CN104244600B - A kind of notebook computer FPC plate face flatness technique - Google Patents
A kind of notebook computer FPC plate face flatness technique Download PDFInfo
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- CN104244600B CN104244600B CN201410359569.7A CN201410359569A CN104244600B CN 104244600 B CN104244600 B CN 104244600B CN 201410359569 A CN201410359569 A CN 201410359569A CN 104244600 B CN104244600 B CN 104244600B
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Abstract
The invention discloses a kind of notebook computer FPC plate face flatness technique, including following steps：(1) preparation：Get out smooth flexible PCB, check whether baking oven meets regular, some blank sheet of paper (fire-retardant) of safe handling, two pieces of burnings pay an iron plate；(2) prebake conditions：Flexible PCB to be baked is erect and is put into baking oven layer frame；(3) secondary baking：Secondary baking is carried out to the flexible PCB for having completed prebake conditions；(4) checked after toasting：Whether its flatness, which reaches technological requirement, is checked to the flexible PCB for completing above flow.The present invention steps up flexible PCB using the gravity for burning pair iron plate, acted on by baking oven high-temperature baking, reach flexible PCB plate face flatness height, till soleplate sticks up respectively less than 6mm purpose by the baking twice to flexible PCB.
Description
【Technical field】
The invention belongs to FPC manufacture technology field, more specifically to notebook computer flexible circuitry
Plate plate face flatness technique.
【Background technology】
As keyboard Luminescence Uniformity requires more and more higher, to FPC plate face flatness requirement also more and more higher.
Made from FPC in terms of processing procedure, the processing procedure for influenceing flexible circuitry plate flatness is the baking of white photosensitive-ink.White sense
When ink toasts, because stress caused by ink solidification can cause FPC plate to stick up.Other manner is with white covering
Film substitutes white photosensitive-ink, but because white covering film cost is higher and processing procedure tolerance (± 0.1mm) is than white photosensitive-ink system
Journey tolerance (± 0.03mm) greatly, influences the yields of product, typically without using.
Therefore, it is necessary to a kind of novel process is provided to solve the above problems.
【The content of the invention】
The technical problem to be solved by the invention is to provide a kind of notebook computer FPC screen board surface evenness
Technique, solve the problems, such as that FPC plate sticks up too high in existing moulding process.
In order to solve the above technical problems, the present invention adopts the following technical scheme that, comprise the following steps.
(1) preparation：If be ready to smooth FPC, check baking oven whether meet safe handling rule,
Extra dry white wine paper (fire-retardant), two pieces of burnings pay an iron plate；
(2) prebake conditions：FPC to be baked is erect and is put into baking oven layer frame；
(3) secondary baking：Secondary baking is carried out to the FPC for having completed prebake conditions；
(4) checked after toasting：Whether its flatness, which reaches technique, is checked to the FPC for completing above flow
It is required that.
Further, in the step (2), blank sheet of paper has flame-retardant nature.
Further, in the step (2), drying temperature is 100 DEG C, time 30min.
Further, in the step (3), each piece of FPC is clipped among two blank sheet of paper.
Further, in the step (3), burning is topmost mixed in the blank sheet of paper of bottom and pays iron plate and FPC
It is middle.
Further, in the step (3), remaining blank sheet of paper is mixed among two FPCs.
Further, in the step (3), two pieces are burnt the outermost end that pair iron plate is located at interlayer respectively.
Further, in the step (3), drying temperature is 150 DEG C, time 50min.
The beneficial effects of the invention are as follows：By the baking twice to FPC, stepped up using the gravity for burning pair iron plate
FPC, acted on by baking oven high-temperature baking, reach FPC plate face flatness height, till soleplate sticks up respectively less than 6mm
Purpose.
【Brief description of the drawings】
Fig. 1 is the sandwich schematic diagram of the present invention.
In figure：1st, FPC；2nd, blank sheet of paper；3rd, burn and pay iron plate.
【Embodiment】
The present invention is further described below with reference to specific embodiment.
Referring to Fig. 1, notebook computer of the present invention FPC plate face flatness process, including baking oven is (not
Mark), comprise the following steps：(1) preparation：Get out smooth FPC 1, check whether baking oven meets safety
Burnt using regular, some blank sheet of paper 2 (fire-retardant), two pieces and pay iron plate 3；(2) prebake conditions：FPC 1 to be baked is erect and put
To in baking oven layer frame, baking oven power supply is opened, it is 100 DEG C to set drying temperature, time 30min.By flexible wires after the completion of baking
Road plate 1 pulls out baking box；(3) secondary baking：Secondary baking is carried out to the FPC 1 for having completed prebake conditions.Such as Fig. 1 institutes
Show, during secondary baking, each piece of FPC 1 is clipped among two blank sheet of paper 2, and topmost the blank sheet of paper 2 with bottom is mixed in
Burn and pay among iron plate 3 and FPC 1, remaining blank sheet of paper 2 is mixed among two FPCs 1, and two pieces are burnt a pair iron plates 3 and divided
Not Wei Yu interlayer outermost end, burn pay iron plate 3 gravity the FPC 1 being mingled with therebetween is compressed, it is ensured that flexible wires
The plate face flatness of road plate 1.Ready interlayer 100 is horizontally placed in baking oven layer frame, opens baking oven power supply, drying temperature is set
Spend for 150 DEG C, time 50min；(4) checked after toasting：The FPC 1 for completing above flow is checked, it is flat
Whether whole degree reaches technological requirement (plate sticks up ＜ 6mm).
In one embodiment, 100 kinds of the interlayer accompanies 5 pieces of FPCs 1, in other embodiments to flexible wires
The quantity of road plate 1 is not limited to that.
For the present invention by the baking twice to FPC 1, the gravity that iron plate 3 is paid using burning steps up FPC 1,
Acted on by baking oven high-temperature baking, reach the plate face flatness of FPC 1 height, plate sticks up low purpose.
The flexible circuitry plate flatness technique of prior art is different from, the plate of FPC 1 processed by this technique sticks up
Control in below 6mm, made much progress compared to using old technology (it is more than 8mm that plate, which sticks up).
Schematically the present invention and embodiments thereof are described above, this describes no restricted, institute in accompanying drawing
What is shown is also one of embodiments of the present invention, and actual structure is not limited thereto.So if common skill of this area
Art personnel are enlightened by it, without departing from the spirit of the invention, without designing and the technical scheme for creativeness
Similar frame mode and embodiment, protection scope of the present invention all should be belonged to.
Claims (6)
1. a kind of notebook computer FPC plate face flatness technique, including baking oven, it is characterised in that include following
Step：
(1) preparation：Get out smooth FPC, some blank sheet of paper, two pieces of burnings and pay an iron plate；
(2) prebake conditions：FPC to be baked is erect and is put into baking oven layer frame, drying temperature is in the prebake conditions
100 DEG C, time 30min；
(3) secondary baking：Secondary baking is carried out to the FPC for having completed prebake conditions, in the secondary baking, drying
Temperature is 150 DEG C, time 50min；
(4) checked after toasting：The FPC for completing above flow is checked, whether its flatness reaches technique will
Ask.
2. notebook computer as claimed in claim 1 FPC plate face flatness technique, it is characterised in that：The paper
There is flame-retardant nature.
3. notebook computer as claimed in claim 1 FPC plate face flatness technique, it is characterised in that：Described two
In secondary baking, each piece of FPC is clipped among two blank sheet of paper.
4. notebook computer as claimed in claim 1 FPC plate face flatness technique, it is characterised in that：Described two
In secondary baking, burning is topmost mixed in the blank sheet of paper of bottom and is paid among iron plate and FPC.
5. notebook computer as claimed in claim 1 FPC plate face flatness technique, it is characterised in that：Described two
In secondary baking, remaining blank sheet of paper is mixed among two FPCs.
6. notebook computer as claimed in claim 1 FPC plate face flatness technique, it is characterised in that：Described two
In secondary baking, two pieces are burnt the outermost end that pair iron plate is located at interlayer respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410359569.7A CN104244600B (en) | 2014-07-25 | 2014-07-25 | A kind of notebook computer FPC plate face flatness technique |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201410359569.7A CN104244600B (en) | 2014-07-25 | 2014-07-25 | A kind of notebook computer FPC plate face flatness technique |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104244600A CN104244600A (en) | 2014-12-24 |
| CN104244600B true CN104244600B (en) | 2018-01-23 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201410359569.7A Active CN104244600B (en) | 2014-07-25 | 2014-07-25 | A kind of notebook computer FPC plate face flatness technique |
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Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
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| CN105307426B (en) * | 2015-09-16 | 2018-10-23 | 深圳市景旺电子股份有限公司 | A kind of curing for avoiding multilayer soft board from being heaved without glue demixing zone |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07307548A (en) * | 1994-05-10 | 1995-11-21 | Sumitomo Electric Ind Ltd | Method of processing flexible printed wiring board |
| CN101022702A (en) * | 2006-05-18 | 2007-08-22 | 黄文平 | Flexible circuit board crimp device and quick crimp machine using the same device |
| CN101730389A (en) * | 2008-10-15 | 2010-06-09 | 比亚迪股份有限公司 | Method for manufacturing single-side hollow out flexible circuit board |
| CN101801156A (en) * | 2009-02-06 | 2010-08-11 | 周伯如 | Method for manufacturing flexible printed circuit board and structure thereof |
| CN102548226A (en) * | 2012-02-16 | 2012-07-04 | 厦门华天华电子有限公司 | Process for treating crease phenomenon during flexible printed circuit machining |
-
2014
- 2014-07-25 CN CN201410359569.7A patent/CN104244600B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07307548A (en) * | 1994-05-10 | 1995-11-21 | Sumitomo Electric Ind Ltd | Method of processing flexible printed wiring board |
| CN101022702A (en) * | 2006-05-18 | 2007-08-22 | 黄文平 | Flexible circuit board crimp device and quick crimp machine using the same device |
| CN101730389A (en) * | 2008-10-15 | 2010-06-09 | 比亚迪股份有限公司 | Method for manufacturing single-side hollow out flexible circuit board |
| CN101801156A (en) * | 2009-02-06 | 2010-08-11 | 周伯如 | Method for manufacturing flexible printed circuit board and structure thereof |
| CN102548226A (en) * | 2012-02-16 | 2012-07-04 | 厦门华天华电子有限公司 | Process for treating crease phenomenon during flexible printed circuit machining |
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|---|---|
| CN104244600A (en) | 2014-12-24 |
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