CN113473721A - Flexible printed circuit board and preparation method thereof - Google Patents
Flexible printed circuit board and preparation method thereof Download PDFInfo
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- CN113473721A CN113473721A CN202110774819.3A CN202110774819A CN113473721A CN 113473721 A CN113473721 A CN 113473721A CN 202110774819 A CN202110774819 A CN 202110774819A CN 113473721 A CN113473721 A CN 113473721A
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- printed circuit
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- 238000002360 preparation method Methods 0.000 title abstract description 8
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 90
- 239000010949 copper Substances 0.000 claims abstract description 80
- 229910052802 copper Inorganic materials 0.000 claims abstract description 73
- 239000000758 substrate Substances 0.000 claims abstract description 38
- 238000000034 method Methods 0.000 claims abstract description 28
- 239000000463 material Substances 0.000 claims abstract description 20
- 238000005530 etching Methods 0.000 claims abstract description 19
- 239000003292 glue Substances 0.000 claims abstract description 6
- 239000011248 coating agent Substances 0.000 claims abstract description 3
- 238000000576 coating method Methods 0.000 claims abstract description 3
- 229910052751 metal Inorganic materials 0.000 claims description 30
- 239000002184 metal Substances 0.000 claims description 30
- 238000004519 manufacturing process Methods 0.000 claims description 18
- 239000011889 copper foil Substances 0.000 claims description 17
- 229920001721 polyimide Polymers 0.000 claims description 12
- 239000011347 resin Substances 0.000 claims description 12
- 229920005989 resin Polymers 0.000 claims description 12
- 238000009713 electroplating Methods 0.000 claims description 9
- 238000007747 plating Methods 0.000 claims description 8
- 239000009719 polyimide resin Substances 0.000 claims description 8
- 239000003822 epoxy resin Substances 0.000 claims description 7
- 238000001755 magnetron sputter deposition Methods 0.000 claims description 7
- 229920000647 polyepoxide Polymers 0.000 claims description 7
- 229920001187 thermosetting polymer Polymers 0.000 claims description 6
- 239000004642 Polyimide Substances 0.000 claims description 4
- 239000004734 Polyphenylene sulfide Substances 0.000 claims description 4
- 229910052755 nonmetal Inorganic materials 0.000 claims description 4
- 229920000069 polyphenylene sulfide Polymers 0.000 claims description 4
- 229920001343 polytetrafluoroethylene Polymers 0.000 claims description 4
- 239000004810 polytetrafluoroethylene Substances 0.000 claims description 4
- JYEUMXHLPRZUAT-UHFFFAOYSA-N 1,2,3-triazine Chemical compound C1=CN=NN=C1 JYEUMXHLPRZUAT-UHFFFAOYSA-N 0.000 claims description 3
- XQUPVDVFXZDTLT-UHFFFAOYSA-N 1-[4-[[4-(2,5-dioxopyrrol-1-yl)phenyl]methyl]phenyl]pyrrole-2,5-dione Chemical compound O=C1C=CC(=O)N1C(C=C1)=CC=C1CC1=CC=C(N2C(C=CC2=O)=O)C=C1 XQUPVDVFXZDTLT-UHFFFAOYSA-N 0.000 claims description 3
- 229920000459 Nitrile rubber Polymers 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- XLJMAIOERFSOGZ-UHFFFAOYSA-M cyanate Chemical compound [O-]C#N XLJMAIOERFSOGZ-UHFFFAOYSA-M 0.000 claims description 3
- 239000011888 foil Substances 0.000 claims description 3
- 239000004973 liquid crystal related substance Substances 0.000 claims description 3
- 229920003192 poly(bis maleimide) Polymers 0.000 claims description 3
- 229920001955 polyphenylene ether Polymers 0.000 claims description 3
- -1 polytetrafluoroethylene Polymers 0.000 claims description 3
- 229910001220 stainless steel Inorganic materials 0.000 claims description 3
- 239000010935 stainless steel Substances 0.000 claims description 3
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 claims description 3
- 229920000642 polymer Polymers 0.000 claims description 2
- 238000007772 electroless plating Methods 0.000 claims 1
- 239000000853 adhesive Substances 0.000 abstract description 4
- 230000001070 adhesive effect Effects 0.000 abstract description 4
- 230000008054 signal transmission Effects 0.000 abstract description 4
- 230000005540 biological transmission Effects 0.000 abstract description 3
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- 230000002349 favourable effect Effects 0.000 abstract description 2
- 238000010586 diagram Methods 0.000 description 8
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- 229920000106 Liquid crystal polymer Polymers 0.000 description 5
- 239000004977 Liquid-crystal polymers (LCPs) Substances 0.000 description 5
- 238000000151 deposition Methods 0.000 description 4
- 230000008021 deposition Effects 0.000 description 4
- 238000001746 injection moulding Methods 0.000 description 3
- 239000004020 conductor Substances 0.000 description 2
- 239000003989 dielectric material Substances 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 229910052710 silicon Inorganic materials 0.000 description 2
- 239000010703 silicon Substances 0.000 description 2
- PXGOKWXKJXAPGV-UHFFFAOYSA-N Fluorine Chemical compound FF PXGOKWXKJXAPGV-UHFFFAOYSA-N 0.000 description 1
- 239000004721 Polyphenylene oxide Substances 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000001125 extrusion Methods 0.000 description 1
- 229910052731 fluorine Inorganic materials 0.000 description 1
- 239000011737 fluorine Substances 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000002985 plastic film Substances 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 229920006380 polyphenylene oxide Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 238000007639 printing Methods 0.000 description 1
- 230000002035 prolonged effect Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 239000007779 soft material Substances 0.000 description 1
Images
Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
- H05K3/022—Processes for manufacturing precursors of printed circuits, i.e. copper-clad substrates
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/0011—Working of insulating substrates or insulating layers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/22—Secondary treatment of printed circuits
- H05K3/24—Reinforcing the conductive pattern
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Manufacturing Of Printed Circuit Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
The invention discloses a preparation method of a flexible printed circuit board, which comprises the following steps: providing a substrate layer; preparing a stripping layer on the surface of the base material layer; preparing a conductive copper layer on the surface of the stripping layer; etching the conductive copper layer to form a circuit layer; coating glue on the etched circuit layer to prepare an insulating layer, and embedding the circuit layer into the insulating layer; peeling the base material layer via the peeling layer; and preparing a thickened copper layer on the surface of the circuit layer with the exposed insulating layer. The flexible printed circuit manufactured by the method can be etched from thin copper to thick copper, the etching is convenient, the cost is lower, the etching is accurate, the line width of an etched line is small, the utilization rate of a circuit board can be improved, and the data transmission effect can be increased; thick copper is more favorable for signal transmission. The method enables the circuit layer to be embedded into the insulating layer, can effectively improve the adhesive force between the circuit layer and the insulating layer, can realize high temperature resistance and heat resistance, can also realize good signal transmission effect, is suitable for high-frequency high-speed circuit boards, and particularly can be used in 5G products.
Description
Technical Field
The invention relates to the technical field of flexible circuits, in particular to a flexible printed circuit board and a preparation method thereof.
Background
A Flexible Printed Circuit (FPC), also called a flexible circuit, is a printed circuit having high reliability and excellent flexibility, which is made of a polyester film or polyimide as a base material. By embedding the circuit design on a bendable light and thin plastic sheet, a large number of precision components are stacked and embedded in a narrow and limited space, thereby forming a bendable flexible circuit. The circuit can be bent and folded at will, has light weight, small volume, good heat dissipation and convenient installation, and is widely applied to the fields of aerospace, mobile phones, digital cameras, notebook computers, liquid crystal displays, audio and video, automobiles and the like.
With the continuous development of science and technology, mobile phones, portable computers, electronic products for automobiles and the like using flexible circuit boards have made higher demands on miniaturization and lightness of products. To meet this demand, the circuit integration in electronic products has been increasing, the patterns of printed circuits have been becoming more and more dense, and the conductor widths, conductor spacings, via sizes, and the like of circuits have been becoming smaller. Therefore, Flexible Printed Circuit (FPC) is used to replace rigid Circuit boards or Circuit board modules with its excellent properties such as lightness, thinness, toughness, flexibility, and fine Circuit characteristics, and is increasingly used for electrical connection between various electronic components.
The current FPC manufacturing process is to set a metal copper layer on an insulating base material, and then etch the metal copper layer to obtain a circuit board. However, the bonding force between the insulating substrate and the copper layer obtained by the manufacturing method is insufficient, so that the copper layer is easy to separate, the quality of the product is affected, and meanwhile, the high temperature resistance and the heat resistance are weak, and the manufacturing method is not suitable for the development of the 5G industry.
Therefore, it is necessary to provide a flexible printed circuit board and a method for manufacturing the same to solve the above drawbacks.
Disclosure of Invention
One of the objectives of the present invention is to provide a method for manufacturing a flexible printed circuit board, which can improve the adhesion between a copper foil and an insulating layer, can realize high temperature resistance and heat resistance, and has the advantages of simple process, low cost and high yield.
The invention also provides a flexible printed circuit board.
In order to achieve the above object, the present invention discloses a method for manufacturing a flexible printed circuit board, comprising the steps of:
providing a substrate layer;
preparing a stripping layer on the surface of the base material layer;
preparing a conductive copper layer on the surface of the stripping layer;
etching the conductive copper layer to form a circuit layer;
gluing the etched circuit layer to prepare an insulating layer, and embedding the circuit layer into the insulating layer;
peeling the base material layer via the peeling layer;
and preparing a thickened copper layer on the surface of the circuit layer with the insulating layer exposed.
Compared with the prior art, the preparation method of the flexible printed circuit board adopts the base material layer as bearing, guarantees are provided for follow-up processes, the stripping layer and the conductive copper layer are sequentially arranged on the surface of the base material layer, the conductive copper layer can be etched according to circuit requirements to obtain the circuit layer, the etched circuit layer is embedded into the insulating layer, the stripping layer is used for stripping the base material layer, the thickened copper layer is prepared on the surface of the circuit layer with the exposed insulating layer, and the required circuit board is obtained. The method effectively improves the adhesive force between the circuit layer and the insulating layer, and the conductive copper layer is prepared on the surface of the stripping layer, so that a thinner conductive copper layer can be realized. Because the insulating layer adopts low dielectric material, signal transmission is effectual, and the circuit board can realize high temperature resistant and heat resistance, is fit for being used for high frequency high speed circuit board, especially can be used for in the 5G product.
Preferably, the substrate layer is selected from a metal substrate or a non-metal substrate.
Preferably, the metal substrate is selected from a copper foil tape, an aluminum foil tape or a stainless steel tape.
Preferably, the non-metallic substrate is selected from PET, PP, PI or PO.
Preferably, the thickness of the conductive copper layer is 0.5 μm to 18 μm.
Preferably, the insulating layer is at least one selected from liquid crystal high molecular polymer, modified polyimide, polyphenylene sulfide, polytetrafluoroethylene resin, epoxy resin, bismaleimide triazine resin, thermosetting cyanate resin, thermosetting polyphenylene oxide resin and polyimide resin, or nitrile rubber and epoxy resin mixed glue.
Preferably, the conductive copper layer is prepared on the surface of the stripping layer by means of vacuum magnetron sputtering, chemical plating, water electroplating or chemical copper deposition.
Preferably, the metal layer is prepared on the surface of the stripping layer by vacuum magnetron sputtering, the copper foil layer is prepared on the surface of the metal layer by electroplating or chemical copper deposition, and the conductive copper layer is formed by the metal layer and the copper foil layer.
Preferably, the metal layer is a Cu layer, a Ni layer, a Cu/Ni layer or an Ag layer.
On the other hand, the invention also provides a flexible printed circuit board which is prepared by the preparation method of the flexible printed circuit board. The flexible printed circuit manufactured by the manufacturing method can be etched from thin copper to thick copper, the etching is convenient, the cost is low, the etching is accurate, the line width of an etched line is small, the utilization rate of the circuit board can be improved, and the data transmission effect can be improved; thick copper is more favorable for signal transmission. Particularly, an etching process is adopted firstly, and then the circuit layer is embedded into the insulating layer, so that the adhesive force between the circuit layer and the insulating layer is effectively improved.
Drawings
Fig. 1 shows a process flow diagram of a method for manufacturing a flexible printed circuit board according to the present invention.
Fig. 2 shows a schematic structural diagram of a substrate layer, a peeling layer, and a conductive copper layer stacked in sequence.
Fig. 3 shows a schematic diagram of the structure of the conductive copper layer etched into the wiring layer shown in fig. 2.
Fig. 4 shows a schematic structure of the circuit layer embedded insulating layer shown in fig. 3.
In fig. 5: fig. 5(a) is a view showing a state where the peeling layer shown in fig. 4 is peeled off, and fig. 5(b) is a view showing a structure where the base material layer is removed.
FIG. 6 shows a schematic diagram of a thickened copper layer formed on the wiring layer shown in FIG. 5 (b).
Fig. 7 shows a schematic structural diagram of a substrate layer, a peeling layer, a metal layer and a copper foil layer stacked in sequence.
Fig. 8 is a schematic diagram illustrating a structure in which the metal layer and the copper foil layer shown in fig. 7 are etched to form a circuit layer.
Fig. 9 shows a schematic structure of the circuit layer embedded insulating layer shown in fig. 8.
In fig. 10: fig. 10(a) is a view showing a state where the peeling layer shown in fig. 9 is peeled off, and fig. 10(b) is a view showing a structure where the base material layer is removed.
FIG. 11 shows a schematic diagram of a thickened copper layer formed on the wiring layer in FIG. 10 (b).
Description of the symbols:
the multilayer printed circuit board comprises a substrate layer 10, a stripping layer 20, a conductive copper layer 30, a metal layer 31, a copper foil layer 33, a circuit layer 40, an insulating layer 50 and a thickened copper layer 60.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1, a process flow diagram of the method for manufacturing a flexible printed circuit board according to the present invention is shown, which includes the steps of:
s1: a substrate layer 10 is provided, and the substrate layer 10 is used for bearing and supporting the stable proceeding of the subsequent process.
S2: preparing a stripping layer 20 on the surface of the substrate layer 10, and conveniently stripping the substrate layer 10 by arranging the stripping layer 20;
s3: preparing a conductive copper layer 30 on the surface of the peeling layer 20, wherein the method can prepare an extremely thin conductive copper layer 30 so as to facilitate etching and achieve larger line width and line distance;
s4: etching the conductive copper layer 30 to form a circuit layer 40;
s5: coating glue on the etched circuit layer 40 to prepare an insulating layer 50, and embedding the circuit layer 40 into the insulating layer 50;
s6: peeling the base material layer 10 via the peeling layer 20;
s7: a thickened copper layer 60 is formed on the surface of the wiring layer 40 where the insulating layer 50 is exposed.
Meanwhile, the method for manufacturing the flexible printed circuit board of the present application is further illustrated with reference to fig. 2 to 11, which includes the following steps:
in the technical scheme of the invention, please refer to fig. 2, a substrate layer 10 is provided, the substrate layer 10 is selected from a metal substrate or a non-metal substrate, and the provision of the substrate layer 10 can provide support guarantee for a subsequent process. The metal substrate may be, but is not limited to, a copper foil tape, an aluminum foil tape, or a stainless steel tape; the non-metallic substrate may be, but is not limited to, PET, PEN, PP, PI, PC. Preferably, a non-metallic substrate is provided. In actual preparation, the surface of the substrate layer 10 is pretreated to obtain a suitable surface tension. Preferably, the method of pretreatment may be, but is not limited to, corona or chemical treatment, or the like. Wherein, in order to ensure a certain supporting force, the thickness of the substrate layer 10 is 25 μm-100 μm. For example, the thickness of the substrate layer 10 may be, but is not limited to, 25 μm, 35 μm, 45 μm, 55 μm, 65 μm, 75 μm, 85 μm, 95 μm, 100 μm.
In the technical solution of the present invention, please refer to fig. 2 again, a peeling layer 20 is prepared on the surface of the substrate layer 10, the forming manner of the peeling layer 20 is not limited to bonding, printing, injection molding, pressing, etc., in this embodiment, a layer of the peeling layer 20 is bonded on the surface of the substrate layer 10. The peeling layer 20 can be peeled from the conductive copper layer 30 to remove the base material layer 10, the peeling layer 20 is operated to be released to remove the base material layer 10, and the base material layer 10 is separated from the conductive copper layer 30 (or the wiring layer 40) by means of the peeling layer 20. Further, the peeling layer 20 may be made of silicon, fluorine, non-silicon, or the like, or may be made of a release material.
In the technical solution of the present invention, please refer to fig. 2 again, after the peeling layer 20 is prepared, a conductive copper layer 30 is prepared on the surface of the peeling layer 20, and the conductive copper layer 30 may be formed by, but not limited to, vacuum magnetron sputtering, chemical plating, water electroplating, electroless copper plating, and other technical means. By the means, the extremely thin conductive copper layer 30 can be obtained on the surface of the stripping layer 20, and the subsequent etching process is facilitated, so that the good line width and line distance are obtained. The thickness of the conductive copper layer 30 is 0.5 μm to 18 μm, for example, the thickness of the conductive copper layer 30 may be, but is not limited to, 0.5 μm, 1 μm, 3 μm, 5 μm, 7 μm, 9 μm, 11 μm, 13 μm, 15 μm, 17 μm, 18 μm. Preferably, the thickness of the conductive copper layer 30 is 2 μm to 9 μm, enabling a line width of 2 μm and a line pitch of 3 μm.
In a preferred embodiment of the above technical solution, referring to fig. 7, the conductive copper layer 30 includes a metal layer 31 and a copper foil layer 33 located on a surface of the metal layer 31. Preparing a metal layer 31 on the surface of the stripping layer 20 by vacuum magnetron sputtering, preparing a copper foil layer 33 on the surface of the metal layer 31 by electroplating or chemical copper deposition, and forming a conductive copper layer 30 on the metal layer 31 and the copper foil layer 33. First, a thin metal layer 31 is formed on the surface of the peeling layer 20 by vacuum magnetron sputtering, and then a copper foil layer 33 is formed on the surface of the metal layer 31 by electroplating or chemical copper deposition, thereby reducing the cost and improving the yield and the productivity. Further, the metal layer 31 is a Cu layer, a Ni layer, a Cu/Ni layer, or an Ag layer. Preferably, the metal layer 31 is a Cu/Ni layer, which is beneficial to improving the performance of the circuit board.
In the technical solution of the present invention, referring to fig. 3, after the conductive copper layer 30 is prepared, the conductive copper layer 30 is etched to form the circuit layer 40. Since the conductive copper layer 30 has a small thickness, the etching process is easy, a small line width can be obtained, for example, the line width is 2 μm, the line distance is 3 μm, the transmission speed is increased, the amount of the etching solution is small, and the method is environment-friendly and low in cost. Further, referring to fig. 8, the conductive copper layer 30 includes a metal layer 31 and a copper foil layer 33, and the metal layer 31 and the copper foil layer 33 are etched to form a circuit layer 40. Among them, the etching process is a common manner in the art and will not be described herein.
In the technical solution of the present invention, referring to fig. 4 or fig. 9, after the circuit layer 40 is formed by etching, the circuit layer 40 after etching is coated with glue to prepare the insulating layer 50, and the circuit layer 40 is embedded in the insulating layer 50. The insulating layer 50 may be formed by, but not limited to, injection molding, screen printing, extrusion, and the like. The insulating layer 50 may be made of a soft material or a hard material, and preferably an insulating material having heat dissipation properties, and more preferably a material having a low dielectric constant. The insulating layer 50 may be, but not limited to, at least one of Liquid Crystal Polymer (LCP), Modified Polyimide (MPI), polyphenylene sulfide (PPS), polytetrafluoroethylene resin (PTFE), epoxy resin (EP), bismaleimide triazine resin (BT), thermosetting cyanate resin (CE), thermosetting polyphenylene ether resin (PPE), and polyimide resin (PI), or nitrile rubber and epoxy resin mixed glue. In the embodiment of the present application, a polyimide resin is coated on the peeling layer 20 and the circuit layer 40, and the circuit layer 40 is embedded in the polyimide resin and then semi-cured or cured. In another embodiment, the insulation layer 50 is made of Liquid Crystal Polymer (LCP) by injection molding, and the circuit layer 40 is embedded in the LCP, which has low dielectric constant, can resist high temperature and heat, and can be used in high frequency circuit boards, such as mobile phone antennas or 5G products.
In the technical solution of the present invention, referring to fig. 5-6 or fig. 10-11, after the insulating layer 50 is prepared, the peeling layer 20 is peeled off (as shown in fig. 5(a) or fig. 10 (a)), so as to separate the substrate layer 10 from the circuit layer 40 and the insulating layer 50, thereby obtaining a structure (as shown in fig. 5(b) or fig. 10 (b)) in which the circuit layer 40 is embedded in the insulating layer 50, and preparing a thickened copper layer 60 (as shown in fig. 6 or fig. 11) on the surface of the circuit layer 40 where the insulating layer 50 is exposed. I.e. a thicker thickened copper layer 60 is obtained on the surface of the circuit layer 40 to improve the transportation capability of the flexible printed circuit board. In particular, the thickened copper layer 60 can be formed by electrolytic copper plating, electroless copper plating or electroless copper plating. In this embodiment, a copper layer is plated on the surface of the circuit layer 40 by electroplating to increase the thickness of the circuit layer 40 in the insulating layer 50. Because the circuit layer 40 is embedded in the insulating layer 50, the adhesion between the circuit layer 40 and the insulating layer 50 is solved, and the stability and the service life are prolonged.
Compared with the prior art, the preparation method of the flexible printed circuit board adopts the substrate layer 10 as bearing, guarantees are provided for follow-up processes, the stripping layer 20 and the conductive copper layer 30 are sequentially arranged on the surface of the substrate layer 10, the conductive copper layer 30 can be etched according to circuit requirements to obtain the circuit layer 40, the etched circuit layer 40 is embedded into the insulating layer 50, the substrate layer 10 is stripped by utilizing the stripping layer 20, and the thickened copper layer 60 is prepared on the surface of the circuit layer 40 with the exposed insulating layer 50 to obtain the required circuit board. The method effectively improves the adhesive force between the circuit layer 40 and the insulating layer 50, and the conductive copper layer 30 is prepared on the surface of the stripping layer 20, and can be carried out by adopting electroplating and other modes, so that the thinner conductive copper layer 30 can be realized, and when the etching process is carried out, the etching is convenient, the cost is lower, the etching is accurate, and the line width of the etched circuit is small. And because the insulating layer 50 is made of low dielectric materials, the circuit board can realize high temperature resistance and heat resistance, and is suitable for high-frequency and high-speed circuit boards, especially for 5G products.
The above disclosure is only for the purpose of illustrating the preferred embodiments of the present invention and is not to be construed as limiting the scope of the present invention, therefore, the present invention is not limited by the appended claims.
Claims (10)
1. A method for manufacturing a flexible printed circuit board, comprising the steps of:
providing a substrate layer;
preparing a stripping layer on the surface of the base material layer;
preparing a conductive copper layer on the surface of the stripping layer;
etching the conductive copper layer to form a circuit layer;
coating glue on the etched circuit layer to prepare an insulating layer, and embedding the circuit layer into the insulating layer;
peeling the base material layer via the peeling layer;
and preparing a thickened copper layer on the surface of the circuit layer with the insulating layer exposed.
2. The method of manufacturing a flexible printed circuit board according to claim 1, wherein the substrate layer is selected from a metal substrate or a non-metal substrate.
3. The method of manufacturing a flexible printed circuit board according to claim 2, wherein the metal substrate is selected from a copper foil tape, an aluminum foil tape or a stainless steel tape.
4. The method of manufacturing a flexible printed circuit board according to claim 2, wherein the non-metal substrate is selected from PET, PP, PI, or PO.
5. The method of manufacturing a flexible printed circuit board according to claim 1, wherein the thickness of the conductive copper layer is 0.5 μm to 18 μm.
6. The method of manufacturing a flexible printed circuit board according to claim 1, wherein the insulating layer is at least one selected from the group consisting of liquid crystal high molecular polymer, modified polyimide, polyphenylene sulfide, polytetrafluoroethylene resin, epoxy resin, bismaleimide triazine resin, thermosetting cyanate resin, thermosetting polyphenylene ether resin and polyimide resin, or nitrile rubber and epoxy resin hybrid.
7. The method of claim 1, wherein the conductive copper layer is formed on the surface of the release layer by vacuum magnetron sputtering, electroless plating, water electroplating or electroless copper plating.
8. The method of claim 1, wherein the metal layer is prepared on the surface of the peeling layer by vacuum magnetron sputtering and the copper foil layer is prepared on the surface of the metal layer by electroplating or electroless copper plating, and the metal layer and the copper foil layer form the conductive copper layer.
9. The method of manufacturing a flexible printed circuit board according to claim 8, wherein the metal layer is a Cu layer, a Ni layer, a Cu/Ni layer, or an Ag layer.
10. A flexible printed circuit board produced by the method for producing a flexible printed circuit board according to any one of claims 1 to 9.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
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| CN202110774819.3A CN113473721A (en) | 2021-07-08 | 2021-07-08 | Flexible printed circuit board and preparation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
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| CN202110774819.3A CN113473721A (en) | 2021-07-08 | 2021-07-08 | Flexible printed circuit board and preparation method thereof |
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| CN202110774819.3A Pending CN113473721A (en) | 2021-07-08 | 2021-07-08 | Flexible printed circuit board and preparation method thereof |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114007343A (en) * | 2021-10-22 | 2022-02-01 | 深圳明阳电路科技股份有限公司 | Printed Circuit Board (PCB) electric thick gold, PCB and manufacturing method thereof |
| CN114305430A (en) * | 2022-01-06 | 2022-04-12 | 江苏正心智能科技有限公司 | Elastic electrocardio-electrode and manufacturing process thereof |
| CN116321810A (en) * | 2023-02-09 | 2023-06-23 | 无锡深南电路有限公司 | Circuit board preparation method and circuit board |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114007343A (en) * | 2021-10-22 | 2022-02-01 | 深圳明阳电路科技股份有限公司 | Printed Circuit Board (PCB) electric thick gold, PCB and manufacturing method thereof |
| CN114007343B (en) * | 2021-10-22 | 2024-05-17 | 深圳明阳电路科技股份有限公司 | Printed circuit board electro-thick gold, printed circuit board and manufacturing method thereof |
| CN114305430A (en) * | 2022-01-06 | 2022-04-12 | 江苏正心智能科技有限公司 | Elastic electrocardio-electrode and manufacturing process thereof |
| CN116321810A (en) * | 2023-02-09 | 2023-06-23 | 无锡深南电路有限公司 | Circuit board preparation method and circuit board |
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