KR20080055728A - Adhesive sheet for capacitor and method for manufacturing printed circuit board having embedded capacitor using the same - Google Patents

Abstract

An adhesive sheet for a capacitor and a method for manufacturing a printed circuit board having an embedded capacitor using the same are provided to miniaturize the capacitor by reducing a distance between electrodes. An adhesive sheet for a capacitor includes a dielectric layer(1) having both adhesive sides, and adhesive resin layers(2,3). The capacitor is formed by adhering an electrode on both sides of the dielectric layer. The capacitor is embedded to a print distribution plate. The dielectric layer has a high dielectric constant, and is configured by a material of which a float is not generated with a realistic thickness change at a pressure and a temperature of a press process for adhering the electrode to the dielectric layer. The contact resin layers have the float for filling a circumference of the electrode in the press process. The adhesive resin layers are arranged on both sides of the dielectric layer.

Description

Adhesive sheet for capacitor and method for manufacturing printed circuit board having embedded capacitor using the same}

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a capacitor adhesive sheet and a method for manufacturing a capacitor-embedded printed wiring board manufactured using the sheet, and in particular, an adhesive sheet for a capacitor applicable to a multilayer flexible printed wiring board having a flexible cable part and a print using the same. The manufacturing method of a wiring board is related.

In recent years, the demand for miniaturization and high density of mounting boards mounted on small electronic devices has increased. As a part thereof, demands for high-density mounting on the surface of wiring boards such as CSPs (chip size packages), chip resistors, and chip capacitors, such as mobile phones, are increasing.

In a multilayer printed wiring board on which components such as a CSP are mounted, capacitors are provided for various purposes such as decoupling capacitors. In order to cope with an increase in mounting cost, component cost, and high density mounting, so-called component embedded wiring boards have been devised.

For example, in order to reduce the number of surface mounting components, capacitors are provided between the layers of the wiring layer (see JP-A-10-93246). That is, a capacitor is formed by providing an insulating layer of an organic resin containing a dielectric filler between adjacent thin film wiring patterns. Thereby, since the number of surface mounting of a capacitor can be reduced, the number of mounting components can be reduced.

However, the method described in Japanese Patent Laid-Open No. 10-93246 is not suitable for reducing switching noise requiring a large capacity (see Japanese Patent Laid-Open No. 2001-177004). Japanese Laid-Open Patent Publication No. 2001-177004 also describes a method of increasing the capacitance of a capacitor by forming a metal foil serving as an electrode in an uneven shape to increase the electrode area.

However, in these methods, no special consideration is given regarding the application to the multilayer flexible printed wiring board.

In this regard, a method of forming an electrode together with a wiring pattern on a base insulating material, forming a dielectric on the base insulator by printing or electrodeposition, and forming an opposite electrode thereon has been proposed (Japanese Patent Laid-Open No. 2001-). 15883).

However, in this method, it is difficult to stably form a thin film thickness of the dielectric, and it can be said that the process is complicated. Moreover, although the flatness of a board | substrate is calculated | required for use for the inner-layer core board | substrate of a multilayer flexible printed wiring board, since flatness cannot be ensured by the method mentioned above, application to a flexible printer wiring board is difficult.

In addition, Japanese Patent Application Laid-Open No. 5-7063 (Japanese Patent No. 3019541) describes a double-sided copper clad laminate in which conductor layers provided on both surfaces of an insulating resin layer containing dielectric powder can be patterned by etching. It is. By using this method, it is possible to stabilize the dielectric constant.

However, when the organic resin layer is formed to have a thickness of 50 μm or less, it is difficult to maintain the shape of the resin layer at the time of pattern formation, and it is difficult to thin the film, which is advantageous for the large capacity of the capacitor. For this reason, there is a need for a thin capacitor that can be applied to a component-embedded multilayer flexible printer wiring board.

FIG. 4 is a cross-sectional view showing the structure of a capacitor described in Japanese Patent Application Laid-Open No. 5-7063. As shown in FIG. 4, copper foil 22 serving as an electrode on both sides of an insulating resin layer 21 containing dielectric powder is provided. The conductor layer of 23) is a double-sided copper clad laminate that is bonded through an adhesive material.

However, since the insulating resin layer 21 has a thickness of about 0.3 mm, it is too thick to be incorporated into a multilayer flexible printed wiring board which is required to be thinned. On the other hand, if the thickness of the insulating resin layer 21 is 50 µm or less, the insulating resin layer 10 including the dielectric powder cannot be maintained at the time of pattern formation by etching, and it is difficult to stably flow the process.

In the printed wiring board, it is preferable that the insulating resin layer between the wirings has a low dielectric constant in order to ensure high frequency characteristics such as reduction of crosstalk generated between wiring patterns and improvement of resonance frequency band.

However, since the insulating resin layer 21 includes dielectric powder for capacitor formation, it is difficult to reduce the dielectric constant.

As described above, the conventional component-embedded printed wiring board capacitors have problems in inter-wire insulation and high frequency characteristics disposed between layers as printed wiring boards.

SUMMARY OF THE INVENTION The present invention has been made in consideration of the above-described matters, and provides a sheet for constituting a thin capacitor that can be applied to a component-embedded multilayer flexible printed wiring board, and a component-embedded multilayer flexible printed wiring board using the same. It aims at providing the manufacturing method.

In order to achieve the above object, the present invention provides each of the following inventions.

1st invention,

In the adhesive sheet for capacitors which comprises the capacitor which the electrode adheres to both surfaces of a dielectric layer, built in a printed wiring board, and comprises it,

A dielectric layer composed of a material having a high dielectric constant and which does not occur in a pressure and temperature at the time of pressing for adhering the electrode to the dielectric layer, with accompanying substantial thickness variation and deformation, and having an adhesive double side;

The adhesive sheet for capacitors which has the fluidity which can fill the periphery of the said electrode at the time of press, and has the adhesive resin layer arrange | positioned at the said both sides of the said dielectric layer.

2nd invention,

In the method for manufacturing a capacitor-embedded printed wiring board comprising a capacitor formed by attaching a capacitor formed by attaching electrodes to both surfaces of a dielectric layer to a printed wiring board,

A dielectric layer having a high dielectric constant and which does not cause substantial thickness change and deformation at a predetermined pressure and temperature in a press for adhering the electrode to the dielectric layer, and has a dielectric layer having adhesive double sides and surrounding the electrode. To prepare an adhesive sheet for a capacitor having an adhesive resin layer for

Two metal substrates having the electrode formed on the metal foil or the flexible resin film that can be peeled off can be prepared.

The surface of the electrode side of the metal substrate is overlapped so that the electrodes face each other toward the capacitor adhesive sheet,

Bonding the opposite electrode and the dielectric layer by an elevated temperature and pressure to form a counter electrode on the surface of the dielectric layer with the electrode embedded in the adhesive resin layer;

After the capacitor is formed, the metal foil or the flexible resin film is peeled off to manufacture a capacitor-embedded printed wiring board.

3rd invention,

In the method for manufacturing a capacitor-embedded printed wiring board comprising a capacitor formed by attaching a capacitor formed by attaching electrodes to both surfaces of a dielectric layer to a printed wiring board,

A dielectric layer having a high dielectric constant and which does not cause substantial thickness change and deformation at a predetermined pressure and temperature in a press for adhering the electrode to the dielectric layer, and has a dielectric layer having adhesive double sides and surrounding the electrode. To prepare an adhesive sheet for a capacitor having an adhesive resin layer for

Two metal substrates having the electrode formed on the metal foil were prepared,

The surface of the electrode side of the metal substrate is overlapped so that the electrodes face each other toward the capacitor adhesive sheet,

Bonding the electrode opposed to the dielectric layer by the press to embed the electrode in the adhesive resin layer to form an opposite electrode on the surface of the dielectric layer,

After forming the capacitor, the metal foil is subjected to wiring pattern processing.

4th invention,

In the method for manufacturing a capacitor-embedded printed wiring board comprising a capacitor formed by attaching a capacitor formed by attaching electrodes to both surfaces of a dielectric layer to a printed wiring board,

A dielectric layer having a high dielectric constant and which does not cause substantial thickness change and deformation at a predetermined pressure and temperature in a press for adhering the electrode to the dielectric layer, and has a dielectric layer having adhesive double sides and surrounding the electrode. To prepare an adhesive sheet for a capacitor having an adhesive resin layer for

Prepare two sheets of the flexible laminated base material in which the electrode is formed on one side of the flexible resin film and the metal foil is laminated on the other side,

The electrode side surface of the flexible laminated base material overlaps with the electrode facing toward the capacitor adhesive sheet,

Bonding the electrode opposed to the dielectric layer by the press to embed the electrode in the adhesive resin layer to form an opposite electrode on the surface of the dielectric layer,

After forming the capacitor, the metal foil is subjected to wiring pattern processing.

These features provide the following effects of the present invention.

According to the adhesive sheet for capacitors according to the present invention, since the adhesive layer has a high fluidity on both sides of the dielectric layer having high dielectric constant and low fluidity, a dielectric material having difficulty in process flow of the printed wiring board alone is removed. It can be flowed without using special devices. In the capacitor constituted by using the adhesive sheet for capacitors, the distance between electrodes is defined by the thickness of the dielectric resin layer even when the thickness direction is not controlled with high accuracy at the time of pressing. For this reason, in addition to obtaining a stable capacitance, the distance between electrodes can be made smaller than before, and the capacitor can be miniaturized.

Moreover, according to the manufacturing method of the capacitor-embedded printed wiring board which concerns on this invention, since the adhesive sheet for capacitors suitable for a capacitor is used, the favorable insulation between the wiring arrange | positioned between layers as a printed wiring board which was difficult in the conventional manufacturing method is high, Capacitor-embedded printed wiring boards having characteristics can be manufactured at low cost and stably.

Hereinafter, embodiments of the present invention will be described in detail with reference to FIGS. 1 to 3.

(Example 1)

BRIEF DESCRIPTION OF THE DRAWINGS It is sectional process drawing which shows the manufacturing method of the adhesive sheet for capacitors in Example 1 of this invention. First, as shown in FIG. 1 (1), the base material which has the adhesive resin layers 2 and 3 with high fluidity on both surfaces of the dielectric layer 1 with high dielectric constant and low fluidity is prepared. Here, the dielectric layer 1 is a film-form molded product containing about 60 to 85 wt% of barium titanate having a dielectric constant of about 2000, and about 15 to 40 wt% of solvent powder and epoxy resin.

The dielectric constant of this film-shaped molded object is about 20-60. The thickness is preferably as thin as possible in a range that does not cause film defects such as pinholes, and is preferably 5 to 30 µm thick because of its flexibility. However, since they are soft and prone to cracking alone, the mechanical properties of the various process flows and the insulating resin of the substrate are not sufficient.

As the dielectric material, those containing powders such as titanic acid, aluminum oxide, strontium titanate, calcium titanate and magnesium titanate can be used in addition to the barium titanate described above. As for the resin powder, as the material which can disperse the dielectric material powder and needs flexibility, and hardly deforms in a subsequent press step, a thermosetting adhesive is preferable, and in addition to the above-mentioned epoxy resin, a thermosetting polyimide, Acrylic resins, mixtures thereof, and the like can be applied.

The adhesive resin layers 2 and 3 need to have a thickness, fluidity, and flexibility in which the electrode part can be filled in a subsequent step. For this reason, an epoxy resin, a thermoplastic and thermosetting polyimide, an acrylic resin, a liquid crystal polymer, a mixture thereof, etc. can be applied. Since it is necessary to fill the electrode portion without deforming the dielectric layer 1, the adhesive resin layers 2 and 3 may need to have a lower softening temperature than the dielectric layer 1.

In order to satisfy these requirements, the dielectric layer 1 is preferably thermosetting, and the adhesive resin layers 2 and 3 are preferably thermoplastic. Since the thickness of the electrode portion was set to 18 µm, the adhesive resin layers 2 and 3 used a liquid crystal polymer which is a thermoplastic resin having a thickness of 20 µm.

Since the thickness of the adhesive resin layers 2 and 3 is the thickness which can fill an electrode part, and also serves to supplement the mechanical property of the dielectric layer 1 containing a dielectric material, when it is less than 10 micrometers, a machine as a multilayer material In some cases, the physical properties are not satisfied. Therefore, it is necessary to set the thickness in consideration of these points.

Such a multilayer structure allows the adhesive resin layers having high dielectric constant and high fluidity to be disposed on both sides of the dielectric layer having low fluidity, so that a dielectric material, which is difficult to process flow of the printed wiring board alone, is not used. Can be flowed without

In the production of a three-layer material consisting of the actual dielectric layers 1, 2, and 3, the adhesive resin 3 is coated on a carrier such as a metal, a resin that can be released, and the dielectric material is included thereon. A method of coating the dielectric layer 1 and coating the adhesive resin 2 thereon may be employed.

Subsequently, as shown in FIG. 1 (2), the base material which has the metal foil 5 used as an electrode on the peelable metal foil 4 is prepared, and the electrode part 5a is formed by the photofabrication method etc. Although not shown, opposing electrode portions 5b are formed on the metal foil 4. The metal foil 4 can select nickel foil etc. which can be removed by selective etching. As the resin material, an electrode part formed by sputtering, vapor deposition, electrolytic plating, or the like on a Teflon (Japanese registered) resin having high releasability to the adhesive resin layers 2 and 3 can be used.

In addition, the polyimide resin can be removed by selective resin etching by using the adhesive resin layers 2 and 3 as epoxy type or acryl type and using polyimide resin instead of the metal foil 4. Here, an electrode part is formed with copper of 18 micrometers thick, and the metal foil 4 shall use the nickel foil of 25 micrometers thick.

Subsequently, as shown in FIG. 1 (3), the substrates on which the electrodes 5a and 5b are formed on the metal foil 4 are overlapped with each other so as to face both surfaces of the dielectric layer 1 having high dielectric constant and low fluidity, and having fluidity. It laminates | stacks on the base material which has these high adhesive resin layers 2 and 3 by hot press.

First, the adhesive resin layers 2 and 3 flow using the vacuum flat press which ensured the surface precision, and the dielectric layer 1 heats up and warms up to the high temperature area which expresses adhesiveness. At this time, the parallelism between the upper and lower hot spots is maintained, and the height is controlled in accordance with the thickness of the substrate to bond the electrodes 5a and 5b to the dielectric layer 1. Then, it cools to the temperature which the adhesive resin layers 2 and 3 which are thermoplastic resins harden | cure, maintaining the height of the upper and lower hot plates.

When such a press is carried out in a vacuum, the adhesives 2 and 3 can fill around the electrodes 5a and 5b because of their high fluidity, while the dielectric layer 1 having a high dielectric constant has low fluidity, The electrodes 5a and 5b are disposed on both surfaces thereof without any gaps. As a result, the distance between the electrodes is defined by the thickness of the dielectric layer 1. Although not shown, if the size of the opposite electrode is set to a different size in consideration of the positional shift during the stacking, the capacitance of the capacitor can be defined by the small area of the electrode.

As an example of the design of a capacitor, the capacitance of the dielectric layer 1, i.e., the dielectric layer having a thickness of 5 mu m and forming a 100 m < ² >

C = ε ₀ × ε × s / d

Where C is the capacitance (F), ε ₀ is the dielectric constant of vacuum 8.85 × 10 ¹² (F / m), ε is the relative dielectric constant (here, 60), s is area (m ² ), and d is thickness (m )to be.

In this size, it is embedded directly under a chip component such as a QFP (Quad Flat Package) mounted on a substrate, or a surface mount component with lead pins drawn from four sides of an IC package. Since it can be built in, it does not interfere with densification.

In addition, the capacitance value on the substrate can be arbitrarily controlled by changing the thickness and area of the dielectric. For example, since the capacitance of a small high frequency capacitor used in a cellular phone or the like is about 0.1 to 1 pF, it can be manufactured with a size of 0402 chip (size 0.4 mm long x 0.2 mm width x 0.2 height) or less. For example, the dielectric layer 1, that is, the dielectric layer has a thickness of 5 mu m and an electrode having a diameter of 50 mu m, can obtain a capacitance of 0.2 pF. Therefore, the mounting area can be greatly reduced.

Thereafter, as shown in FIG. 1 (4), the nickel foil of the metal foil 4 is removed by selective etching to obtain the capacitor 6. With such a structure, even a capacitor using a soft dielectric material can be given flexibility to the resin parts other than the capacitor, which is bent at the time of assembling into the device.

Although not shown, by stacking a plurality of capacitors 6, the capacitance can be further increased without increasing the substrate area. Moreover, since the adhesive resin layers 2 and 3 have a thickness of 20 µm, the interlayer insulation can be sufficiently secured, and the electrical properties are superior to those of the conventional structure in which a dielectric material is sandwiched by an electrode.

In addition, in order to ensure high frequency characteristics between the wiring patterns between layers other than the electrode of the capacitor, it is preferable that the insulating resin layer therebetween has a low dielectric constant. It can respond by comprised with the material of low dielectric constants, such as a polymer, and low dielectric loss tangent.

In addition, although not shown, the capacitor 6 is formed by a method such as electroless plating, sputtering, vapor deposition, or the like, and the capacitor 6 is embedded by a so-called semi-additive method in which the seed layer is a seed layer. The fine printed wiring board can be configured.

With such a structure, since the adhesive resin layers 1, 2, 3 are present between the wiring layers, it is possible to ensure higher insulation characteristics than the dielectric material alone. In addition, the capacitor 6 may be used as an inner core board, and a copper-clad laminate may be built up thereon to form a capacitor-embedded multilayer printed wiring board.

(Example 2)

Fig. 2 is a cross sectional view showing a method for manufacturing a capacitor in Example 2 of the present invention. First, as shown in FIG. 2 (1), as shown in FIG. 1 (1), a base having high flowability adhesive resin layers 2 and 3 on both sides of the dielectric layer 1 having high dielectric constant and low fluidity. Prepare the ingredients.

Next, as shown to (2) of FIG. 2, copper foil 4a (for example, thickness 18micrometer) / nickel foil 7 (for example, thickness 2micrometer) / copper foil 5 (for example , A metal substrate having a three-layer structure having a thickness of 18 μm) is prepared, and the electrode portion 5a is formed by selective etching in the photofabrication method.

In addition, although not shown in figure, the opposing electrode part 5b is formed on copper foil 4a. The exposed nickel foil other than the electrode portion is removed by selective etching, and then roughened to increase the adhesion strength between the copper foil and the adhesive in the subsequent step.

Subsequently, as shown in FIG. 2 (3), a pair of base materials on which the electrodes 5a and 5b are formed on the copper foil 4a is positioned so as to face both surfaces of the dielectric layer 1 having high dielectric constant and low fluidity, Lamination | stacking is carried out to the base material which has the adhesive resin layers 2 and 3 with high fluidity | liquidity by heat press. The specific process is the same as in Example 1.

Subsequently, as shown in Fig. 2 (4), the wiring pattern 4b is formed by selective etching of the copper foil 4a by the photofabrication method. As shown in the figure, a structure in which a soft dielectric material is sandwiched by a high fluidity adhesive resin layer prevents damage to the substrate due to transportation during the wiring pattern forming step. As selective etching at this time, a chemical liquid for etching copper with nickel is used.

Thereby, the wiring pattern 4b can be formed without damaging the electrode parts 5a and 5b. Nickel foil is removed by selective etching as needed, and the double-sided printed wiring board 8 in which a capacitor is built is obtained.

With such a structure, even a capacitor using a soft dielectric material can be given flexibility to the resin parts other than the capacitor when it is assembled in the device. For this reason, it can be set as the flexible printed wiring board which has a cable part. In addition, since the adhesive resin layers 2 and 3 have a thickness of 20 µm, the interlayer insulation can be sufficiently secured, which is electrically superior to the conventional structure in which a dielectric material is sandwiched by an electrode.

On the other hand, the interlayer connection can be achieved by, for example, forming a through hole in a desired portion with an NC drill or the like after lamination of Fig. 2 (3), and performing a through hole plating process including a conduction treatment. In addition, after forming wiring patterns on both surfaces of Fig. 2 (4), a conductive hole may be formed in a desired portion with an NC drill or the like to be partially plated.

Further, after the double-sided printed wiring board 8 having the capacitor built therein is used as the core substrate, and the build-up layer is laminated, a conductive hole is formed in a desired portion with an NC drill or the like, and the through-hole plating process including the conduction treatment is performed. You can do it by At this time, via-hole connection may be made from the surface to the electrode or the inner layer circuit.

(Example 3)

3 is a cross-sectional process diagram showing a method for manufacturing a capacitor in Example 3 of the present invention. First, as shown in FIG. 3 (1), the base material having the adhesive resin layers 2 and 3 having high fluidity on both surfaces of the dielectric layer 1 having high dielectric constant and low fluidity shown in FIG. 1 (1). Prepare.

Next, as shown to (2) of FIG. 3, what is called a double-sided copper clad laminated board which has copper foils 10 and 11 on both surfaces of the polyimide film 9 which is 25 micrometers in thickness, is prepared, and selective etching by the photofabrication method. The electrode portion 10a is formed by this. On the other hand, although not shown, opposing electrode portions 10b are formed on the polyimide film 9. Then, a roughening treatment is performed to increase the adhesion strength between the copper foil and the adhesive in the subsequent step.

Subsequently, as shown in FIG. 3 (3), the substrate on which the electrodes 10a and 10b are formed on the polyimide film 9 is positioned so as to face both surfaces of the dielectric layer 1 having high dielectric constant and low fluidity. And lamination | stacking is carried out to the base material which has the adhesive resin layers 2 and 3 with high fluidity | liquidity by hot press. The specific process is the same as in Example 1, 2.

Subsequently, as shown in FIG. 3 (4), the wiring pattern 11a is formed by selective etching of the copper foil 11 by the photofabrication method. On the other hand, the interlayer connection can be achieved by, for example, forming a through hole in a desired portion with an NC drill or the like after lamination in Fig. 3 (3), and performing a through hole plating treatment including a conduction treatment.

Thereafter, if necessary, the surface of the substrate is subjected to surface treatment such as solder plating, nickel plating, or gold plating, and the photo solder resist layer is formed, and the shield layer toward the outer layer side of the cable is formed using silver paste, film, or the like. By performing the external processing, the multilayer printed wiring board 13 having the cable portion 12 in the outer layer is obtained.

1 is a conceptual cross-sectional view showing a first embodiment of the present invention.

2 is a conceptual cross-sectional view showing a second embodiment of the present invention.

3 is a conceptual cross-sectional view showing a third embodiment of the present invention.

Figure 4 is a schematic cross-sectional view of the manufacturing method of a double-sided printed wiring board containing a capacitor according to the prior art.

** Description of the sign **

1: dielectric layer with high dielectric constant and low flowability

2, 3: high fluidity adhesive resin layer

4: removable metal foil or flexible resin film

5: metal foil which becomes an electrode part

5a: first electrode portion

5b: second electrode portion

6: capacitor according to the invention

7: nickel foil

8: double-sided printed wiring board containing a capacitor according to the present invention

9: copper foil

10a: first electrode portion

10b: second electrode portion

11: copper foil

12: cable section

13: Multilayer printed wiring board having a cable section incorporating a capacitor according to the present invention

21: dielectric material

22, 23: copper foil

Claims (5)

In the adhesive sheet for capacitors which comprises the capacitor which the electrode adheres to both surfaces of a dielectric layer, built in a printed wiring board, and comprises it, A dielectric layer composed of a material having a high dielectric constant and which does not occur in a pressure and temperature at the time of pressing for adhering the electrode to the dielectric layer, with accompanying substantial thickness variation and deformation, and having an adhesive double side; The adhesive sheet for capacitors which has the fluidity which can fill the periphery of the said electrode at the time of press, and has the adhesive resin layer arrange | positioned on the said both surfaces of the said dielectric layer. In the method for manufacturing a capacitor-embedded printed wiring board comprising a capacitor formed by attaching a capacitor formed by attaching electrodes to both surfaces of a dielectric layer to a printed wiring board, A dielectric layer having a high dielectric constant and which does not cause substantial thickness change and deformation at a predetermined pressure and temperature in a press for adhering the electrode to the dielectric layer, and has a dielectric layer having adhesive double sides and surrounding the electrode. To prepare an adhesive sheet for a capacitor having an adhesive resin layer for Two metal substrates having the electrode formed on the metal foil or the flexible resin film that can be peeled off can be prepared. The surface of the electrode side of the metal base is overlapped so that the electrodes face each other toward the capacitor adhesive sheet, Bonding the opposite electrode and the dielectric layer by an elevated temperature and pressure to form a counter electrode on the surface of the dielectric layer with the electrode embedded in the adhesive resin layer; After the capacitor is formed, the metal foil or the flexible resin film is peeled off to manufacture a capacitor-embedded printed wiring board. In the method for manufacturing a capacitor-embedded printed wiring board comprising a capacitor formed by attaching a capacitor formed by attaching electrodes to both surfaces of a dielectric layer to a printed wiring board, A dielectric layer having a high dielectric constant and which does not cause substantial thickness change and deformation at a predetermined pressure and temperature in a press for adhering the electrode to the dielectric layer, and has a dielectric layer having adhesive double sides and surrounding the electrode. To prepare an adhesive sheet for a capacitor having an adhesive resin layer for Two metal substrates having the electrode formed on the metal foil were prepared, The surface of the electrode side of the metal substrate is overlapped so that the electrodes face each other toward the capacitor adhesive sheet, Bonding the electrode opposed to the dielectric layer by the press to embed the electrode in the adhesive resin layer to form an opposite electrode on the surface of the dielectric layer, A wiring pattern processing of said metal foil is carried out after formation of the said capacitor, The manufacturing method of the capacitor internal printed wiring board characterized by the above-mentioned. In the method for manufacturing a capacitor-embedded printed wiring board comprising a capacitor formed by attaching a capacitor formed by attaching electrodes to both surfaces of a dielectric layer to a printed wiring board, A dielectric layer having a high dielectric constant and which does not cause substantial thickness change and deformation at a predetermined pressure and temperature in a press for adhering the electrode to the dielectric layer, and has a dielectric layer having adhesive double sides and surrounding the electrode. To prepare an adhesive sheet for a capacitor having an adhesive resin layer for Prepare two sheets of the flexible laminated base material in which the electrode is formed on one side of the flexible resin film and the metal foil is laminated on the other side, The electrode side surface of the flexible laminated base material overlaps with the electrode facing toward the capacitor adhesive sheet, Bonding the electrode opposed to the dielectric layer by the press to embed the electrode in the adhesive resin layer to form an opposite electrode on the surface of the dielectric layer, A wiring pattern processing of said metal foil is carried out after formation of the said capacitor, The manufacturing method of the capacitor internal printed wiring board characterized by the above-mentioned. The method of claim 4, wherein An opening is provided in the formation part of the flexible cable part of the said adhesive sheet for capacitors, Forming a capacitor by laminating the flexible laminate on the adhesive sheet for the capacitor, A process for manufacturing a capacitor-embedded printed wiring board, wherein the metal foil is subjected to wiring pattern processing, so that the flexible laminated substrate positioned in the opening portion is a flexible cable portion.

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