JP2002305365A - Multilayer printed wiring board and manufacturing method therefor - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide a multilayer printed wiring board which is easily manufactured and incorporates the stable capacitor of large capacity or a circuit element using the capacitor. SOLUTION: The board has a first conductive layer 101 which is formed on a first base material 2 and includes a first capacitor electrode 3, a first insulating layer 103 which is laminated on the first conductive layer 101 and in which adhesive 7 is applied to both faces of a film-like dielectric material 6 and a second conductive layer 102 which is laminated on the first insulating layer 103 and includes a second capacitor electrode 5 arranged in a place confronted with the first capacitor electrode 3.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a structure of a multilayer printed circuit board (PCB) and a method of manufacturing the same, and more particularly, to a capacitor or a passive element (filter or directional coupler using a capacitor function). Etc.) and a method of manufacturing the same.

[0002]

2. Description of the Related Art FIG.
FIG. 2 is a cross-sectional view illustrating a configuration of a printing capacitor portion of a conventional multilayer printed wiring board in which a printing capacitor disclosed in Japanese Patent Publication No. 2 is incorporated. In the figure, reference numeral 90 denotes a copper-clad laminate serving as a base material of a multilayer printed wiring board, and reference numeral 91 denotes a first circuit pattern (wiring pattern) of copper foil formed on the surface of the copper-clad laminate (base material) 90. A conductor layer 92 is a dielectric layer formed on the first conductor layer 91 by a dielectric paint or a dielectric paste, and 93 is a second dielectric layer formed of a conductive paint layer.
Of the conductive layer. Note that 91a is the first conductor layer 9
1, a first capacitor electrode of the print capacitor 94 is shown, and 93a is a part of the second conductor layer 93 and is a second capacitor electrode of the print capacitor 94. Is shown.

[0004] Reference numeral 94 denotes a first capacitor electrode 91a, a dielectric layer 92, and a second capacitor electrode 91 included in the first conductor layer 91.
Capacitor electrode 93a included in the conductor layer 93 of FIG.
Is a printing capacitor composed of: Although not shown, on the copper-clad laminate (base material) 90,
A plurality of printing capacitors are formed. Also, 91b
The portion indicated by is a part of the first conductor layer 91,
This is a connection portion to which the second capacitor electrode 93a of the printing capacitor 94 is connected, and is formed on the surface of the laminated substrate (base material) 90.

In the above-described printed capacitor 94 of the conventional multilayer printed wiring board, a first capacitor electrode 91a is formed as a part of a first conductor layer 91 made of copper foil on a base material 90 made of a copper-clad laminate. Forming, then this first
The dielectric layer 92 is formed by printing a dielectric paint or a dielectric paste on the conductive layer 91 of FIG.
A second capacitor electrode 93a is sequentially formed as a part of the second conductor layer 93 on the second capacitor 2 using a conductive paint.
Since the first capacitor electrode 91a made of copper foil has a flat surface and no irregularities, the first capacitor electrode 91a
Since a does not enter the inside of the dielectric layer 92, it is possible to prevent the capacity of the print capacitor 94 from decreasing, and to form a print capacitor having a relatively large capacity.

[0005]

However, since it is difficult to control the thickness of the dielectric layer 92 of the capacitor formed by the conventional printing method as described above, the dielectric layer 92 has a small and uniform thickness. It was difficult to obtain a body layer, and it was difficult to obtain a stable large capacity. Further, before the step of printing the dielectric layer 92, the second conductive layer 9 as a conductive paint layer is used.
Before the step of applying No.3, the first capacitor electrode 91a and the second capacitor electrode 93a have to be washed, which has a problem that the manufacturing procedure is complicated. The present invention has been made in order to solve the above-described problems, and has a built-in large-capacity capacitor which is easy to manufacture and has a small variation and is stable, or a circuit element using the same. And a method of manufacturing the same.

[0006]

A multilayer printed wiring board according to the present invention is formed on a first base material and includes a first conductor layer including a first capacitor electrode, and a first conductor layer. A first insulating layer laminated on the first layer and having an adhesive applied to both surfaces of a film-shaped dielectric material; and a first insulating layer laminated on the first insulating layer and arranged at a position facing the first capacitor electrode. And a second conductor layer including the second capacitor electrode.

Further, the first capacitor electrode of the multilayer printed wiring board according to the present invention is in contact with the dielectric material of the first insulating layer, and the dielectric material of the first base material and the first insulating layer. Is filled with an adhesive.

Further, the second conductive layer of the multilayer printed wiring board according to the present invention is formed on the second base material.

Further, the second capacitor electrode included in the second conductor layer of the multilayer printed wiring board according to the present invention is in contact with the dielectric material of the first insulating layer and has the second capacitor electrode.
The gap between the base material and the dielectric material of the first insulating layer is filled with an adhesive.

Further, in the multilayer printed wiring board according to the present invention, a part of the first insulating layer sandwiched between the first capacitor electrode and the second capacitor electrode has a predetermined dielectric constant. It is replaced with a dielectric.

[0011] The multilayer printed wiring board according to the present invention further comprises a second insulating layer laminated on the second conductive layer and having an adhesive applied to both surfaces of a film-shaped dielectric material; A third conductive layer including a third capacitor electrode, which is stacked on the insulating layer and arranged at a position facing the second capacitor electrode, and further comprising: The capacitors are stacked.

Further, in the multilayer printed wiring board according to the present invention, a wiring serving as an inductor is formed on the first conductive layer, and is electrically connected to the second capacitor electrode via the second base material. A ground layer is formed, and a wiring serving as an inductor is connected to a first capacitor electrode included in the first conductor layer to form a filter circuit.

Further, a multilayer printed wiring board according to the present invention has a first conductor layer including a first wiring pattern laminated on a first base material and serving as a first coupling line; A first insulating layer, which is laminated on the conductive layer and has a film-like dielectric material coated on both sides with an adhesive, and a first insulating layer, which is laminated on the first insulating layer and arranged at a position facing the first wiring pattern. And a second conductor layer including a second wiring pattern serving as a second coupling line to be formed, thereby forming a directional coupler.

According to a method of manufacturing a multilayer printed wiring board according to the present invention, a step of forming a first conductor layer including a first capacitor electrode on a first base material; Laminating a first insulating layer coated with an adhesive on both surfaces of a dielectric material, and a second capacitor electrode disposed on the first insulating layer at a position facing the first capacitor electrode. Laminating a second conductor layer.

Further, according to a method of manufacturing a multilayer printed wiring board according to the present invention, a step of forming a first conductor layer including a first capacitor electrode on a first base material; Forming a second conductive layer including a second capacitor electrode corresponding to the first capacitor electrode, sandwiching a first insulating layer having an adhesive applied to both surfaces of a film-shaped dielectric material, and Laminating the first conductor layer and the second conductor layer with the first capacitor electrode and the second capacitor electrode facing each other.

Further, in the method for manufacturing a multilayer printed wiring board according to the present invention, the first insulating layer includes a partial region of the first insulating layer sandwiched between the first capacitor electrode and the second capacitor electrode. It is replaced with a dielectric having a predetermined dielectric constant.

[0017]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of the present invention will be described below with reference to the drawings. In addition, between each figure,
The same reference numerals indicate the same or corresponding ones. Embodiment 1 FIG. FIG. 1 is a cross-sectional view of a main part for describing the structure of a multilayer printed wiring board according to Embodiment 1 of the present invention. More specifically, FIG. is there. In the figure, 1 is a capacitor, 101 is a first conductor layer, 1
02 is a second conductive layer, and 103 is a first insulating layer which is a dielectric layer. Further, reference numeral 2 denotes a first base material that supports the first conductive layer 101, and 3 denotes a first capacitor formed on the surface of the first base material 2 so as to be convex and included in the first conductive layer 101. The electrodes 4 are wirings included in the first conductor layer 101,
Is a second capacitor electrode included in the second conductor layer 102.

Reference numeral 6 denotes a first polymer film, which is a film-like dielectric material for forming the first insulating layer 103;
Is an adhesive applied to both sides of the first polymer film (that is, a film-like dielectric material) 6, and the first insulating layer 103 is a first polymer film (a film-like dielectric material). 6 and an adhesive 7. Note that the first capacitor electrode 3 and the second capacitor electrode 5 are disposed to face each other with the first insulating layer 103 interposed therebetween, and the capacitor 1 includes the first capacitor electrode 3 and the second capacitor electrode 5. , And a first insulating layer (dielectric layer) 103 sandwiched between these two capacitor electrodes. The adhesive 7 has fluidity at first, but is cured by heat treatment, and includes a first capacitor electrode 3 and a wiring 4 formed on the first substrate 2. , A first polymer film 6 as a film-shaped dielectric material, and a second conductor layer 102 including a second capacitor electrode 5 are bonded.

FIGS. 2 and 3 are views for explaining a manufacturing procedure of a multilayer printed wiring board having a built-in capacitor according to the first embodiment, and more specifically, are included in a multilayer printed wiring board having a built-in capacitor. FIG. 6 is a cross-sectional view of a main part near the capacitor to be manufactured in the middle of manufacturing. 2 and 3, reference numeral 8 denotes a metal foil that eventually becomes the second conductor layer 102 including the second capacitor electrode 5. FIG. 4 is a view for explaining a gap caused by the adhesive 7 generated between the first polymer film 6 and the first capacitor electrode 3 when the thickness of the adhesive 7 is too large in the manufacturing process. FIG. 3 is a cross-sectional view of the vicinity of the capacitor. In FIG. 4, reference numeral 51 denotes a gap formed by an adhesive between the first polymer film (film-like dielectric material) 6 and the first capacitor electrode 3.

FIG. 5 shows a capacitor for explaining a gap (ie, a gap) generated between the first base material 2 and the adhesive 7 when the thickness of the adhesive 7 is too small. It is sectional drawing of a vicinity. In FIG. 5, reference numeral 52 denotes a gap (gap) between the first base material 2 and the first polymer film (film-like dielectric material) 6 that is not filled with the adhesive. FIG.
FIG. 5 is a cross-sectional view of the vicinity of a capacitor for explaining a dent (dent) of the first polymer film 6 that occurs when the melting point or softening point of the first polymer film 6 is too low. In FIG. 6, reference numeral 53 denotes a dent (depression) of the first polymer film (film-like dielectric material) 6 due to the first capacitor electrode 3 and the wiring 4.

As shown in FIG. 1, the capacitor 1 in the multilayer printed wiring board according to the present embodiment includes a first capacitor electrode 3 included in a first conductive layer 101,
The second capacitor electrode 5 included in the second conductor layer 102, and the first insulating layer 103 (that is, the first polymer film 6 and the adhesive 7) sandwiched therebetween; The first capacitor electrode 3 is buried in the adhesive 7 of the first insulating layer 103 and is in contact with the first polymer film (film-like dielectric material) 6. Therefore, the distance between the first capacitor electrode 3 and the second capacitor electrode 5 is reduced (that is, the distance between the first capacitor electrode 3 and the second capacitor electrode 5 is reduced), and the capacitance of the capacitor is increased. . Further, since the first capacitor electrode 3 is in contact with the first polymer film 6, the variation in the thickness of the adhesive 7 on the first base material 2 side does not contribute to the capacity of the capacitor, and The variation in the capacity of the battery is reduced.

Next, the procedure for manufacturing the capacitor of the multilayer printed wiring board according to the present embodiment will be described. FIG.
As shown in FIG. 2, a first substrate 2 (FIG. 2C) having a conductor including the first capacitor electrode 3 and the wiring 4 (that is, equivalent to the first conductor layer 101) formed on the surface thereof And a first polymer film 6 (FIG. 2) having an adhesive 7 applied to both sides thereof.
(B)) and a metal foil 8 serving as a second conductor layer (FIG. 2)
(A)) are laminated together. That is, in manufacturing the multilayer printed circuit board according to the present embodiment, the first base material 2
First conductive layer 101 including first capacitor electrode 3
And laminating a first insulating layer 103 in which an adhesive 7 is applied to both surfaces of a film-shaped dielectric material (that is, the first polymer film 6) on the first conductive layer 101. And a step of laminating the second conductor layer 102 including the second capacitor electrode 5 disposed on the first insulating layer 103 at a position facing the first capacitor electrode 3.

The laminating method may be a general method of laminating a printed wiring board. For example, the laminating may be performed by a laminating press capable of applying a pressure higher than the atmospheric pressure to the laminate, or may be performed under a reduced pressure environment. You may laminate | stack by the vacuum press machine which presses an object. In addition, as a material of the first capacitor electrode 3 and the wiring 4 formed on the surface of the first base material 2 in a convex shape, copper or copper is used in order to make the height of the wiring 4 formed in the convexity as uniform as possible. A metal such as silver, a metal alloy, or a conductive resin may be used. The material of the first base 2 is not particularly limited as long as the first base 2 can be used as a support base of the wiring even after the wiring 4 is formed to be convex. Is not done. For example, a general printed material that uses a metal or polymer film such as Ni as a base material and applies a conductor on the entire surface by coating or plating, or a copper pattern is formed on the surface of the base material of a copper-clad laminate The first substrate 2 and the first capacitor electrode 3 and the wiring 4 which are formed to be convex from the surface of the first substrate 2 are obtained by the method of manufacturing the wiring substrate.

A first conductor layer 101 including a first capacitor electrode 3 and a wiring 4 is formed on a first base material 2, and an adhesive 7 is further formed on the first conductor layer 101. The first polymer film 6 (that is, the first insulating layer 103) applied to both sides is laminated. Since the first capacitor electrode 3 is formed to be convex on the first base material 2, the first insulating layer 103 is laminated on the first conductive layer 101, as shown in FIG. As described above, the adhesive near the first capacitor electrode 3 is pushed away, and the first capacitor electrode 3
In contact with the polymer film 6. Furthermore, the metal foil 8
By etching a part other than a necessary part such as the electrode 5 of the second capacitor by a general manufacturing technology of a printed wiring board to form the second capacitor electrode 5 and the like, FIG.
A multilayer printed wiring board incorporating a capacitor as shown in (1) is manufactured. In addition, after laminating | stacking, you may remove the 1st base material 2 as needed.

If the thickness of the adhesive 7 is too large, a gap 51 is formed between the first polymer film 6 and the first capacitor electrode 3 as shown in FIG. Not only can high-capacity capacitors not be obtained, but the gap between the first polymer film and the first electrode varies greatly due to variations in lamination conditions and adhesive properties. I can't get it. Specifically, when the thickness of the adhesive 7 before lamination is more than 300% of the height of the wiring 4 convexly formed on the surface of the base material 2, the first capacitor is remarkably formed. A gap 51 formed by the adhesive 7 between the electrode 3 and the first polymer film 6 appears in some capacitors.

If the thickness of the adhesive 7 is too small,
Thus, a gap (void) 52 in which the surface of the first base material 2 is not filled with the adhesive 7 is formed. Specifically, when the thickness of the adhesive before lamination is less than 50% of the height of the wiring 4 formed to be convex on the surface of the first base material 2, the adhesive is remarkably reduced. A gap 52 (gap) in which the surface of one base material 2 is not filled with the adhesive 7 can be formed in some capacitors. Due to the generation of the gap (gap) 52, the reliability of the multilayer printed wiring board having a built-in capacitor deteriorates. In particular,
For example, in a soldering process for mounting a semiconductor device or the like, there occurs a problem that an interface between the electrode 3 of the first capacitor and the adhesive 7 is separated.

Further, if the melting point or softening point of the first polymer film (film-like dielectric material) 6 is too lower than the temperature at the time of lamination, as shown in FIG. However, not only the adhesive 7 but also the first polymer film 6 is pushed away, so that a dent (dent) 53 of the first polymer film 6 occurs. Since the first polymer film 6 in the vicinity of the first capacitor electrode 3 greatly varies due to the dent (dent) 53 of the first polymer film 6, a capacitor having a stable capacity cannot be obtained. When manufacturing the multilayer printed wiring board according to the present invention (that is, the multilayer printed wiring board according to each embodiment), the first capacitor electrode 3 and the first polymer film 6 as described above are used.
, A gap 52 (gap) in which the surface of the first base material 2 is not filled with the adhesive 7,
Care must be taken to prevent the polymer film 6 from being dented (dented).

FIG. 7 shows a difference between a manufacturing process of a multilayer printed wiring board having a built-in capacitor according to the present invention and a conventional manufacturing process of a multilayer printed wiring board having a built-in capacitor. As shown in the figure, between the electrode degreasing and cleaning step and the wiring blackening step, in the case of a conventional multilayer printed circuit board with a built-in capacitor, the electrode is degreased and cleaned, A printing process of the dielectric paste and a curing process of the dielectric paste are required.
The formation of the electrode requires a degreasing and cleaning step of the electrode, a printing step of the conductor paste, and a curing step of the conductor paste. On the other hand, in the case of the present invention, the formation of the dielectric requires only the degreasing and cleaning step of the electrode and the laminating press step of the film with the adhesive and the conductor, and the formation of the second electrode requires the formation of the conductor. Only a patterning step is required, which greatly simplifies the manufacturing process and reduces manufacturing costs.

Embodiment 2 FIG. 8 is a cross-sectional view of a principal part for describing the structure of the multilayer printed wiring board according to the second embodiment, and more specifically, is a cross-sectional view of the vicinity of a capacitor of a multilayer printed wiring board having a built-in capacitor. In the figure, 1 is a capacitor, 101 is a first conductor layer,
102 is a second conductive layer, 103 is a first dielectric layer
Is an insulating layer. Reference numeral 2 denotes a first base material that supports the first conductive layer 101, and 3 denotes a first base material included in the first conductive layer 101 and formed on the surface of the first base material 2 so as to be convex. The capacitor electrodes 4 are wirings included in the first conductive layer 101,
Reference numeral 5 denotes a second capacitor electrode included in the second conductor layer 102, and reference numeral 6 denotes a first polymer film (film-like dielectric material) forming the insulating layer 103. Reference numeral 2a denotes a second base material on which a second conductor layer 102 including the second capacitor electrode 5 is formed.

The multilayer printed wiring board according to the present embodiment has a first capacitor electrode 3 and a wiring 4 on its surface.
The first base material 2 on which the first conductive layer 101 is formed and the second base material 2a on the surface of which the second conductive layer 102 including the second capacitor electrode 5 is formed are bonded to the adhesive 7 Polymer film coated on both sides (film-like dielectric material)
6 are laminated. The capacitor 1 according to the present embodiment includes a first capacitor electrode 3 in the first conductor layer 101 and a second capacitor layer 102 in the second conductor layer 102 formed on the surface of the second base material 2a. 2 and a first polymer film 6 constituting a first insulating layer 103 sandwiched between them. Then, both of the first capacitor electrode 3 and the second capacitor electrode 5 are stacked and buried in the adhesive 7 and are in contact with the first polymer film 6.

For this reason, the first capacitor electrode 3 sandwiching the first polymer film 6 which is a film-shaped dielectric material
The distance between the capacitor 1 and the second capacitor electrode 5 is further reduced, and the capacitance of the capacitor 1 can be further increased. Further, the first capacitor electrode 3 and the second capacitor electrode 5
Are in contact with the first polymer film 6, the adhesive 7 on the first base material 2 and the second base material 2a side is used.
Does not contribute to the capacitance of the capacitor, and the variation in the capacitance of the capacitor 1 is further reduced. Further, in the present embodiment, the first base material 2 having the first conductor layer 101 including the first capacitor electrode 3 and the wiring 4 formed on the surface thereof and the second base material 2a having the first conductor layer 101 formed thereon. A structure in which the second conductor layer 102 including the second capacitor electrode 5 is formed is manufactured in advance, and these are laminated with the first polymer film 6 coated with the adhesive 7 on both sides interposed therebetween. Is possible, and the manufacturing process is simplified.

In the conventional process of manufacturing a multilayer printed circuit board having a built-in printing capacitor, a washing process of a large number of electrodes, a printing process, and a drying process of a printed material are required. Only the laminating step and the electrode pattern forming step are effective for reducing the manufacturing cost. In addition, by using a conventional printed wiring board or multilayer printed wiring board without a built-in passive element for the multilayer printed wiring board of the present invention, a part without a built-in passive element can be separated from the step of manufacturing a capacitor part. Can be manufactured, which is very effective in reducing the manufacturing cost, including the manufacturing time. Also, there is no need to discard the substrate.

Embodiment 3 FIG. 9 is a cross-sectional view of a principal part for describing the structure of a multilayer printed wiring board according to the third embodiment, and more specifically, a cross-sectional view near a capacitor of a multilayer printed wiring board incorporating a capacitor. In the figure, 1 is a capacitor, 101 is a first conductor layer,
102 is a second conductive layer, 103 is a first dielectric layer
Is an insulating layer. Reference numeral 2 denotes a first base material that supports the first conductive layer 101, and 3 denotes a first base material included in the first conductive layer 101 and formed on the surface of the first base material 2 so as to be convex. The capacitor electrodes 4 are wirings included in the first conductive layer 101,
Reference numeral 5 denotes a second capacitor electrode included in the second conductor layer 102, 6 denotes a first polymer film which is a film-like dielectric material, and 7 denotes an adhesive.

The capacitor 1 has a first capacitor electrode 3, a second capacitor electrode 5, and a first insulating layer (that is, a first insulating layer) sandwiched between these two capacitor electrodes.
Dielectric layer composed of polymer film 6 and adhesive 7)
It is composed of Reference numeral 9 denotes a dielectric having a dielectric constant different from that of the adhesive 7 or the first polymer film 6. In the present embodiment, as shown in FIG. 9, one polymer film with an adhesive (that is, first insulating layer 103) sandwiched between first capacitor electrode 3 and second capacitor electrode 5 is used. The area of the part is the adhesive 7 or the first
Characterized in that the dielectric film 9 is replaced with a dielectric material 9 having a predetermined dielectric constant different from the dielectric constant of the polymer film 6.

As shown in FIG. 9, a partial area of the polymer film with an adhesive (that is, the first insulating layer 103) has a predetermined area different from the dielectric constant of the adhesive 7 or the first polymer film 6. The capacitance of the capacitor can be changed without changing the area occupied by the capacitor 1 by substituting the dielectric material having the dielectric constant of. As a result, when changing the design value of the capacitor, without changing the shape and size of the capacitor on the multilayer printed circuit board,
The capacity of the capacitor can be changed. Further, by using a high dielectric constant material as the dielectric 9, a capacitor having a larger capacity can be obtained. In the above description, a case is described in which a partial region of the first insulating layer of the multilayer printed wiring board according to the first embodiment shown in FIG. 1 is replaced with a dielectric material 9 having a predetermined dielectric constant. ,
Even when a partial region of the first insulating layer (that is, the first polymer film 6) of the multilayer printed wiring board according to the second embodiment shown in FIG. 8 is replaced with the dielectric material 9 having a predetermined dielectric constant. Needless to say, a similar effect is obtained.

Next, a specific example of the method for manufacturing a multilayer printed wiring board according to the present embodiment will be described. For example,
A release film is attached to the surface of the adhesive on the second capacitor electrode 5 side of the first polymer film with the adhesive (that is, the first insulating layer 103), and the first polymer with the adhesive is attached. The surface of the film (that is, the first insulating layer 103) without the release film is temporarily attached to the first conductor layer 101 including the first capacitor electrode 3. Then, a polymer film with an adhesive (that is, the first insulating layer 10) on which a release film is attached by a carbon dioxide laser, a drill, or the like.
3) A hole is formed at an arbitrary position on the first capacitor electrode 3, and the dielectric is packed by printing a liquid dielectric having a predetermined dielectric constant in a vacuum in the hole.

After that, the release film is removed, and the second conductor layer 102 including the second capacitor electrode 5 is laminated to manufacture. In order to make the liquid dielectric hardly flow at the time of lamination, the dielectric may be filled, if necessary, and then temporarily cured by heating. Further, by using the release film, it is possible to reliably prevent the dielectric from being printed on unnecessary portions when printing the dielectric.

As another specific manufacturing method, for example, a first release film is stuck on one adhesive surface of a first polymer film with an adhesive, and a carbon dioxide gas laser or the like is used. A through hole is made by a drill, and then, a second release film capable of absorbing the dielectric paste is attached to another surface of the first polymer film with an adhesive on which the release film is not attached. The holes may be formed at any position where the layers are to be laminated between the electrodes of the capacitor, and the number of holes may be plural. Thereafter, a liquid dielectric is printed in the holes through the first release film having the holes, the second release film is removed, and the first release film is temporarily attached to the first conductor layer including the first capacitor electrode 3. First
Is manufactured by removing the release film and laminating it together with the conductor forming the second conductor layer 102.

Also in this case, in order to make the dielectric material less likely to flow during lamination, the dielectric material may be temporarily cured by heating after filling the dielectric material as necessary. Also, the first
By using the release film, it is possible to reliably prevent the dielectric from being printed on unnecessary portions when printing the dielectric. Further, as another specific manufacturing method, for example, a first polymer film 6 coated with an adhesive only on one side is contacted with the first capacitor electrode 3 on the surface of the adhesive 7 to form a first high-level film. Laminate so that the molecular film is exposed on the surface, then paste the release film on the surface of the first polymer film, and use a carbon dioxide laser or drill, etc.
A hole is made in the first polymer film with an adhesive to which a release film is attached at an arbitrary position on the first capacitor electrode, and a liquid dielectric is printed in the hole in a vacuum to form the dielectric. Stuff. Further, it can be manufactured by removing the release film, applying an adhesive to the surface, and laminating the second conductor layer 102 including the second capacitor electrode 5.

Also in this case, in order to make the dielectric material less likely to flow during lamination, the dielectric material may be temporarily cured by heating after filling the dielectric material as necessary. Further, by using the release film, it is possible to reliably prevent the dielectric from being printed on unnecessary portions when printing the dielectric. In addition, the dielectric material is filled in a hole formed in a partial region of the polymer film with an adhesive (that is, the first insulating layer 103) sandwiched between the first capacitor electrode 3 and the second capacitor electrode 5. A liquid body is preferable because a liquid body is easily packed when the body is packed. Furthermore, in order to adhere to the first capacitor electrode 3 and the second capacitor electrode 5 at the time of lamination, the dielectric contains a thermosetting resin that cures at the time of lamination or a thermoplastic resin that melts at the time of lamination. Is desirable.

When a solvent is contained in the dielectric when the layers are stacked, they boil at the time of stacking, and the multilayer printed wiring board with a built-in passive element is destroyed, or the solvent remains and deteriorates the reliability of the capacitor. Since the dielectric filled in the hole does not contain a solvent or is dried at a temperature that does not deteriorate the adhesive strength of the adhesive of the first polymer film with the adhesive, It is desirable to use a solvent that evaporates most before lamination. Also,
By adding a substance capable of adjusting the dielectric constant, such as a compound having a high dielectric constant or a compound having a low dielectric constant, together with the thermosetting resin or the thermoplastic resin, a dielectric material having various dielectric constants can be obtained.

Specifically, for example, as a thermosetting resin or a thermoplastic resin, a mixture of an acid anhydride curing agent and an epoxy resin, a mixture of an aliphatic polyamine and an epoxy resin,
Before curing, including phenolic resin before curing, thermosetting resin before curing without solvent such as epoxy resin, liquid phenolic resin, melamine resin, or low boiling point solvent such as resol type phenolic resin using lower alcohol as solvent And a low melting point thermoplastic resin such as low molecular weight polyethylene, and a thermoplastic resin containing a low boiling solvent such as polycarbonate dissolved in acetone. Examples of the substance whose dielectric constant can be adjusted include inorganic compounds such as barium titanate, strontium titanate, and silica, and powders of high molecular compounds such as Teflon (registered trademark) and 6,6-nylon. A mixture of these resins and a substance whose dielectric constant can be adjusted as appropriate is mixed, and a mixture of thermosetting resins that can be packed as a dielectric can be used.

Embodiment 4 FIG. FIG. 10 is a cross-sectional view of a main part for describing the structure of a multilayer printed wiring board according to the fourth embodiment, and more specifically, a cross-sectional view near a capacitor of a multilayer printed wiring board incorporating a capacitor. . FIG. 10 shows an example in which capacitors are stacked in three layers. In the figure, 101 is a first conductive layer, 103 is a first insulating layer (dielectric layer), and 102 is a second conductive layer.
A conductor layer 203; a second insulating layer (dielectric layer) 203;
1 is a third conductor layer, 204 is a third insulating layer (dielectric layer), and 202 is a fourth conductor layer. 2 is the first
The substrate 3 that supports the conductive layer 101 of the first conductive layer 101 is included in the first conductive layer 101, and the first capacitor electrode 4 formed on the surface of the substrate 2 to be convex is the first conductive layer 101. 5 is a second capacitor electrode in the second conductor layer 102, 5a is a third capacitor electrode in the third conductor layer 201, and 5b is a third capacitor electrode in the fourth conductor layer 202. This is the fourth capacitor electrode.

Reference numeral 6 denotes a first insulating layer (dielectric layer) 10
3, a first polymer film which is a film-like dielectric material included in the second insulating layer 203; 6b, a second polymer film which is a film-like dielectric material included in the second insulating layer 203; The third polymer film 7, which is a film-like dielectric material included in the insulating layer 204, is an adhesive. Also, 3
2 and 32a are first and second conductors, and the first conductor 32 has a first capacitor electrode 3 and a third
Is electrically connected to the second capacitor electrode 5a, and the second capacitor electrode 5 and the fourth capacitor electrode 5b are electrically connected to the second conductor 32a.

In the example shown in FIG. 10, the first, second, third, fourth
The capacitor electrodes of the conductor layers of the first, second, third,
4, a first insulating layer is sandwiched between the first and second capacitor electrodes to form a first capacitor, and a second insulating layer is sandwiched between the second and third capacitor electrodes. To form a second capacitor, and a third capacitor is formed with a third insulating layer interposed between the third and fourth capacitor electrodes. The first to third capacitors thus stacked constitute one stacked capacitor 31 by the first conductor 32 and the second conductor 32a.

The multilayer printed wiring board according to the present embodiment has the first conductor layer 10 including the first capacitor electrode 3.
1, a first insulating layer 103 as a dielectric layer, and a second conductive layer 102 including a second capacitor electrode 5, and then a second adhesive layer with a high adhesive layer is formed on the second capacitor electrode 5. The conductive film including the molecular film and the capacitor electrode is laminated at least once, and a multilayer capacitor is formed by a plurality of the laminated polymer films with adhesive and the capacitor electrode. I do. By forming such a multilayered capacitor 31, a multilayer printed wiring board including a capacitor having a large capacitance per unit area can be obtained. That is, according to the multilayer printed wiring board of the present embodiment, the capacity of the built-in capacitor can be greatly increased without increasing the area occupied by the capacitor in the board.

An example of a specific method for manufacturing a multilayer printed wiring board according to the present embodiment will be described. For example, FIG.
As shown in 0, a polymer film with an adhesive serving as the second insulating layer 203 and a conductor such as a metal foil serving as the third conductor layer 201 are further laminated on the second conductor layer 102.
After that, the metal foil is used to form a capacitor electrode and a wiring pattern by a method of forming a wiring pattern on a general printed wiring board. Further, the third conductor layer 201
A polymer film with an adhesive serving as the third insulating layer 204 and a metal foil serving as the fourth conductor layer 202 are laminated thereon to form a capacitor electrode and wiring pattern.

Thereafter, the first capacitor electrode 3 formed on the first conductor layer 101 and the third capacitor electrode 5a formed on the third conductor layer 201 are connected to the first conductor 3
2 for electrical connection. The connection method is an electrical connection method between conductor layers in a general method of manufacturing a printed wiring board, for example, an electrical connection between conductor layers by drilling a through hole and plating copper. I don't care. Similarly, the second capacitor electrode 5 formed on the second conductor layer 102 and the fourth conductor layer 20
2 and the fourth capacitor electrode 5b are electrically connected by the second conductor 32a. As a result, a laminated capacitor 31 having a capacitance per unit area that is about three times that of the case where no lamination is performed can be obtained.

Embodiment 5 FIG. 11 is a cross-sectional view of a principal part for describing the structure of a multilayer printed wiring board according to the fifth embodiment, specifically, a cross-sectional view near a filter configured by connecting a capacitor and an inductor. In the figure, 1 is a capacitor, 101 is a first conductor layer,
102 is a second conductive layer, 103 is a first dielectric layer
Is an insulating layer. Reference numeral 2 denotes a first base material that supports the first conductive layer 101, and 3 denotes a first base material included in the first conductive layer 101 and formed on the surface of the first base material 2 so as to be convex. The capacitor electrodes 4 are wirings included in the first conductive layer 101,
Reference numeral 5 denotes a second capacitor electrode included in the second conductor layer 102, reference numeral 6 denotes a first polymer film (film-like dielectric material) forming the insulating layer 103, and reference numeral 7 denotes an adhesive.

The capacitor 1 is composed of a first capacitor electrode 3, a second capacitor electrode 5, and a first polymer film 6 interposed between these two capacitor electrodes. Numeral 60 denotes a thin wire serving as an inductor. By forming a thinner wire on the first base material 2 than a wire having a reference characteristic impedance,
A larger inductance component can be obtained. 2a is a second base, 61 is a conductor, 62 is a ground layer, and the conductor 61 is formed on the ground layer 62 and the second conductor layer 102 formed on the upper surface of the second base 2a. The second capacitor electrode 5 included therein is electrically connected.
The multilayer printed wiring board according to the present embodiment includes the capacitor 1 including the first capacitor electrode 3, the first insulating layer 103, and the second capacitor electrode 5, and the thin wiring 60 having an inductance component. The capacitor 1 and the wiring 60 serving as an inductor are electrically connected to form a filter.

That is, in the filter of the multilayer printed wiring board according to the present embodiment, the first
The first capacitor electrode 3 and the wiring 60 serving as an inductor electrically connected to the first capacitor electrode 3 are formed on the surface of the polymer film 6 (that is, the first insulating layer 103) with the polymer film 6 (that is, the first insulating layer 103) interposed therebetween. The first base member 2 and the second base member 2a on the surface of which a second conductor layer including the second capacitor electrode 5 is formed are laminated. Here, a ground layer 62 is provided on the back surface of the second capacitor electrode 5 with the second base material 2a interposed therebetween, and the ground layer 62 is electrically connected to the second capacitor electrode 5 by a conductor 61. ing. According to this structure, since the second capacitor electrode 5 is electrically the same as the ground layer, the electrode of the first capacitor is a line close to the ground layer.

On the other hand, the thin wiring 60 serving as an inductor is
Since there is no second capacitor electrode at a position facing this, it is located far from the ground layer 62. for that reason,
The thin wiring 60 serving as an inductor becomes a high characteristic impedance line and functions as an inductor. It is well known that a filter circuit is made by combining a capacitor and an inductor.However, as a filter made of a conventional printed wiring board, a thin insulating layer having a high dielectric constant is used for a capacitor and a thick insulating layer is used for an inductor. For this reason, there is a type in which a capacitor and an inductor are formed in different layers to form a filter circuit. This method has a problem that the manufacturing cost is increased by using a large number of layers each of a ground layer and a wiring layer, which are conductor layers.

As another method of forming the filter, the capacitor and the inductor are formed by keeping the thickness of the insulating layer constant and appropriately changing the width of the wiring of the wiring layer. Thus, in the case of a microstrip line,
One wiring layer and one ground layer and one insulating layer can be formed respectively. In the case of a strip line, a capacitor and an inductor can be formed by one wiring layer and two ground layers and two insulating layers. Can be reduced. However, in this method, if the thickness of the insulating layer is reduced in order to increase the capacitance of the capacitor, the inductance per unit area of the inductor is reduced, and processing technology is limited to reducing the line width of the inductor wiring. When the inductance is increased by increasing the thickness of the insulating layer, the capacitance per unit area of the capacitor decreases. Therefore, there is a problem that a large area is required to form a filter circuit.

On the other hand, when the filter circuit is formed by the multilayer printed wiring board according to the present embodiment, the apparent appearance of the electrode 3 of the first capacitor is caused by the second capacitor electrode 5 which is electrically identical to the ground layer 62. Since the thickness of the insulating layer up to the upper ground layer 62 can be reduced,
The electrode area of the capacitor can be reduced. Further, in the wiring 60 serving as an inductor in the same first conductive layer 101 as the first capacitor electrode 3, the thickness of the insulating layer up to the ground layer 62 can be increased. And the area occupied by the filter circuit can be reduced. In addition, since the filter can be configured only by the first conductive layer 101 including the first capacitor electrode 3, the manufacturing cost is smaller than when the capacitor and the inductor are formed by different layers.

Specifically, the dielectric constant of the substrate and the adhesive was 3.37, the thickness of the substrate was 0.2 mm, the thickness of the electrode of each capacitor was 18 μm, and the dielectric constant of the polymer film was 3.37.
0, the thickness of the polymer film is 6 μm, the wiring width of the inductor portion is 50 μm, a ground layer is provided on the back side of each capacitor electrode, and the wiring which becomes the first capacitor electrode and the inductor is used as a signal line, and Of the Chebychev type low-pass filter with the passive element built-in multilayer printed wiring board, and the signal line of the Chebychev type low-pass filter made by appropriately changing the width of the conventional signal line wiring using the same base material. Comparing the occupied areas, the area occupied by the multilayer printed wiring board according to the present embodiment is several tenths.

Embodiment 6 FIG. 12 to 14 are diagrams for explaining the structure of the main part of the multilayer printed wiring board according to the sixth embodiment. Specifically, a polymer film, a first conductor layer sandwiching the polymer film, and FIG. 4 is a diagram for explaining a structure of a directional coupler formed by two circuit patterns (wiring patterns) formed on two conductor layers. 12 to 14, reference numeral 101 denotes a first conductive layer, 102 denotes a second conductive layer, 103 denotes a first insulating layer which is a dielectric layer, and 2 denotes a first conductive layer 101. The first substrate 70 to be supported is included in the first conductive layer 101, and the first circuit pattern (wiring pattern) 71 formed on the surface of the first substrate 2 to be convex is 71 second Conductive layer 102
, And the second base 2a is formed to be convex on the surface of the second base 2a.
Circuit pattern (wiring pattern). Reference numeral 6 denotes a first dielectric material in the form of a film for forming the insulating layer 103.
And 7 is an adhesive.

FIG. 12 shows the shape of the first circuit pattern (wiring pattern) 70 when viewed from the direction perpendicular to the first base member 2, and FIG. 13 shows the shape of the first base member 2. 2 shows the shape of a second circuit pattern (wiring pattern) 71 when viewed from a direction perpendicular to FIG. Also, FIG.
FIG. 14 is a cross-sectional view taken along line AA in FIGS. 12 and 13. The directional coupler incorporated in the multilayer printed wiring board according to the present embodiment has the structure shown in FIG.
Forming a first circuit pattern 70 having a shape as shown in FIG.
A second circuit pattern (wiring pattern) 71 having a shape as shown in FIG.
The circuit pattern 70 and the second circuit pattern (wiring pattern) 71 are arranged to face each other with the insulating layer 103 (that is, the first polymer film 6) interposed therebetween.

In a general directional coupler incorporated in a conventional printed wiring board, two parallel lines formed in the same conductor layer are brought close to each other as a coupling line, and the side surfaces of the lines are connected to each other. Electrically coupled. When two lines are brought close to each other, the degree of coupling increases. However, when a directional coupler is formed on an actual printed wiring board, there is a problem in the accuracy of forming a wiring pattern. There is a problem that they cannot be approached and the degree of connection is low. Another common directional coupler that can be built into a conventional printed wiring board is a ladder-type hybrid. In this case, the degree of coupling is high, but the circuit occupies a large area and the ladder-type hybrid is used. The problem is that the available frequency band is narrow.

On the other hand, the directional coupler 72 formed by the multilayer printed wiring board according to the present embodiment and having two lines approaching each other forms a first circuit pattern (wiring pattern).
70 and a second circuit pattern (wiring pattern) 71
It has a high degree of bonding because it faces in a plane across the polymer film 6. Specifically, the dielectric constant of the base material and the adhesive is 3.37, the thickness of the base material is 0.2 mm, the thickness of each capacitor electrode is 18 μm, and the dielectric constant of the polymer film is 3.
0, the thickness of the polymer film is 6 μm, the width of the wiring pattern of the bonding portion is 50 μm, the length is 7 mm, and a ground layer is provided on the back side for each wiring pattern,
When the directional coupler was formed using the multilayer printed wiring board with a built-in passive element of the present invention, the coupling degree when the electric signal was 2 GHz was 3.4 dB. On the other hand, in the case of a directional coupler in which the same base material is used and two lines are formed in parallel in a conventional general same conductor layer with a wiring width of 50 μm, a length of 7 mm, and a distance of 50 μm, which are arranged in parallel. The coupling degree was 14.8 dB. That is, according to the present embodiment, a multilayer printed wiring board having a built-in directional coupler having a high degree of coupling can be easily realized.

The first circuit pattern (wiring pattern) 70 is a main line, and the second circuit pattern (wiring pattern) is
Considering the case where power is supplied from the left end of the first circuit pattern (wiring pattern) 70 as a main line, for example, there is an electrical connection between the main line and the sub line. Power is also transmitted to the second circuit pattern (wiring pattern) 71 which is a double track. Here, assuming that the powers appearing at the left end and the right end of the second circuit pattern (wiring pattern) 71 as the sub-line are Pf and Pr, respectively, the degree of electrical coupling between the main line and the sub-line (that is, the degree of coupling) is , -10 l
og ₁₀ (Pf / Pi) dB. The characteristic of the directional coupler is represented by the degree of coupling. It is said that the smaller the numerical value of the degree of coupling defined by the above equation, the higher the degree of coupling or the higher the degree of coupling.

[0061]

According to the multilayer printed wiring board of the present invention, the first conductor layer including the first capacitor electrode and formed on the first base material is laminated on the first conductor layer. A first insulating layer in which an adhesive is applied to both sides of a film-shaped dielectric material, and a second capacitor laminated on the first insulating layer and arranged at a position facing the first capacitor electrode Since the second conductive layer including the electrodes is provided, a variation in the built-in capacitor capacity is small, and a multilayer printed wiring board having a stable built-in capacitor capacity can be easily realized.

According to the multilayer printed wiring board of the present invention, the first capacitor electrode is in contact with the dielectric material of the first insulating layer, and the first base material and the dielectric material of the first insulating layer are separated from each other. Since the gap with the material is filled with the adhesive, the distance between the first and second capacitor electrodes is reduced,
Further, the capacity of the built-in capacitor can be increased, and a multilayer printed wiring board with high adhesion reliability between the stacked layers can be easily realized.

Further, according to the multilayer printed wiring board of the present invention, since the second conductor layer is also formed on the second base material, the variation is reduced by a simpler manufacturing method, and the stable capacitance is obtained. It is possible to easily manufacture a multilayer printed wiring board incorporating the above capacitor.

According to the multilayer printed wiring board of the present invention, the second capacitor electrode included in the second conductor layer contacts the dielectric material of the first insulating layer,
Since the gap between the second base material and the dielectric material of the first insulating layer is filled with the adhesive, the distance between the first and second capacitor electrodes is further reduced, and the distance between the first and second capacitor electrodes is reduced. The capacity can be further increased.

According to the multilayer printed wiring board of the present invention, a part of the first insulating layer sandwiched between the first capacitor electrode and the second capacitor electrode has a predetermined dielectric constant. Since the dielectric can be replaced by the dielectric, the capacity of the built-in capacitor can be set to a desired value without changing the dimensions of the capacitor.

Further, according to the multilayer printed wiring board of the present invention, a second insulating layer laminated on the second conductor layer and having an adhesive applied to both surfaces of a film-like dielectric material;
A third capacitor electrode laminated on the second insulating layer and including a third capacitor electrode disposed at a position facing the second capacitor electrode;
Since further comprising a plurality of capacitors electrically connected in the vertical direction of the base material,
The capacity of the built-in capacitor can be greatly increased without increasing the area occupied by the capacitor in the substrate.

Further, according to the multilayer printed wiring board of the present invention, the wiring serving as an inductor is formed in the first conductive layer, and the wiring is electrically connected to the second capacitor electrode via the second base material. A connected ground layer is formed,
The first wiring included in the wiring serving as an inductor and the first conductive layer
And the capacitor electrodes are connected to form a filter circuit, so that the area occupied in the substrate can be kept small,
In addition, it is possible to easily realize a multilayer printed wiring board having a built-in high-quality filter circuit including a capacitor and an inductor having a small variation and a stable capacitor capacity.

Further, according to the multilayer printed wiring board of the present invention, a first conductor layer including a first wiring pattern laminated on a first base material and serving as a first coupling line;
A first insulating layer laminated on the first conductor layer and having an adhesive applied to both surfaces of a film-shaped dielectric material, and a position laminated on the first insulating layer and opposed to the first wiring pattern. And a second conductor layer including a second wiring pattern serving as a second coupling line disposed in the directional coupler, so that the directional coupler is configured. A multi-layer printed wiring board can be easily realized.

According to the method of manufacturing a multilayer printed wiring board of the present invention, a step of forming a first conductor layer including a first capacitor electrode on a first base material; Laminating a first insulating layer coated with an adhesive on both sides of a film-shaped dielectric material, and a second capacitor disposed on the first insulating layer at a position facing the first capacitor electrode A step of laminating a second conductor layer including electrodes, so that the manufacturing process is simple, the variation in the built-in capacitor capacitance is small, and the multilayer printed circuit board has a stable capacitor capacity. Can be easily realized.

Further, according to the method of manufacturing a multilayer printed wiring board according to the present invention, a step of forming a first conductor layer including a first capacitor electrode on a first base material; Forming a second conductive layer including a second capacitor electrode corresponding to the first capacitor electrode, and sandwiching a first insulating layer having an adhesive applied to both surfaces of a film-shaped dielectric material; In addition, the method includes a step of laminating the first conductor layer and the second conductor layer with the first capacitor electrode and the second capacitor electrode facing each other. In addition, a multilayer printed wiring board having a stable capacitor capacity can be realized more easily.

According to the method for manufacturing a multilayer printed wiring board of the present invention, the first insulating layer is a part of the first insulating layer sandwiched between the first capacitor electrode and the second capacitor electrode. Since the region is replaced with a dielectric having a predetermined dielectric constant, a method of manufacturing a multilayer printed wiring board can be provided in which the capacity of a built-in capacitor can be set to a desired value.

[Brief description of the drawings]

FIG. 1 is a cross-sectional view of a principal part for describing a structure of a multilayer printed wiring board according to a first embodiment.

FIG. 2 is a diagram for explaining a manufacturing procedure of the multilayer printed wiring board according to the first embodiment.

FIG. 3 is a diagram for illustrating a procedure for manufacturing the multilayer printed wiring board according to the first embodiment.

FIG. 4 is a diagram for explaining a gap caused by an adhesive generated between a polymer film and a first capacitor electrode.

FIG. 5: Gap (gap) generated between the base material and the adhesive
FIG.

FIG. 6 is a diagram for explaining dents in the polymer film that occur when the melting point or softening point of the polymer film is too low.

FIG. 7 is a diagram for explaining a difference between a manufacturing process of a multilayer printed wiring board according to the present invention and a manufacturing process of a conventional multilayer printed wiring board.

FIG. 8 is a main-portion cross-sectional view for describing a structure of a multilayer printed wiring board according to Embodiment 2.

FIG. 9 is a fragmentary cross-sectional view for explaining the structure of the multilayer printed wiring board according to the third embodiment;

FIG. 10 is a fragmentary cross-sectional view for explaining the structure of the multilayer printed wiring board according to Embodiment 4;

FIG. 11 is a cross-sectional view of a principal part for describing a structure of a multilayer printed wiring board including a filter circuit according to a fifth embodiment;

FIG. 12 shows a first embodiment of a directional coupler in a multilayer printed wiring board incorporating a directional coupler according to the sixth embodiment.
FIG. 4 is a diagram for describing a first circuit pattern (wiring pattern) formed on the conductive layer of FIG.

FIG. 13 shows a second embodiment of a directional coupler in a multilayer printed wiring board incorporating a directional coupler according to the sixth embodiment.
FIG. 4 is a diagram for explaining a second circuit pattern (wiring pattern) formed on the conductive layer of FIG.

FIG. 14 is a diagram for illustrating a structure of a multilayer printed wiring board according to a sixth embodiment.

FIG. 15 is a cross-sectional view showing a configuration of a printing capacitor portion of a conventional multilayer printed wiring board having a built-in printing capacitor as a passive element.

[Explanation of symbols]

DESCRIPTION OF SYMBOLS 1 Capacitor 2 1st base material 2a 2nd base material 3 1st capacitor electrode 4 Wiring 5 2nd capacitor electrode 5a 3rd capacitor electrode 5b 4th capacitor electrode 6 1st polymer film (film form) 6a Second polymer film (film-shaped dielectric material) 6b Third polymer film (film-shaped dielectric material) 7 Adhesive 8 Metal foil 9 Dielectric 31 Laminated capacitor 32 First conductor 32a Second conductor 33 Ground layer 51 Gap by adhesive 52 Gap not filled with adhesive 53 Indentation of polymer film 60 Wiring to be an inductor 61 Conductor 62 Ground layer 70 First wiring Pattern 71 second wiring pattern 72 directional coupler 101 first conductive layer 102 second conductive layer 103 first insulating layer 20 The third conductive layer 202 fourth conductive layer 203 second insulating layer 204 third insulating layer

──────────────────────────────────────────────────続 き Continued on the front page (51) Int.Cl. ⁷ Identification symbol FI Theme coat ゛ (Reference) H05K 3/18 H05K 3/42 620B 3/42 620 3/46 G 3/46 N H01G 4/40 321A ( 72) Inventor Hirofumi Fujioka 2-3-2 Marunouchi, Chiyoda-ku, Tokyo, Mitsubishi Electric Co., Ltd. (72) Inventor Satoshi Yanaura 2-3-2 Marunouchi, Chiyoda-ku, Tokyo F-term in Mitsubishi Electric Co., Ltd. reference) 5E082 AB03 BB01 BC38 DD08 FF15 FG26 FG34 KK01 5E317 AA21 AA24 BB12 CC32 CC33 GG14 GG16 5E339 AB01 AC01 AD03 AD05 AE01 BC02 BD02 BD06 BD08 BE11 BE13 GG02 5E343 AA02 AA13 AA17 BB12 BB14 BB24 BB67 BB71 DD33 DD43 DD76 ER32 GG08 5E346 AA02 AA06 AA12 AA15 AA32 AA43 AA51 CC02 CC08 CC09 CC32 DD02 DD12 DD23 DD24 DD32 DD33 EE06 EE07 EE09 EE13 EE18 FF07 FF15 GG15 GG17 GG22 GG28 HH11 HH26 HH31

Claims (11)

[Claims] 1. A first conductor layer formed on a first base material and including a first capacitor electrode, and both surfaces of a film-shaped dielectric material laminated on the first conductor layer A first insulating layer on which an adhesive is applied, and a second conductor laminated on the first insulating layer and including a second capacitor electrode disposed at a position facing the first capacitor electrode And a multilayer printed wiring board. 2. The first capacitor electrode contacts a dielectric material of a first insulating layer, and contacts a first base material with the first base material.
2. The multilayer printed wiring board according to claim 1, wherein a gap between the insulating layer and the dielectric material is filled with an adhesive. 3. The multilayer printed wiring board according to claim 1, wherein the second conductor layer is formed on the second base material. 4. A second capacitor electrode included in the second conductor layer is in contact with the dielectric material of the first insulating layer and the second base material and the dielectric material of the first insulating layer. 4. The multilayer printed wiring board according to claim 3, wherein an adhesive is filled in a gap between the multilayer printed wiring board and the substrate. 5. A method according to claim 1, wherein a part of the first insulating layer sandwiched between the first capacitor electrode and the second capacitor electrode is replaced with a dielectric having a predetermined dielectric constant. The multilayer printed wiring board according to claim 1. 6. A second insulating layer laminated on a second conductor layer and having an adhesive applied to both surfaces of a film-shaped dielectric material, and a second insulating layer laminated on the second insulating layer, A third conductor layer including a third capacitor electrode disposed at a position facing the capacitor electrode, wherein a plurality of capacitors electrically connected in the vertical direction of the base material are stacked; The multilayer printed wiring board according to any one of claims 1 to 4, wherein: 7. A wiring which serves as an inductor is formed on a first conductor layer, and a ground layer which is electrically connected to a second capacitor electrode via a second base material is formed. 5. A filter circuit is formed by connecting a wiring to be formed and a first capacitor electrode included in the first conductor layer.
The multilayer printed wiring board according to any one of the above items. 8. A first conductor layer including a first wiring pattern, which is laminated on a first base material and serves as a first coupling line, and a film laminated on the first conductor layer, A first insulating layer in which an adhesive is applied to both sides of a dielectric material in a shape of a circle, and a second coupling line laminated on the first insulating layer and arranged at a position facing the first wiring pattern And a second conductor layer including a second wiring pattern to form a directional coupler. 9. A step of forming a first conductor layer including a first capacitor electrode on a first base material, and an adhesive on both surfaces of a film-like dielectric material on the first conductor layer. Laminating the applied first insulating layer, and laminating a second conductor layer including a second capacitor electrode disposed at a position facing the first capacitor electrode on the first insulating layer. And a method for manufacturing a multilayer printed wiring board. 10. A step of forming a first conductor layer including a first capacitor electrode on a first substrate, and a step of forming a second conductor corresponding to the first capacitor electrode on a second substrate.
Forming a second conductive layer including a capacitor electrode of the first type, and a first method in which an adhesive is applied to both surfaces of a film-shaped dielectric material.
Laminating the first conductor layer and the second conductor layer with the first capacitor electrode and the second capacitor electrode opposed to each other with the insulating layer of the first layer sandwiched therebetween. A method for manufacturing a multilayer printed wiring board, comprising: 11. A method according to claim 1, wherein a portion of the first insulating layer sandwiched between the first capacitor electrode and the second capacitor electrode is replaced with a dielectric having a predetermined dielectric constant. 11. The method for manufacturing a multilayer printed wiring board according to 9 or 10.