
Beneficial effect: effectively can improve the glue-free demixing zone of multilayer soft board by method of the present invention and heave bad problem, improve plate surface evenness, guarantee that plating layered district is infiltrated without liquid medicine, simultaneously outer-layer circuit can pad pasting smoothly, dry film can not be produced and press unreal situation, improve product reliability and stability.
Accompanying drawing explanation
Fig. 1 to Fig. 4 is the flow chart of curing of the prior art.
Fig. 5 to Fig. 6 is the flow chart of curing of the present invention.
Embodiment
The invention provides a kind of curing avoiding the glue-free demixing zone of multilayer soft board to heave, for making object of the present invention, technical scheme and effect clearly, clearly, the present invention is described in more detail below.Should be appreciated that specific embodiment described herein only in order to explain the present invention, be not intended to limit the present invention.
The present invention is a kind of curing preferred embodiment avoiding the glue-free demixing zone of multilayer soft board to heave, and it comprises:
S1, first multilayer soft board is put neatly;
S2, clean is carried out to the one side contacting upper steel plate and lower steel plate in multilayer soft board;
S3, be positioned on thousand layers of frame by lower steel plate, multilayer soft board, then is positioned on lower steel plate upward by the shiny surface of lower steel plate, is pressed in down by the shiny surface of upper steel plate on multilayer soft board;
S4, advance baking ovens to toast on thousand layers of frame, baking temperature is 150 ~ 170 DEG C, and baking time is 2 ~ 2.5h;
S5, toast rear release thousand layers of frame, after the cooling of upper steel plate, lower steel plate and multilayer soft board, take out multilayer soft board.
In step sl, according to heat conductivility and the adhesive-free area gas tension of multilayer soft board (FPC), by measuring, in multilayer soft board, it is≤30pnl that the best of lamination puts quantity, as often folded board for putting number selects 20pnl.
In step s 2, first carry out clean to the one side contacting upper steel plate and lower steel plate in multilayer soft board, namely carry out clean to the bottom surface of multilayer soft board and end face, to avoid impurity to weigh plate face wounded, cull is counter stains the problems such as dye plate face.
In step s3, the selection of upper steel plate and lower steel plate, must select suitable dimension and weight in conjunction with actual, make upper steel plate and lower steel plate cover multilayer soft board, and can provide the expansion of enough weight resistance adhesive-free area gas.
As shown in Figure 5, the one side that upper steel plate 300 and lower steel plate 200 must guarantee to contact multilayer soft board 100 is shiny surface, and namely the shiny surface of lower steel plate 200 upward, and the shiny surface of upper steel plate 300, makes shiny surface contact multilayer soft board 100 down.Overall in following structure: upper steel plate 300+FPC(multilayer soft board 100)+lower steel plate 200.
In step S4, baking time is 2 ~ 2.5h, and wherein preferably baking time is preferably 2.2h, and baking temperature is preferably 160 DEG C.Be cured under this condition, coordinate the technology of upper lower steel plate pressing simultaneously, solidification effect can be made better, and can avoid producing expansion and heaving.In the curing process, multilayer soft board 100 is pressed in centre by upper steel plate 300 and lower steel plate 200, and the effect because of steel plate can offset the bulbs of pressure of air in glue-free demixing zone, thus makes multilayer soft board 100 holding plate face in press curing process smooth.Push down after solidification through steel plate, glue-free demixing zone can not be heaved again, and only there is the difference in height of a hot-setting adhesive between You Jiao district and adhesive-free area, plate face is more smooth.
In step S5, rear release thousand layers of frame are toasted, take out after the cooling of upper steel plate 300, lower steel plate 200 and multilayer soft board 100, as shown in Figure 6, specifically after solidify the multilayer soft board 100 such as rear and upper steel plate 300, the automatic cool to room temperature (25 DEG C) of lower steel plate 200, just receive plate.
In sum, effectively can improve the glue-free demixing zone of multilayer soft board by method of the present invention and heave bad problem, improve plate surface evenness, guarantee that plating layered district is infiltrated without liquid medicine, simultaneously outer-layer circuit can pad pasting smoothly, dry film can not be produced and press unreal situation, improve product reliability and stability.
Should be understood that, application of the present invention is not limited to above-mentioned citing, for those of ordinary skills, can be improved according to the above description or convert, and all these improve and convert the protection range that all should belong to claims of the present invention.
Claims (5)
1. the curing avoiding the glue-free demixing zone of multilayer soft board to heave, is characterized in that, comprising:
Step one, first multilayer soft board is put neatly;
Step 2, clean is carried out to the one side contacting upper steel plate and lower steel plate in multilayer soft board;
Step 3, be positioned on thousand layers of frame by lower steel plate, multilayer soft board, then is positioned on lower steel plate upward by the shiny surface of lower steel plate, is pressed in down by the shiny surface of upper steel plate on multilayer soft board;
Step 4, advance baking ovens to toast on thousand layers of frame, baking temperature is 150 ~ 170 DEG C, and baking time is 2 ~ 2.5h;
Step 5, toast rear release thousand layers of frame, after the cooling of upper steel plate, lower steel plate and multilayer soft board, take out multilayer soft board.
2. the curing avoiding the glue-free demixing zone of multilayer soft board to heave according to claim 1, is characterized in that, in step one, and often folded board for putting number≤30pnl.
3. the curing avoiding the glue-free demixing zone of multilayer soft board to heave according to claim 1, is characterized in that, in step 4, baking time is 2.2h.
4. the curing avoiding the glue-free demixing zone of multilayer soft board to heave according to claim 1, is characterized in that, in step 4, baking temperature is 160 DEG C.
5. the curing avoiding the glue-free demixing zone of multilayer soft board to heave according to claim 1, is characterized in that, in step 5, is cooled to room temperature and takes out multilayer soft board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510588420.0A CN105307426B (en) | 2015-09-16 | 2015-09-16 | A kind of curing for avoiding multilayer soft board from being heaved without glue demixing zone |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201510588420.0A CN105307426B (en) | 2015-09-16 | 2015-09-16 | A kind of curing for avoiding multilayer soft board from being heaved without glue demixing zone |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN105307426A true CN105307426A (en) | 2016-02-03 |
| CN105307426B CN105307426B (en) | 2018-10-23 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201510588420.0A Active CN105307426B (en) | 2015-09-16 | 2015-09-16 | A kind of curing for avoiding multilayer soft board from being heaved without glue demixing zone |
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Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101562160A (en) * | 2009-05-18 | 2009-10-21 | 天水华天科技股份有限公司 | IC card packaging part and production method thereof |
| CN102290354A (en) * | 2011-08-08 | 2011-12-21 | 慈溪市永旭丰泰电子科技有限公司 | Novel IC (integrated circuit) package manufacturing technology |
| CN202979475U (en) * | 2012-12-31 | 2013-06-05 | 惠州市金百泽电路科技有限公司 | Multi-layer shelf used for roasting boards |
| CN103337483A (en) * | 2013-05-14 | 2013-10-02 | 天水华天科技股份有限公司 | Ultrathin VSOP (very thin small outline package) packaging part and production method thereof |
| CN104244600A (en) * | 2014-07-25 | 2014-12-24 | 昆山圆裕电子科技有限公司 | Board surface flattening technology of flexible printed circuit board for notebook computer |
-
2015
- 2015-09-16 CN CN201510588420.0A patent/CN105307426B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101562160A (en) * | 2009-05-18 | 2009-10-21 | 天水华天科技股份有限公司 | IC card packaging part and production method thereof |
| CN102290354A (en) * | 2011-08-08 | 2011-12-21 | 慈溪市永旭丰泰电子科技有限公司 | Novel IC (integrated circuit) package manufacturing technology |
| CN202979475U (en) * | 2012-12-31 | 2013-06-05 | 惠州市金百泽电路科技有限公司 | Multi-layer shelf used for roasting boards |
| CN103337483A (en) * | 2013-05-14 | 2013-10-02 | 天水华天科技股份有限公司 | Ultrathin VSOP (very thin small outline package) packaging part and production method thereof |
| CN104244600A (en) * | 2014-07-25 | 2014-12-24 | 昆山圆裕电子科技有限公司 | Board surface flattening technology of flexible printed circuit board for notebook computer |
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| Publication number | Publication date |
|---|---|
| CN105307426B (en) | 2018-10-23 |
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