JP2019176006A - Method of manufacturing printed circuit board - Google Patents

Abstract

To provide a method of manufacturing a printed circuit board, inexpensive and easy to process, capable of suppressing misalignment that occurs when electronic components are mounted on a substrate.SOLUTION: In a through hole forming process, at least two through holes are formed by shifting a center of a formation position of each of the at least two through holes on a mounting surface of a substrate with respect to a center of an insertion position of each of the at least two lead pins on the mounting surface of the substrate and shifting the center of the formation position of each of the at least two through holes on the mounting surface of the substrate in mutually different directions.SELECTED DRAWING: Figure 1

Description

  The present invention relates to a method of manufacturing a printed circuit board for mounting an electronic component.

  NC drill processing, router processing, or press processing using a die is performed to form a pilot hole for a through hole similar to the cross-sectional shape of a lead pin mounted on an electronic component in a base that constitutes a printed circuit board. Yes. In general, the router processing has a problem that the manufacturing cost of the printed circuit board becomes high when fine processing is performed. Further, the press work has a problem that burrs are easily generated at the end of the prepared hole, and the quality of the printed circuit board is impaired. On the other hand, NC drill processing has higher processing accuracy than router processing and press processing, and can prepare a pilot hole at a lower cost than router processing and press processing. For this reason, it is preferable to form the said pilot hole in the base | substrate which comprises a printed circuit board by NC drill process.

JP 2011-161666 A

  However, there are cases where it is difficult to form a prepared hole in the base body as specified only by the NC drilling process. In this case, since router processing is used together, processing accuracy deteriorates. The deterioration of the processing accuracy of the pilot hole means that the play of the mounting position of the electronic component is large. As a result, there is a problem that the positional deviation of the components becomes large, and the finished accuracy as a mounting circuit board is deteriorated. In addition, since the prepared hole is formed by different processing, there is a problem that the processing accuracy differs for each prepared hole.

  The present invention has been made in consideration of such circumstances, and the object of the present invention is to be inexpensive and easy to process, and to suppress misalignment that occurs when an electronic component is mounted on a substrate. It is providing the manufacturing method of a printed circuit board.

  In order to achieve the above object, in the printed circuit board manufacturing method according to the present embodiment, an electronic component having at least two lead pins is inserted into at least two through holes formed in a plate-like substrate, and the electronic component is inserted. In a method of manufacturing a printed circuit board for mounting, a preparation step of preparing the base body, and formation of a through hole that forms at least two through holes in the base body, each facing at least two of the lead pins, using an NC drill And a film forming step of forming at least two through holes in the base by forming a metal film on the exposed surface of the base exposed by the at least two through holes. In the through hole forming step, the center of the formation position of each of the at least two through holes on the mounting surface of the base is shifted from the center of the insertion position of each of the at least two lead pins on the mounting surface of the base; In addition, at least two of the through holes are formed by shifting the centers of the positions of the at least two of the through holes on the mounting surface of the substrate in different directions.

  According to the above configuration, at least two through holes formed by the method for manufacturing a printed circuit board according to the present embodiment have a shape that can be formed only by an NC drill. In other words, the at least two through holes have a shape that does not need to be processed using a router or a mold. For this reason, at least two through-holes can be processed at low cost. Moreover, since all the through holes can be formed only by the NC drill, the processing accuracy is also good. In addition, when the electronic component EC is mounted on the base body 2, play at the mounting position of the electronic component EC can be reduced, and the above-described positional deviation can be suppressed.

  The method for manufacturing a printed circuit board according to the present embodiment is inexpensive and easy to process, and can suppress displacement that occurs when an electronic component is mounted on a substrate.

It is a figure which shows the printed circuit board which concerns on this embodiment. It is a figure which shows the mounting surface in each manufacturing process of the manufacturing method of the printed circuit board which concerns on this embodiment. It is a figure which shows the mounting surface in each manufacturing process of the manufacturing method of the printed circuit board which concerns on this embodiment. It is a figure which shows the mounting surface in each manufacturing process of the manufacturing method of the printed circuit board which concerns on this embodiment. It is a figure which shows the mounting surface in each manufacturing process of the manufacturing method of the printed circuit board which concerns on this embodiment. It is a figure which shows the mounting surface in each manufacturing process of the manufacturing method of the printed circuit board which concerns on this embodiment. It is a figure which shows the mounting surface in each manufacturing process of the manufacturing method of the printed circuit board which concerns on this embodiment. It is a figure which shows the mounting surface in each manufacturing process of the manufacturing method of the printed circuit board which concerns on this embodiment. It is a figure which shows the mounting surface in each manufacturing process of the manufacturing method of the printed circuit board which concerns on this embodiment. It is a figure which shows the mounting surface in each manufacturing process of the manufacturing method of the printed circuit board which concerns on this embodiment.

  Hereinafter, a printed circuit board manufacturing method according to an embodiment of the present invention will be described with reference to the drawings. In addition, this embodiment is not limited to the content demonstrated below, In the range which does not change the summary, it can change arbitrarily and can implement. In addition, the drawings used for the description of the embodiments schematically show the constituent members, and are partially emphasized, enlarged, reduced, or omitted to deepen the understanding. And may not accurately represent the shape or the like.

  FIG. 1 is a diagram illustrating a printed circuit board 1 according to the present embodiment. FIG. 1 shows a mounting surface of the electronic component EC on the printed circuit board 1 according to the present embodiment. The printed circuit board 1 shown in FIG. 1 inserts the electronic component EC having four lead pins LP1 to LP4 into the four through holes 31 to 34 formed in the base 2, and solders the electronic component EC. It is for implementation.

  The cross-sectional shape on the mounting surface of the lead pins LP1 and LP2 shown in FIG. 1 is a rounded rectangular shape with opposed semicircles. Moreover, the cross-sectional shape on the mounting surface of the lead pins LP3 and LP4 shown in FIG. 1 is circular. On the printed circuit board 1, on the mounting surface of the base 2, a through hole 31 associated with the lead pin LP1, a through hole 32 associated with the lead pin LP2, a through hole 33 associated with the lead pin LP3, and a lead pin LP4 Each of the through-holes 34 associated with is formed. A lead pin LP1 is inserted into the through hole 31. The lead pin LP2 is inserted into the through hole 32. The lead pin LP3 is inserted into the through hole 33. A lead pin LP4 is inserted into the through hole 34. After inserting the four lead pins LP1 to LP4 into the four through holes 31 to 34, the electronic component EC is soldered to the printed circuit board 1.

  Furthermore, the printed circuit board 1 according to the present embodiment will be described in detail. The base 2 is a plate-like member. For example, the base 2 includes a resin material such as glass epoxy. Specifically, the base 2 may be a single-layer resin plate made of only a resin material, or a double-sided plate in which a metal foil such as copper is bonded to both surfaces of the resin plate, or a resin material and a metal foil such as copper. A multilayer plate in which at least two layers are laminated may be used. In the present embodiment, the metal foil is not limited to copper, and other metal materials such as silver and gold can be used depending on the intended use of the printed circuit board 1.

  The through hole 31 includes a through hole 41 formed in the base 2 and a metal film 51 formed on the exposed surface of the base 2 exposed by the through hole 41. The through hole 41 is formed in the base 2 with an NC drill (not shown) so as to face the lead pin LP1. The opening shape of the through hole 41 in the present embodiment is a shape that can be formed only with an NC drill. In other words, the opening shape of the through hole 41 is a shape that does not need to be processed using a router or a mold. For this reason, the through hole 41 can be processed at low cost, and the processing accuracy is also good. The opening shape of the through-hole 41 is a rounded rectangular shape that is opposed to a semicircle. In the present embodiment, the ratio of the major axis to the minor axis of the through hole 41 is 1: 2 or more. The metal film 51 is formed on the substrate 2 by performing a film forming process on the exposed surface of the substrate 2 exposed by the through hole 41. In addition, the film-forming process in this embodiment is a plating process, for example.

  The through hole 32 includes a through hole 42 formed in the base 2 and a metal film 52 formed on the exposed surface of the base 2 exposed by the through hole 42. The through hole 42 is formed in the base 2 with an NC drill (not shown) so as to face the lead pin LP2. The opening shape of the through-hole 42 in the present embodiment is a rounded rectangular shape that is opposed to a semicircle. In the present embodiment, the ratio of the major axis to the minor axis of the through hole 41 is 1: 2 or more. The metal film 52 is formed on the substrate 2 by performing a film forming process on the exposed surface of the substrate 2 exposed by the through hole 42.

  The through hole 33 includes a through hole 43 formed in the base 2 and a metal film 53 formed on the exposed surface of the base 2 exposed by the through hole 43. The through hole 43 is formed in the base 2 by an NC drill (not shown) so as to face the lead pin LP3. The opening shape of the through-hole 43 in this embodiment is circular. The metal film 53 is formed on the substrate 2 by performing a film forming process on the exposed surface of the substrate 2 exposed by the through holes 43.

  The through hole 34 includes a through hole 44 formed in the base 2 and a metal film 54 formed on the exposed surface of the base 2 exposed by the through hole 44. The through hole 44 is formed in the base 2 with an NC drill (not shown) so as to face the lead pin LP4. The opening shape of the through hole 44 in the present embodiment is a circular shape. The metal film 54 is formed on the substrate 2 by performing a film forming process on the exposed surface of the substrate 2 exposed by the through hole 44.

  Here, the metal films 51 to 54 are formed in a film forming process to be described later. The metal films 51 to 54 are made of, for example, copper. The metal films 51 to 54 in the present embodiment are not limited to copper, but other metals such as silver and gold depending on the usage of the printed circuit board 1 and the required characteristics of the through holes 31 to 34. Materials can be used.

  Here, in the method for manufacturing the printed circuit board 1 according to the present embodiment, four through-holes with respect to the center of the insertion position on the mounting surface of the base 2 of each of at least two of the four lead pins LP1 to LP4. 41 to 44, the center of the formation position on the mounting surface of the base 2 of each of the at least two through holes is shifted, and the center of the formation position of at least two through holes on the mounting surface of the base 2 is different from each other. By shifting, at least two through holes are formed.

  In general, the four through-holes 41 to 44 have four through-holes 41 to 41 on the mounting surface of the base body 2 with respect to the centers CL1 to CL4 of the insertion positions of the four lead pins LP1 to LP4 on the mounting surface of the base body 2, respectively. 44, the centers CH1 to CH4 of the respective formation positions are made to coincide with each other. Here, in order to facilitate insertion of the electronic component EC, the size of the through hole is formed larger than the lead pin. For this reason, the play of the mounting position of the electronic component EC becomes large. As a result, there is a problem that the positional deviation that occurs when the electronic component EC is mounted on the base 2 becomes large.

  On the other hand, in the method for manufacturing the printed circuit board 1 according to the present embodiment, among the four lead pins LP1 to LP4, four through holes 41 with respect to the center of the insertion position of each of at least two lead pins on the mounting surface of the substrate 2. ˜44, the center of each of the formation positions of at least two through holes on the mounting surface in the base 2 is shifted, and the center of the formation position of at least two through holes on the mounting surface in the base 2 is shifted in different directions. Thus, at least two through holes are formed. Thereby, when the electronic component EC is mounted on the base body 2, play at the mounting position of the electronic component EC can be reduced, and the above-described displacement can be suppressed.

  Here, in the method for manufacturing the printed circuit board 1 according to the present embodiment, as an example, at least two on the mounting surface of the base 2 with respect to the center of the insertion position of each of at least two lead pins on the mounting surface of the base 2. The center of the formation position of each through-hole is shifted, and the center of the formation position of each of the at least two through-holes on the mounting surface of the substrate 2 is shifted in parallel to each other to form at least two through-holes. To do.

  Specifically, in the method of manufacturing the printed circuit board 1 according to the present embodiment, as shown in FIG. 1, the mounting on the base 2 is performed with respect to the center of the insertion position of at least two lead pins on the mounting surface of the base 2. The center of the formation position of each of at least two through holes on the surface is shifted, and in the X direction, the center CH1 of the formation position of the through hole 41 and the center CH2 of the formation position of the through hole 42 approach each other, and in the Y direction The center CH1 of the formation position of the through hole 41 and the center CH3 of the formation position of the through hole 43 are separated from each other, and in the Y direction, the center CH2 of the formation position of the through hole 42 and the center CH4 of the formation position of the through hole 44 are separated. The through holes 41 to 44 are formed so as to be separated from each other. Thereby, the positions of at least two through holes are point-symmetric with respect to the center point of a straight line connecting the centers of at least two through holes of the base 2, and the finishing accuracy of the printed circuit board 1 can be improved.

  Here, a method of manufacturing the printed circuit board 1 according to the present embodiment will be described with reference to FIGS. 2 to 10 are diagrams showing the mounting surface in each manufacturing process of the printed circuit board manufacturing method according to this embodiment.

  First, as shown in FIG. 2, the substrate 2 is prepared (preparation step). Next, as shown in FIGS. 3 to 9, an NC drill is used to form four through holes in the base body 2 that face each of the four lead pins (through hole forming step). The positions where the four through holes are formed are determined, for example, by the allowable installation range of the electronic component EC in the base 2.

  First, as shown in FIG. 3, a through hole 411 is formed in the base 2. The through hole 411 is formed by cutting one end of the through hole 41 where the through hole 41 is to be formed with an NC drill. Here, the formation scheduled position α coincides with the formation position of the through hole 41. Next, as shown in FIG. 4, a through hole 412 is formed in the base 2. The through hole 412 is formed by cutting the other end of the formation position α of the through hole 41 with an NC drill. That is, in the method for manufacturing the printed circuit board 1 according to this embodiment, the through hole is formed from the end of the through hole 41 where the through hole 41 is to be formed. The reason for this is to prevent the through hole 41 from expanding beyond a predetermined dimension by forming the through hole 41 from the end of the formation position α of the through hole 41. Thereby, the processing precision of the through-hole 41 can be improved.

  Next, as shown in FIG. 5, the remaining cutting location of the formation position α of the through hole 41 is further cut with an NC drill. For example, the formed through hole 411 is further cut with an NC drill to form the through hole 413 in the base 2. For example, cutting is performed by shifting the cutting area by the NC drill by 1/2 or less. That is, a part of the region of the through hole 413 corresponds to the region of the through hole 411. Next, by repeating the process of cutting the remaining cutting location of the through hole 41 formation planned position α with an NC drill, the through hole 41 corresponding to the lead pin LP1 is formed in the base 2 as shown in FIG. .

  Next, as shown in FIG. 7, a through hole 42 corresponding to the lead pin LP <b> 2 is formed in the base 2. The process of forming the through hole 42 is the same as the process of forming the through hole 41. As described above, the through hole 42 is formed so that the center CH1 of the formation position of the through hole 41 and the center CH2 of the formation position of the through hole 42 are close to each other in the X direction.

  Next, as shown in FIG. 8, a through hole 43 corresponding to the lead pin LP3 is formed in the base 2. As described above, the through hole 43 is formed so that the center CH1 of the formation position of the through hole 41 and the center CH3 of the formation position of the through hole 43 are separated from each other in the Y direction. Next, as shown in FIG. 9, a through hole 44 corresponding to the lead pin LP4 is formed in the base 2. The process of forming the through hole 44 is the same as the process of forming the through hole 43. As described above, the through hole 43 is formed so that the center CH2 of the formation position of the through hole 42 and the center CH4 of the formation position of the through hole 44 are separated from each other in the Y direction.

  Next, as shown in FIG. 10, metal films 51 to 54 are formed on the exposed surfaces of the base 2 exposed by the through holes 41 to 44 by performing a film forming process. As a result, four through holes 31 to 34 are formed in the substrate 2 (film formation step). Through the above process, the printed circuit board 1 in which four through-holes facing each of the four lead pins are formed using an NC drill.

(Summary)
As described above, the printed circuit board manufacturing method according to the present embodiment inserts the electronic component EC having the four lead pins LP1 to LP4 into the four through holes 31 to 34 formed in the plate-like base 2 so that the electronic In the manufacturing method of the printed circuit board 1 for mounting the component EC, the four through-holes 41 facing each of the lead pins of the four lead pins LP1 to LP4 using a preparation step for preparing the base 2 and an NC drill (not shown). Through-hole forming step for forming ~ 44 in the base body 2 and forming a metal film on the exposed surface of the base body 2 exposed by the four through-holes 41 to 44, thereby forming four through holes 31 to 34 in the base body 2 And a film forming process. In the through hole forming step, at least two of the four through holes 41 to 44 with respect to the center of the insertion position on the mounting surface of the base 2 of each of the at least two lead pins among the four lead pins LP1 to LP4. The centers of the formation positions of the through holes 41 to 44 on the mounting surface of the base 2 are shifted, and the centers of the positions of the at least two through holes on the mounting surface of the base 2 are shifted in different directions from each other. A through hole is formed.

  According to the above configuration, at least two through holes formed by the method for manufacturing a printed circuit board according to the present embodiment have a shape that can be formed only by an NC drill. In other words, the at least two through holes have a shape that does not need to be processed using a router or a mold. For this reason, at least two through-holes can be processed at low cost. Moreover, since all the through holes can be formed only by the NC drill, the processing accuracy is also good. In addition, when the electronic component EC is mounted on the base body 2, play at the mounting position of the electronic component EC can be reduced, and the above-described positional deviation can be suppressed.

  Thus, the printed circuit board manufacturing method according to the present embodiment is inexpensive and easy to process, and can suppress misalignment that occurs when an electronic component is mounted on a substrate.

  Here, in the method for manufacturing the printed circuit board 1 according to the present embodiment, as an example, at least two on the mounting surface of the base 2 with respect to the center of the insertion position of each of at least two lead pins on the mounting surface of the base 2. The center of the formation position of each through-hole is shifted, and the center of the formation position of each of the at least two through-holes on the mounting surface of the base 2 is shifted in parallel to each other to form at least two through-holes. Yes. However, the manufacturing method of the printed circuit board 1 in this embodiment is not limited to this. For example, in the method of manufacturing the printed circuit board 1 according to this embodiment, the centers CH1 to CH4 of the formation positions of at least two through holes on the mounting surface of the base 2 are not close to each other, but approach or separate from each other. Alternatively, at least two through holes may be formed. In other words, in the method for manufacturing the printed circuit board 1 according to the present embodiment, at least two through holes may be formed so that play at the mounting position of the electronic component EC is reduced.

  In the present embodiment, the through hole 41 and the through hole 42 are formed so that the center CH1 of the formation position of the through hole 41 and the center CH2 of the formation position of the through hole 42 are close to each other. Further, the through hole 41 and the through hole 43 are formed such that the center CH1 of the formation position of the through hole 41 and the center CH3 of the formation position of the through hole 43 are separated from each other. Further, the through hole 42 and the through hole 44 are formed so that the center CH2 of the formation position of the through hole 42 and the center CH4 of the formation position of the through hole 44 are separated from each other. That is, a plurality of through holes are formed so that the centers of the positions where the two through holes are formed approach or separate from each other. However, the manufacturing method of the printed circuit board 1 in this embodiment is not limited to this. For example, in the method for manufacturing the printed circuit board 1 according to the present embodiment, a plurality of through holes may be formed such that the centers of the positions where two or more through holes are formed approach or separate from each other.

  In the present embodiment, the printed circuit board 1 shown in FIG. 1 is soldered by inserting an electronic component EC having four lead pins LP1 to LP4 into four through holes 31 to 34 formed in the base 2. Thus, the electronic component EC is mounted. For example, the printed circuit board 1 according to the present embodiment inserts the electronic component EC having at least two or more lead pins into at least two through holes formed in the base 2 and solders the electronic component EC. It may be for mounting the component EC.

DESCRIPTION OF SYMBOLS 1 Printed circuit board 2 Base | substrate 31-34 Through-hole 41-44 Through-hole 51-54 Metal film EC Electronic component LP1-LP4 Lead pin

Claims (4)

In a method of manufacturing a printed board for mounting an electronic component having at least two lead pins inserted into at least two through holes formed in a plate-like base body,
A preparation step of preparing the substrate;
A through-hole forming step of forming at least two through-holes in the base body, each facing at least two of the lead pins, using an NC drill;
Forming a metal film on an exposed surface of the base exposed by at least two through-holes, thereby forming at least two through holes in the base, and
In the through hole forming step, the center of the formation position of each of the at least two through holes on the mounting surface of the base is shifted from the center of the insertion position of each of the at least two lead pins on the mounting surface of the base; And the manufacturing method of a printed circuit board which forms at least two said through-holes by shifting the center of the formation position of each of said at least two said through-holes on the mounting surface in the said base | substrate in a mutually different direction.   The said through-hole formation process WHEREIN: The center of the formation position of each of the at least two said through-holes on the mounting surface in the said base | substrate is shifted in parallel to a mutually different direction, and at least 2 said through-hole is formed. Manufacturing method for printed circuit boards.   3. The print according to claim 1, wherein in the through-hole forming step, at least two of the through-holes are formed such that the centers of the formation positions of the at least two through-holes approach or separate from each other. A method for manufacturing a substrate.   The printed circuit board according to any one of claims 1 to 3, wherein, in the through-hole forming step, the through-hole is formed having a rounded rectangular shape or a circular shape facing a semicircle as an opening shape. Production method.

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