CN108811325B - Pressing method and manufacturing method of printed circuit board - Google Patents
Pressing method and manufacturing method of printed circuit board Download PDFInfo
- Publication number
- CN108811325B CN108811325B CN201710300886.5A CN201710300886A CN108811325B CN 108811325 B CN108811325 B CN 108811325B CN 201710300886 A CN201710300886 A CN 201710300886A CN 108811325 B CN108811325 B CN 108811325B
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- steel plate
- circuit board
- polyolefin wax
- pressing
- water
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0058—Laminating printed circuit boards onto other substrates, e.g. metallic substrates
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/46—Manufacturing multilayer circuits
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/06—Lamination
- H05K2203/068—Features of the lamination press or of the lamination process, e.g. using special separator sheets
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
- H05K2203/07—Treatments involving liquids, e.g. plating, rinsing
- H05K2203/0756—Uses of liquids, e.g. rinsing, coating, dissolving
- H05K2203/0759—Forming a polymer layer by liquid coating, e.g. a non-metallic protective coating or an organic bonding layer
Abstract
The invention provides a pressing method and a manufacturing method of a printed circuit board. The press fit method of the printed circuit board comprises the following steps: and arranging the steel plates with the water-soluble organic film on the two surfaces on the top surface and the bottom surface of the circuit board respectively in a mode that the water-soluble organic film faces the circuit board, and then pressing. According to the pressing method provided by the invention, the water-soluble organic film is arranged on the surface of the steel plate, so that the water-soluble organic film is easy to remove after pressing is finished, the surface abrasion of the steel plate caused by the treatment of brushing or polishing the steel plate in the traditional process is avoided, the automation of the pressing process is easy to realize, the recycling of the steel plate is realized, and the pollution caused by the PP glue flowing to the surface of the steel plate in the pressing process is avoided. The invention also provides a manufacturing method of the printed circuit board, which improves the manufacturing efficiency.
Description
Technical Field
The invention relates to the technical field of printed circuit board manufacturing processes, in particular to a laminating method and a manufacturing method of a printed circuit board.
Background
With the rapid development of electronic communication technology and the popularization and application of electronic consumer products, the development of Printed Circuit Board (PCB) process technology and the product upgrade are promoted, and particularly the development of high-level high-density interconnection HDI, any-layer interconnection ELIC, special process circuit boards and other products is promoted. In the traditional production flow of printed circuit board, except for the main X-ray drilling target and cutting edge, the pressing is also one of the important auxiliary processes.
And the pressing is a process for pressing the circuit board subjected to pretreatment such as inner layer drying, copper etching, AOI inspection, surface browning treatment and the like, and a copper foil and a prepreg into a multilayer circuit board. In the conventional press-fitting process, a rigid bottom support is usually formed by using a steel plate to ensure the press-fitting smoothness of the printed circuit board. Simultaneously, still need pad a great copper foil of thickness on the steel sheet among the traditional pressfitting flow to prevent that the PP glue stain from flowing to the steel sheet. In the pressfitting flow, basically, all will carry out brush grinding to the steel sheet after every OPEN produces to get rid of the probably remaining glue stain and the foreign matter in steel sheet surface, stab the circuit board copper foil surface when preventing it from reusing, avoid printed circuit board sunken and foreign matter granule unusual etc..
In the current pressing process, two modes of ceramic wheel brushing and abrasive paper grinding are generally adopted to clean the pressing steel plate, so that the thickness of the steel plate is thinner and thinner along with the increase of the use times, the normal thickness of the newly purchased steel plate is 2.50mm, and when the thickness of the newly purchased steel plate is less than 2.00mm, the steel plate can not be reused. Meanwhile, the surface of the steel plate is treated by adopting the brushing or grinding mode, which depends on the familiarity of operators to the process technology to a great extent, and the single-point foreign matter or PP glue stain needs to be repeatedly ground and removed manually. However, some abnormal particles on the surface of the steel plate cannot be identified by naked eyes, so that the problems of incomplete brushing and uneven surface of the steel plate are often caused, the quality of the pressing process is affected, and the final quality of the printed circuit board is affected. In addition, the way of manually brushing and grinding the steel plate is not beneficial to the automation realization of the whole process, thereby causing the defects of high cost, long process cycle and the like of the printed circuit board.
Therefore, how to provide a new printed circuit board preparation technology, especially a printed circuit board pressing technology, avoids the problems of abnormal particles, small recessed holes, scratches and the like on the surface of a steel plate, realizes the efficient recycling of the steel plate, and is a problem to be solved at present.
Disclosure of Invention
The invention provides a pressing method and a manufacturing method of a printed circuit board. In the process of pressing the printed circuit board, the water-soluble organic film is arranged on the surface of the steel plate, and the water-soluble organic film is easy to remove, so that the surface loss of the steel plate caused by physical brushing on the surface of the steel plate in the process of repeated use is avoided, and the automatic operation of the pressing and manufacturing processes of the printed circuit board can be realized.
The invention firstly provides a pressing method of a printed circuit board, which comprises the following steps:
and arranging the steel plates with the water-soluble organic film on the two surfaces on the top surface and the bottom surface of the circuit board respectively in a mode that the water-soluble organic film faces the circuit board, and then pressing.
According to the invention, the water-soluble organic film is arranged on the surface of the steel plate, and can fill the defects of depression and the like on the surface of the steel plate, so that the flatness of the surface of the steel plate is ensured, and the flatness of a circuit board in the pressing process can be ensured; in the pressing process, the water-soluble organic film is arranged between the steel plate and the adjacent circuit board, so that PP glue stains can be effectively prevented from directly flowing to the surface of the steel plate, the laying of copper foil on the steel plate in the traditional pressing process can be eliminated, and one operation procedure is reduced; after the pressing is completed, the water-soluble organic film can be easily and thoroughly removed, so that the surface physical finishing such as brushing or polishing and the like on the surface of the steel plate is not needed when the steel plate is repeatedly used, the surface of the steel plate is almost lossless, the input cost of the steel plate is reduced, the purpose of quickly recycling the steel plate is achieved, and the automation of the pressing and manufacturing processes of the steel plate is easily realized.
The present invention is not particularly limited to how the water-soluble organic thin film is provided on the surface of the steel sheet. In an embodiment of the present invention, the method for manufacturing a steel sheet having a water-soluble organic thin film formed on a surface thereof includes:
and soaking the steel plate in a water-soluble organic matter, and then drying to obtain the steel plate with the water-soluble organic matter film arranged on the surface.
The water-soluble organic film with uniform thickness can be obtained by the method, so that on one hand, the defects such as the pits and the like on the surface of the steel plate can be filled, and the flatness of the surface of the steel plate is ensured; on the other hand, a complete isolation layer can be formed on the surface of the steel plate, so that dust and PP glue in the pressing process are prevented from flowing to the surface of the steel plate.
It is understood that the steel plate surface is subjected to a necessary cleaning treatment before the steel plate is immersed in the water-soluble organic substance. Generally, a steel plate is placed in a rinsing bath for ultrasonic cleaning, and foreign matters such as dust and the like attached to the surface of the steel plate are cleaned, so that the cleanliness of the surface of the steel plate is ensured.
Furthermore, in the specific implementation process of the invention, after the surface of the steel plate is cleaned, the steel plate can be placed into a pre-soaking tank, and a thin layer of liquid medicine is formed on the surface of the steel plate, wherein the main component of the liquid medicine is sodium persulfate, for example, a 0.1-10 wt% sodium persulfate aqueous solution, so as to be beneficial to improving the bonding strength between the steel plate and the water-soluble organic matter. The aqueous sodium persulfate solution also helps to further clean the steel sheet during the process of placing the steel sheet in the pre-dip tank.
In the invention, the two steel plates are respectively arranged on the top surface and the bottom surface of the plurality of circuit boards, the number of the circuit boards is not particularly limited, the circuit boards can be reasonably arranged according to the requirement of an actual printed circuit board, and usually, more than two circuit boards are stacked between the two steel plates with the water-soluble organic film arranged on the surfaces.
It can be understood that after the pressing process is completed, the water-soluble organic film should be easily removed from the surface of the steel plate to avoid the brushing or grinding of the steel plate during the recycling process. The present invention is not particularly limited to the specific components of the water-soluble organic thin film, as long as it can be easily peeled off from the surface of the steel sheet after being dissolved in water, can endure high temperature during the lamination of the printed circuit board, and has a certain deformability.
In a preferred embodiment of the present invention, a polyolefin wax film, which is a wax-like film formed from a low-molecular polyolefin at room temperature (25 ℃) can be obtained by adding a polyolefin wax to a water-soluble organic substance satisfying the above requirements and drying the mixture. Specifically, the melting point of the polyolefin wax film is more than 250 ℃, for example, the melting point of the polyolefin wax film can be more than or equal to 350 ℃, so that the polyolefin wax film has higher stability in the pressing process. In the specific implementation process of the invention, the melting point of the polyolefin wax film is 350-450 ℃, so that the polyolefin wax film not only maintains high stability in the pressing process, but also can quickly fall off from the surface of the steel plate in the modes of soaking in water and the like after the pressing is finished.
Specifically, the polyolefin wax aqueous solution is usually placed in a coating tank in advance, the cleaned steel plate is soaked in the polyolefin wax aqueous solution, and then the steel plate is taken out and dried at 70 to 90 ℃ to remove moisture in the polyolefin wax aqueous solution, so that a polyolefin wax film is formed on the surface of the steel plate. Wherein the polyolefin wax aqueous solution is milky white liquid (hence also called polyolefin wax emulsion) at room temperature (about 25 deg.C), has pH of about 7, and relative density of about 0.99g/cm3The viscosity was about 29 mPas, and the boiling point was about 100 ℃.
The thickness of the water-soluble organic film is not particularly limited, but is usually 5 to 20 μm, for example, 10 μm. The thickness can ensure that the water-soluble organic film can fully fill the depression on the surface of the steel plate, and the PP glue is prevented from permeating the surface of the steel plate in the pressing process.
In an embodiment of the present invention, before the pressing, the method further includes: 10-20 layers of kraft paper are arranged between the steel plate with the surface provided with the water-soluble organic film and the circuit board. The kraft paper can be recycled after the pressing is finished.
In an embodiment of the present invention, before the pressing, the method further includes: a laminate buffer layer such as 10-20 layers of kraft paper, a special epoxy resin buffer material is provided between adjacent circuit boards.
Specifically, a plurality of circuit boards can be pre-folded and riveted to form an integral overlapped product, and a prepreg is arranged between two adjacent circuit boards; then, more than one integral superposed product is arranged on a steel plate with a water-soluble organic film arranged on the surface in a laminated mode, and 10-20 layers of kraft paper are arranged between the steel plate and the adjacent integral superposed product; secondly, sequentially arranging 10-20 layers of kraft paper and a steel plate with a water-soluble organic matter film on the surface of the topmost layer integral laminated product; and finally, feeding the laminated steel plate and the integral laminated product into a press, and laminating according to a laminating program.
It can be understood that, in order to realize the recycling of the steel plates, after the pressing, the method further comprises: and soaking the steel plate with the water-soluble organic film on the surface in water to remove the water-soluble organic film. Because the water-soluble organic film is very soluble in water, the water-soluble organic film on the surface of the steel plate can fall off by itself after the steel plate is immersed in clear water, and the surface of the steel plate is not damaged, so that the obtained steel plate can be recycled, and the input cost of the steel plate is reduced. Moreover, the water-soluble organic film is short in falling time and free of manual brushing or polishing, the purpose of rapid recycling of the steel plate can be achieved, an automatic operation mode is easy to realize, the process of manual brushing or polishing in the traditional process is saved, and therefore the production efficiency of the printed circuit board is improved.
It can be understood that, in order to further improve the falling efficiency of the water-soluble organic film, in the specific implementation process of the invention, a water-based brush (which is a soft brush grinding mode and has little damage to the surface of the steel plate) can be used in a matching manner to destroy the surface of the water-soluble organic film, accelerate the falling rate of the water-soluble organic film in water and achieve the purpose of rapid demoulding.
After the water-soluble organic matter film falls off from the surface of the steel plate, the steel plate can be cleaned again to thoroughly remove the water-soluble organic matters possibly remained on the surface of the steel plate, and then the steel plate is dried for later use.
The invention finally provides a method for laminating a printed circuit board, which comprises the following steps:
performing surface browning treatment on the circuit board;
pressing the circuit board by adopting the pressing method to obtain a multilayer circuit board;
and carrying out X-ray target drilling, plate dividing and edge fishing on the multilayer circuit board to obtain the printed circuit board.
It can be understood that before the surface browning treatment of the circuit board, pretreatment such as drying, copper etching, AOI inspection and the like is also included; after the pressing is finished, the conventional post-processing except X-ray target drilling, board dividing and edge fishing is further carried out on the pressed circuit board, the circuit board can be reasonably designed according to the actual requirements of the printed circuit board, and the description is omitted.
The invention provides a pressing method of a printed circuit board, which has the following advantages that a water-soluble organic film is arranged on the surface of a steel plate:
the water-soluble organic matter film can effectively fill the defects of depression and the like on the surface of the steel plate so as to ensure the flatness of the surface of the steel plate and further ensure that a circuit board does not deform in the pressing process;
the water-soluble organic film can effectively prevent PP glue stains from directly flowing to the surface of the steel plate, so that the laying of copper foil on the steel plate in the traditional pressing process can be eliminated, and the pressing process flow is shortened;
the water-soluble organic film is extremely easy to rapidly remove, avoids the surface loss of the steel plate caused by physical surface brushing in the repeated use process of the steel plate, reduces the investment cost of the steel plate, achieves the purpose of rapid recycling of the steel plate, can realize the automation of the pressing and manufacturing processes of the printed circuit board, and improves the pressing efficiency of the printed circuit board.
The invention also provides a manufacturing method of the printed circuit board, and the steel plate with the water-soluble organic film arranged on the surface is used in the pressing process, so that the manufacturing efficiency of the printed circuit board is improved, and the production cost is reduced.
Drawings
FIG. 1 is a schematic structural view of a unitary laminated product according to an embodiment of the present invention;
fig. 2 is a schematic view of a printed circuit board bonding structure according to an embodiment of the invention.
Description of reference numerals:
1-a steel plate; 2-a water-soluble organic film; 3-kraft paper;
4-integral superposition products; 41-a circuit board; 42-prepreg.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are some, but not all, embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The present invention provides a method for manufacturing a printed circuit board, as shown in fig. 1 and 2, comprising the steps of:
s1: pretreatment before lamination
A plurality of circuit boards 41 which are subjected to pretreatment such as drying, copper etching, AOI inspection, surface browning treatment and the like are pre-laminated and riveted to form an integral laminated product 4, wherein a prepreg 41 is arranged between two adjacent circuit boards 41, and each integral laminated product 4 comprises 60 layers of circuit boards 41, as shown in fig. 1.
S2: pretreatment of Steel sheet 1
Firstly, putting the steel plate 1 in a rinsing bath for ultrasonic cleaning to clean foreign matters such as dust and the like attached to the surface of the steel plate 1; then putting the cleaned steel plate into a presoaking tank, wherein a sodium persulfate aqueous solution with the concentration of about 5 wt% is placed in the presoaking tank in advance; finally, placing the steel plate in a coating tank to soak the steel plate in the polyolefin wax emulsion; and taking out the steel plate, and drying at 70-90 ℃ to obtain the steel plate 1 with the water-soluble organic film 2 arranged on the surface, wherein the thickness of the water-soluble organic film 2 is about 10 mu m, and the melting point is about 350 ℃.
Wherein the polyolefin wax emulsion has a pH of about 7 and a relative density of about 0.99g/cm, measured at 25 deg.C3Viscosity of about 29 mPas and boiling point of about 100 ℃; as described above.
S3: laminating treatment
Firstly, 18 pieces of kraft paper 3 are laid on the surface of a steel plate 1 with a water-soluble organic film 2 arranged on the surface, then one or more laminated products 4, such as 60 pieces of kraft paper 3 are stacked on the kraft paper 3, 15 pieces of kraft paper 3 are laid between every two adjacent laminated products 4, secondly, 18 pieces of kraft paper 3 are laid on the surface of the topmost laminated product 4, and the steel plate 1 with the water-soluble organic film 2 arranged on the surface is sent into a press as shown in figure 2, and finally, pressing is carried out according to a pressing formula, wherein the pressing temperature is 190 +/-10 ℃, the pressing strength is 300psi, and the heating rate is less than 3 ℃/min.
S4: detaching plate and removing film of steel plate 1
And after the pressing is finished, cooling to room temperature, and disassembling the board, namely disassembling the steel plate 1 with the water-soluble organic matter film 2 arranged on the surface and the kraft paper 3 to obtain the multilayer circuit board. Wherein:
carrying out post-treatment on the multilayer circuit board by X-ray target drilling, board splitting, edge dragging and the like to finally obtain a printed circuit board;
placing the steel plate 1 with the water-soluble organic matter film 2 on the surface in a rinsing bath, immersing the water-soluble organic matter film 2 in clear water, softening, then performing water brushing and grinding to quickly remove the water-soluble organic matter film 2 on the surface of the steel plate 1, and finally performing water washing and drying on the steel plate 1 for the next use;
the kraft paper 3 can be repeatedly recycled.
Finally, it should be noted that: the above examples are only intended to illustrate the technical solution of the present invention, but not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (8)
1. A method for laminating a printed circuit board, comprising:
arranging steel plates with organic matter films containing polyolefin wax on the two surfaces on the top surface and the bottom surface of the circuit board respectively in a mode that the organic matter films face the circuit board, and then pressing;
the preparation method of the steel plate with the organic matter film containing the polyolefin wax arranged on the surface comprises the following steps:
adding polyolefin wax into a water-soluble organic substance to form polyolefin wax emulsion, soaking a steel plate in the polyolefin wax emulsion, and then drying to obtain the steel plate with the surface provided with an organic substance film containing the polyolefin wax;
before the steel plate is soaked in the polyolefin wax emulsion, the steel plate is firstly placed into a presoaking tank, a layer of thin liquid medicine is formed on the surface of the steel plate, and the main component of the liquid medicine is sodium persulfate.
2. A press-fitting method according to claim 1, wherein two or more of said wiring boards are laminated between two steel plates each having an organic film containing polyolefin wax on a surface thereof.
3. A laminating method according to claim 1, characterised in that the melting point of the organic film containing polyolefin wax is more than 250 ℃.
4. A laminating method according to any one of claims 1 to 3, characterised in that the thickness of the organic film containing polyolefin wax is 5 to 20 μm.
5. A press-fitting method according to claim 1, further comprising, before the press-fitting:
10-20 layers of kraft paper are arranged between the steel plate with the surface provided with the organic matter film containing the polyolefin wax and the circuit board.
6. A press-fitting method according to claim 1 or 5, characterized by, before performing press-fitting, further comprising: and arranging a prepreg or 10-20 layers of kraft paper between the adjacent circuit boards.
7. The laminating method according to claim 1, further comprising: and after the pressing is finished, soaking the steel plate with the organic film containing the polyolefin wax on the surface in water to remove the organic film containing the polyolefin wax.
8. A method of manufacturing a printed circuit board, comprising:
performing surface browning treatment on the circuit board;
pressing the circuit board by using the pressing method according to any one of claims 1 to 7 to obtain a multilayer circuit board;
and carrying out X-ray target drilling, plate dividing and edge fishing on the multilayer circuit board to obtain the printed circuit board.
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| Application Number | Priority Date | Filing Date | Title |
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| CN201710300886.5A CN108811325B (en) | 2017-05-02 | 2017-05-02 | Pressing method and manufacturing method of printed circuit board |
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| Application Number | Priority Date | Filing Date | Title |
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| CN201710300886.5A CN108811325B (en) | 2017-05-02 | 2017-05-02 | Pressing method and manufacturing method of printed circuit board |
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| CN108811325A CN108811325A (en) | 2018-11-13 |
| CN108811325B true CN108811325B (en) | 2020-12-29 |
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| CN112410848A (en) * | 2019-08-23 | 2021-02-26 | 华孚精密科技(马鞍山)有限公司 | Method for preventing magnesium piece from being polluted during encapsulation |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101224650A (en) * | 2007-10-17 | 2008-07-23 | 周伟 | Auxiliary material for laminating flexible circuit board and laminating process thereof |
| CN100509181C (en) * | 2005-08-02 | 2009-07-08 | 株式会社神户制钢所 | Resin-coated metal sheet and resin composition |
| CN201750634U (en) * | 2010-06-12 | 2011-02-16 | 东莞森玛仕格里菲电路有限公司 | Improved pressing in carrier structure provided with rigid-flexible circuit board |
| CN102573337A (en) * | 2010-12-30 | 2012-07-11 | 北大方正集团有限公司 | Manufacturing method of multilayer circuit board, laminating device and multilayer circuit board |
| CN103108730A (en) * | 2010-09-17 | 2013-05-15 | 三菱瓦斯化学株式会社 | Entry sheet for drilling |
| CN103152987A (en) * | 2013-02-17 | 2013-06-12 | 深圳市崇达电路技术股份有限公司 | Manufacturing method for embedded metal block of high-frequency mixed pressed circuit board |
-
2017
- 2017-05-02 CN CN201710300886.5A patent/CN108811325B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100509181C (en) * | 2005-08-02 | 2009-07-08 | 株式会社神户制钢所 | Resin-coated metal sheet and resin composition |
| CN101224650A (en) * | 2007-10-17 | 2008-07-23 | 周伟 | Auxiliary material for laminating flexible circuit board and laminating process thereof |
| CN201750634U (en) * | 2010-06-12 | 2011-02-16 | 东莞森玛仕格里菲电路有限公司 | Improved pressing in carrier structure provided with rigid-flexible circuit board |
| CN103108730A (en) * | 2010-09-17 | 2013-05-15 | 三菱瓦斯化学株式会社 | Entry sheet for drilling |
| CN102573337A (en) * | 2010-12-30 | 2012-07-11 | 北大方正集团有限公司 | Manufacturing method of multilayer circuit board, laminating device and multilayer circuit board |
| CN103152987A (en) * | 2013-02-17 | 2013-06-12 | 深圳市崇达电路技术股份有限公司 | Manufacturing method for embedded metal block of high-frequency mixed pressed circuit board |
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