JPH1154327A - Coil parts - Google Patents

Abstract

PROBLEM TO BE SOLVED: To provide coil parts having a superior common-mode noise removing ability. SOLUTION: A laminated body 7 which is formed by alternately laminating coil pattern 4 and 5, insulating layers 6 upon another is formed on a first magnetic substrate 3, and a second magnetic substrate 10 is formed on the laminated body 7 with an adhesive layer in between. On the bottom face of the second magnetic substrate 10, projecting sections 20 are formed at the parts corresponding to a central area surrounded by the coil patterns and the peripheral edge area on the outside of the coil patterns and, on the laminated body 7, inserting sections into which the projecting sections 20 are inserted are formed. Then the projecting sections 20 are inserted into their corresponding inserting sections. Since most of the permeating routes of the closed magnetic paths of the lines of magnetic force generated form the coil patterns 4 and 5 are composed of the magnetic substrates 3 and 10, hardly lines of magnetic force leak out of the closed magnetic paths, and the degree of electromagnetic coupling and electrical characteristic of a coil part are improved.

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a coil component such as a transformer and a common mode choke coil.

[0002]

2. Description of the Related Art FIG. 5 is a perspective view showing an example of a common mode choke coil as a coil component, and FIG. 6 is an exploded view of the common mode choke coil shown in FIG. This common mode choke coil 1 is disclosed in
FIG.
As shown in FIG. 2, a laminated body 7 is formed on the first magnetic substrate 3, and a second laminated body 7 is formed on the laminated body 7 with an adhesive layer 8 interposed therebetween.
An external electrode 11 is formed on the outer wall surface of the laminate of the first magnetic substrate 3, the laminate 7, the adhesive layer 8, and the second magnetic substrate 10. ing.

As shown in FIG. 6, the laminate 7 is formed by laminating a plurality of layers by a thin film forming technique such as sputtering, and is formed of a nonmagnetic insulating material such as a polyimide resin or an epoxy resin. An insulating layer 6a is laminated on the first magnetic substrate 3, an extraction electrode 12a, 12b is formed on the upper side of the insulating layer 6a, and an insulating layer 6b is formed on the upper side of the extraction electrodes 12a, 12b. A coil pattern 4 and a lead electrode 12c drawn from the coil pattern 4 are formed above the insulating layer 6b, and an insulating layer 6c is formed above the coil pattern 4 and the lead electrode 12c. Are formed with a coil pattern 5 and a lead electrode 12d drawn out from the coil pattern 5, thereby forming a laminate 7.

One end of the coil pattern 4 has an insulating layer 6
b is electrically connected to the extraction electrode 12a through a via hole 13a formed in the extraction electrode 1a.
2a is electrically connected to the external electrode 11a. The other end of the coil pattern 4 is electrically connected to the external electrode 11c via the lead electrode 12c.

[0005] One end of the coil pattern 5 is electrically connected to a lead electrode 12b through a via hole 13c formed in the insulating layer 6c and a via hole 13b formed in the insulating layer 6b, and the lead electrode 12b is connected to an external electrode. 1
1b. The other end of the coil pattern 5 is electrically connected to the external electrode 11d via the lead electrode 12d.

When the common mode choke coil 1 is incorporated in a circuit, the coil patterns 4 and 5 can be incorporated in the circuit by electrically connecting the external electrodes 11 to connection portions of predetermined circuits.

Since the common mode choke coil 1 can be formed by using a thin film forming technique such as sputtering or vapor deposition, it is easy to reduce the size and the productivity is high.

[0008]

In the above-mentioned coil components such as the common mode choke coil and the transformer, it is important to increase the degree of electromagnetic coupling between the coil patterns. By increasing the degree of electromagnetic coupling, its electrical characteristics can be improved. For example, the above-described common mode choke coil can be configured to have a high impedance with respect to the common mode noise, and the common mode noise removal performance can be improved. Also,
In the transformer, the energy loss can be reduced and the bandwidth can be widened.

In the common mode choke coil 1 shown in FIGS. 5 and 6, since the insulating layer 6 can be formed by using the thin film forming technique as described above, the thickness of the insulating layer 6 can be reduced. That is, the interval between the coil patterns 4 and 5 can be reduced. As the distance between the coil patterns 4 and 5 becomes smaller,
The degree of electromagnetic coupling between the coil patterns 4 and 5 is increased, and the impedance of the common mode choke coil 1 can be increased. However, there is a limit to reducing the thickness of the insulating layer 6 in order to secure insulation between the coil pattern 4 and the coil pattern 5. In the method of increasing the impedance of the common mode choke coil 1,
There is a limit to the improvement of the degree of electromagnetic coupling and impedance, and the common mode choke coil having higher impedance is not required to exhibit satisfactory common mode noise removal performance.

SUMMARY OF THE INVENTION The present invention has been made to solve the above-mentioned problems, and an object of the present invention is to provide a coil component which further enhances the degree of electromagnetic coupling between coil patterns and exhibits excellent common mode noise elimination performance. Is to do.

[0011]

Means for Solving the Problems In order to achieve the above object, the present invention has the following structure to solve the above problems. That is, in the present invention, a laminated body in which the coil patterns and the insulating layers are alternately laminated is formed above the first magnetic substrate, and the second magnetic substrate is formed above this laminated body. In the coil component, on the bottom surface of the second magnetic substrate, a convex portion is formed at a portion corresponding to one or both of a central region surrounded by the coil pattern and a peripheral region outside the coil pattern. The stacked body has a configuration in which a fitting portion in which the convex portion is fitted is formed as means for solving the above-mentioned problem.

In the invention having the above structure, for example, a convex portion is formed on a bottom surface of the second magnetic substrate at a portion corresponding to a central region surrounded by the coil pattern, and the convex portion is formed on a central region of the laminate. A hole is formed as a fitting portion that fits into the hole. The protrusion of the second magnetic substrate is fitted in the hole of the laminated body.

The lines of magnetic force generated from the coil pattern pass through, for example, the first magnetic substrate and the central region of the laminated body, the second magnetic substrate and the peripheral region of the laminated body, and pass to the first magnetic substrate. Since the returning closed magnetic path is formed, as described above, by inserting the convex portion of the second magnetic substrate into the central region of the stacked body, the ratio of the magnetic substrate occupying the entire transmission path through which the lines of magnetic force penetrates, The number of magnetic field lines leaking from the closed magnetic path decreases due to the increase in the number of magnetic field lines leaking from the closed magnetic circuit. It is possible to increase the degree of electromagnetic coupling between the coil patterns. As described above, since the degree of electromagnetic coupling of the coil component can be increased, the electrical characteristics of the coil component can be improved.

[0014]

Embodiments of the present invention will be described below with reference to the drawings. In the description of this embodiment, the same reference numerals are given to the same parts as those in the conventional example, and the overlapping description of the common parts will be omitted.

FIG. 1 shows an exploded view of a common mode choke coil which is a coil component of this embodiment, and FIG. 2 shows an xx section of the common mode choke coil 1 shown in FIG. FIG. 3 shows the pattern shapes of the coil patterns 4 and 5 when the common mode choke coil 1 shown in FIG. 1 is viewed from above. What is characteristic in this embodiment is that by reducing the lines of magnetic force leaking from the closed magnetic circuit, the degree of electromagnetic coupling and impedance in the common mode choke coil 1 can be increased, and excellent common mode noise removal performance can be exhibited. That is, it is a configuration.

As shown in FIG. 1, the first magnetic substrate 3
An insulating layer 6a is formed on an upper side (for example, a NiZn-based ferrite substrate manufactured by powder molding), and lead electrodes 12a and 12b are formed on the upper side of the insulating layer 6a.
And a conductive pattern layer 15a composed of an electrode 14a conducting to the extraction electrode 12a and an electrode 14b conducting to the extraction electrode 12b is formed by a thin film forming technique such as sputtering.

An insulating layer 6b is formed above the conductor pattern layer 15a. Above the insulating layer 6b, a conductive pattern is formed between the coil pattern 4, a lead electrode 12c drawn from the coil pattern 4, and the lead electrode 12c. A layer 15b of a conductor pattern including the electrode 14c to be connected is formed by a thin film forming technique. The inner end of the coil pattern 4 is conductively connected to the extraction electrode 12a.

On the upper side of the conductor pattern layer 15b, an insulating layer 6c is formed. On the upper side of the insulating layer 6c, a conductive pattern is formed between the coil pattern 5, a lead electrode 12d drawn from the coil pattern 5, and the lead electrode 12d. A conductive pattern layer 15c including the connecting electrode 14d is formed by a thin film forming technique. The inner end of the coil pattern 5 is electrically connected to the extraction electrode 12b. An insulating layer 6d is provided above the conductor pattern layer 15c.
Are formed.

As described above, the laminated body 7 is formed by alternately forming the insulating layers 6 and the conductor pattern layers 15 by the thin film forming technique. The conductor patterns of the coil patterns 4 and 5, the extraction electrodes 12a to 12d, and the external electrodes 14a to 14d are made of a single metal such as Ag, Pd, Cu, or Al, or an alloy obtained by combining two or more of these metals. And the like, and the insulating layers 6a, 6b, 6c,
6d is made of a resin such as a polyimide resin, an epoxy resin, an acrylic resin, a cyclic olefin resin, or a benzocyclobutene resin, or a nonmagnetic insulating material such as glass or glass ceramics.

The insulating layer 6 and the conductive pattern layer 15 can be formed very thin by using a thin film forming technique. In this embodiment, the thickness of the insulating layer 6 is, for example, about 5 μm. The conductive pattern has a thickness of about 1 to 10 μm.

In this embodiment, most of the coil patterns 4 and 5 are formed so as to overlap as shown in FIG.

In this embodiment, as described above, the thickness of the insulating layer 6 can be made extremely thin, and furthermore, since the coil pattern 4 and the coil pattern 5 are formed so as to overlap with each other, the coil pattern 4 The distance between the coil pattern 5 and the coil pattern 5 is formed very narrow, so that the degree of electromagnetic coupling between the coil pattern 4 and the coil pattern 5 can be improved. Needless to say, the insulating layer 6 has the coil pattern 4
And the coil pattern 5 are surely insulated, and the coil pattern 4
And the coil pattern 5 are formed to a thickness that does not cause a problem such as a short circuit.

Further, in this embodiment, as shown in FIG. 1, the insulating layers 6a, 6b, 6c, 6d of the laminate 7 are formed.
Are formed with holes 16a, 16b, 16c and 16d respectively in the central region surrounded by the coil patterns 4 and 5, and a notch 18 is formed in the peripheral region outside the coil patterns 4 and 5. As described above, by forming the holes 16 in the central region of each insulating layer 6, a through hole is formed in the central region of the stacked body 7, and the notch 18 is formed in the peripheral region of each insulating layer 6. By forming the groove, a groove extending from the lower end to the upper end of the laminate 7 is formed in the peripheral region of the laminate 7.

In this embodiment, the laminated body 7 is configured as described above, and the second magnetic substrate 10 (for example, N
An iZn-based ferrite substrate) is bonded and formed by the bonding layer 8.

As shown in FIG. 4, on the bottom surface of the second magnetic substrate 10, there are provided protrusions 20a, 20b, 20c, 20c.
d and 20e are formed by sandblasting or the like. The protrusion 20a is formed so as to fit into a through hole formed in a central region of the laminated body 7, and the protrusion 20a
The b and 20d are formed so as to fit into the grooves formed in the left and right peripheral regions of the laminate 7 shown in FIG.
Reference numeral 20e is formed so as to fit into a groove formed in the front and rear peripheral regions of the laminate 7 shown in FIG.

When the second magnetic substrate 10 is bonded to the upper side of the laminate 7 via the adhesive layer 8, the protrusion 20 a of the second magnetic substrate 10 is inserted through the central region of the laminate 7. The protrusions 20b, 20c, 20d, and 20e are aligned with the corresponding grooves in the peripheral region of the laminate 7, respectively, so that the protrusions 20 penetrate the laminate 7 as shown in FIG. It will fit into the hole or groove. As described above, the through-holes and grooves of the laminated body 7 correspond to the protrusions 2 of the second magnetic substrate 10.
0 and a fitting portion to be fitted.

The material of the adhesive layer 8 is a material having a relative magnetic permeability higher than 1.0 (a material having magnetism). In this embodiment, the insulating adhesive such as polyimide is made of NiZn-based ferrite. Since a material having a relative magnetic permeability of more than 1.0 can be obtained by containing magnetic powder, the adhesive layer 8 is formed from a material containing NiZn-based ferrite magnetic powder in the insulating adhesive. Yes,
The thickness of the adhesive layer 8 is formed to be about 30 μm.

The relative magnetic permeability of the material of the adhesive layer 8 is desirably large, and the relative magnetic permeability of the adhesive material of the adhesive layer 8 is increased by increasing the content of NiZn-based ferrite magnetic powder with respect to the insulating adhesive. It is possible to make it larger,
If the amount of the magnetic powder contained is too large, the adhesive strength of the adhesive material is reduced, so that a problem such as the second magnetic substrate 10 being easily peeled off may occur. From this, the adhesive layer 8 is formed of an adhesive material containing an appropriate amount of magnetic powder capable of avoiding the problem of peeling of the second magnetic substrate 10, and the relative permeability of the adhesive layer 8. Can obtain 1.5 or more.

When the second magnetic substrate 10 is attached to the upper side of the laminate 7 via the adhesive layer 8, the material of the adhesive layer 8 is in a molten state, and the material of the adhesive layer 8 is Second
Due to its own weight, the magnetic substrate 10 is pressed against the first magnetic substrate 3 and the laminated body 7 and spreads, as shown in FIG.
The space between the first magnetic substrate 3 and the laminated body 7 and the second magnetic substrate 10 is filled without gaps. Thus, the second magnetic substrate 10 can be firmly bonded to the upper side of the stacked body 7.

As described above, the first magnetic substrate 3, the laminate 7, the adhesive layer 8, and the second magnetic substrate 10 are integrally formed in a block, and the outer wall surface of the block is External electrodes (not shown) are formed on the electrodes 14a to 14d for conducting connection in a one-to-one correspondence, and the coil patterns 4 and 5 are incorporated into the circuit via these external electrodes.

In this embodiment, the coil patterns 4 and
The magnetic field lines generated from the magnetic field lines 5 are closed magnetic paths as shown in FIG. 2, that is, the convex portions 20a in the central region, the base portion of the second magnetic substrate 10, the convex portions 20 in the peripheral region, and the first magnetic substrate. 3 in order to return to the convex portion 20a of the central region via the third magnetic path (or
A closed magnetic path which returns to the central region convex portion 20a through the central region convex portion 20a, the first magnetic substrate 3, the peripheral region convex portion 20 and the second magnetic substrate 10 in this order. .

That is, in this embodiment, most of the transmission paths through which the magnetic lines of force pass are constituted by the magnetic substrates 3 and 10. The relative permeability of the non-magnetic insulating material is 1.0 or less, while the relative permeability of the magnetic substrates 3 and 10 is about 10 to 1500, and the relative permeability of the transmission path of the magnetic field lines is high. Since the lines of magnetic force leaking out of the closed magnetic path decrease as much as possible, when most of the transmission paths of the lines of magnetic force are constituted by the magnetic substrates 3 and 10 as in this embodiment, the leakage of the lines of magnetic force is substantially avoided. It is possible,
The degree of electromagnetic coupling and impedance in the common mode choke coil 1 can be increased due to the reduction of the leakage of the magnetic field lines.

On the other hand, as in the conventional example shown in FIGS. 5 and 6, the region between the first magnetic substrate 3 and the second magnetic substrate 10 is relatively transparent except for the conductor portion. When formed of a non-magnetic material having a magnetic susceptibility of 1.0 or less, the ratio of the non-magnetic material portion to the entire transmission path of the magnetic field lines is large, and leakage of the magnetic field lines occurs in the non-magnetic material portion. Leakage causes a problem that the degree of electromagnetic coupling of the common mode choke coil 1 is reduced.

In this embodiment, as described above, since almost all of the magnetic flux transmission paths are formed by the magnetic substrate, the leakage of the magnetic flux is very small. A reduction in the degree of electromagnetic coupling and impedance in the mode choke coil 1 can be prevented, and a high degree of electromagnetic coupling and impedance can be obtained. As a result, the common mode choke coil 1 exhibiting excellent common mode noise removal performance can be obtained.

In particular, in this embodiment, since the adhesive layer 8 is made of a material containing magnetic powder such as ferrite in an insulating material, the relative magnetic permeability of the adhesive layer 8 is larger than 1.0. As a result, there is almost no leakage of magnetic field lines in the adhesive layer 8, the impedance of the common mode choke coil 1 is further increased, and the common mode choke coil 1 with more excellent common mode noise removal performance can be provided.

Note that the present invention is not limited to the above-described embodiment, but can adopt various embodiments. For example, in the above-described embodiment, on the bottom surface of the second magnetic substrate 10, a portion corresponding to a peripheral region outside the coil pattern is provided, as shown in FIG.
b to 20e are formed, but the second magnetic substrate 10
A series of convex portions may be formed so as to border the bottom surface of, or one or more of the convex portions 20b to 20e may be divided into a plurality.

In the above embodiment, the adhesive layer 8 is formed of a material in which an NiZn-based ferrite magnetic powder is contained in an insulating adhesive. However, the MnZn-based ferrite magnetic powder, the NiZn-based A magnetic material such as ferrite magnetic powder other than MnZn-based or magnetic powder other than ferrite may be formed of a material containing an insulating adhesive. Further, the adhesive layer 8 may be made of an adhesive material made of only an insulating material that does not contain a magnetic material.

Further, in the above-described embodiment, an example in which two coil patterns 4 and 5 are laminated is shown, but three or more coil patterns may be laminated via an insulating layer. Furthermore, the number of turns of the coil patterns 4 and 5 is not limited to a number as long as it is one or more turns, and is appropriately set according to specifications.

Further, in the above embodiment, the insulating layer 6a
Electrodes 12a, 12b and electrodes 14a, 1
4b, and the coil pattern 4 is formed on the upper side via the insulating layer 6b.
a may be formed above the insulating layer 6b or the insulating layer 6,
The extraction electrode 12b and the electrode 14b may be formed above the insulating layers 6c and 6d. Extraction electrode 12
a, 12b and the electrodes 14a, 14b are all formed on the insulating layer 6 other than the insulating layer 6a.
No conductor is formed between the insulating layer 6b and the insulating layer 6b.
a can be omitted.

Further, in the above embodiment, the description has been given by taking the common mode choke coil as an example. However, the present invention can be applied to coil components other than the common mode choke coil such as a transformer.

[0041]

According to the present invention, the bottom surface of the second magnetic substrate is provided with a portion corresponding to one or both of a central region surrounded by the coil pattern and a peripheral region outside the coil pattern. The protrusion is formed, and the fitting portion in which the protrusion is fitted is formed in the laminate, so that the protrusion of the magnetic substrate is inserted into one or both of the central region and the peripheral region of the laminate. As a result, the ratio of the magnetic substrate occupying the entire transmission path through which the magnetic field lines generated from the coil pattern penetrates increases, and as a result, the magnetic field lines leaking from the closed magnetic path decrease, and the leakage of the magnetic field lines decreases. A reduction in the degree of electromagnetic coupling of the coil component can be prevented, and the degree of electromagnetic coupling of the coil component can be increased.

In particular, when the convex portions and the fitting portions of the convex portions are formed in both the central region and the peripheral region, most of the transmission paths of the magnetic force lines are constituted by the magnetic substrate. In addition, the leakage of the lines of magnetic force is remarkably reduced, which can further enhance the electromagnetic coupling of the coil component.

As described above, since the impedance of the coil component can be increased, the common mode noise elimination performance is improved, and a coil component having excellent common mode noise elimination performance can be provided.

[Brief description of the drawings]

FIG. 1 is an explanatory view showing a disassembled state of a coil component according to an embodiment of the present invention.

FIG. 2 is an explanatory diagram showing an xx section of the coil component shown in FIG. 1;

FIG. 3 is an explanatory diagram showing a coil pattern shape of the coil component shown in FIG.

FIG. 4 is an explanatory view showing a bottom surface shape of a second magnetic substrate constituting the coil component shown in FIG. 1;

FIG. 5 is an explanatory view showing an example of a conventional coil component in a perspective view.

FIG. 6 is an explanatory view showing the coil component of FIG. 5 in an exploded state.

[Explanation of symbols]

 Reference Signs List 1 common mode choke coil 3 first magnetic substrate 4, 5 coil pattern 6, 6a, 6b, 6c, 6d insulating layer 7 laminate 10 second magnetic substrate 16 hole

Claims (1)

[Claims] A coil in which a coil pattern and an insulating layer are alternately laminated on a first magnetic substrate, and a second magnetic substrate is formed on the laminate on the first magnetic substrate. In the component, on the bottom surface of the second magnetic substrate, a convex portion is formed at a portion corresponding to one or both of a central region surrounded by the coil pattern and a peripheral region outside the coil pattern. A coil component, wherein a fitting portion is formed on the body to fit the above-mentioned convex portion.