CN115696787B - Manufacturing method of high-shielding flexible circuit board - Google Patents
Manufacturing method of high-shielding flexible circuit board Download PDFInfo
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- CN115696787B CN115696787B CN202211166307.XA CN202211166307A CN115696787B CN 115696787 B CN115696787 B CN 115696787B CN 202211166307 A CN202211166307 A CN 202211166307A CN 115696787 B CN115696787 B CN 115696787B
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- 238000004519 manufacturing process Methods 0.000 title claims abstract description 22
- QTBSBXVTEAMEQO-UHFFFAOYSA-M Acetate Chemical compound CC([O-])=O QTBSBXVTEAMEQO-UHFFFAOYSA-M 0.000 claims abstract description 83
- 239000004744 fabric Substances 0.000 claims abstract description 73
- 238000012545 processing Methods 0.000 claims abstract description 69
- 239000000853 adhesive Substances 0.000 claims abstract description 64
- 230000001070 adhesive effect Effects 0.000 claims abstract description 64
- 238000004080 punching Methods 0.000 claims abstract description 27
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 14
- 229910052802 copper Inorganic materials 0.000 claims abstract description 14
- 239000010949 copper Substances 0.000 claims abstract description 14
- 238000003475 lamination Methods 0.000 claims abstract description 10
- 238000003825 pressing Methods 0.000 claims abstract description 8
- 238000004804 winding Methods 0.000 claims abstract description 8
- 238000010030 laminating Methods 0.000 claims abstract description 7
- 238000005553 drilling Methods 0.000 claims abstract description 4
- 238000009713 electroplating Methods 0.000 claims abstract description 4
- 239000010408 film Substances 0.000 claims description 50
- 238000000034 method Methods 0.000 claims description 37
- 238000009826 distribution Methods 0.000 claims description 5
- 239000013039 cover film Substances 0.000 claims description 3
- 239000011248 coating agent Substances 0.000 claims description 2
- 238000000576 coating method Methods 0.000 claims description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 2
- 229910052737 gold Inorganic materials 0.000 claims description 2
- 239000010931 gold Substances 0.000 claims description 2
- 230000000694 effects Effects 0.000 abstract description 23
- 239000010410 layer Substances 0.000 description 95
- 230000035882 stress Effects 0.000 description 46
- 239000000047 product Substances 0.000 description 11
- 230000001965 increasing effect Effects 0.000 description 7
- 238000005452 bending Methods 0.000 description 5
- 239000003292 glue Substances 0.000 description 5
- 239000000463 material Substances 0.000 description 4
- 239000004642 Polyimide Substances 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 230000008054 signal transmission Effects 0.000 description 3
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 2
- 238000002679 ablation Methods 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000006355 external stress Effects 0.000 description 2
- 239000013067 intermediate product Substances 0.000 description 2
- 238000003754 machining Methods 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- 230000002633 protecting effect Effects 0.000 description 2
- 229910052709 silver Inorganic materials 0.000 description 2
- 239000004332 silver Substances 0.000 description 2
- 238000004026 adhesive bonding Methods 0.000 description 1
- 239000002390 adhesive tape Substances 0.000 description 1
- 230000032683 aging Effects 0.000 description 1
- 238000009739 binding Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000007795 chemical reaction product Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000018109 developmental process Effects 0.000 description 1
- 239000003989 dielectric material Substances 0.000 description 1
- 239000003814 drug Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000002708 enhancing effect Effects 0.000 description 1
- 238000000227 grinding Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000011229 interlayer Substances 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000012805 post-processing Methods 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 238000007789 sealing Methods 0.000 description 1
- 238000000926 separation method Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 230000005476 size effect Effects 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
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Abstract
The invention discloses a manufacturing method of a high-shielding flexible circuit board, which comprises the following steps: manufacturing a circuit pattern layer on the flexible copper-clad plate, pressing a second flexible copper-clad plate on the surface, processing the circuit copper layer to form a net-shaped circuit, attaching a covering film layer, drilling and electroplating to form stress relief holes, attaching a shielding film on the surface, punching to form a plurality of independent wire harness flexible plates, attaching single-sided adhesive acetate cloths on two ends, attaching double-sided adhesive acetate cloths on the surface, mutually laminating and adhering until an integral wire harness circuit board is formed, and winding and wrapping an overlapped area by using the acetate cloths to form a high-shielding flexible circuit board; the novel flexible circuit board and wire harness product mode is formed by designing and processing the reticular circuit, the shielding layer and the acetate cloth to form a triple protection effect and winding the acetate cloth in a lamination manner, so that the novel flexible circuit board and wire harness product mode can replace coaxial wires, and has the comprehensive effects of high shielding performance, high wiring density, high reliability and low processing difficulty.
Description
Technical Field
The invention relates to the field of flexible circuit board design and processing, in particular to a manufacturing method of a high-shielding flexible circuit board.
Background
With the continuous development of terminal products such as new energy automobiles, the flexible circuit board is used as a key electronic component for wiring and wiring in the flexible circuit board, and the flexible circuit board is widely applied, and based on the advantages of good flexibility of the flexible circuit board, wiring characteristics of high integration, flexible adaptability of application scenes, high reliability and the like, the flexible circuit board is increasingly used for replacing wiring harness circuits in the field of terminal products such as new energy automobiles.
In general, because the harness circuit is longer and the electric signal and other signal transmission processes may be greatly interfered, electromagnetic shielding treatment is generally required for the harness circuit to improve the anti-interference capability in the electric signal and other signal transmission processes; in the case where the flexible circuit board is used instead of the wire harness, the flexible circuit board needs to be subjected to electromagnetic shielding treatment.
At present, as the functions of the end products such as new energy automobiles are more and more powerful, the requirements on performances such as wiring density, reliability, high shielding performance, large signal transmission effect and the like of the flexible circuit boards such as replacement wiring harnesses are higher and higher, so that the flexible circuit boards can adopt the design of increasing the number of layers of the flexible circuit boards, improving the wiring density, improving the performances and effects by adopting the processing modes such as silver paste, electromagnetic shielding films and the like, and adopting the multi-layer flexible circuit board or the multi-layer laminated flexible circuit board for the flexible circuit boards with higher wiring density requirements.
However, the multilayer flexible circuit board has more complicated structure and longer processing flow, so that the processing difficulty is higher, the processing cost is higher, and the processing difficulty of the multilayer layered flexible circuit board is higher; moreover, the silver paste and the electromagnetic shielding film are simply used, so that the processing difficulty is further increased, and the processing cost is further increased; in order to meet the comprehensive consideration of realizing high shielding performance, high wiring density, high reliability, low processing difficulty and low processing cost of the flexible circuit board in a limited assembly space, the requirements of various aspects are difficult to effectively balance by simply using a structure with increased layers or being designed into a multi-layer layering type structure.
Based on the background and the problems, a simple and feasible manufacturing method of the high-shielding flexible circuit board needs to be provided, so that various performance and effect requirements of the flexible circuit board for replacing wire harnesses are conveniently balanced.
Disclosure of Invention
The invention aims to solve the problems of high processing difficulty, high processing cost, high shielding property, high reliability and other comprehensive performance balance required by the replacement of a wire harness type flexible circuit board in the prior art, and provides a manufacturing method of a high-shielding flexible circuit board, which is characterized by comprising the following steps of:
S10: a flexible copper-clad plate is taken, a circuit pattern layer is manufactured on the flexible copper-clad plate, and a pattern flexible plate is formed;
s20: pressing a second flexible copper-clad plate on the circuit pattern layer of the pattern flexible plate, wherein the second flexible copper-clad plate comprises a circuit dielectric layer and a circuit copper layer, and the circuit dielectric layer is covered on the circuit pattern layer; carrying out graphic processing on the circuit copper layer to form a net-shaped circuit, and attaching a covering film layer on the second flexible copper-clad plate to form a net-shaped circuit flexible board;
s30: drilling the reticular circuit flexible board, electroplating to form a stress relief hole, and integrally forming the stress relief hole flexible board;
s40: attaching a shielding film to the surface of the stress relief hole flexible plate to form a shielding film flexible plate;
s50: punching the shielding film flexible board to form an independent wiring harness flexible board comprising a plurality of sub-boards which are adjacently distributed in parallel;
S60: attaching single-sided adhesive acetate cloths to two ends of the independent wire harness flexible board in the long direction, and attaching double-sided adhesive acetate cloths to one surface of part of the independent wire harness flexible board;
S70: laminating and adhering the independent wire harness flexible board which is not attached with the double-sided adhesive acetate cloth on the independent wire harness flexible board which is attached with the double-sided adhesive acetate cloth to form a primary wire harness flexible board;
S80: repeating the steps S60 to S70 until the independent wiring harness flexible boards are overlapped to form an integral wiring harness circuit board;
s90: and winding and wrapping the overlapped area of the integral wire harness circuit board by using single-sided adhesive acetate cloth to form the high-shielding flexible circuit board.
Further, the circuit pattern layer is manufactured on the flexible copper-clad plate, and the circuit pattern layer further comprises golden finger patterns, wherein the golden finger patterns are positioned at two ends of the pattern flexible plate in the long direction; and pressing a second flexible copper-clad plate on the circuit pattern layer of the pattern flexible plate, and further comprising attaching a release film to a position area of the dielectric layer of the second flexible copper-clad plate corresponding to the golden finger pattern, and then performing the pressing and coating processing process.
Further, after the stress relief hole flexible board is manufactured, deep control slotting processing is performed along the surface of the stress relief hole flexible board corresponding to the release film region, the second flexible copper-clad plate, the release film and the cover film layer which are covered on the golden finger graph are removed, the golden finger graph is exposed, and electrical golden processing is performed on the golden finger graph to form the golden finger.
Further, the stress relief holes are positioned at two ends of the bending area of the stress relief hole flexible board in the long direction and are at a certain distance from the golden finger, and the stress relief holes are correspondingly distributed at two ends of the stress relief hole in the long direction;
And the punching is to perform punching processing along the two opposite stress relief holes, and the opposite unilateral hole rings of the two opposite stress relief holes are punched and cut at the same time.
Further, the double-sided adhesive acetate cloth is attached to a part of the daughter board of the independent wire harness flexible board, and is independently attached according to the width of the independent wire harness flexible board and the length of the punching seam;
The distribution rule of the attached double-sided adhesive acetate cloth is that the independent wire harness flexible plates distributed from the center are attached to two ends, the surfaces of two adjacent independent wire harness flexible plates are attached, one independent wire harness flexible plate is not attached, and the surfaces of the two adjacent independent wire harness flexible plates are attached;
And the independent wire harness flexible board not attached with the double-sided adhesive acetate cloth is adhered to the independent wire harness flexible board attached with the double-sided adhesive acetate cloth in a lamination manner, and the independent wire harness flexible board not attached with the double-sided adhesive acetate cloth is pulled from the middle position to the independent wire harness flexible board attached with the double-sided adhesive acetate cloth and is adhered in a lamination manner.
Further, the single-sided adhesive acetate cloth is attached to two ends of the independent wire harness flexible board in the long direction, and is integrally attached to the position of the stress relief hole along the intersection line of the golden finger graph and the independent wire harness flexible board.
Further, the mesh-like wiring covers the surface of the graphic flexible board except the golden finger graphic.
Further, the mesh wire has a wire width of 0.1mm to 2.0mm.
Further, the mesh length of the mesh wire multiplied by the mesh width of the mesh wire is 0.1mm×0.1mm to 2.0mm×2.0mm.
Further, the stress relief hole comprises an annular ring having a unilateral width of 50 μm to 300 μm.
According to the technical scheme, the net-shaped circuit is added, the effect of a first shielding layer is achieved on the flexible circuit board, the stress of the flexible board is removed through the stress removing holes, and the die-cut stress and the stress of subsequent superposition, adhesion and winding of the flexible boards of the independent wire harnesses are removed; the method comprises the steps that acetate cloth is adopted to laminate and adhere each independent wire harness flexible board of a flexible circuit board to form an integral wire harness circuit board, under the condition that the number of layers of the circuit board is not increased or the structure of the circuit board is not changed, a single circuit board is adhered, wound and wrapped by the acetate cloth to form a product mode similar to the flexible circuit board and the wire harness, a novel intermediate product which is excessive from a traditional wire harness product to the flexible circuit board product is invented, coaxial wires can be replaced, and the cost is only about 10% of that of the replaced coaxial wires; and the shielding performance of the reticular shielding circuit and the acetate cloth is utilized in the processing, so that the flexible circuit board has high shielding performance, and the product and the processing effect of the comprehensive performance of high shielding performance, high wiring density, high reliability, low processing difficulty and low processing cost of the flexible circuit board can be met.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings that are required in the embodiments or the description of the prior art will be briefly described, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and other drawings may be obtained according to the structures shown in these drawings without inventive effort for a person skilled in the art.
FIG. 1 is a schematic illustration of a process flow according to an embodiment of the present invention;
FIG. 2 is a schematic cross-sectional structure of a double-sided copper-clad plate and a circuit pattern layer according to an embodiment of the present invention;
FIG. 3 is a schematic cross-sectional view of a flexible board for forming a mesh circuit according to an embodiment of the present invention;
FIG. 4 is a schematic cross-sectional structure of a flexible board for forming stress relief holes and a flexible board for forming shielding films according to an embodiment of the present invention;
FIG. 5 is a schematic plan view of a flexible board for forming individual harnesses according to an embodiment of the present invention;
fig. 6 is a schematic plan view of a single-sided adhesive acetate cloth and a double-sided adhesive acetate cloth according to an embodiment of the present invention;
fig. 7 is a schematic plan view of a flexible board for forming a preliminary wiring harness according to an embodiment of the present invention;
Fig. 8 is a schematic plan view of a circuit board for forming an integral wiring harness according to an embodiment of the present invention;
Fig. 9 is a schematic plan view of a high shielding flexible circuit board according to an embodiment of the present invention.
Reference numerals illustrate:
| Reference numerals | Name of the name | Reference numerals | Name of the name |
| 100 | Graphic flexible board | 5110 | First shielding film |
| 110 | Flexible copper-clad plate | 5120 | Second shielding film |
| 1110 | First circuit pattern layer | 300 | Shielding film flexible board |
| 1120 | Insulating dielectric layer | 3210 | First golden finger |
| 1130 | Second circuit pattern layer | 3220 | Second golden finger |
| 200 | Net-shaped circuit flexible board | 6110 | First independent wire harness flexible board |
| 210 | Second flexible copper-clad plate (1) | 6120 | Second independent wire harness flexible board |
| 310 | Second flexible copper-clad plate (2) | 6130 | Third independent wire harness flexible board |
| 2110 | Line medium layer (1) | 6140 | Fourth independent wire harness flexible board |
| 3110 | Line medium layer (2) | 6210 | Punching slit |
| 2120 | First net-shaped circuit | 7110 | Single-sided adhesive acetate cloth |
| 3120 | Second net-shaped circuit | 7120 | Double-sided adhesive acetate cloth |
| 2130 | A first covering film layer | 400 | Primary wire harness flexible board |
| 3130 | A second covering film layer | 6110-6120 | First two-layer laminated sub-board |
| 2140 | First release film | 6130-6140 | Third four laminated sub-board |
| 3140 | Second release film | 10 | High shielding flexible circuit board |
| 300 | Shielding film flexible board | 6110-6140 | Integral wire harness circuit board |
| 410 | Destressing hole | 6110-6140 | First two three four laminated sub-board |
| 4110 | Annular ring | / | / |
The achievement of the objects, functional features and advantages of the present invention will be further described with reference to the accompanying drawings, in conjunction with the embodiments.
Detailed Description
The following description of the embodiments of the present invention will be made clearly and fully with reference to the accompanying drawings, in which it is evident that the embodiments described are only some, but not all embodiments of the invention. All other embodiments, which can be made by those skilled in the art based on the embodiments of the invention without making any inventive effort, are intended to be within the scope of the invention.
It should be noted that all directional indicators (such as up, down, left, right, front, and rear … …) in the embodiments of the present invention are merely used to explain the relative positional relationship, movement, etc. between the components in a particular posture (as shown in the drawings), and if the particular posture is changed, the directional indicator is changed accordingly.
Furthermore, descriptions such as those referred to as "first," "second," and the like, are provided for descriptive purposes only and are not to be construed as indicating or implying a relative importance or implying an order of magnitude of the indicated technical features in the present disclosure. Thus, a feature defining "a first" or "a second" may explicitly or implicitly include at least one such feature. In the description of the present invention, the meaning of "plurality" means at least two, for example, two, three, etc., unless specifically defined otherwise.
In the prior art, the flexible circuit board for replacing the wiring harness generally realizes the effects of high wiring density and high reliability by increasing the number of circuit layers, namely, the flexible circuit board can be designed into a multi-layer flexible circuit board, and if the flexible circuit board needs to be inserted, a golden finger can be designed to meet the effect of electric connection.
The flexible circuit board can be designed into a multi-layer layered circuit board, and in general, the multi-layer layered circuit board is a rigid-flex combined circuit board, namely, the flexible board in the flex area is divided into multiple layers, the items are separated and arranged, the multiple layers of flexible boards are converged into the rigid board to form the rigid board for supporting, and the flexible board has the functions of flex and connection.
The two modes all cause the increase of the design difficulty of the circuit board, the increase of the processing flow and the increase of the processing difficulty.
In the embodiment of the invention, the high-shielding flexible circuit board can be a single-layer board or a double-sided board, and the processing processes of the high-shielding flexible circuit board under the technology of the invention are the same.
The embodiment of the invention selects the double-sided board as a specific implementation process to describe the technical method.
Referring to fig. 1, fig. 1 is a schematic process flow diagram of an embodiment of the invention.
The manufacturing process of the embodiment of the present invention is implemented by using the step flow in fig. 1, and the step flow in fig. 1 will be further described step by step.
Referring to fig. 2, fig. 2 is a schematic cross-sectional structure of a double-sided copper-clad plate and a circuit pattern layer according to an embodiment of the invention; the processing procedure of fig. 2, namely the step S10 in fig. 1, is specifically as follows:
S10: and taking the flexible copper-clad plate, and manufacturing a circuit pattern layer on the flexible copper-clad plate to form a pattern flexible plate.
As shown in fig. 2, the flexible copper-clad plate is a double-sided flexible copper-clad plate, the double-sided flexible copper-clad plate is manufactured to form a double-sided circuit pattern layer, that is, a first circuit pattern layer 1110 and a second circuit pattern layer 1130 are formed, and the double-sided flexible copper-clad plate is an insulating medium layer 1120 to manufacture and form the pattern flexible plate 100.
In one embodiment, the circuit pattern layer is made on the flexible copper-clad plate, and the method further comprises making a golden finger pattern, as shown in fig. 2, wherein the first circuit pattern layer 1110 and the second circuit pattern layer 1130 in fig. 2 comprise the golden finger pattern; the gold finger patterns are located at both ends of the pattern flexible board 100 in the long direction.
Because the flexible circuit board of the embodiment is a product for replacing the wire harness, and the wire harness circuit board is connected with other modules, the wire harness circuit board is generally required to be spliced or welded by using golden fingers, and has good weldability and reliability; golden finger, namely plug circuit.
Referring to fig. 3, fig. 3 is a schematic cross-sectional structure of a flexible board for forming a mesh circuit according to an embodiment of the invention; the processing procedure of fig. 3, namely the step S20 in fig. 1, is specifically as follows:
s20: pressing a second flexible copper-clad plate on the circuit pattern layer of the pattern flexible plate, wherein the second flexible copper-clad plate comprises a circuit dielectric layer and a circuit copper layer, and the circuit dielectric layer is covered on the circuit pattern layer; carrying out graphic processing on the circuit copper layer to form a net-shaped circuit, and attaching a covering film layer on the second flexible copper-clad plate to form a net-shaped circuit flexible board;
As shown in fig. 3, the second flexible copper-clad plate (1) 210 and the second flexible copper-clad plate (2) 310 are respectively laminated on the first circuit pattern layer 1110 and the second circuit pattern layer 1130 of the graphic flexible board 100; the second flexible copper-clad plate (1) 210 comprises a circuit dielectric layer (1) 2110 and a circuit copper layer (1); the second flexible copper-clad plate (2) 310 comprises a circuit dielectric layer (2) 3110 and a circuit copper layer (2); wherein, the line medium layer (1) and the line medium layer (2) are respectively covered on the first line pattern layer 1110 and the second line pattern layer 1130; patterning the line copper layer (1) and the line copper layer (2) to form a first mesh line 2120 and a second mesh line 3120; the first covering film layer 2130 and the second covering film layer 3130 are respectively attached to the second flexible copper-clad plate (1) 210 and the second flexible copper-clad plate (2) 310, so as to form the mesh-shaped circuit flexible board 200.
The design increases first netted circuit 2120 and second netted circuit 3120, makes the double faced board of original, forms pseudo-four-layer board, on the one hand, has cancelled the via hole of golden finger, makes golden finger be set up in the inlayer, can effectively reduce the transmission loss of signal of telecommunication, on the other hand, pseudo-four-layer board can provide the shielding circuit layer processing of upper and lower two-layer for the double faced board.
It should be noted that, after the golden finger is arranged on the inner layer, the golden finger can be processed by adopting a front uncovering mode, namely, the covering layer at the golden finger position is removed firstly, the subsequent processing is processed by adopting a mode of attaching blue glue for protection, and the blue glue is torn off after the processing is finished; the method can also adopt a mode of post uncovering for processing, namely, a covering layer at the position of the golden finger is adopted to design a covering copper sheet layer contacted with the golden finger, then the processing is carried out, and finally, the covering layer at the position of the golden finger is removed by a processing mode of depth-control milling plate or laser depth-control ablation; the two processing modes can be selected according to actual requirements.
Further, the mesh-shaped circuit covers the surface of the graphic flexible board except the golden finger graphic; as shown in fig. 3, the first mesh wire 2120 and the second mesh wire 3120 cover both surfaces of the graphic flexible board 100, respectively.
Further, the mesh wire has a wire width of 0.1mm to 2.0mm.
Preferably, the mesh length of the mesh wire multiplied by the mesh width of the mesh wire is 0.1mm×0.1mm to 2.0mm×2.0mm.
In this embodiment, the mesh-shaped circuit pattern is formed on the double-sided flexible circuit board, so that the shielding and protecting effects on the first circuit pattern layer 1110 and the second circuit pattern layer 1130 can be effectively achieved, and in general, the thickness of the mesh-shaped circuit is 10 μm to 50 μm so as not to affect the bending performance of the flexible circuit board itself.
It should be further noted that, since the flexible circuit board of the wire harness is generally designed with impedance lines, such circuit board generally has a requirement on impedance values, but after designing the mesh circuit pattern, a certain signal shielding effect, or a local shielding effect, or an effect of making the impedance values of the impedance lines nonuniform is also generated on the impedance lines, so that a certain adjustment and design need to be made on the circuit width and the mesh width of the mesh circuit pattern, preferably, a thinner circuit width, for example, a circuit width of 100 μm or 150 μm or 200 μm can be selected; while the length and width of the mesh are 0.1mm×0.1mm to 2.0mm×2.0mm, in the case of adjusting the impedance value to the required value, preferably, the same dimension of the line width of the mesh line can be selected, i.e., for example, the line width of the mesh line is 1.0mm, and the length and width of the mesh are selected to be 1.0mm×1.0mm, so that the best shielding effect, the best flexibility effect and the effect of matching the thinnest material with the best impedance can be achieved; finer dimensions can be selected according to practical requirements, for example, the mesh length and width dimensions of 0.1mm×0.1mm, 0.15mm×0.15mm, 0.5mm×0.5mm and 0.8mm×0.8mm can be selected, and the mesh size effect which is relatively matched with the performances of the flexible circuit board such as impedance performance, bending performance, processing reliability and aesthetic property can be realized.
It should be further noted that, in this embodiment, not only the line width and the mesh size of the mesh line can be adjusted to meet the impedance value requirement of the impedance line, but also the impedance value can be adjusted by adjusting the width of the impedance line, and in general, the wider the width of the impedance line, the smaller the impedance value, and the more stable the impedance; in the actual processing and application process, the effects of adjusting the grid line width, the grid size and the impedance line width, matching each other and comprehensively adjusting the impedance value are generally needed.
In one embodiment, a second flexible copper-clad plate is laminated on the circuit pattern layer of the pattern flexible board 100, and the processing process of laminating is performed after attaching a release film to the position area of the dielectric layer of the second flexible copper-clad plate corresponding to the golden finger pattern; as shown in fig. 3, first release films 2140 and 3140 are attached to the golden finger pattern positions included in the first circuit pattern layer 1110 and the second circuit pattern layer 1130, respectively.
The double-sided board is changed into a pseudo four-sided board due to the fact that the net-shaped circuit is manufactured, but due to the fact that the double-sided board is provided with the golden finger, when the golden finger area is processed, other layers such as a dielectric layer covered on the golden finger area are required to be removed, and the attaching release film is adopted, so that the effect of isolating the other layers covered on the golden finger from the golden finger layer can be effectively achieved, and meanwhile after the layers of the flexible circuit board are laminated, the firmness of lamination of the layers of the whole circuit board can be ensured, and the phenomenon of interlayer separation can be avoided.
Referring to fig. 4, fig. 4 is a schematic cross-sectional structure diagram of a flexible board for forming stress relief holes and a flexible board for forming shielding films according to an embodiment of the present invention; the processing procedure of fig. 4, namely, the steps S30 to S40 in fig. 1, is specifically as follows:
s30: and drilling the reticular circuit flexible board, electroplating to form a stress relief hole, and integrally forming the stress relief hole flexible board.
S40: and attaching a shielding film to the surface of the stress relief hole flexible plate to form the shielding film flexible plate.
As shown in fig. 4, the mesh-shaped circuit flexible board 200 is drilled and electroplated to form the stress relief holes 410, the stress relief holes flexible board is integrally formed, and then the first shielding film 5110 and the second shielding film 5120 are respectively attached to both surfaces of the stress relief holes flexible board to form the shielding film flexible board 300.
In one embodiment, the stress relief holes are located at two ends of the flexible board in the long direction and at a certain distance from the golden finger, and the stress relief holes are correspondingly distributed at two ends of the flexible board in the long direction;
in one embodiment, the destressing hole comprises an annular ring with a unilateral width of 50 μm to 300 μm.
Because the flexible circuit board needs to be punched in the subsequent processing process and needs lamination adhesion, the dielectric material of the flexible circuit board is Polyimide (PI) material, the material has larger internal stress, and the stress removing holes can be manufactured in the punching and post-processing processes with increased risks of easy deformation, easy pulling and the like, and the unilateral hole ring of the stress removing holes is punched in the subsequent punching process, so that the internal stress of the flexible circuit board can be better released, and the external stress of the flexible circuit board can be given to the punching cutter in the buffer cutting process; typically, the finished pore size of the destressing pores may be 0.15mm or 0.2mm or 0.3mm or 0.4mm or 0.5mm; the thickness of the copper on the inner wall after the destressing hole plating is generally 10 μm to 35 μm.
The stress relief holes are punched in a straight line in the punching process, and the stress relief holes are correspondingly distributed at two ends of the flexible circuit board instead of the flexible circuit board of the wire harness.
However, in some embodiments, if the harness flex circuit is in a bent pattern, the distribution of the stress relief holes is designed according to the specific shape, and the shape of the die cut pattern is designed.
And attaching a shielding film, namely an electromagnetic shielding film with the thickness of 30-100 mu m, to avoid the stress relief hole and the hole ring and prevent the stress relief effect and the effect of the stress relief hole from being influenced by the shielding film.
In one embodiment, after the stress relief hole flexible board is manufactured, deep-control grooving is performed along the surface of the stress relief hole flexible board corresponding to the release film region, the second flexible copper-clad plate, the release film and the cover film layer which are covered on the golden finger graph are removed, the golden finger graph is exposed, and electrical golden processing (blue-pasting glue and electrical golden) is performed on the golden finger graph to form the golden finger.
As shown in fig. 4, after the destressing flexible board is manufactured, the covering areas corresponding to the first golden finger 3210 and the second golden finger 3220 are subjected to "uncovering" processing, the processing process utilizes the depth-controlled grooving, and the mechanical depth-controlled grooving or the laser depth-controlled ablation grooving mode can be adopted for processing, after the grooving, the first release film 2140 and the second release film 3140 are respectively covered on the areas corresponding to the first golden finger 3210 and the second golden finger 3220, so that the "uncovering" layer can be removed easily to expose the golden finger graph, the blue pasting is performed on other areas of the circuit board, the areas without electric golden are covered, and the golden finger graph areas are subjected to electric golden processing to form the first golden finger 3210 and the second golden finger 3220.
As mentioned above, the double-sided board of the present embodiment is made with the mesh circuit, so that the double-sided board becomes a pseudo-four-layer board structure, so that when the golden finger is processed, the golden finger needs to be "uncovered" to expose and then electroplated to form a complete golden finger, and it is necessary to protect other areas of the board surface from being attacked by components such as grinding board and liquid medicine when the golden finger is processed; further, since the flexible circuit board also needs subsequent processing and manufacturing, blue glue or a dry film is needed to protect the golden finger in order to avoid the problems of damage to the golden finger in subsequent processing, and then the blue glue is torn off or the dry film is removed in the final finished product process; of course, a mesh circuit may be provided on one side of the double-sided board to form a pseudo three-layer board structure.
It should be noted that, in order to more clearly illustrate the specific technical content of the present embodiment, fig. 5 to 9 each use a flexible circuit board after being individually molded as an illustration, and do not affect the implementation technical process descriptions of fig. 5 to 9 for the present embodiment; in actual machining, the machining may be performed in batch form, and there may be a tool area on the edges of the plate.
Referring to fig. 5, fig. 5 is a schematic plan view of a flexible board for forming independent wire harnesses according to an embodiment of the present invention; the processing procedure of fig. 5, namely the step S50 in fig. 1, is specifically as follows:
s50: and punching the shielding film flexible board to form an independent wiring harness flexible board comprising a plurality of sub-boards which are adjacently distributed in parallel.
As shown in fig. 5, the shielding film flexible board 300 is die-cut to form an independent wire harness flexible board including a plurality of sub-boards arranged adjacently in parallel, and in this embodiment, the shielding film flexible board 300 is die-cut to form four independent wire harness flexible boards, namely, a first independent wire harness flexible board 6110, a second independent wire harness flexible board 6120, a third independent wire harness flexible board 6130, and a fourth independent wire harness flexible board 6140 in the drawing.
In one embodiment, the punching is performed by punching a slit between the two corresponding destressing holes, and the punching is performed simultaneously by punching opposite unilateral hole rings of the two opposite destressing holes.
As shown in fig. 5, a punching slit 6210 is formed by punching a slit between the corresponding pair of distressing holes 410, and when punching, the unilateral annular ring 4110 of the distressing holes is punched out.
As described above, since the polyimide sheet material of the flexible circuit board has a large internal stress and a large external stress during punching, the stress relief holes are used, and the punching process is performed between the stress relief holes which are opposite to each other, the reliability of punching the flexible circuit board can be ensured, and the stress of the circuit board can be effectively released; after punching, the formed independent wire harness flexible board can be effectively laminated during subsequent processing.
Referring to fig. 6, fig. 6 is a schematic plan view of a single-sided adhesive acetate cloth and a double-sided adhesive acetate cloth according to an embodiment of the invention; the processing procedure of fig. 6, namely the step S60 in fig. 1, is specifically as follows:
S60: and attaching single-sided adhesive acetate cloths to two ends of the independent wire harness flexible board in the long direction, and attaching double-sided adhesive acetate cloths to one surface of part of the independent wire harness flexible board.
As shown in fig. 6, a single-sided adhesive acetate cloth 7110 is attached to both ends of the individual harness flexible board in the longitudinal direction, and a double-sided adhesive acetate cloth 7120 is attached to the second individual harness flexible board 6120 and the third individual harness flexible board 6130.
In one embodiment, as shown in fig. 6, the single-sided adhesive acetate cloth 7110 is attached to two ends of the independent wire harness flexible board in the long direction, and the single-sided adhesive acetate cloth 7110 is integrally attached to the position of the stress relief hole along the intersection line of the golden finger pattern and the independent wire harness flexible board.
The acetate cloth is generally selected from acetate cloth electronic adhesive tape, has aging resistance and antistatic effects, and in this embodiment, single-sided adhesive acetate cloth and double-sided adhesive acetate cloth are required, and the thickness of the acetate cloth is usually selected to be 100 μm, 120 μm or 150 μm.
Firstly, sticking single-sided adhesive acetate cloth 7110 at two ends of a flexible circuit board to play a role in enhancing shielding to a certain extent at the two ends of the flexible circuit board, and simultaneously, protecting the flexible circuit board to a certain extent, so as to prevent the problem that the flexible circuit board may be torn from a stress relief hole when a subsequent lamination is adhered; the single-sided adhesive acetate cloth 7110 attached to the two ends of the flexible circuit board extends from the bottom end of the golden finger towards the inside of the flexible circuit board body, and can cover or partially cover the stress relief hole.
In one embodiment, the double-sided adhesive acetate cloth 7120 is attached to a part of the daughter board of the independent wire harness flexible board, and the double-sided adhesive acetate cloth 7120 is attached separately according to the width of the independent wire harness flexible board and the length of the punching seam; the distribution rule of the attached double-sided adhesive acetate cloth 7120 is that the independent wire harness flexible plates distributed from the center are attached to two ends, the surfaces of two adjacent independent wire harness flexible plates are attached, one independent wire harness flexible plate is not attached, and the surfaces of two adjacent independent wire harness flexible plates are attached.
As shown in fig. 6, the double-sided adhesive acetate cloth 7120 is attached to the second independent wire harness flexible board 6120 and the third independent wire harness flexible board 6130, the double-sided adhesive acetate cloth 7120 is not attached to the first independent wire harness flexible board 6110 and the fourth independent wire harness flexible board 6140, so that subsequent lamination adhesion of each layer is facilitated, and the double-sided adhesive acetate cloth 7120 is attached to one side of the flexible circuit board.
When attaching double-sided adhesive acetate cloth, if make in batches, can adopt the mode of machine laminating or artifical laminating, if attach two adjacent independent pencil flexible sheets, can place the flow of attaching acetate cloth before die-cut processing, after the whole double-sided adhesive acetate cloth that has been pasted, die-cut, can practice thrift processing flow and processing cost.
When a plurality of (more than or equal to 4) independent wire harness flexible boards exist, the double-sided adhesive acetate cloth can be attached to each independent wire harness flexible board in a spacing attaching mode, or the double-sided adhesive acetate cloth can be attached in a spacing mode in a mode of attaching 2 spaces 1.
Referring to fig. 7, fig. 7 is a schematic plan view of a flexible board for forming a preliminary wire harness according to an embodiment of the present invention; the processing procedure of fig. 7, namely the step S70 in fig. 1, is specifically as follows:
S70: laminating and adhering the independent wire harness flexible board which is not attached with the double-sided adhesive acetate cloth on the independent wire harness flexible board which is attached with the double-sided adhesive acetate cloth to form a primary wire harness flexible board;
as shown in fig. 7, a first independent wire harness flexible board 6110 is laminated and adhered to a second independent wire harness flexible board 6120 to form first two-layered sub-boards 6110-6120, and a fourth independent wire harness flexible board 6140 is laminated and adhered to a third independent wire harness flexible board 6130 to form third four-layered sub-boards 6130-6140 to form a preliminary wire harness flexible board 400.
The independent wire harness flexible board to which the double-sided adhesive acetate cloth 7120 is not attached is laminated and adhered on the independent wire harness flexible board to which the double-sided adhesive acetate cloth 7120 is attached, and the independent wire harness flexible board to which the double-sided adhesive acetate cloth 7120 is not attached is pulled and laminated from a middle position to the independent wire harness flexible board to which the double-sided adhesive acetate cloth 7120 is attached.
As shown in fig. 7, the flexible circuit board is subjected to harness processing, and each independent harness flexible board is laminated by using double-sided adhesive acetate cloth 7120 attached in the previous step to form a harness-like flexible circuit board; since the number of independent wire harness flexible boards is plural, the primary wire harness flexible boards are first laminated.
Referring to fig. 8, fig. 8 is a schematic plan view illustrating a circuit board for forming an integral wire harness according to an embodiment of the present invention; the processing procedure of fig. 8, namely the step S80 in fig. 1, is specifically as follows:
S80: and repeating the steps S60 to S70 until the independent wiring harness flexible boards are overlapped to form an integral wiring harness circuit board.
As shown in fig. 8, on the surface of one of the laminated first two-layer laminated sub-board 6110-6120 or the third four-layer laminated sub-board 6130-6140, double-sided adhesive acetate cloth 7120 is attached, and the first two-layer laminated sub-board 6110-6120 and the third four-layer laminated sub-board 6130-6140 are laminated to form a first two-three four-layer laminated sub-board 6110-6140, namely, the whole wiring harness circuit board 6110-6140.
And further carrying out harness processing on the flexible circuit board, so that each independent harness flexible board forms a harness structure mode.
The first independent wire harness flexible board 6110 and the second independent wire harness flexible board 6120 can be mutually wound through acetate cloth, the third independent wire harness flexible board 6130 and the fourth independent wire harness flexible board 6140 can be mutually wound through acetate cloth, and the two sub-boards after winding are further mutually wound through acetate, so that the effect of separating signals of the second independent wire harness flexible board 6120 and the third independent wire harness flexible board 6130 through acetate cloth can be achieved.
In this embodiment, the independent wire harness flexible boards on two sides are adhered to the independent wire harness flexible boards in the center, and then the adhered primary wire harness flexible boards are laminated and adhered, so that on one hand, the problems of hard bending, tearing and the like of the independent wire harness flexible boards caused by adhering scattering and non-sealing can be prevented, or the problem of distortion of circuit transmission signals caused by overlarge circuit pulling and distortion occurs, on the other hand, the distribution rationality of wiring patterns of the independent wire harness flexible boards can be improved, and the wiring patterns of the independent wire harness flexible boards can be designed to be circuit patterns with radians close to the center or circuit patterns with thicker ends and thinner centers according to the adhesion sequence of the independent wire harness flexible boards, thereby improving the lamination adhesion performance of the independent wire harness flexible boards.
Because the flexible circuit board needs harness processing, a certain distance is required to be reserved from the golden finger position to the end position of the punching gap, so that the golden finger area at the end of the flexible circuit board is given a sufficient space capable of guaranteeing flatness, and the problem of poor splicing and welding caused by bending and twisting of the golden finger area is prevented; further, reinforcement can be arranged in the golden finger area or in the golden finger-free surface of the single-sided golden finger so as to strengthen the hardness of the golden finger.
Referring to fig. 9, fig. 9 is a schematic plan view illustrating a circuit board for forming an integral wire harness according to an embodiment of the present invention; the processing procedure of fig. 9, namely the step S90 in fig. 1, is specifically as follows:
s90: and winding and wrapping the overlapped area of the integral wire harness circuit board by using single-sided adhesive acetate cloth to form the high-shielding flexible circuit board.
As shown in fig. 9, the overlapped area of the whole harness circuit board 6110-6140 is wrapped with single-sided adhesive acetate cloth 7110 to form the high shielding flexible circuit board 10.
The laminated integrated harness circuit boards 6110 to 6140 are wound with acetate cloth, and the harness flexible circuit board, namely the high-shielding flexible circuit board 10, is integrally formed.
The acetate cloth is used, so that the effects of gluing, winding and binding can be achieved, the shielding performance of the flexible circuit board can be further enhanced, and the circuit board can realize triple high-efficiency shielding layers of the net-shaped circuit, the shielding film and the acetate cloth, so that the high shielding characteristic in the true sense is formed.
In summary, it can be seen that this embodiment has adopted triple protection effect of netted circuit, shielding rete, acetate cloth to adopt acetate cloth to adhere flexible circuit board stromatolite formation similar flexible circuit board + intermediate product mode of pencil, form a novel replacement flexible circuit board and also replace the novel product of pencil simultaneously, and the processing degree of difficulty is relative multilayer flexible circuit board, multilayer layering flexible circuit board is low, and product reliability is high, and the processing cost is low, and the flexibility of application is high.
It should be noted that, because different designs, processing and application situations of the flexible circuit board exist in the actual processing and application processes, the drawing of the embodiment is only used as an implementation process for illustrating the embodiment, and does not represent the dimension proportion of the actual product or the drawing of the equal scale enlargement according to the actual situation.
The foregoing description is only of the preferred embodiments of the present invention and is not intended to limit the scope of the invention, and all equivalent structural changes made by the description of the present invention and the accompanying drawings or direct/indirect application in other related technical fields are included in the scope of the invention.
Claims (10)
1. The manufacturing method of the high-shielding flexible circuit board is characterized by comprising the following steps of:
S10: a flexible copper-clad plate is taken, a circuit pattern layer is manufactured on the flexible copper-clad plate, and a pattern flexible plate is formed;
s20: pressing a second flexible copper-clad plate on the circuit pattern layer of the pattern flexible plate, wherein the second flexible copper-clad plate comprises a circuit dielectric layer and a circuit copper layer, and the circuit dielectric layer is covered on the circuit pattern layer; carrying out graphic processing on the circuit copper layer to form a net-shaped circuit, and attaching a covering film layer on the second flexible copper-clad plate to form a net-shaped circuit flexible board;
s30: drilling the reticular circuit flexible board, electroplating to form a stress relief hole, and integrally forming the stress relief hole flexible board;
s40: attaching a shielding film to the surface of the stress relief hole flexible plate to form a shielding film flexible plate;
s50: punching the shielding film flexible board to form an independent wiring harness flexible board comprising a plurality of sub-boards which are adjacently distributed in parallel;
S60: attaching single-sided adhesive acetate cloths to two ends of the independent wire harness flexible board in the long direction, and attaching double-sided adhesive acetate cloths to one surface of part of the independent wire harness flexible board;
S70: laminating and adhering the independent wire harness flexible board which is not attached with the double-sided adhesive acetate cloth on the independent wire harness flexible board which is attached with the double-sided adhesive acetate cloth to form a primary wire harness flexible board;
S80: repeating the steps S60 to S70 until the independent wiring harness flexible boards are overlapped to form an integral wiring harness circuit board;
s90: and winding and wrapping the overlapped area of the integral wire harness circuit board by using single-sided adhesive acetate cloth to form the high-shielding flexible circuit board.
2. The method for manufacturing a high-shielding flexible circuit board according to claim 1, wherein the manufacturing of a circuit pattern layer on the flexible copper clad laminate further comprises manufacturing a golden finger pattern, wherein the golden finger pattern is positioned at two ends of the pattern flexible board in the long direction;
And pressing a second flexible copper-clad plate on the circuit pattern layer of the pattern flexible plate, and further comprising attaching a release film to a position area of the dielectric layer of the second flexible copper-clad plate corresponding to the golden finger pattern, and then performing the pressing and coating processing process.
3. The method of manufacturing a high shielding flexible circuit board according to claim 2, wherein after the stress relief hole flexible board is manufactured, deep-control grooving is performed along the surface of the stress relief hole flexible board corresponding to the release film region, the second flexible copper-clad plate, the release film and the cover film layer covered on the golden finger pattern are removed, the golden finger pattern is exposed, and electrical gold processing is performed on the golden finger pattern to form the golden finger.
4. The method for manufacturing a high-shielding flexible circuit board according to claim 2, wherein the stress relief holes are positioned at two ends of the flexible board in the longitudinal direction and at a certain distance from the golden finger, and the stress relief holes are correspondingly distributed at two ends of the flexible board in the longitudinal direction;
And the punching is to perform punching processing along the two opposite stress relief holes, and the opposite unilateral hole rings of the two opposite stress relief holes are punched and cut at the same time.
5. The method for manufacturing a high shielding flexible circuit board according to claim 4, wherein said attaching a double-sided adhesive acetate cloth to a portion of said daughter board of said individual harness flexible board is according to the width of said individual harness flexible board and the length of a portion of said seam punch, and said double-sided adhesive acetate cloth is attached separately;
The distribution rule of the attached double-sided adhesive acetate cloth is that the independent wire harness flexible plates distributed from the center are attached to two ends, the surfaces of two adjacent independent wire harness flexible plates are attached, one independent wire harness flexible plate is not attached, and the surfaces of the two adjacent independent wire harness flexible plates are attached;
And the independent wire harness flexible board not attached with the double-sided adhesive acetate cloth is adhered to the independent wire harness flexible board attached with the double-sided adhesive acetate cloth in a lamination manner, and the independent wire harness flexible board not attached with the double-sided adhesive acetate cloth is pulled from the middle position to the independent wire harness flexible board attached with the double-sided adhesive acetate cloth and is adhered in a lamination manner.
6. The method for manufacturing a high shielding flexible circuit board according to claim 1, wherein the single-sided adhesive acetate cloth is attached to both ends of the individual harness flexible board in the longitudinal direction, and the single-sided adhesive acetate cloth is integrally attached to the positions of the stress relief holes along the intersection line of the golden finger pattern and the individual harness flexible board.
7. The method of claim 1, wherein said mesh-like circuit covers the surface of said patterned flexible board except for said golden finger pattern.
8. The method of manufacturing a high shielding flexible circuit board according to claim 1, wherein the mesh-shaped circuit has a circuit width of 0.1mm to 2.0mm.
9. The method of manufacturing a high shielding flexible circuit board as claimed in claim 1, wherein the mesh length of the mesh wire multiplied by the mesh width of the mesh wire is 0.1mm x 0.1mm to 2.0mm x 2.0mm.
10. The method of manufacturing a high shielding flexible circuit board as defined in claim 1, wherein said stress relief hole comprises an annular ring having a single-sided width of 50 μm to 300 μm.
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|---|---|---|---|---|
| KR100907353B1 (en) * | 2008-07-18 | 2009-07-10 | 한화엘앤씨 주식회사 | Electromagnetic shielding film for flexible printed circuit board, shielded fpcb and method for manufacturing shielded fpcb |
| CN114206008A (en) * | 2021-12-16 | 2022-03-18 | 深圳市实锐泰科技有限公司 | Manufacturing method of thick copper flexible board and thick copper flexible board |
| CN114390793A (en) * | 2021-12-16 | 2022-04-22 | 深圳市实锐泰科技有限公司 | Manufacturing method of high-shielding flexible board and high-shielding flexible board |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| KR100907353B1 (en) * | 2008-07-18 | 2009-07-10 | 한화엘앤씨 주식회사 | Electromagnetic shielding film for flexible printed circuit board, shielded fpcb and method for manufacturing shielded fpcb |
| CN114206008A (en) * | 2021-12-16 | 2022-03-18 | 深圳市实锐泰科技有限公司 | Manufacturing method of thick copper flexible board and thick copper flexible board |
| CN114390793A (en) * | 2021-12-16 | 2022-04-22 | 深圳市实锐泰科技有限公司 | Manufacturing method of high-shielding flexible board and high-shielding flexible board |
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