JP2001217045A - Connector having built-in emc function - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide an EMC built-in connector which has an EMC function built in without enlarging the outside dimension of the connector. SOLUTION: A connector structure comprises an insulting substrate 1, of which on one surface plural spiral-shape flat coils 20 are disposed, and a connector pin 10 is connected to one end of each plane coil as a contact maker and at the other end of each plane coil 20 a wire 51 of a wire cable 50 is connected respectively, and both sides of the flat coil 20 are covered with a complex magnetic substance 30, and at least the above insulating substrate 1 having the above flat coil 20 is covered with a connector case as a package case.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a connector to be attached to an end of a multi-core signal cable for signal transmission, and more particularly to an EMC without increasing the external dimensions of the connector.
The present invention relates to an EMC function built-in connector having a built-in function.

[0002]

2. Description of the Related Art Conventionally, EMC (electromagnetic) of a connector or a wire cable connected to various electronic devices has been known.
The following configurations are known as compatibility) measures.

(1) A clamp filter is installed on a cable near a connector (JP-A-7-282906).

(2) At least a part of the housing of the connector is made of a magnetic material or a composite magnetic material.
JP-A-16640, JP-A-7-282906,
JP-A-7-254457, JP-A-5-23464
No. 3).

(3) Individual components such as a coil, a capacitor, a common mode choke coil, and a T-type filter are connected to each pin of the connector and housed in a housing (Japanese Patent Laid-Open No. 8-84).
No. 124, JP-A-5-29042, JP-A-5-29042
-234643).

(4) A coil is provided on the circuit board side on which the connector is mounted, and the circuit component and the connector-side connection terminal are connected through the coil (Japanese Patent Laid-Open No. Hei 10-242892).

[0007]

By the way, in the structure of the above (1), the clamp filter is constituted by a one-turn circuit, and in order to obtain a predetermined inductance value, a high permeability material is used as the magnetic core. And the thickness of the magnetic core must be increased. As a result, the overall volume is increased, the high magnetic permeability material is used, so the high frequency characteristics are inferior.
There are problems such as the need for a space for cable routing, difficulty in handling, and an increase in the number of steps for molding the resin cover on the core.

In the configuration of the above (2), the filter portion is constituted by a one-turn circuit, and if the size of the connector is the same as that of the conventional one, the volume of the magnetic material to be used is not sufficient, and the inductance is not sufficient. Value is small. Because of this,
In the low frequency region, the impedance is small and the performance is inferior. Conversely, if a design is performed to obtain a sufficient inductance value, the size of the entire connector will be greatly increased.

In the above configuration (3), an air-core coil is used when high-frequency characteristics are important for individual inductance components, and a magnetic core of a high magnetic permeability material is used when low-frequency regions are valued. In this case, the filter function can be housed inside the housing with the overall size of the connector being the same as the conventional size.
However, in order to obtain good impedance characteristics in a wide frequency range from low frequency to high frequency, it is necessary to use a low magnetic permeability material. Not enough body volume,
Low inductance value. Therefore, in a low frequency region, the impedance is small and the performance is inferior. Conversely, if a design is performed to obtain a sufficient inductance value, the size of the entire connector will be greatly increased.

The configuration (4) is a countermeasure against noise on the circuit board side of the electronic device, and may require a coil arrangement space on the circuit board side.

[0011] A first object of the present invention is to solve the above problems,
An object of the present invention is to provide an EMC function built-in connector having a built-in EMC function without increasing the external dimensions of the connector.

A second object of the present invention is to provide a connector with a built-in EMC function capable of realizing good filter characteristics in a wide frequency range from a low frequency range to a high frequency range of 100 MHz or more at the same size and price as the conventional connector. To provide.

Other objects and novel features of the present invention will be clarified in embodiments described later.

[0014]

In order to achieve the above object, according to the first aspect of the present invention, a plurality of spiral planar coils are arranged on at least one surface of an insulating substrate, and a contact is provided at one end of each planar coil. The planar coil was connected to each other, and the other end of each planar coil was connected to a wire of a wire cable. Both sides of the planar coil were covered with a composite magnetic material, and at least the insulating substrate provided with the planar coil was covered with an exterior body. It is characterized by:

According to a second aspect of the present invention, in the first aspect, the insulating substrate is a composite magnetic substrate.

According to a third aspect of the present invention, in the second aspect, the composite magnetic substrate also serves as the composite magnetic body that covers one side of the planar coil.

According to a fourth aspect of the present invention, in the second aspect, a plurality of the planar coils are arranged on both sides of the composite magnetic substrate, and both sides of the composite magnetic substrate are covered with the composite magnetic material. Features.

According to a fifth aspect of the present invention, in the first, second or third aspect, the arrangement pitch of the planar coils substantially matches the arrangement pitch of the contacts.

According to a sixth aspect of the present invention, in the fourth aspect, the arrangement pitch of the planar coils is substantially twice as large as the arrangement pitch of the contacts.

According to a seventh aspect of the present invention, in the fourth aspect, a conductor layer is formed at an intermediate portion in a thickness direction of the composite magnetic substrate.

The invention of claim 8 of the present application is directed to claims 1, 2,
3, 4, 5, 6, or 7, wherein the planar coil is formed by serially connecting a plurality of spiral conductive patterns provided on the insulating substrate.

According to a ninth aspect of the present invention, in the first, fifth or eighth aspect, a hole is formed in a portion of the insulating substrate corresponding to a central portion of the planar coil, and the composite magnetic body is formed inside the hole. Is present.

The invention of claim 10 of the present application is directed to claims 1, 2,
3, 4, 5, 6, 7, 8, or 9, wherein the mounting base of the contact and the planar coil are covered with a mold of the composite magnetic body.

The invention of claim 11 of the present application is directed to claims 1 to 1
0, wherein the composite magnetic body also serves as part or all of the exterior body.

The twelfth aspect of the present invention provides the first to first aspects.
In any one of the first to fifth aspects, the composite magnetic body has a combination structure of a plurality of composite magnetic bodies having different magnetic properties.

The invention of claim 13 of the present application is directed to claims 1 to 1
2. In any one of the above items 2, the cross section of the spiral conductor of the planar coil has a mushroom shape, and the width of the head (L) and the width of the neck (N) satisfy the relationship of L> 1.2N. It is characterized by.

[0027] The invention of claim 14 of the present application is the invention of claims 1 to 1
2. In any one of (2), when the cross-sectional shape of the spiral conductor of the planar coil is H> 0.7D and G <G when the conductor height is H, the conductor width is D, and the conductor interval is G,
1.5H 2.

The invention of claim 15 of the present application is directed to claims 1 to 1
4. In any one of the aspects 4, the planar coils connected to at least one pair of the contacts are mutually coupled to form a common mode choke.

[0029] The invention of claim 16 of the present application is directed to claims 1 to 1
5. In any one of the aspects 5, a short ring or a ground pattern for reducing crosstalk is formed on the insulating substrate between the planar coils.

[0030]

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS An embodiment of a connector with a built-in EMC function according to the present invention will be described below with reference to the drawings.

FIGS. 1 to 6 show an EMC according to the present invention.
A first embodiment of a connector with a built-in function will be described. FIG.
As shown in FIG. 2 and the overall configuration of FIG. 2, the connector with the EMC function includes an insulating substrate 1, a number of metal connector pins 10 as contacts mounted on the insulating substrate 1, and an arrangement of the connector pins 10. A plurality of spiral planar coils 20 arranged and formed on the insulating substrate 1 in an array (one row) so as to substantially match the pitch (for example, 4 mm), and a composite magnetic body 30 covering both sides of each planar coil 20 And a connector case 40 as an exterior body covering the insulating substrate 1 provided with the planar coil 20 and the composite magnetic body 30. In the illustrated example, the connector pins 10 are arranged at equal intervals, and the arrangement pitches of the planar coils 20 are also equal according to this. Good.

As shown in FIGS. 5 and 6, the insulating substrate 1
Spiral planar coil 20 formed and adhered to
FIG. 5A and FIG. 6A show the spiral conductive pattern 21 on the front side (that is, the first layer) of the insulating substrate 1.
6B, the spiral conductor pattern 22 on the back side (that is, the second layer) of the substrate 1 in FIG. 6B is connected in series via a through hole 23 penetrating the substrate 1. One end of the spiral-shaped conductor patterns 21 and 22 connected in series is connected to a connector pin mounting conductor land (square conductor pattern) 24, and the other end is connected to a wire cable connection conductor land (square conductor pattern) 25. ing.
The conductor lands 24 on the upper and lower surfaces of the substrate 1 are connected to each other by through holes 26, and the conductor lands 25 are similarly connected to each other by through holes 27. FIG.
6 (B) and FIG. 6 (B) show the conductor pattern on the back side seen through from the front side.

The insulating substrate 1 may be any insulating substrate, such as an alumina substrate, a machineable ceramic substrate,
A paper phenol board, a glass epoxy board, a BT resin board, etc. are mentioned. Among them, a material for a printed board such as a glass epoxy board is preferable in consideration of cost and workability. The thickness of the substrate is preferably as thin as possible within a range that does not adversely affect handling and reliability, because the inductance value increases. For example, 0.2mm thick FR
There are four substrates.

The spiral conductor patterns 21 and 22 and the conductor lands 24 and 25 are formed by a subtractive method, a pattern plating method, or the like, which is an ordinary method for forming a printed circuit board.
For example, a high aspect plating method disclosed in Japanese Patent Application Laid-Open No. 11-204361, and a laminating method in the case of a heat-resistant substrate such as alumina may be used.

As shown in FIGS. 1 to 4, a large number of connector lands 24 are arranged and formed on the insulating substrate 1.
The connector pins 10 are electrically and mechanically connected to each other, and similarly, a multi-core wire cable 50 is
Are connected. Each connector pin 10 is mechanically supported by a connector case 40 as an exterior body,
The wire cable 50 is drawn out behind the connector case 40.

The method for joining the conductor lands 24 and 25 of the substrate 1 to the connector pins 10 and the wires 51 includes a soldering method, a welding method, and a bonding method using a conductive adhesive.

As shown in FIG. 2 and FIG. 4, the composite magnetic body 30 is formed integrally with the insulating substrate 1 by molding of a composite magnetic material to have a thickness of about 6 to 8 mm on both upper and lower sides. The composite magnetic material is made of Ni as a binder such as a liquid crystal polymer or an epoxy resin.
A mixture of 30 wt% (wt%) to 70 wt% of magnetic powder such as Zn-based ferrite or MnZn-based ferrite, or metallic magnetic powder such as carbonyl iron, permalloy, etc.
There is a mixture of 0 wt% to 70 wt%. When importance is placed on the insulation between the connector pins 10, a material having a large specific resistance of the magnetic powder itself, such as NiZn ferrite, is used or the mixing ratio of the magnetic powder is reduced. In addition, planar coil 2
It is also preferable that after forming a thin insulating layer of about 10 μm with an epoxy resin or the like on the conductor pattern of No. 0, the composite magnetic body 30 is molded.

It is preferable that the mold of the composite magnetic body 30 be as thick as possible as long as it can enter the housing of the connector case 40. The thicker the mold, the higher the inductance of the coil and the higher the impedance at each frequency. It is known that increasing the volume of the composite magnetic body 30 increases the effect of removing noise.

According to the first embodiment, the following effects can be obtained.

(1) The spiral planar coil 20 is formed on the insulating substrate 1 to which the connector pins 10 are fixed, so that the EMC of the connector can be increased without increasing the external dimensions of the connector.
Built-in functions.

(2) The number of windings can be increased by employing the spiral planar coil 20, and the composite magnetic body 30 formed by mixing ferrite magnetic powder or metal-based magnetic powder into a binder and molding the same is used as the planar coil 20. Since it is provided on both sides so as to sandwich it, a necessary and sufficient inductance value can be secured without using a high magnetic permeability material such as sintered ferrite, thereby improving impedance characteristics in a low frequency region.

(3) In addition, since a low-permeability material is used, the impedance characteristics in a high-frequency region are good.
Good filter characteristics can be obtained in a wide frequency range up to a high frequency range of 100 MHz or more.

(4) Since the composite magnetic material is used, the shape of the composite magnetic body 30 can be freely set, and a coil having a large inductance value can be effectively placed in the small connector by effectively utilizing the space in the connector case 40. Can be created.

(5) As the insulating substrate, an inexpensive substrate such as a glass epoxy substrate can be used, and the composite magnetic material is also inexpensive, so that the connector as a whole can be provided at the same price as the conventional connector. That is, the features (1) to (4) can be realized at the same cost as the conventional product.

In the first embodiment, a hole 28 shown by an imaginary line in FIG. 6 is formed in a portion of the insulating substrate corresponding to the central portion of the planar coil 20. 30 may be provided. That is, the hole 28 is provided in the insulating substrate at the center of the spiral conductor patterns 21 and 22, and the inside of the hole is also molded with a composite magnetic material to form the composite magnetic body 30. Thereby, the inductance of the planar coil 20 can be further increased. Preferably, the hole 28 is as large as space permits.

FIG. 7 shows a second embodiment of the present invention.
In this case, the arrangement interval of the connector pins 10 is narrower than that of the first embodiment (for example, the arrangement interval is 1.2 m).
m). The upper spiral conductive pattern 21A of a large number of spiral planar coils 20A formed on the insulating substrate 1 has a shape in which the widthwise direction is somewhat reduced. Although not shown, the same applies to the lower spiral conductive pattern.
Other configurations are the same as those of the first embodiment, and the same or corresponding portions are denoted by the same reference characters and description thereof is omitted.

In the second embodiment, it is possible to cope with the case where the arrangement pitch of the connector pins 10 is narrow by devising the shape of the spiral planar coil 20A. Other functions and effects are the same as those of the first embodiment.

FIGS. 8 and 9 show a third embodiment of the present invention. In this case, the insulating substrate is composed of the composite magnetic substrate 2. The spiral planar coil 60 has a two-layer structure on one side of the composite magnetic substrate 2. That is, as shown in FIG.
Numeral 0 indicates that the lower spiral conductive pattern 62 is connected in series with the spiral conductive pattern 61 laminated thereon via the interlayer insulating film 66 via a through hole 63 penetrating the interlayer insulating film 66. . One end of the spiral-shaped conductor patterns 61 and 62 connected in series is connected to a connector pin mounting conductor land (square conductor pattern) 64, and the other end is connected to a wire cable connection conductor land (square conductor pattern) 65. ing.

The interlayer insulating film 66 may be formed by exposing and developing a through hole by using, for example, a photosensitive insulating resin (photosensitive resist) or by performing through hole processing by laser processing.

The composite magnetic body 30 is molded over one surface of the composite magnetic substrate 2 so as to sandwich the plane coil 60 from both sides together with the composite magnetic substrate 2. Here, the composite magnetic substrate 2 also serves as a composite magnetic material that covers one side of the planar coil 60. The composite magnetic substrate 2 is, for example, a substrate obtained by impregnating a base material such as a glass cloth with the same composite magnetic material as that used for the composite magnetic body 30. It is desirable that the thickness of the substrate 2 be as large as possible within a range that can be accommodated in the housing of the connector case, because the inductance of the coil can be increased and the noise removing effect can be improved.

The connector pins 10 are electrically and mechanically connected to the connector pin mounting conductor lands 64 formed and arranged on the composite magnetic substrate 2.
Each wire 51 of the multi-core wire cable is connected to the wire cable connection conductor lands 65 formed and arranged in a large number.

The other configuration is the same as that of the first embodiment described above, and the same or corresponding portions are denoted by the same reference characters and description thereof is omitted.

In the third embodiment, the composite magnetic substrate 2 is used as an insulating substrate, and the composite magnetic substrate 2 also serves as a composite magnetic material that covers one side of the planar coil 60. Therefore, the configuration can be simplified. it can. Other functions and effects are the same as those of the first embodiment.

FIGS. 10 to 12 show a fourth embodiment of the present invention, and show a structure suitable for a case where the arrangement pitch of the connector pins 10 is narrow. In this case, the spiral planar coil 70 on the upper surface of the composite magnetic substrate 2 as an insulating substrate
Are approximately twice as large as the arrangement pitch of the connector pins 10. For this reason, the spiral planar coil 70 on the upper surface of the substrate is connected to every other connector pin 10, and the number of coils is insufficient. Therefore, a similar spiral planar coil 8 is also provided on the lower surface of the composite magnetic substrate 2.
0 is shifted and arranged by one arrangement pitch of the connector pins 10 so as to be connected to the remaining connector pins 10.

One spiral planar coil 70 is formed on one surface of the composite magnetic substrate 2 in a two-layer structure. That is, as shown in FIG.
Numeral 0 indicates that the lower spiral conductive pattern 72 is connected in series with the spiral conductive pattern 71 laminated thereon via an interlayer insulating film 76 via a through hole 73 penetrating the interlayer insulating film 76. . FIG. 12 (A)
Spiral conductor pattern 7 connected in series like
One end of each of the first and second conductors 72 is connected to a conductor land (square conductor pattern) 74 for mounting a connector pin, and the other end is connected to a conductor land (square conductor pattern) 75 for connecting a wire cable.

The other spiral planar coil 80 is formed in a two-layer structure on the other surface of the composite magnetic substrate 2. That is, the spiral planar coil 80 is formed by connecting the lower spiral conductive pattern 82 and the spiral conductive pattern 81 laminated thereon via the interlayer insulating film 86 via the through hole 83 penetrating the interlayer insulating film 86 in series. Connected to. One end of the spiral conductor patterns 81 and 82 connected in series as shown in FIG. 12B is a conductor land (square conductor pattern) 8 for mounting a connector pin.
4 and the other end is connected to a wire cable connection conductor land (square conductor pattern) 85. In addition,
Connector pin mounting conductor land (square conductor pattern) 8
4 is connected to an upper land 74, and a wire cable connecting conductor land (square conductor pattern) 85 is connected to an upper land 75.

The interlayer insulating films 76 and 86 may be formed by exposing and developing, for example, a photosensitive insulating resin (photosensitive resist) to form through holes, or may be formed by laser processing.

The composite magnetic body 30 is molded on both sides of the composite magnetic body substrate 2 so as to cover the planar coils 70 and 80, respectively. That is, as shown in FIG. 11, both sides of the planar coil 70 are covered with the upper composite magnetic body 30 and the composite magnetic substrate 2, and both sides of the planar coil 80 are covered with the lower composite magnetic body 30 and the composite magnetic substrate 2. And will be covered with. Here, the thickness of the composite magnetic substrate 2 is set to increase the noise removing effect and to increase the planar coils 70 and 80 on the front and back.
In order to reduce or prevent crosstalk between them, a thicker one is preferable.

The other structure is the same as that of the first embodiment described above, and the same or corresponding parts are denoted by the same reference characters and description thereof is omitted.

According to the fourth embodiment, the planar coil 70 is disposed on one surface of the composite magnetic substrate 2 at an arrangement pitch substantially twice the arrangement pitch of the connector pins 10, and the planar coil 80 is similarly disposed on the other side. Connector pin 1
Even when the arrangement pitch of 0s is narrow (for example, 2 mm), a coil having a sufficiently large spiral conductor pattern can be obtained, and there is an advantage that a sufficient inductance can be secured. Other functions and effects are the same as those of the first embodiment.

FIGS. 13 and 14 show a fifth embodiment of the present invention. In this case, the arrangement pitch of the spiral planar coils 70 on the upper surface of the composite magnetic substrate 2 as the insulating substrate is substantially twice the arrangement pitch of the connector pins 10, and similarly, the arrangement of the spiral planar coils 80 on the lower surface of the substrate. The pitch is also about twice the arrangement pitch of the connector pins 10. Then, a conductor layer 5 is formed at an intermediate portion in the thickness direction of the composite magnetic substrate 2. The conductor layer 5 can be formed by inserting a metal foil into the composite magnetic substrate 2 or the like. Any material can be used for the metal foil as long as the specific resistance is low, and examples thereof include aluminum, stainless steel, copper, gold, and silver. Among them, copper is preferable in consideration of price and specific resistance.

In this case, since it is difficult to form a connection through-hole penetrating the composite magnetic substrate 2, FIG.
The connector pins 10 and the multi-core wire cable are connected to the upper connector pin mounting conductor land (square conductor pattern) 74 and the upper wire cable connection conductor land (square conductor pattern) 75 connected to the upper plane coil 70 of the substrate. The wires 51 are connected and fixed. FIG.
The connector pins 10 and the conductor lands (square conductor pattern) 84 for attaching lower connector pins and the conductor lands (square conductor pattern) 85 for connecting a lower wire cable which are connected to the planar coil 80 on the lower side of the board in FIG. The wires 51 of the multi-core wire cable are connected and fixed, respectively.

The other structure is the same as that of the first embodiment, and the same or corresponding parts are denoted by the same reference characters and description thereof will not be repeated.

In the fifth embodiment, the conductor layer 5 is provided in the middle of the composite magnetic substrate 2 in the thickness direction.
Crosstalk between the upper and lower coils can be prevented. Other functions and effects are the same as those of the first embodiment.

FIGS. 15 and 16 show a sixth embodiment of the present invention. In this case, the composite magnetic body 31 covering both sides of the insulating substrate 1 provided with the planar coil 20 is connected to the connector pin 10.
Of the connector and constitutes a part of the exterior body of the connector. The connection side of the insulating substrate 1 to the wire cable 50 is a connector case 41 integrated with the composite magnetic body 31.
Covered with.

Here, the composite magnetic body 31 may have substantially the same composition as the composite magnetic body 30 in the first embodiment. However, since the composite magnetic body 31 also serves as an exterior body, strength is required, and the content of the magnetic powder is reduced. Is desirably reduced to some extent.

The other structure is the same as that of the first embodiment described above, and the same or corresponding portions are denoted by the same reference characters and description thereof is omitted.

In the sixth embodiment, a part of the exterior body of the connector can be constituted by the composite magnetic body 31, and the outer dimensions can be further reduced.

FIGS. 17 and 18 show a seventh embodiment of the present invention. In this case, the composite magnetic body 32 covering both sides of the insulating substrate 1 provided with the planar coil 20 is connected to the connector pin 10.
Of the connector and the connecting portion of the wire cable 50, and constitutes an outer package of the connector.

Here, the composite magnetic body 32 may have the same composition as the composite magnetic body 30 in the first embodiment. However, since the composite magnetic body 32 also serves as an outer package, strength is required, and the content of the magnetic powder is reduced. It is desirable to lower to some extent.

The other structure is the same as that of the first embodiment, and the same or corresponding parts are denoted by the same reference characters and description thereof will be omitted.

In the seventh embodiment, since the entire connector outer body is made of the composite magnetic body 32, the outer dimensions can be further reduced. In addition, the composite magnetic material 3
By increasing the volume of 2, the noise reduction effect can be improved.

When the present invention is applied to an actual connector product, which structure of the first, sixth or seventh embodiment is adopted is determined in consideration of the shape and cost of the connector. For example, in the case of a connector having a narrow arrangement of connector pins, the case where the entire exterior body shown in the seventh embodiment is made of a composite magnetic body has an increased inductance value and good impedance characteristics can be obtained.

FIG. 19 shows an eighth embodiment of the present invention. In this case, the composite magnetic body 33 covering one side of the insulating substrate 1 provided with the planar coil 20 and the composite magnetic body 34 covering the other side have different magnetic characteristics. Examples of the types of composite magnetic materials that can be used for molding the composite magnetic bodies 33 and 34 include the following.

Composite magnetic material 1: A mixed material of ferrite powder and epoxy resin.
Using Mn-Mg-Zn ferrite powder, Mn-Zn ferrite powder, Ni-Zn ferrite powder, etc.
i = 3.5 (powder addition amount 68 wt%).

Composite magnetic material 2: Mixed material of flat powder of carbonyl iron and epoxy resin, magnetic permeability μi = 8.0
(Addition amount of powder: 80 wt%).

Composite magnetic material 3: A mixed material of flat Si-Fe powder and epoxy resin, having a magnetic permeability μi = 20.0
(Amount of powder added: 72 wt%). By combining two of these composite magnetic materials 1 to 3, the peak frequency of the impedance-frequency characteristic can be adjusted,
Alternatively, the peak can be shifted to widen the band.

The other constructions and functions and effects are the same as those of the first embodiment, and the same or corresponding parts are denoted by the same reference characters and description thereof is omitted.

FIG. 20 shows a ninth embodiment of the present invention. In this case, the composite magnetic body 35 covering the inside of the front and back surfaces of the insulating substrate 1 provided with the planar coil 20 and the composite magnetic body 36 covering the outside of the composite magnetic body 35 have different magnetic characteristics. Examples of the types of composite magnetic materials that can be used for the molds of the composite magnetic bodies 35 and 36 include the composite magnetic materials 1 to 3 described in the eighth embodiment, for example. By combining the two, the peak frequency of the impedance-frequency characteristic can be adjusted or the peak can be shifted to achieve a wider band.

The other structure and operation and effect are the same as those of the first embodiment, and the same or corresponding portions are denoted by the same reference characters and description thereof is omitted.

In the eighth or ninth embodiment, three or more kinds of composite magnetic materials may be combined and molded around the plane coil.

FIG. 21 shows a tenth embodiment of the present invention. In this case, among the planar coils arranged in an array on the insulating substrate 1, the planar coils of the power line and the ground line, which form a pair adjacent to each other, are mutually coupled to form the common mode choke 90. A pair of parallel wound spiral planar coils 91A, constituting a common mode choke 90 attached and formed on the insulating substrate 1,
Reference numeral 91B denotes spiral conductor patterns 92A and 92B on the front side (that is, the first layer) of the insulating substrate 1 in FIG. 21A and the spiral conductor patterns on the back side (that is, the second layer) of the substrate 1 in FIG. 21B. The patterns 93A and 93B are connected in series via through holes 96A and 96B penetrating the substrate 1. One end of the spiral-shaped conductor patterns 92A and 93A connected in series is connected to a connector pin mounting conductor land (square conductor pattern) 94A, and the other end is a wire cable connection conductor land (square conductor pattern) 9.
5A. Similarly, one ends of the spiral-shaped conductor patterns 92B and 93B connected in series are connected to a connector pin mounting conductor land (square conductor pattern) 94B, and the other end is a wire cable connection conductor land (square conductor pattern) 95B. Connected to The conductor lands on the upper and lower surfaces of the substrate 1 are mutually connected by through holes 97.

The other configuration is the same as that of the first embodiment described above, and the same or corresponding portions are denoted by the same reference characters and description thereof is omitted.

In the tenth embodiment, the common mode noise can be suppressed by forming the common mode choke 90 having a double spiral pattern in a power supply line or the like where common mode noise is likely to occur. Further, since the common mode choke 90 can be constituted by the patterns on the front and rear surfaces of the substrate, it can be manufactured at low cost. Other functions and effects are the same as those of the first embodiment.

FIG. 22 shows an eleventh embodiment of the present invention. In this case, among the planar coils arranged in an array on the insulating substrate 1, the planar coils of the power line and the ground line, which form a pair next to each other, are mutually coupled to form the common mode choke 100. Insulating substrate 1 is 3
22A. One spiral planar coil 101A of the common mode choke 100 is a conductor pattern of the first layer shown in FIG.
The other spiral planar coil 101B of the common mode choke 100 is respectively formed by the conductor pattern of the second layer of (B), and both coils 101A and 101B are mutually overlapped and coupled by a spiral pattern symmetrical with respect to the interlayer insulating film. It is supposed to.

One end of the coil 101A is connected to a conductor land (square conductor pattern) 104A for mounting a connector pin, and the other end is connected to a conductor for wire cable connection via a through hole 102A and a lead conductor 103A of FIG. 22C. It is connected to a land (square conductor pattern) 105A.
Similarly, one end of the coil 101B is connected to a conductor land (square conductor pattern) 104B for mounting a connector pin, and the other end is connected to a conductor for wire cable connection via a through hole 102B and a lead conductor 103B of FIG. 22C. It is connected to a land (square conductor pattern) 105B.

The other planar coil 20 is obtained by the conductor patterns of the first and second layers.

The conductor pattern of the first layer in FIG.
For example, on the upper surface of the insulating substrate 1, the second-layer conductive pattern may be formed on the intermediate layer of the insulating substrate 1, and the third-layer conductive pattern may be formed on the back surface of the insulating substrate 1, respectively. Alternatively, when a composite magnetic substrate is used, a first layer, a second layer, and a third layer conductor pattern may be formed on the substrate via an interlayer insulating film.

The other configuration is the same as that of the first embodiment, and the same or corresponding parts are denoted by the same reference characters and description thereof will be omitted.

According to the eleventh embodiment, the common mode noise can be suppressed by forming the common mode choke 100 on a power supply line or the like where common mode noise is likely to occur. This common mode choke 100 is the common mode choke 9 of the tenth embodiment.
A coupling coefficient higher than 0 can be achieved, but is expensive due to the addition of one conductor layer. Which one to use is determined based on a balance between the magnitude of the common mode noise and the cost. The other operation and effects are the same as those of the first embodiment.

FIG. 23 shows a twelfth embodiment of the present invention. In this case, short rings 110 are respectively attached and formed between the planar coils 20 arranged and formed in an array on the insulating substrate 1. In this example, the short ring 110 is provided on both the conductor pattern on the front side of the substrate in FIG. 23A and the conductor pattern on the back side of the substrate in FIG.

The other configuration is the same as that of the first embodiment described above, and the same or corresponding portions are denoted by the same reference characters and description thereof is omitted.

As in the twelfth embodiment, the coil 20
When the short ring 110 is formed therebetween, a current that generates a magnetic flux in the opposite direction with the same magnitude as the magnetic flux passing through the short ring is induced in the short ring, so that the magnetic field between the coils can be canceled. Note that the short ring 110 may be formed on at least one conductor layer, and may be formed on a plurality of conductor layers. Other functions and effects are the same as those of the first embodiment.

FIG. 24 shows a thirteenth embodiment of the present invention. In this case, ground patterns 115 are respectively attached and formed between the planar coils 20 arranged and formed in an array on the insulating substrate 1. In this example, FIG.
The ground pattern 115 is provided on both the conductor pattern on the front side of the substrate and the conductor pattern on the back side of the substrate in FIG. Each ground pattern 115 is a conductor land (square conductor pattern) 24 for mounting a connector pin for a ground line.
G, wire cable connecting lands 25G.

The other structure is the same as that of the first embodiment, and the same or corresponding parts are denoted by the same reference characters and description thereof is omitted.

In the thirteenth embodiment, since the ground pattern 115 is provided between the coils 20, the coupling between adjacent coils can be reduced. Other functions and effects are the same as those of the first embodiment.

FIG. 25 shows an example of a coil conductor (spiral conductor) on a substrate which can be used in each of the embodiments of the present invention. The high aspect plating method disclosed in JP-A-11-204361 is used. It is due to. After forming a pattern of a plating base film by a photolithographic technique, a cross-section mushroom-like plating layer is expanded. Here, the width L of the head and the width N of the neck of the coil conductor 120 satisfy the relationship of L> 1.2N. This is preferable since the conductor height of the spiral planar coil formed on the substrate is increased to reduce the DC resistance of the coil, and power loss can be prevented in the case of a power supply line, and signal attenuation can be prevented in the case of a signal line. In FIG. 25, L ≦ 1.
In 2N, the significance of adopting the high aspect plating method disclosed in JP-A-11-204361 is lost.

In this case, if the conductor spacing is too narrow, the capacitance between lines increases, and the resonance frequency decreases, so that the high-frequency characteristics do not increase. For applications that require consideration of high-frequency characteristics,
The conductor spacing should be at least 0.5 times the conductor height, preferably at least the conductor height.

Further, when a magnetic film such as nickel is formed on the surface of the conductor for a protective film or other reasons, it is preferable that the film thickness be minimized in consideration of high frequency characteristics. For example, in the case of nickel, the film thickness is preferably 1 μm or less.

FIG. 26 shows another example of a coil conductor (spiral conductor) on a substrate that can be used in each embodiment of the present invention. The coil conductor 125 is formed on the substrate by pattern plating. I have. Here, the conductor height is H,
When the conductor width is D and the conductor interval is G, H> 0.7
D and G <1.5H. As a result, the conductor height of the spiral planar coil formed on the substrate is increased and the number of turns is secured, reducing the DC resistance of the coil, preventing power loss in the case of power supply lines, and preventing signal attenuation in the case of signal lines It is preferable because necessary inductance can be obtained. Note that H ≦ 0.7
In the case of D, the conductor height is insufficient and the effect of reducing the DC resistance is reduced, and when G ≧ 1.5H, the number of coil turns cannot be increased and the inductance is insufficient.

It is to be noted that the coil conductor 125 shown in FIG. 26 is particularly preferably formed by a pattern plating method, and the conventional subtractive method is not preferable because the etching proceeds isotropically, so that the conductor interval becomes too large.

[0102]

Embodiments of the present invention will be described below in detail.

Example 1 The thickness of the insulating layer was 200 μm,
Nine spiral conductor patterns are formed at 4 mm pitch on both sides of a double-sided copper-applied glass epoxy substrate having a copper layer thickness of 10 μm, and the front and back patterns are connected in series with inner through holes, and an array as shown in FIG. The planar coils 20 arranged in a shape were prepared.

The spiral conductor patterns 21 and 22 of FIG. 6 constituting each planar coil 20 are wound 19.25 times from the outside at a width of 55 μm and a space of 55 μm in a 3.5 mm square area, and have a diameter of 0.3 mm inside. Through holes were provided to electrically connect the front and back.

The pattern forming method is a normal subtractive method. That is, a through hole is formed at a predetermined position of a glass epoxy substrate as the insulating substrate 1, a 0.3 μm layer of electroless copper plating is formed on the entire surface of the panel, and this is used as a base conductive layer. 10μm by plating
Perform thickening. Thereafter, a spiral conductive pattern is formed by a photoetching method. FIGS. 6A and 6B show the spiral conductor patterns on the front and back, and FIG.
(A) and (B) show.

At this time, the inductance value of each planar coil 20 was 0.92 μH, and the DC resistance was 5Ω.

Next, spiral conductor patterns 2 on both sides
The top and bottom of the ferrules 1 and 22 were covered with a composite ferrite having a thickness of 2 mm as the composite magnetic body 30. The composite ferrite uses NiZn-based magnetic powder, and the blending ratio is 50 wt%. At this time, the inductance value of the individual planar coil 20 is 2.1 μm.
H.

Thereafter, the connector pin 10 having a diameter of 1 mm is soldered to the connector pin mounting conductor land 24 from which one coil end is led out, and the wire cable connecting conductor land 25 from which the other coil end is led out. The wire 51 of the wire cable 50 was soldered, and the whole was housed in the connector case 40. 1 and 2 show an overall view of the connector. The EMC countermeasure function can be built in a connector case (width 42, thickness 12, depth 35 mm) with a volume of 18 cc.

Next, the impedance characteristics of the individual connector pins were measured, as shown in FIG. It can be seen that good impedance characteristics are exhibited in a wide frequency range from low frequency to high frequency.

(Comparative Example 1) Each wire of the wire cable was directly connected to the connector pin by the above connector, and NiZ having a magnetic permeability of 750 was placed near the wire cable outside the connector.
A clamp filter made of n-ferrite material was attached. The shape is 8 mm in inner diameter, 16 mm in outer diameter, 25 mm in length, and the volume is 6 cc.

FIG. 27 shows the impedance characteristics at this time. Compared with Comparative Example 1 and Example 1, the overall impedance of Example 1 is larger, and the difference between the two is remarkable on the high frequency side. In addition, comparing the outer shape of Example 1 with that of Comparative Example 1, the volume of Example 1 is smaller by 30% (because the clamp filter around the wire cable becomes unnecessary). That is, Example 1 shows better impedance characteristics in a wide frequency range from low frequency to high frequency,
And it is small as a connector. In the case of Comparative Example 1, since the individual ferrite ring core swells around the outer periphery of the cable, a space is required for routing the cable, and there is a difficulty in handling.

Example 2 In Example 1, the coil pattern was the same, and the conductor had a cross-sectional shape of 70 μm in conductor width and 60 μm in conductor height. A method for creating a pattern is disclosed in
According to the high aspect plating method disclosed in JP-A-204361. However, the thickness of the nickel plating on the conductor surface is set to 1 μm in consideration of high frequency characteristics.

The frequency characteristic of the impedance at this time is the same as that of the first embodiment, and the DC resistance can be reduced to 0.8Ω. Thus, the power loss of the power supply line and the attenuation of the waveform of the signal line can be reduced as compared with the first embodiment.

(Embodiment 3) A case where the distance between the metal connector pins 10 in Embodiment 1 is 1.2 mm is shown. In this case, the plane coil 20A of FIG.
And 40 turns in total from the outside into the area. The conductor width of the spiral conductor is 10 μm, and the conductor interval is 10 μm.
m, and the conductor height is 20 μm. The conductor is formed by a pattern plating method, and an ion milling device is used for etching the underlying conductor layer. FIG. 7 shows a state before the composite magnetic body is formed by molding.

In this case, the inductance before molding with the composite magnetic material was 0.8 μH, and that after molding the composite magnetic material was 2.0 μH. The frequency characteristic of the impedance is almost the same as that of the first embodiment.
The dimensions of the connector case are depth 15 × width 20 × thickness 8 mm, and the volume is 3 cc.

Comparative Example 2 The same clamp filter as in Comparative Example 1 was installed by connecting each wire of the wire cable directly to the connector pin with the connector having the same outer shape and pin arrangement as in Example 3 described above. Compared with Comparative Example 2 and Example 3, Example 3 has better impedance characteristics over a wide frequency range and the total volume is reduced to 1/3 (there is no need for a clamp filter around the wire cable). For).

Embodiment 4 As shown in FIGS. 8 and 9, a spiral planar coil 20 having the same pattern as in Embodiment 2 is formed on one surface of a composite magnetic substrate 2 having a thickness of 1.6 mm. The thickness of the interlayer insulating film 66 interposed between the two spiral conductive patterns 61 and 62 is 50 μm, and the method is a pattern plating method and a build-up method. The underlying layer between the spiral conductor patterns is etched by ion milling. Next, the upper part of the spiral conductor pattern was molded with a composite magnetic material to form a composite magnetic body having a thickness of 2 mm. The connector pin 10 is soldered to the connector pin mounting conductor land 64 from which the coil end is led out, and the wire 51 of the wire cable 50 is soldered to the wire cable connection conductor land 65 from which the other coil end is led out. Connecting. After that, they were housed in a connector case, and the frequency characteristics of impedance were measured. The result is almost the same as in the case of Example 1.

Example 5 As shown in FIG. 12, the same spiral planar coil 20 as in Example 4 was formed on both surfaces of the composite magnetic substrate 2 with the center position shifted by 2 mm. Thereafter, in the same manner as in Example 4, the upper and lower portions of the substrate are made of a composite magnetic material having a thickness of 1.
5 mm was molded, and a connector having a connector pin 10 with a spacing of 2 mm was prepared. FIGS. 10 and 11 show overall views at this time. The frequency characteristics of the impedance were almost the same as those of the first embodiment.

(Example 6) In Example 5, in order to prevent crosstalk between the front and back planar coils 20, as shown in FIG. Sandwiched between 18μm copper foil. In this case, the composite magnetic substrate having a thickness of 0.8 mm is used in advance.
It is obtained by preparing a sheet and bonding it to both sides of an 18 μm copper foil.

(Example 7) In Example 1, a hole having a diameter of 1 mm was formed in the center of the insulating substrate, and then the inside of the hole was molded with a composite magnetic material to form a composite magnetic body.
At this time, the inductance value of the planar coil increased by 20%. Accordingly, the impedance value at each frequency also increased by about 20% compared to the case of the first embodiment.

Example 8 In Example 1, the power supply line and the ground line were used as the common mode choke 90 as shown in FIG. The conductor width of each coil of the common mode choke 90 is 55 μm, the conductor interval is 55 μm, and the conductor height is 2
0 μm. The creation method is based on the subtractive method.

(Embodiment 9) In Embodiment 4, the power supply line and the ground line terminal were the common mode choke coil 100 shown in FIG. Common mode choke 10
0, the conductor width of each coil is 55 μm, the conductor interval is 55 μm,
The conductor height is 40 μm. The thickness of the interlayer insulating film between the first layer conductor pattern and the second layer conductor pattern is 10 μm. The coupling coefficient of the common mode part at this time is 0.92
Met.

Although the embodiments and examples of the present invention have been described above, it is to be understood by those skilled in the art that the present invention is not limited thereto and that various modifications and changes can be made within the scope of the claims. Would be self-evident.

[0124]

As described above, the EM according to the present invention is used.
According to the connector with a built-in C function, a plurality of spiral planar coils are arranged on at least one surface of the insulating substrate, contacts are connected to one end of each planar coil, and wires of a wire cable are respectively connected to the other end of each planar coil. The connector has a configuration in which both sides of the planar coil are covered with a composite magnetic material, so that the external dimensions of the connector can be increased without increasing the external dimensions of the connector.
MC function can be built in. In other words, the number of turns can be increased by adopting the spiral planar coil, and the composite magnetic material is provided on both sides so as to sandwich the planar coil, and a sufficient inductance value without using a high magnetic permeability material such as sintered ferrite. From the low frequency region.
Good filter characteristics can be obtained in a wide frequency range up to a high frequency range of 00 MHz or more. Further, as the insulating substrate, an inexpensive substrate such as a glass epoxy substrate can be used, and the composite magnetic material is also inexpensive, so that the connector as a whole can be realized at the same price as the conventional connector.

[Brief description of the drawings]

FIG. 1 is a plan view of a connector with a built-in EMC function according to a first embodiment of the present invention, showing the inside of a connector case through;

FIG. 2 is a side sectional view of the first embodiment.

FIG. 3 is a plan view showing an arrangement of planar coils, connector pins, and cable connections on an insulating substrate in the first embodiment.

FIG. 4 is a side sectional view of a planar coil and a peripheral portion thereof according to the first embodiment.

FIG. 5 is a plan view showing conductor patterns on the front and back of the planar coils arranged in an array according to the first embodiment.

FIG. 6 is an enlarged plan view showing conductor patterns on the front and back of the planar coil according to the first embodiment.

FIG. 7 is a plan view showing a second embodiment of the present invention.

FIG. 8 is a plan view showing a third embodiment of the present invention.

FIG. 9 is a side sectional view of a planar coil and a peripheral portion thereof according to a third embodiment.

FIG. 10 is a plan view showing a fourth embodiment of the present invention.

FIG. 11 is a side sectional view of a planar coil and a peripheral portion thereof according to a fourth embodiment.

FIG. 12 is a plan view showing conductor patterns on the front and back of a planar coil arranged in an array according to a fourth embodiment.

FIG. 13 is a plan view showing a fifth embodiment of the present invention.

FIG. 14 is a side sectional view of a planar coil and a peripheral portion thereof according to a fifth embodiment.

FIG. 15 is a plan view showing a connector case according to a sixth embodiment of the present invention as seen through the inside of a connector case.

FIG. 16 is a side sectional view of the sixth embodiment.

FIG. 17 is a plan view showing a seventh embodiment of the present invention as seen through the inside;

FIG. 18 is a side sectional view of the seventh embodiment.

FIG. 19 is a side sectional view of an eighth embodiment of the present invention.

FIG. 20 is a side sectional view of a ninth embodiment.

FIG. 21 is a plan view showing conductor patterns on the front and back of a planar coil arranged in an array according to a tenth embodiment of the present invention.

FIG. 22 is a plan view showing a conductor pattern of each layer of a planar coil arranged in an array according to an eleventh embodiment of the present invention.

FIG. 23 is a plan view showing conductor patterns on the front and back of a planar coil arranged in an array according to a twelfth embodiment of the present invention.

FIG. 24 is a plan view showing conductor patterns on the front and back of a planar coil arranged in an array according to a thirteenth embodiment of the present invention.

FIG. 25 is a cross-sectional view showing an example of a cross-sectional shape of a coil conductor that can be used in each embodiment of the present invention.

FIG. 26 is a cross-sectional view showing another example of a cross-sectional shape of a coil conductor that can be used in each embodiment of the present invention.

FIG. 27 is a graph showing impedance characteristics in the case of Example 1 according to the present invention in comparison with Comparative Example 1.

[Explanation of symbols]

REFERENCE SIGNS LIST 1 insulating substrate 2 composite magnetic substrate 5 conductor layer 10 connector pin 20, 20A, 60, 70, 80, 91A, 91B, 1
01A, 101B planar coils 21, 21A, 22, 61, 62, 71, 72, 81,
82, 92A, 92B, 93A, 93B Spiral conductor pattern 24, 64, 74, 84, 94A, 94B, 104A,
104B Conductor land for connector pin mounting 25, 65, 75, 85, 95A, 95B, 105A,
105B Wire cable mounting conductor land 28 hole 30, 31, 32, 33, 34, 35, 36 composite magnetic body 40, 41 connector case 50 wire cable 51 wire 90, 100 common mode choke 110 short ring 115 ground pattern 120, 125 Coil conductor

Continuation of the front page (72) Inventor Minoru Takaya 1-13-1 Nihonbashi, Chuo-ku, Tokyo TDC Corporation F-term (reference) 5E021 FA05 FA11 FB10 FB14 FC19 FC33 LA30 MA18 MA31 MB08

Claims (16)

[Claims] 1. A plurality of spiral planar coils are arranged on at least one surface of an insulating substrate, a contact is connected to one end of each planar coil, and a wire of a wire cable is connected to the other end of each planar coil. A connector with a built-in EMC function, wherein both sides of the planar coil are covered with a composite magnetic body, and at least the insulating substrate provided with the planar coil is covered with an exterior body. 2. The connector with a built-in EMC function according to claim 1, wherein said insulating substrate is a composite magnetic substrate. 3. The connector with a built-in EMC function according to claim 2, wherein said composite magnetic substance substrate also serves as said composite magnetic substance covering one side of said planar coil. 4. The connector with a built-in EMC function according to claim 2, wherein a plurality of said planar coils are arranged on both sides of said composite magnetic substrate, and both sides of said composite magnetic substrate are covered with said composite magnetic material. 5. The connector with a built-in EMC function according to claim 1, wherein an arrangement pitch of said planar coils substantially coincides with an arrangement pitch of said contacts. 6. The E according to claim 4, wherein an arrangement pitch of said planar coils is substantially twice as large as an arrangement pitch of said contacts.
MC function built-in connector. 7. The connector with a built-in EMC function according to claim 4, wherein a conductor layer is formed at an intermediate portion in a thickness direction of the composite magnetic substrate. 8. The EMC according to claim 1, 2, 3, 4, 5, 6, or 7, wherein said planar coil is formed by connecting a plurality of spiral conductive patterns provided on said insulating substrate in series. Connector with built-in function. 9. The EMC according to claim 1, wherein a hole is formed in a portion of said insulating substrate corresponding to a central portion of said planar coil, and said composite magnetic body also exists inside said hole.
Connector with built-in function. 10. The EM according to claim 1, wherein said mounting base of said contact and said planar coil are covered with a mold of said composite magnetic material.
Connector with built-in C function. 11. The connector with a built-in EMC function according to claim 1, wherein the composite magnetic body also serves as part or all of the exterior body. 12. The connector with an EMC function according to claim 1, wherein the composite magnetic body has a combination structure of a plurality of composite magnetic bodies having different magnetic characteristics. 13. The planar coil according to claim 1, wherein a cross section of the spiral conductor has a mushroom shape, and a width of a head (L) and a width of a neck (N) satisfy a relationship of L> 1.2N. 13. The connector with a built-in EMC function according to any one of 1 to 12. 14. The cross-sectional shape of the spiral conductor of the planar coil is such that the conductor height is H, the conductor width is D, and the conductor interval is G.
Where H> 0.7D and G <1.5H
The connector with a built-in EMC function according to any one of claims 1 to 12. 15. The connector with a built-in EMC function according to claim 1, wherein planar coils connected to at least one pair of the contacts are mutually coupled to form a common mode choke. 16. The connector with an EMC function according to claim 1, wherein a short ring or a ground pattern for reducing crosstalk is formed on the insulating substrate between the planar coils.